KR20100025596A - 신규 폴리머, 폴리머 합성 방법 및 포토레지스트 조성물 - Google Patents
신규 폴리머, 폴리머 합성 방법 및 포토레지스트 조성물 Download PDFInfo
- Publication number
- KR20100025596A KR20100025596A KR1020107003751A KR20107003751A KR20100025596A KR 20100025596 A KR20100025596 A KR 20100025596A KR 1020107003751 A KR1020107003751 A KR 1020107003751A KR 20107003751 A KR20107003751 A KR 20107003751A KR 20100025596 A KR20100025596 A KR 20100025596A
- Authority
- KR
- South Korea
- Prior art keywords
- polymerization
- reaction
- polymer
- reaction mixture
- reagents
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F232/00—Copolymers of cyclic compounds containing no unsaturated aliphatic radicals in a side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic ring system
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F234/00—Copolymers of cyclic compounds having no unsaturated aliphatic radicals in a side chain and having one or more carbon-to-carbon double bonds in a heterocyclic ring
- C08F234/02—Copolymers of cyclic compounds having no unsaturated aliphatic radicals in a side chain and having one or more carbon-to-carbon double bonds in a heterocyclic ring in a ring containing oxygen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F234/00—Copolymers of cyclic compounds having no unsaturated aliphatic radicals in a side chain and having one or more carbon-to-carbon double bonds in a heterocyclic ring
- C08F234/04—Copolymers of cyclic compounds having no unsaturated aliphatic radicals in a side chain and having one or more carbon-to-carbon double bonds in a heterocyclic ring in a ring containing sulfur
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
- G03F7/0382—Macromolecular compounds which are rendered insoluble or differentially wettable the macromolecular compound being present in a chemically amplified negative photoresist composition
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
- G03F7/0395—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having a backbone with alicyclic moieties
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
- G03F7/0397—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having an alicyclic moiety in a side chain
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
- G03F7/2004—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by the use of a particular light source, e.g. fluorescent lamps or deep UV light
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
- G03F7/2012—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image using liquid photohardening compositions, e.g. for the production of reliefs such as flexographic plates or stamps
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
- Y10S430/1055—Radiation sensitive composition or product or process of making
- Y10S430/106—Binder containing
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Materials For Photolithography (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US27140101P | 2001-02-27 | 2001-02-27 | |
| US60/271,401 | 2001-02-27 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020037011229A Division KR100976988B1 (ko) | 2001-02-27 | 2002-02-26 | 신규 폴리머, 폴리머 합성 방법 및 포토레지스트 조성물 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20100025596A true KR20100025596A (ko) | 2010-03-09 |
Family
ID=23035387
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020107003751A Ceased KR20100025596A (ko) | 2001-02-27 | 2002-02-26 | 신규 폴리머, 폴리머 합성 방법 및 포토레지스트 조성물 |
| KR1020037011229A Expired - Fee Related KR100976988B1 (ko) | 2001-02-27 | 2002-02-26 | 신규 폴리머, 폴리머 합성 방법 및 포토레지스트 조성물 |
| KR1020097008576A Expired - Fee Related KR100970661B1 (ko) | 2001-02-27 | 2002-02-26 | 신규 폴리머, 폴리머 합성 방법 및 포토레지스트 조성물 |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020037011229A Expired - Fee Related KR100976988B1 (ko) | 2001-02-27 | 2002-02-26 | 신규 폴리머, 폴리머 합성 방법 및 포토레지스트 조성물 |
| KR1020097008576A Expired - Fee Related KR100970661B1 (ko) | 2001-02-27 | 2002-02-26 | 신규 폴리머, 폴리머 합성 방법 및 포토레지스트 조성물 |
Country Status (4)
| Country | Link |
|---|---|
| US (2) | US6841331B2 (enExample) |
| JP (1) | JP2004524564A (enExample) |
| KR (3) | KR20100025596A (enExample) |
| WO (1) | WO2002069040A1 (enExample) |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20100025596A (ko) * | 2001-02-27 | 2010-03-09 | 롬 앤드 하스 일렉트로닉 머트어리얼즈, 엘.엘.씨 | 신규 폴리머, 폴리머 합성 방법 및 포토레지스트 조성물 |
| DE10203839B4 (de) * | 2002-01-31 | 2007-10-18 | Infineon Technologies Ag | Resist für die Fotolithografie mit reaktiven Gruppen für eine nachträgliche Modifikation der Resiststrukturen |
| TWI349831B (en) * | 2003-02-20 | 2011-10-01 | Maruzen Petrochem Co Ltd | Resist polymer and method for producing the polymer |
| US20050160934A1 (en) | 2004-01-23 | 2005-07-28 | Molecular Imprints, Inc. | Materials and methods for imprint lithography |
| US7307118B2 (en) | 2004-11-24 | 2007-12-11 | Molecular Imprints, Inc. | Composition to reduce adhesion between a conformable region and a mold |
| TWI371657B (en) * | 2004-02-20 | 2012-09-01 | Fujifilm Corp | Positive resist composition for immersion exposure and method of pattern formation with the same |
| US8076386B2 (en) * | 2004-02-23 | 2011-12-13 | Molecular Imprints, Inc. | Materials for imprint lithography |
| US7759407B2 (en) | 2005-07-22 | 2010-07-20 | Molecular Imprints, Inc. | Composition for adhering materials together |
| US8808808B2 (en) | 2005-07-22 | 2014-08-19 | Molecular Imprints, Inc. | Method for imprint lithography utilizing an adhesion primer layer |
| US8557351B2 (en) | 2005-07-22 | 2013-10-15 | Molecular Imprints, Inc. | Method for adhering materials together |
| JP4774252B2 (ja) * | 2005-08-17 | 2011-09-14 | 富士フイルム株式会社 | ポジ型レジスト組成物、該ポジ型レジスト組成物の製造方法及び該ポジ型レジスト組成物を用いたパターン形成方法 |
| KR100688569B1 (ko) * | 2005-08-30 | 2007-03-02 | 삼성전자주식회사 | 플루오르를 함유하는 탑 코팅 조성물과 이를 이용한포토레지스트 패턴 형성 방법 |
| US8142703B2 (en) | 2005-10-05 | 2012-03-27 | Molecular Imprints, Inc. | Imprint lithography method |
| JP5215228B2 (ja) * | 2009-04-16 | 2013-06-19 | 株式会社ダイセル | フォトレジスト用樹脂組成物の製造法 |
| US8541523B2 (en) | 2010-04-05 | 2013-09-24 | Promerus, Llc | Norbornene-type polymers, compositions thereof and lithographic process using such compositions |
| JP5811848B2 (ja) * | 2010-10-18 | 2015-11-11 | 三菱レイヨン株式会社 | リソグラフィー用重合体の製造方法、レジスト組成物の製造方法、パターンが形成された基板の製造方法 |
| JP5743858B2 (ja) * | 2011-11-14 | 2015-07-01 | 丸善石油化学株式会社 | 低分子量レジスト用共重合体の製造方法 |
| US9796815B2 (en) * | 2013-07-31 | 2017-10-24 | Dow Global Technologies Llc | Process for preparing polycarbamate and reaction product thereof |
| US9006379B2 (en) * | 2013-07-31 | 2015-04-14 | Dow Global Technologies Llc | Process to produce polycarbamate using a gradient feed of urea |
| CN108264605A (zh) * | 2016-12-30 | 2018-07-10 | 罗门哈斯电子材料韩国有限公司 | 单体、聚合物和光致抗蚀剂组合物 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56122031A (en) | 1980-03-01 | 1981-09-25 | Japan Synthetic Rubber Co Ltd | Positive type photosensitive resin composition |
| KR100258494B1 (ko) * | 1992-06-02 | 2000-06-15 | 미우라 아끼라 | 레지스트 표면 반사 방지막 형성 조성물 및 패턴 형성방법 |
| EP0779308B1 (en) * | 1995-12-11 | 2001-01-24 | Mitsui Chemicals, Inc. | Heat-resistant high-nitrile polymer compositions and process for preparing same |
| JPH1060214A (ja) * | 1996-08-22 | 1998-03-03 | Nippon Oil Co Ltd | カラーフィルター用アクリル樹脂組成物 |
| US6706826B1 (en) | 1998-03-27 | 2004-03-16 | Mitsubishi Rayon Co., Ltd. | Copolymer, process for producing the same, and resist composition |
| EP1059568B1 (en) * | 1999-06-07 | 2007-02-14 | Canon Kabushiki Kaisha | Toner and image forming method |
| TWI227377B (en) * | 1999-10-06 | 2005-02-01 | Fuji Photo Film Co Ltd | Positive-type resist composition |
| KR20100025596A (ko) * | 2001-02-27 | 2010-03-09 | 롬 앤드 하스 일렉트로닉 머트어리얼즈, 엘.엘.씨 | 신규 폴리머, 폴리머 합성 방법 및 포토레지스트 조성물 |
-
2002
- 2002-02-26 KR KR1020107003751A patent/KR20100025596A/ko not_active Ceased
- 2002-02-26 KR KR1020037011229A patent/KR100976988B1/ko not_active Expired - Fee Related
- 2002-02-26 KR KR1020097008576A patent/KR100970661B1/ko not_active Expired - Fee Related
- 2002-02-26 WO PCT/US2002/005609 patent/WO2002069040A1/en not_active Ceased
- 2002-02-26 US US10/083,675 patent/US6841331B2/en not_active Expired - Lifetime
- 2002-02-26 JP JP2002568099A patent/JP2004524564A/ja active Pending
-
2004
- 2004-04-05 US US10/819,686 patent/US7208261B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| US7208261B2 (en) | 2007-04-24 |
| KR100976988B1 (ko) | 2010-08-19 |
| JP2004524564A (ja) | 2004-08-12 |
| US6841331B2 (en) | 2005-01-11 |
| KR20040030516A (ko) | 2004-04-09 |
| US20030027075A1 (en) | 2003-02-06 |
| KR100970661B1 (ko) | 2010-07-15 |
| US20040259025A1 (en) | 2004-12-23 |
| WO2002069040A1 (en) | 2002-09-06 |
| KR20090074222A (ko) | 2009-07-06 |
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| A107 | Divisional application of patent | ||
| PA0104 | Divisional application for international application |
Comment text: Divisional Application for International Patent Patent event code: PA01041R01D Patent event date: 20100219 |
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| PG1501 | Laying open of application | ||
| A201 | Request for examination | ||
| PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 20100319 Comment text: Request for Examination of Application |
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Comment text: Notification of reason for refusal Patent event date: 20100519 Patent event code: PE09021S01D |
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Patent event date: 20110222 Comment text: Decision to Refuse Application Patent event code: PE06012S01D Patent event date: 20100519 Comment text: Notification of reason for refusal Patent event code: PE06011S01I |
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| PC1202 | Submission of document of withdrawal before decision of registration |
Comment text: [Withdrawal of Procedure relating to Patent, etc.] Withdrawal (Abandonment) Patent event code: PC12021R01D Patent event date: 20110324 |
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| WITB | Written withdrawal of application |