KR20100019611A

KR20100019611A - Probe card

Info

Publication number: KR20100019611A
Application number: KR1020080078266A
Authority: KR
Inventors: 김정식; 전태운; 정두연
Original assignee: 주식회사 아이엠
Priority date: 2008-08-11
Filing date: 2008-08-11
Publication date: 2010-02-19

Abstract

The present invention relates to a probe card, according to the present invention probe probes in contact with the pad provided on the detection object; A probe block provided on a lower side of a probe substrate on which a plurality of probe needles are mounted; A main board positioned on an upper side of the probe block and having a circuit pattern for transmitting an electrical signal to the probe needle; A main frame that reinforces the main board on an upper surface of the main board; A subframe positioned above the main frame and fastened by the probe block and the fastening means with the main substrate and the main frame interposed therebetween to support the probe block; And a support block mounted to the main frame and fastened to the subframe. The probe block may be tilted with respect to the main substrate by the support block so that a plurality of the probe needles can be in contact with each of the pads provided in the detection object at a time. A technique for suppressing deformation of a probe card during inspection is disclosed.

Description

Probe card

The present invention relates to a probe station for inspecting electronic components, and more particularly, to a probe card mounted and used in the probe station.

In general, a semiconductor device is manufactured through a fabrication process of forming a pattern on a wafer and an assembly process of assembling the wafer on which the pattern is formed into respective devices.

After the fabrication process, the semiconductor device undergoes an electrical die sorting (EDS) process that inspects electrical characteristics of each device formed on the wafer prior to the assembly process.

In this case, the EDS process is performed to determine a defective device among the devices formed on the wafer. In the EDS process, a probe station is mainly used to determine whether a device is defective by applying an electrical signal to a device on a wafer and analyzing the electrical signal from the device.

The probe station for determining whether a device is defective is equipped with a probe card to transmit an electrical signal to the pad of the device.

The probe card is equipped with a large number of probes, and each probe is arranged in accordance with a pad for an external connection terminal. And the size of the pad for the external connection terminal of the electronic device is very small within several tens of micrometers. Therefore, the accuracy and flatness of the probe tip in the inspection using the probe card is very important for the probe card.

On the other hand, wafer inspection using such a probe card is inspected several times under different conditions of wafer temperature. Firstly, the die is inspected at 25 degrees Celsius at room temperature, then at 85 degrees to 105 degrees Celsius, which is the high temperature condition, and the wafer is inspected at the low temperature below zero.

In particular, during the inspection of high temperature conditions, wafer inspection is performed by applying heat to the wafer in a chuck positioned below the wafer. Only dies with good electrical signal response under all temperature conditions are passed to the assembly process. The above inspection through the probe card is carried out on each wafer produced.

In the inspection of the temperature conditions, the flatness of the probe tip and the position change amount of the probe tip due to thermal deformation increase, so that it is difficult to secure contact reliability. For example, during the inspection of high temperature conditions, not only the wafer but also the probe card are expanded together, but because the coefficients of thermal expansion are different, the position of the probe tip may be out of the pad of the device or the flatness of the probe tip may be worse. problems arise.

1 is a cross-sectional view showing an example of a probe card according to the prior art. The probe card 10 of FIG. 1 has a structure using a sub substrate 14, and the probe block 11 is fixed to the main frame 13 as a support block 15 through which the main substrate 12 passes. A plurality of probe needles 17 are mounted on the probe block 11 so as to be electrically connected to the sub board 14, and the main board is provided through an elastic pogo pin 16 provided on the sub board 14. It was a structure electrically connected to (12).

The probe card 10 secures positional accuracy and flatness of the tip of the probe needle 17 (that is, maintains the same level as the level of the tip end of the neighboring probe needle). In order to use the main frame 13 made of a material having a small coefficient of thermal expansion to the main substrate 12 as a support means and the probe block 11 was fixed to the main frame (13). However, the mainframe 13 made of a material having a small coefficient of thermal expansion has a problem of weak strength or weak brittleness. In addition, even if the probe block 11 or the main frame 13 is made of a material having a small thermal expansion coefficient, deformation occurs due to a characteristic difference from the main substrate 12 having a large thermal expansion coefficient. This will seriously affect the position and flatness of the). Further, even when the flatness of the tip of the probe needle 17 is secured, the probe block 11 is fixed to the main substrate 12, so that the probe block 11 is not parallel to the wafer surface. At the same time, the pads of the wafer are prevented from contacting the pads, so that the force applied to the probe needles 17 which first come into contact with the pads is increased, resulting in shortening of the life of some probe needles 17, and even accurately contacting the pads of the highly integrated wafer. There was also a problem that arises when not.

In this regard, there is a Republic of Korea Patent No. 10-0725456 (invention name: wafer inspection probe card. Hereinafter referred to as the prior art 1) There is a support block is directly coupled to the main frame locally due to thermal expansion of the main frame Techniques are disclosed to make the probe block less affected. However, since the support block is directly connected to the main board, there is a problem that the strain due to thermal expansion of the main frame is forced to be received.

Accordingly, an object of the present invention is to provide a probe card in which the position or flatness of the probe tip is not affected during wafer inspection.

Probe card according to the present invention for achieving the above object is a probe needle in contact with the pad provided in the detection object; A probe block provided on a lower side of a probe substrate on which a plurality of probe needles are mounted; A main board positioned on an upper side of the probe block and having a circuit pattern for transmitting an electrical signal to the probe needle; A main frame that reinforces the main board on an upper surface of the main board; A subframe positioned above the main frame and fastened by the probe block and the fastening means with the main substrate and the main frame interposed therebetween to support the probe block; And a support block mounted to the main frame and fastened to the subframe. The subframe may be tilted with respect to the mainframe by the support block so that the lower surface of the main board and the lower surface of the subframe are parallel to each other.

Here, the support block is located on the center axis line of the main substrate, the fastening means is coupled so that the central portion of the support block and the central portion of the sub-frame is connected to form a connecting shaft, the connecting shaft is the main substrate Another feature is that it can be moved to have a random angle with respect to the central axis of the.

Here, the support block is a supporter which is fastened by the subframe and the fastening means; And a supporter frame fixed to the main frame and having a predetermined space in which the supporter is installed and supported to move. It is another feature to include a.

Furthermore, the supporter has a fastening hole penetrating the center of the supporter, and a fastening means for fastening the subframe and the support block is inserted into a fastening hole formed in the supporter and fastened to a groove formed in the subframe. It is another feature that it is.

In this case, a predetermined separation space is provided between the support block and the main board.

In this case, the support block and the subframe may be fastened only at the center of the support block and at the center of the subframe.

Probe card according to the present invention for achieving the above object is a probe needle in contact with the pad provided in the detection object; A probe block provided on a lower side of a probe substrate on which a plurality of probe needles are mounted; A main substrate positioned above the probe block and having a circuit pattern for transmitting an electrical signal to the probe needle; A main frame that reinforces the main board on an upper surface of the main board; A subframe positioned above the main frame and fastened by the probe block and the fastening means with the main board and the main frame interposed therebetween to support the probe block; And a support block mounted to the main frame and fastened to the subframe so as to be positioned on a vertical center line of the main board. It includes, The fastening of the support block and the subframe is characterized in that made only in the central portion of the support block and the central portion of the subframe.

Probe card according to the present invention for achieving the above object is a probe needle in contact with the pad provided in the detection object; A probe block provided on a lower side of a probe substrate on which a plurality of probe needles are mounted; A main substrate positioned above the probe block and having a circuit pattern for transmitting an electrical signal to the probe needle; A main frame that reinforces the main board on an upper surface of the main board; A subframe positioned above the main frame and fastened by the probe block and the fastening means with the main substrate and the main frame interposed therebetween to support the probe block; And a support block mounted to the main frame and fastened to the subframe so as to be positioned on a vertical center line of the main board. It includes, characterized in that a predetermined space is provided between the support block and the main substrate.

Here, the subframe is screwed to the subframe to fix the tilted state with respect to the mainframe such that the lower surface of the main board and the lower surface of the subframe are parallel to push the force to the mainframe. Pushing bolts; It is characterized by another comprising a further.

Here, the subframe is screwed to the subframe to fix the tilted state with respect to the mainframe such that the lower surface of the main board and the lower surface of the subframe are parallel to the upper surface of the mainframe. It is another feature that a ball plunger (ball plunger) is one end in contact with the groove.

Here, the screw is coupled to the subframe to secure the tilted state with respect to the main frame so that the lower surface of the main board and the lower surface of the subframe are parallel to one end pushing the main frame Pushing bolt (pushing bolt) for applying; And a pulling bolt inserted into a hole formed in a central axis of the pushing bolt and screwed to the main frame. It is characterized by another comprising a further.

According to the present invention, since the supporter of the support block supports the subframe while moving in such a way that it can be tilted variably, the flatness can be adjusted in the repeated wafer inspection, thereby reducing the accuracy of the inspection and shortening the life of the probe card.

In addition, since the influence of thermal expansion of the main board and the main frame is almost insignificant on the probe, the positional accuracy and flatness of the plurality of probe ends are improved, so that more accurate inspection is possible, thereby improving reliability of the inspection result.

In addition, since there is a predetermined space between the main board and the support block, heat transfer to the subframe is suppressed.

In addition, since the influence of the thermal expansion of the main substrate and the main frame has little effect on the probe block and the subframe, a material having a large thermal expansion coefficient but strong brittleness can be used, thereby improving the durability of the probe card.

Hereinafter, a preferred embodiment with reference to the accompanying drawings to be described in more detail with respect to the present invention will be described.

2 is an exploded cross-sectional view schematically showing the disassembled probe card according to an embodiment of the present invention, Figure 3 is an assembly cross-sectional view schematically showing a cross section of the probe card according to an embodiment of the present invention, Figure 4 is 5 is a partially enlarged view illustrating an enlarged center portion of a probe card according to an embodiment of the present invention, and FIG. 5 is a cross-sectional view schematically illustrating a center portion of the probe card according to an embodiment of the present invention.

6 is an exploded view schematically showing a support block of a probe card according to an embodiment of the present invention.

2 to 6, the probe card 100 according to the embodiment of the present invention includes a probe needle 111, a probe block 110, a main board 120, a main frame 130, and a subframe 140. ) And a support block 150.

For convenience of description, the surface direction of the main board 120 on which the probe needle 111 and the probe block 110 are located is lower, and the main board 120 on which the main frame 130 and the subframe 140 are located. The surface direction will be referred to as the upper side.

The probe needle is in contact with a pad (not shown) provided in the test object. Here, the detection object refers to, for example, an electronic device implemented on a silicon wafer, and the pad refers to a contact terminal for testing whether the electronic device is normally manufactured. As the probe needle is in contact with the pad, the electronic device receives an electrical signal to determine whether the electronic device is good.

The probe needle 111 has an elastic force as a conductive conductor. In the case of the cantilever type probe needle, a soldering part (not shown) soldered to the substrate, a probe part (not shown) contacting the pad of the device with elastic force, and a beam part connecting the soldering part and the probe part and supporting the probe part ( Not shown).

A plurality of probe needles 111 are provided on the probe substrate of the probe block 110.

The probe block 110 includes a probe needle 111, a probe substrate (not shown), a probe bar 112, a sub substrate 113, and a conductive member (not shown).

The probe block 110 has a probe substrate on which a plurality of probe needles 111 are mounted on a lower side thereof. The probe block 110 is located below the main substrate 120. In addition, current is supplied between the probe needle 111 and the circuit pattern of the main substrate 120. The probe block 110 receives an electrical signal coming through the main board 120 through an interposer (or pogo pin, interface pin, etc.).

For example, the probe block 110 is provided with an interposer having elasticity, for example, a sub substrate 113 on which the pogo pins 114 are mounted. The pogo pin 114 is connected to a pad (not shown) provided on the lower side of the main substrate 120 to be electrically connected to the circuit pattern formed on the main substrate 120. The pogo pin 114 has elasticity and is stably connected to a pad (not shown) provided on the lower side of the main substrate 120 as the probe block 110 is fastened to the subframe 140 to be described later. Conversely, the pogo pin 114 may be provided on the lower side of the main substrate 120, and a pad (not shown) may be provided on the sub substrate 113 to be energized.

A probe board on which the probe needle 111 is mounted is provided on the lower side of the probe block 110, and is electrically connected to the probe needle 111 to receive an electrical signal transmitted through the pogo pin 114. have. The probe block 110 may be made of a material having a low coefficient of thermal expansion in order to maintain positional accuracy and flatness of the tip of the probe needle 111. For example, the material may be made of a material such as ceramic, invar, and novinite.

The main board 120 is positioned above the probe block 110 and has a circuit pattern for transmitting an electrical signal to the probe needle 111. The electrical signal coming from the probe station (not shown) is passed to the probe needle 111 through the circuit block of the main board 120, the probe block 110 to be described later, the electrical signal transferred to the probe needle 111 Is delivered to the pad (not shown) provided in the detection object. The main substrate 120 has a hole 122 for fastening the probe block 110 and the subframe 140. And it is fastened by the main frame 130 and the fastening means (132, 134).

The main board 120 is a printed circuit board (PCB) board and may be generally made of a material constituting the board, for example, FR-4, BT resin, or the like.

The main frame 130 is located on the upper side of the main substrate 120 (that is, the opposite side of the surface on which the probe block 110 is installed in the main substrate 120) to reinforce the main substrate 120. In more detail, one side of the main frame 130 is fastened by the fastening means 134 and 132 to be in contact with the main board 120 to suppress physical deformation of the main board 120.

Here, the main frame 130 and the main substrate 120 are coupled using a fastening means, for example, a bolt 135. A hole 133 is formed in the main frame 130 to be coupled using the bolt 135.

The main frame 130 is provided with predetermined spaces 135 and 136 for mounting the support block 150 to be described later.

The main frame 130 is for reinforcing the main substrate 120 and preferably has a thermal expansion coefficient that is not significantly different from that of the main substrate. For example, when FR-4 having a thermal expansion coefficient of 14 to 15 × 10 -6 of the main board 120 is used, the main frame 130 is made of S45C (11 × 10 ^-6 ), SUS having a similar thermal expansion coefficient. 420 (10.3 × 10 ^-6 ) and the like can be used.

The subframe 140 is located above the main frame 130 located above the main board 120. That is, the upper side of the main frame 130 coupled to the upper surface of the main substrate 120 is located.

Subframe 140 is coupled to the probe block 110 as a fastening means. Here, the fastening means may be an example of the bolt 145. The bolt 145 is inserted into the hole 142 provided in the subframe 140 to couple the subframe 140 and the probe block 110 to form a groove formed in each of the mainframe 130 and the main substrate 120. It passes through the bushing 146 inserted into the 131, 122. Here, a bushing 146 is inserted into the grooves 131 and 122 formed in the main frame 130 and the main substrate 120, respectively. The bolt 145 penetrates through the bushing 146 to fit into the groove 115 formed in the probe block 110 and couples the subframe 140 and the probe block 110.

The bushing 145 is preferably made of a material such as ceramic as a material having a similar coefficient of thermal expansion to the probe block 110. The subframe 140 is fastened by the probe block 110 and the fastening means to support and reinforce the probe block 110.

Subframe 140 is preferably made of a material similar to the coefficient of thermal expansion and the wave block 110 in order to minimize the deformation of the coupling state due to thermal expansion. For example, the probe block 110 may be made of a material such as invar or ceramic. The support block 145 may also be made of a material having a similar coefficient of thermal expansion to the subframe 140 and the probe block 110.

Meanwhile, a handle 149 may be provided in the subframe 140 to facilitate the handling of the probe card 100.

The support block 150 is mounted on the main frame 130 and fastened to the subframe 140. The support block 150 mounted on the mainframe 130 is fastened to the subframe 140 to support the subframe 140, and the subframe 140 variably tilts the mainframe 130. To be possible.

The probe block 110 is fastened to and supported by the subframe 140. Therefore, the probe block 110 is also tilted together with the subframe 140. In addition, a probe substrate (not shown) is provided on the lower side of the probe block 110.

Since the probe substrate has a plurality of probe needles 111, the virtual surface formed by the ends of the plurality of probe needles 111 (that is, the probe end of the probe needle) is variable with respect to the main substrate 120. ) Can be tilted. Accordingly, the probe block 110 is tilted with respect to the main substrate 120, so that the ends of the plurality of probe needles 111 may be in equilibrium with the surface of the test object such that the ends of the plurality of probe needles 111 may be in contact with the pad of the test object at one time.

Here, to explain more easily that the variable is tilted means that the degree of tilting can be tilted fluidly when tilted. That is, the angle between the subframe 140 (or the probe block 110 parallel to the subframe 140 and the surface (not shown) virtually formed by the ends of the probe needles) formed with the main substrate 120 is tilted. Whenever the test object is tested, not the angle having a fixed value, the subframe (or the probe block 110 parallel to the subframe 140 and the surface of the ends of the probe needles 111) are virtually formed. ) Have the flexibility to have various angles so that they can be parallel.

The support block 150 may be variably tilted as described above.

The support block 150 is supported on the central axis line 171 perpendicular to the surface of the main board 120 passing through the center of the main board 120 (ie, located above the center of the main board 120). It is preferable to be mounted to the main frame 130 so that the center of the block 150 is located.

For example, as shown in FIG. 4, spaces 135 and 136 to which the support blocks 150 can be mounted are provided in the main frame 130, and the support blocks 150 are inserted into the spaces 135 and 136. Is mounted. The mounting support block 150 may be mounted using a fastening means so as not to fall out, and may be fastened by a bolt 161 which is a fastening means.

The bolt 161 is inserted into the bolt groove 137 formed in the main frame 130, and the support block 150 is mounted on the main frame 130 as the head of the bolt 161 so as not to be pulled out. Therefore, the support block 150 is mounted on the main frame 130.

The support block 150 may include a supporter 155 and supporter frames 151 and 152.

The supporter 155 is fastened to the subframe 140 by fastening means. The support block 150 is mounted at the center of the main frame 130, and the support block 155 of the support block 150 is connected to the center of the subframe 140 and the main frame 130. 130) in the central part.

In addition, the supporter frames 151 and 152 are provided with a predetermined space 153 in which the supporter 155 is mounted and supported and movable. The supporter 155 is mounted in the predetermined space 153 so that the supporter 155 can move in the space 153.

Since the supporter 155 coupled to the subframe 140 may move in the predetermined space 153 provided in the supporter frames 151 and 152 mounted on the main frame 130, the probe block 150 may be moved by the supporter block 150. 110 may be variably tilted with respect to the main substrate 120.

As shown in the supporter 155, a fastening hole 156 penetrating the center of the supporter 155 is formed.

The bolt 157, which is a fastening means, is inserted into the fastening hole 156. The body and the end of the inserted bolt 157 penetrate the supporter 155 and fit into the groove 143 formed in the subframe 140. The head of the bolt 157 is formed so that the diameter of the head of the bolt 155 is larger than the diameter of the fastening hole 156 so as not to be inserted into the fastening hole 156 of the supporter 155.

When the supporter 155 and the subframe 140 are fastened by the bolt 157 as the fastening means, the center line 173 of the bolt 157 penetrating the center of the supporter 155 is the surface of the subframe 140. Is perpendicular to

The supporter 155 coupled to the subframe 140 may be mounted and moved in a predetermined space 153 provided in the supporter frames 151 and 152. The supporter frames 151 and 152 are provided with a predetermined space 153 for providing the supporter 155. In other words, the supporter frames 151 and 152 are provided with a predetermined space 153 on which the supporter 155 is mounted, supported and movable. As shown, the outer shape of the supporter 155 is a sphere shape, and the predetermined space 153 provided in the supporter frames 151 and 152 in accordance with the sphere shape is also a rectangular space.

Therefore, the supporter 155 may move so that the subframe 140 fastened to the supporter 155 may be tilted without being pulled out of the predetermined space 153 provided in the supporter frames 151 and 152. The centerline 173 of the bolt 157 penetrating the center of the supporter 155 may be directed in various directions as the supporter 155 moves.

In its basic form, the centerline 173 of the bolt 157 is perpendicular to each of the mainframe 130 and the subframe 140. When the supporter 155 moves in a state in which the supporter 155 is mounted on the supporter frames 151 and 152, the center line 173 of the bolt 157 is inclined with respect to the center line 171 of the main board 120 at a predetermined angle.

Since the subframe 140 is fixed perpendicularly to the centerline 173 of the bolt 157, the centerline 173 of the bolt 157 is inclined with respect to the mainframe 130 on which the supporter frames 151 and 152 are fixedly mounted. As a result of the change of direction, the subframe 140 is tilted with respect to the main frame 130 because the subframe 140 is out of parallel with the main frame 130.

Since the subframe 140 is fastened by the probe blocks 110 and the fastening means 145 and 115 and maintains parallel to the probe blocks 110, the probe blocks 110 are tilted with respect to the main substrate 120. The probe block 110 is coupled to a probe substrate on which a plurality of probe needles 111 are mounted. Therefore, virtual surfaces formed by the ends of the plurality of probe needles 111 are also tilted with respect to the main substrate 120. Therefore, even though the main substrate 120 and the surface of the test object are not parallel to each other, virtual surfaces formed by the ends of the probe needle 111 may be in contact with the pad of the test object while being parallel to the surface of the test object.

The subframe 140 is coupled to the probe block 110 and the support block 150. It is not directly fastened to the main frame 130 and the main substrate 120. And since the support block 150 is mounted on the central portion of the main frame 130, the fastener between the supporter 155 and the subframe 140 of the support block 150 is the central portion of the subframe 140 and the main frame ( 130) in the central part.

Since the subframe 140 and the probe block 110 are combined without being directly fixed to the main board 120 and the main frame 130, the subframe with respect to the main board 120 and the main frame 130 in thermal expansion. 140 and the probe block 110 is an independent structure. In addition, since the thermal expansion coefficients of the subframe 140 and the probe block 110 are made of similar materials, the influence of the thermal expansion of the main substrate 120 and the shape deformation due to heat are greatly reduced. Therefore, the tip of the probe needle 111 on the pad of the device can maintain the correct position and can easily secure the flatness.

In addition, since the subframe 140 is not directly fastened to the mainframe 130 and the main board 120, the subframe 140 is expanded with respect to the central part of the subframe fastened to the supporter, that is, the origin. In other words, the thermal expansion point is unified into one virtual point. The center point of thermal expansion is unified with the center point of the probe card so that the occurrence of the above strain is suppressed or minimized. Heat torsion is significantly suppressed.

In addition, the mainframe 130 has a large coefficient of thermal expansion, but can be secured by using a strong material for brittleness and strength. Even if the main frame 130 and the main substrate 120 expand by receiving heat, the probe block 110 and the subframe 140 having a small coefficient of thermal expansion are not significantly affected.

3 to 5, a predetermined separation space 136 is provided between the support block 150 and the main substrate 120. Since there is a predetermined separation space 136, heat transfer is not directly performed from the main board 120 to the support block 150, and heat transfer is considerably suppressed. Therefore, the coefficient of thermal expansion of the support block 150 need not be largely considered, and thus the material selection of the support block becomes considerably wider.

As the supporter 155 of the support block 150 moves so that each of the plurality of probe needles of the probe block 110 can be temporarily contacted with the pad of the probe, the probe block 110 is tilted variably with respect to the main substrate 120. As a result, the flatness can be controlled during repeated wafer inspections, thereby reducing the accuracy of inspections and shortening the life of the probe card.

In addition, since the influence of thermal expansion of the main board and the main frame is almost insignificant on the probe, the positional accuracy and flatness of a plurality of probe ends are improved, so that more accurate inspection is possible, thereby improving reliability of the inspection result.

On the other hand, the pushing bolt (pushing bolt), pulling bolt (pulling bolt), ball plunger (ballplunger) may be further included in the probe card, which will be described below with reference to FIGS. 7 and 8.

7 is a view schematically showing a plane and a partial cross-section of the probe block according to an embodiment of the present invention, Figure 8 is a partial cross-sectional view schematically showing a ball plunger according to an embodiment of the present invention.

Referring to FIGS. 7 and 8, the pushing bolt 261 may include a subframe (parallel) such that the bottom surface of the main board 120 (see FIG. 3) of the probe card and the bottom surface of the subframe 240 are parallel to each other. In order to fix the tilted state with respect to the main frame 230, the 240 is screwed to the subframe 240 to apply a pushing force to the main frame 230.

Here, the description of the application of the 'pushing force' is performed so that the gap between the subframe 240 and the mainframe 230 is no longer narrowed by the pushing bolt 261 (a kind of spacer and The same role), and this meaning is referred to as 'pushing out' or 'pushing force'.

The pulling bolt 262 is inserted into a hole formed in the central axis of the pushing bolt 261 to screw the main frame 230 to pull the main frame 230.

The pushing bolt 261 screwing to the subframe 240 pushes the main frame 230, and the pulling bolt 262 screwing to the pushing bolt 261 is formed on the central axis of the pushing bolt 261. Since the main frame 230 is pulled, as a result, the relative positions of the subframe and the main frame are more strongly held.

The ball plunger 270 has a subframe 240 with respect to the main frame 230 such that the bottom surface of the main board 120 (see FIG. 3) of the probe card and the bottom surface of the subframe 240 are parallel to each other. In order to fix the tilted state, one end contacts the groove formed on the upper surface of the main frame 230 by applying screw force to the main frame 230. (Here, the 'pushing force' is the same as the meaning of the 'pushing force' described in the pushing bolt above.) An example of a ball plunger is illustrated in FIG.

One end of the ball plunger 270 is in contact with the groove of the main frame 230, there is a ball, the ball plunger 270 is screwed with the subframe 240, the ball of the ball plunger 270 and the groove contact The main frame 230 is pushed out.

Therefore, as shown in FIG. 7, the pushing bolt, the ball plunger and the pulling bolt are positioned at appropriate points so that the bottom surface of the main board 120 (see FIG. 3) of the probe card and the bottom surface of the subframe 240 are parallel to each other. In order to achieve this, the subframe 240 can be more firmly fixed to the tilted state with respect to the mainframe 230.

As described above, the detailed description of the present invention has been made by the embodiments with reference to the accompanying drawings, but since the above-described embodiments have only been described with reference to preferred examples of the present invention, the present invention has been described above. It should not be understood to be limited only to the embodiments, and the scope of the present invention should be understood by the claims and equivalent concepts described below.

1 is a cross-sectional view showing an example of a probe card according to the prior art.

Figure 2 is an exploded cross-sectional view schematically showing the disassembled probe card according to an embodiment of the present invention.

3 is an assembly cross-sectional view schematically showing a cross section of the probe card according to an embodiment of the present invention.

Figure 4 is an enlarged partial view showing the central portion of the probe card according to an embodiment of the present invention.

5 is a cross-sectional view schematically showing the center of the probe card according to an embodiment of the present invention.

7 is a view schematically showing a plane and a partial cross-section of the probe card according to an embodiment of the present invention.

8 is a perspective cross-sectional view schematically showing a ball plunger according to an embodiment of the present invention.

110: probe block 120: main board

130: main frame 140: subframe

150: Support Block

Claims

A probe needle in contact with a pad provided in the test object;

A probe block provided on a lower side of a probe substrate on which a plurality of probe needles are mounted;

A main board positioned on an upper side of the probe block and having a circuit pattern for transmitting an electrical signal to the probe needle;

A main frame that reinforces the main board on an upper surface of the main board;

A subframe positioned above the main frame and fastened by the probe block and the fastening means with the main substrate and the main frame interposed therebetween to support the probe block; And

A support block mounted to the main frame and fastened to the subframe; Including,

And the subframe may be tilted with respect to the mainframe by the support block such that the lower surface of the main board and the lower surface of the subframe are parallel to each other.

The method of claim 1,

The support block is positioned on the center axis line of the main substrate, and is fastened so that the central portion of the support block and the central portion of the subframe are connected by fastening means to form a connecting shaft, and the connecting shaft is formed on the main substrate. Probe card, characterized in that movable to be able to have a variable angle with respect to the central axis.

The method according to claim 1 or 2,

The support block

A supporter fastened to the subframe by a fastening means; And

A supporter frame fixed to the main frame and having a predetermined space in which the supporter is installed and supported to move; Probe card comprising a.

The method of claim 3,

The supporter is formed with a fastening hole penetrating the center of the supporter,

The fastening means for fastening the subframe and the support block is a probe card, characterized in that the bolt is inserted into the fastening hole formed in the supporter is fastened to the groove formed in the subframe.

The method of claim 1,

Probe card, characterized in that a predetermined space is provided between the support block and the main substrate.

The method of claim 1,

And the fastening of the support block and the subframe is made only at the center of the support block and at the center of the subframe.

A probe needle in contact with a pad provided in the test object;

A main substrate positioned above the probe block and having a circuit pattern for transmitting an electrical signal to the probe needle;

A support block mounted to the main frame and fastened to the subframe so as to be positioned along a vertical center line of the main board; Including,

The method of claim 7, wherein

A probe needle in contact with a pad provided in the test object;

And a predetermined space is provided between the support block and the main board.

The method according to any one of claims 1, 7, and 9,

Pushing bolts that are screwed to the subframe to apply a pushing force to the mainframe to fix the subframe tilted with respect to the mainframe such that the lower surface of the main board and the lower surface of the subframe are parallel to each other. (pushing bolt); Probe card further comprising a.

The method according to any one of claims 1, 7, and 9,

The subframe is screwed to the subframe to fix the tilted state with respect to the mainframe such that the lower surface of the main board and the lower surface of the subframe are parallel to the groove formed on the upper surface of the mainframe. Probe card further comprises a ball plunger (ball plunger) that one end is in contact.

The method according to any one of claims 1, 7, and 9,

In order to fix the state in which the subframe is tilted with respect to the mainframe such that the lower surface of the main board and the lower surface of the subframe are parallel to each other, screwing is applied to the subframe so that one end pushes the mainframe. Pushing bolts; And

A pulling bolt inserted into a hole formed in a central axis of the pushing bolt and screwed to the main frame; Probe card further comprising a.