KR20100009801A - Chemically amplified positive extremely high sensitive organic insulator composition and method of foming organic insulator using thereof - Google Patents

Abstract

PURPOSE: A high sensitive organic insulator composition is provided to ensure low film reduction of an unexposed part with high-sensitivity in development, and to prevent the degradation of transmittance and the reduction of film thickness, and to maintain high transmittance. CONSTITUTION: A chemically amplified positive extremely high sensitive organic insulator composition comprises a binder resin, a photoacid generator, and solvent. The binder resin comprises a polymer or copolymer containing a monomer with an acid-labile acetal blocking group represented by chemical formula 1. In chemical formula, R1 and R2 are an alkyl group.

Description

Chemically Amplified Positive Extremely High Sensitive Organic Insulator Composition And Method of Foming Organic Insulator Using Thereof}

The present invention relates to a chemically amplified positive type ultra-high sensitivity organic insulating film composition and a method for forming an organic insulating film using the same. More specifically, the present invention not only exhibits very high sensitivity in forming an organic insulating film of a display material such as a liquid crystal display device, but also has a positive type having excellent physical properties such as low dielectric constant, UV transmittance, residual film rate, pattern formation property, and chemical resistance. An organic insulating film composition used to form an organic insulating film and a method of forming an organic insulating film using the same.

In display devices such as thin film transistor (TFT) type liquid crystal displays, inorganic protective films such as silicon nitride have conventionally been used as protective films for protecting and insulating TFT (Thin Film Transistor) circuits. There is a problem that it is difficult to improve the aperture ratio due to this high, and in order to overcome this, the demand for an organic dielectric film having a low dielectric constant is increasing.

As such an organic insulating film, a photosensitive resin, which is a polymer compound which is chemically reacted by light and electron beams and changes in solubility in a specific solvent, is generally used. By change and crosslinking reaction. In particular, the organic insulating film material utilizes a change characteristic of solubility in a solvent such as an aqueous alkali solution after exposure.

The organic insulating film is classified into a positive type and a negative type according to the solubility of the sensitized part. In the positive type photoresist, the exposed portion is dissolved by the developer, and in the negative type photoresist, the exposed portion is not dissolved in the developer and the unexposed portion is dissolved to form a pattern.

Among these, the positive type organic insulating film can eliminate the use of the organic developer used in the negative type organic insulating film by using an aqueous alkali solution, which is advantageous in terms of working environment and theoretically, Since the swelling phenomenon can be prevented, the resolution is improved. In addition, after the organic film is formed, it is easy to remove by the stripping solution, and the substrate recovery and reusability are greatly improved by removing the organic film when a defective panel is generated during the process.

In particular, in forming an insulating film of a liquid crystal display device as such an organic insulating film, the insulating film must not only have excellent insulation property but also have low thermal expansion property to reduce stress at an interface when coated on a substrate, and physically. It must have a strong character.

In addition, the insulating film, the protective film, and the like inevitably form an interface with a metal, a silicon compound, and the like, wherein excellent interface adhesion is a very important factor in terms of reliability of the device. The insulating film is subjected to a fine pattern forming process to provide interconnection passages between the circuits. If the photoresist is provided to the insulating film itself, the process of forming a pattern by applying a separate photoresist on the conventional insulating film can be reduced. It is possible to form a fine pattern.

For this reason, the positive type organic insulating film composition includes a photosensitive compound (PAC) that provides photosensitivity to a binder resin, such as an acrylic photosensitive resin used as a typical binder resin, a noblock resin type, a polyimide, or a siloxane type. Research into applying the added composition has been actively conducted, and recently, the insulating film has been commercialized and various devices using the same have been released.

Sensitivity is mentioned as an important characteristic among the characteristics calculated | required by the said organic insulating film. Since the improvement of the sensitivity enables a significant reduction in the production time in the industrial production of the display apparatus, in the present situation in which the demand for liquid crystal display devices and the like is remarkably increasing, the sensitivity is the most required for this kind of organic insulating film. It is recognized as one of the important characteristics.

However, organic insulating film compositions using acrylic photosensitive resins and PACs, which are conventionally used, are often insufficient in sensitivity, and in particular, they do not have sufficient resolution because the solubility difference between the portion irradiated with ultraviolet rays and the portion not irradiated is not large. many.

For example, US Pat. No. 4139391 discloses a photosensitive resin organic insulating film composition prepared by using a copolymer of an acrylic acid compound and an acrylate compound as a binder resin and using an acrylate compound as a multifunctional monomer. However, the difference in solubility between the exposed portion and the non-exposed portion is not large enough, so that the development characteristics are not good, and the binder resin, which should remain during the development process, is partially dissolved in the developing solution to obtain a fine pattern of 15 microns or less.

As described above, the conventional organic insulating film was not able to sufficiently satisfy the problem of sensitivity. Although it is possible to improve the sensitivity by increasing the solubility or development time of the alkaline developer for the polymer used, this method is limited, and also the solubility of the unexposed portion occurs, which lowers the overall residual film rate. In the large display substrate, there existed a fault which causes a film bleeding and a pattern damage.

In addition, the organic insulating film composition has excellent process resistance such as heat resistance, solvent resistance, and long-term high temperature firing resistance, good adhesion with a support layer, and wide process margin for forming a pattern under various process conditions according to the intended use. In addition, various characteristics such as high sensitivity and high permeability, film bleeding after development, and low loss by the developer are required.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and its object is sufficiently high sensitivity, but the film reduction of the unexposed portion during development is small, the film thickness after development and the decrease in transmittance do not occur, and even after firing at high temperature after film formation. The present invention provides a chemically amplified positive ultra-high sensitivity organic insulating film composition capable of maintaining high transmittance and an organic insulating film forming method using the same.

The positive type organic insulating film composition for organic insulating films by this invention for solving the said subject contains a binder resin, a photo-acid generator, and an organic solvent.

Hereinafter, the chemically amplified ultra-high sensitivity positive type organic insulating film composition according to the present invention will be described.

1. Binder Resin

The binder resin in the present invention basically contains a monomer containing an acid-decomposable acetal protecting group represented by the following general formula (1) (typically, a polyethylethoxy styrene ((p-1-etylethoxyl) styrene, PEES) group) It comprises a polymer or a copolymer containing the polymerized as a repeating unit.

<Formula 1>

(In Formula 1, R ₁ , R ₂ is an alkyl group, preferably an ethyl group or a methyl group.)

The acid-decomposable acetal protecting group (primarily PEES group) of Formula 1 may be applied to a composition used as a photoresist of a semiconductor, but in a liquid crystal display (LCD) manufacturing field as compared to a silicon wafer used in a semiconductor device manufacturing field The state of the substrate surface to which the photoresist composition is applied is very different in LCD manufacturing and semiconductor device manufacturing, for example, a large substrate is used, an extremely fine unevenness is present on the surface of the LCD manufacturing substrate, and a deformation of the substrate itself is also present. Thus, the photoresist compositions used to make both will be technically different.

Specifically, in applying the acid-decomposable acetal protecting group (hereinafter, referred to as 'PEES group') of the formula (1) including the PEES group to a photoresist used as a specific layer for semiconductors, It is mainly applied to increase the resolution by using KrF excimer laser exposure technology of 248nm wavelength, and because the lower layer is etched and removed, characteristics such as light transmittance and residual film ratio are not considered. However, as in the present invention, when the PEES group is applied to the organic insulating film for a liquid crystal display device, since the organic insulating film remains after pattern formation, the required properties will be completely different.

Accordingly, the inventors of the present invention, as a result of using the PEES group of the general formula (1) in the organic insulating film applied to display devices such as liquid crystal display device, by controlling the solubility in the composition, the transmittance required as a characteristic of the organic insulating film and It was confirmed that not only the effect of improving the residual film ratio was exhibited, but also the high transmittance characteristics in the visible light region of 400 nm or more. Hereinafter, various embodiments of the binder resin using the PEES group of Chemical Formula 1 will be described.

Embodiment of Binder Resin

The binder resin including the PEES group of Chemical Formula 1 may include a copolymer obtained by polymerizing a compound represented by the following Chemical Formulas 2 to 5 by further including other functional groups in the acetal protecting group of Chemical Formula 1.

<Formula 2>

<Formula 3>

<Formula 4>

<Formula 5>

(In the formula, R ₃ , R _{4 ,} and R ₆ is an alkyl group, R ₅ is a hydrogen atom, an alkyl group, an alkoxy group, an acetoxy group or a carboxylic acid group, X is an epoxide group, oxetane ), A tetrahydrofuran group, a tetrahydropyran group, an oxocane group or a phenyl group, Y represents an alkoxy, acetoxy group, carboxylic acid group, or hydroxy group, Z represents an alkyl group, and a, b, c, d, e, f, g and h are molar ratios of each polymerized unit, and 0 <a <1, 0 ≦ b <1, 0 ≦ c <1, 0 ≦ d <1, 0≤e <1, 0≤f <1, 0≤g <1, 0≤h <1, and the sum of at least one of a, b, c, d, e, f, g and h is 1 to be)

Herein, the copolymer may be formed by polymerizing any one of the compounds represented by the following Chemical Formulas 2 to 5, or may be made by simply blending the copolymers. However, when mixing each polymer, at least one of the compounds constituting the mixture should have a PEES group represented by the formula (1). That is, when the copolymer is mixed, at least one of the compounds to be mixed should have a value of a> 0 indicating the molar ratio of the PEES group, and the a value in the remaining mixed compound may be a≥0.

As a specific example, a monomer which is represented by the following Chemical Formula 2-1 by further including a (meth) acryl group in the acetal protecting group of Chemical Formula 1 may be mentioned.

<Formula 2-1>

R ₁ And R ₂ Mainly applies to methyl or ethyl groups.

Specifically, when the PEES represented by Chemical Formula 1 is prepared in the form of Chemical Formula 2-1 (4-hydroxystyrene-co-4- (1ethylethoxystyrene), EE-PHS), the ethylethoxy group Is removed by the photoacid generator, and serves to form a pattern while the exposed organic insulating film is removed by the solution. When the PEES is included in combination with other monomers, the sensitivity is excellent, and thus an organic insulating film composition can be easily obtained.

Particularly, in Formula 2 or Formula 5, when the (meth) acryl group is composed of a plurality of connected forms, the alkyl groups R ₃ and R ₄ included therein not only increase chemical resistance but also easily control the shape of the pattern, and improve adhesion. Can be improved.

That is, as one to three various types of (meth) acrylate groups are included in the formula (2) or formula (5), such as transmittance, exposure amount, residual film rate, etc. There is a difference in properties. The detailed example of the said (meth) acrylate and the polymerization method of the binder resin using the same are mentioned later.

The average molecular weight of the binder resin for producing a desirable effect as a protective film for a liquid crystal display device is preferably 500 to 50,000, and more preferably 5,000 to 20,000. Moreover, it is preferable that the dispersion degree is 1.0-5.0.

The binder resin including the PEES group is a photosensitive polymer resin, which improves the etching resistance of the organic insulating film, and is deprotected at a very high rate in the form of chemical amplification by the action of an acid generated by the photoacid generator in the exposure process, so that the solubility is high. On the other hand, the non-exposed portion exhibits sufficient dissolution inhibiting ability to increase the contrast and resolution of the organic insulating film composition, so that a fine circuit pattern can be formed even under a light source having a single wavelength or a complex wavelength such as i, g, and h-rays. .

A positive organic insulating film composition is obtained by adding a photoacid generator and an organic solvent to the binder resin, and in the present invention, the photoacid generator may generate an acid when exposed to active radiation, and does not adversely affect the protective film formation. Any material may be used, but it is preferable to use a material capable of maintaining appropriate light absorption at a wavelength of 250 to 400 nm and transparency of the organic insulating film material in the visible light region of 400 nm or more.

2. Photoacid generator

The photoacid generator is a compound that generates an acid by irradiation with actinic light or radiation, and the photoacid generator used in the present invention includes a diazonium salt system, a phosphonium salt system, a sulfonium salt system, an iodonium salt system, and an imide sulfo Nate type, oxime sulfonate type, diazo disulfone type, disulfone type, ortho-nitrobenzyl sulfonate type, and a triazine type compound can be used individually or in mixture of 2 or more. For example, a sulfonium salt-based photoacid generator having a structure of Formula 6 may be used.

<Formula 6>

 Here, the content of the photoacid generator is preferably 0.2 to 11 parts by weight, more preferably 1 to 5 parts by weight based on 100 parts by weight of the binder resin. When the content of the photoacid generator is added in less than 0.2 parts by weight with respect to 100 parts by weight of the binder resin, it is difficult to see the effect as a photoacid generator, and when it exceeds 11 parts by weight,

3. Solvent

As the solvent, any one of organic solvents such as alcohols, acetates, ethers, glycols, ketones, and carbonates may be used alone or in combination of two or more thereof.

Specifically, it is preferable to use propylene glycol methyl ether acetate (PGMEA) because it is excellent in coating property and excellent in film thickness uniformity of the organic insulating film on a large glass substrate.

4. Additive

In the present invention, additives may be used if necessary in addition to the photoacid generator and the solvent. Examples of such additives are thermal stabilizers, thermal crosslinkers, photocuring accelerators, surfactants, base quenchers, antihalation agents, antioxidants, adhesion aids, light stabilizers, and defoamers (deaerator / defoamers). Etc. can be mentioned. If necessary, the additives listed above may be used alone or in combination.

Thermal cross-linker (thermal cross-linker) is a composition to form a cross-linking reaction smoothly through UV irradiation and heat treatment when forming an organic insulating film, and is added to improve the heat resistance, polyacrylate resin, epoxy resin, phenolic resin , A melamine resin, an organic acid, an amine compound, and an anhydride compound may be used alone or in combination of two or more thereof.

In particular, the heat stabilizer is used to increase the permeability of the residual organic film by suppressing the decrease in permeability during the post-heat treatment process of the formed organic film, the type is not particularly limited, but preferably, Any of phenolic, phosphite, or lactone compounds having a structure of may be used alone or in combination of two or more thereof.

<Formula 7>

<Formula 8>

<Formula 9>

The light stabilizer is used to maximize the light resistance of the organic insulating film composition, and the type of light stabilizer having such characteristics is not particularly limited, but is preferably benzotriazole-based, triazine-based, benzophenone-based or hin One of the hindered aminoether and hindered amine compounds is used alone or in combination of two or more thereof.

The adhesion promoter and the base quencher are not particularly limited in kind, but as the adhesion assistant, any one of a sisocyanate group, an epoxy group, an acrylate group, a vinyl group, or a mercapto group may be used alone. Or an alkoxy silane compound formed by mixing two or more thereof, and as the base quencher, any one of a primary amine, a secondary amine, a tertiary amine, and an amide compound may be used. It is preferable to use.

Surfactant is used to improve the adhesion between the substrate and the organic insulating film composition, the type is not particularly limited, but preferably polyoxy lauryl ether, polyoxyethylene stearyl ether, polyoxyethylene oleyl ether And polyoxyethylene octyl phenol ether, polyoxyethylene nonyl phenol ether or polyethylene glycol dilaurate. The content of these surfactants is preferably used in an amount of 2 parts by weight or less based on 100 parts by weight of the solid component in the positive organic insulating film composition of the present invention.

In addition, generally used photocuring accelerators, antihalation agents (leveling agents), antifoaming agents, and the like can be used. If necessary, various other additives can be used to improve desired properties in addition to the additives listed above.

Next, an organic insulating film forming method of forming an organic insulating film on a display device such as a liquid crystal display using the organic insulating film composition will be described.

The organic insulating film forming method according to the present invention comprises the steps of: applying the organic insulating film composition on a substrate of a display device or on a source / drain or silicon or nitride layer formed on the substrate; Pre-bake the organic insulating film composition; Selectively exposing and developing the organic insulating film composition to form a pattern; And forming an insulating protective film by exposing and heat treating the organic insulating film composition.

 As the substrate, glass or transparent plastic resins commonly used in liquid crystal displays, organic ELs, and the like are mainly used, but are not particularly limited depending on the characteristics of the display apparatus used. For example, the metal film which comprises a gate electrode is formed on insulated substrates, such as a glass substrate, and what has the metal film as a surface layer can be used.

In the present invention, the method of coating the organic insulating film composition on the substrate or the like may include a coating method using a slit nozzle such as a spray coating method, a roll coating method, a discharge nozzle type coating method, a rotary coating method such as a central dropping spin method, There are an extrusion coating method and a bar coating method, and two or more coating methods can be combined and coated.

The applied film thickness varies depending on the application method, the solid content concentration of the composition, the viscosity, and the like, but is usually applied so that the film thickness becomes 0.5 to 100 m after drying. After the grilling step is performed, the solvent is volatilized by applying vacuum, infrared rays, or heat to obtain a non-flowable coating film after forming the coating film. Heating conditions vary depending on the type and composition of each component, but when heated to a hot plate, it is heated at 60 to 130 ° C. for 5 to 500 seconds, and when a heat oven is used to 60 to 140 ° C. It is common to heat for 20 to 1,000 seconds. Next, the selective exposure process includes excimer laser, far ultraviolet, ultraviolet light, visible light, electron beam, X-ray or g-ray (wavelength 436nm), i-ray (wavelength 365nm), h-ray (wavelength 405nm) or a mixture thereof. It is carried out while irradiating the rays. The exposure may be performed by contact, porximity, projection exposure, or the like.

In the present invention, after performing the alkali development, the organic insulating film composition is characterized in that the step of performing the entire surface exposure and heat treatment (high temperature firing). The thermal crosslinking agent is applied to the composition of the organic insulating film composition of the present invention for the high temperature firing. The heat treatment step is performed for 30 minutes to 3 hours at a temperature of 150 to 350 ℃ using a heating apparatus such as a hot plate or an oven. After the heat treatment, a completely cross-cured pattern is obtained.

For example, the organic insulating film formed as described above will be described with reference to the display device of FIG. 1. The substrate 10, the gate electrode 20, the gate insulating film 30, and the semiconductor layer 40 such as silicon nitride and the source may be described. In the laminated structure consisting of the 51, the drain 52, and the protective film 60, it is used for the gate insulating film 30 or the protective film 60. As shown in FIG.

According to the chemically amplified positive type ultra-high sensitivity organic insulating film composition according to the present invention, it has excellent sensitivity, excellent electrical characteristics, and excellent residual film ratio, and thus can be used as a substitute for the conventional positive type organic insulating film. A resist can be provided.

In addition, according to the method for forming an organic insulating film using the composition according to the present invention, as an ultra-sensitive composition, there is an effect that can significantly reduce the process margin to reduce the cost.

Hereinafter, the polymerization method of the binder resin using the polymer resin will be described with reference to specific examples.

Polymerization Method of Binder Resin ( First embodiment )

Example  1-1

The binder resin represented by the following formula (10) was prepared by the following method. In formula 10, R ₁ is a methyl group, R ₂ is an ethyl group, a is 0.3, b is 0.2, c is 0.5.

<Formula 10>

After raising PGMEA (propylene glycol methyl ether acetate) to 70 degreeC as an organic solvent, 30 mol% of p-1-ethylethoxylstyrene (PEES), 20 mol% of methyl methacrylate, styrene (Styrene) was dissolved in a monomer group consisting of 50 mol% by mixing 0.6 wt% of an initiator (2,2-azobis (2,4-dimethylpentanenitrile), Vazo 52G) with respect to the total monomers, and then mixed with PGMEA. Stir for hours and react again for 3 hours. After the addition of the initiator (Vazo 52G) 0.005% by weight relative to the total monomer, the polymerization is terminated after the reaction for 3 hours. As a result of the polymerization reaction, a binder resin having an average molecular weight of 7,000 to 10,000 was obtained.

Example  1-2

The binder resin represented by the following formula (11) was prepared by the following method. In formula 11, R ₁ is a methyl group, R ₂ is an ethyl group, a is 0.3, b is 0.2, c is 0.47, d is 0.03.

<Formula 11>

After heating PGMEA (propylene glycol methyl ether acetate) to 70 ° C, 30 mol% of Poly (1-ethylethoxyl) styrene and 20 mol% of methyl methacrylate and styrene 47 mol%, and 3 mol% of octahydro 4,7-methano-indene (FA-513 M) were dissolved with initiator (Vazo 52G) in an amount of 0.6% by weight relative to the total monomers, followed by PGMEA for 3 hours. The mixture was stirred and reacted for another 3 hours. After the addition of an initiator (Vazo 52G) 0.07% by weight relative to the total monomer, the polymerization is terminated after 3 hours of reaction. As a result of the polymerization reaction, a binder resin having an average molecular weight of 7,000 to 10,000 was obtained.

Example  1-3

The binder resin represented by the following formula (12) was prepared in the following manner. To the formula 12, R ₁ is a methyl group, R ₂ is an ethyl group, a is 0.3, b is 0.2, c is 0.36, d is 0.04, e is 0.1.

<Formula 12>

Another polymerization method is carried out in the same manner as in Example 1-2, and 10 mole% of glycidyl methacrylate is further added as a monomer, and the remaining composition is the same as the content of a to d in Chemical Formula 13 above. Added together.

Example  1-4

Binder resin represented by the following formula (13) was prepared in the following manner. In Formula 13, R ₁ is a methyl group, R ₂ is an ethyl group, a is 0.3, b is 0.15, c is 0.24, d is 0.04, e is 0.15, f is 0.12.

<Formula 13>

Another polymerization method was carried out in the same manner as in Example 1-3, and 12 mol% of hydroxypropyl methacrylate was further added as a monomer.

Example  1-5

Binder resin represented by the following formula (14) was prepared in the following manner. In Formula 14, R ₁ is a methyl group, R ₂ is an ethyl group, a is 0.3, b is 0.2, c is 0.1, d is 0.04, e is 0.1, f is 0.26.

<Formula 14>

Another polymerization method was carried out in the same manner as in Example 1-4, and 26 mol% of normal butyl methacrylate (n-buthyl methacrylate) was further added to the monomer instead of hydroxypropyl methacrylate.

Example  1-6

A binder resin represented by Formula 15 below was prepared in the following manner. In Formula 15, R ₁ is a methyl group, R ₂ is an ethyl group, a is 0.3, b is 0.15, c is 0.2, d is 0.05, e is 0.15, f is 0.05, g is 0.1.

<Formula 15>

Another polymerization method was carried out in the same manner as in Example 1-5, to which 10 mol% of hydroxy propyl methacrylate (Hydroxypropyl methacrylate) was further added.

Example  1-7

The binder resin represented by the following formula (16) was prepared in the following manner. In Formula 16, R ₁ is a methyl group, R ₂ is an ethyl group, a is 0.3, b is 0.15, c is 0.2, d is 0.05, e is 0.15, f is 0.05, g is 0.1.

<Formula 16>

The other polymerization method is carried out according to the case of Example 1-2, 15 mol% of hydroxypropyl acrylate as a monomer, 5 mol% of n-buthyl methacrylate, 3, Further 10 mol% of 3-diethyl-oxetane methacrylate (3,3-Diethyl-oxetane mathacrylate, OXE 30) was added.

Example  1-8

A polymer resin represented by the following Formula 17 was prepared according to the polymerization method of Example 1-1, and a polymer resin represented by the following Formula 17 and the polymer resin represented by the following Formula 18 were weight ratio 90:10 (total weight 8.45 g) A binder resin obtained by mixing was prepared. In Formula 17, a is 0.3, b is 0.2, c is 0.5, and in Formula 18, R1 and R2 are methyl groups and ethyl groups, respectively, and a and b are each 0.5.

<Formula 17>

<Formula 18>

Example  1-9

A binder resin was prepared by mixing the polymer resin represented by Formula 17, the polymer resin represented by Formula 18, and the polymer resin represented by Formula 19 below in a weight ratio of 40:30:30 (total weight 7.45 g).

In Formula 19, a is 0.3, b is 0.2, c is 0.1, d is 0.1, e is 0.26, f is 0.04, and the polymerization method is as shown below.

<Formula 19>

Prepared according to the polymerization method of Example 1-1, but methyl methacrylate (Methyl methacrylate) 30 mol%, Styrene 20 mol%, Hydroxypropyl acrylate (10 mol%), Meta Polymerized by 10 mol% of acrylic acid, 26 mol% of tetrahydrofurfuryl methacrylate and 4 mol% of octahydro4,7-methano-indene methacrylate (FA-513 M) It was.

Evaluation of Physical Properties of Organic Insulating Film by Organic Insulating Film Composition Second embodiment )

Next, the organic insulating film composition was made by adding a photoacid generator, an organic solvent, and other additives together with the binder resin prepared by the polymerization method, and the results of evaluating the physical properties of the passivation film (passivation film) formed therefrom were examined. Shall be.

The organic insulating film composition prepared in Examples 2-1 to 2-9 below was applied onto the substrate, spin-coated at a rotational speed of 1,000 to 2,000 rpm per minute, exposed on a hot plate, and then exposed to a temperature of 90 ° C. After drying for 90 seconds to form a coating film. The formed coating film formed the thickness of 0.5-10 micrometers according to the rotation speed.

Example  2-1

In 100 parts by weight of an organic solvent (PGMEA), 8.45 g of the binder resins of Formulas 17 and 18 and 0.03 g of the photoacid generator of Formula 6 polymerized in Example 1-8 were dissolved to 31 parts by weight, and After adding 0.02 g of surfactant (FZ-2122) and 2.62 g of organic solvent (PGMEA), the mixture was added and mixed.Then, after rotation coating at a rotation speed of 1000 rpm on a glass substrate, the film was dried at 90 ° C. for 90 seconds on a hot plate. Thereafter, the resultant was exposed to light and developed for 2.38% alkaline developer (TMAH) for 100 seconds to confirm the residual film ratio and the exposure amount for the 20 µm L / S pattern.

Example  2-2

As the binder resin, the experiment was performed in the same manner as in Example 2-1 except that 7.45 g of the binder resin polymerized in Example 1-9 was used.

Example  2-3

As the binder resin, 8.50 g of the binder resin of Chemical Formula 13 polymerized according to Example 1-4 was used, and the binder resin and the photoacid generator were dissolved to 35 parts by weight based on 100 parts by weight of PGMEA, and then the surfactant ( FZ-2122) was carried out in the same manner as in Example 2-1, except that 0.02 g of organic solvent (PGMEA) 1.569 g was added.

Example  2-4

8.50 g of the binder resin of Formula 13 and 0.024 g of the photoacid generator of Formula 6 were dissolved as binder resin so that the binder resin and the photoacid generator were 35 parts by weight relative to 100 parts by weight of PGMEA, Thereafter, the experiment was conducted in the same manner as in Example 2-1, except that 0.02 g of the surfactant (FZ-2122) and 1.569 g of the organic solvent PGMEA were added thereto.

Comparative example

The experiment was carried out in the same manner as in Example 2-1, except that an organic insulating film composition applied in the prior art, which was composed of an alkali-soluble acrylic resin and a naphthoquinone diazide group-containing PAC compound, was used as the binder resin.

The exposure amount and the residual film ratio after development were measured by the following method using the patterns formed by the above Examples and Comparative Examples.

Property evaluation

Exposure

Using a mask in which a pattern of CD size of 20 μm was engraved, it was observed under a microscope after exposure to confirm an appropriate exposure amount of the pattern (CD size of pattern: 20 μm). Surface photographs of the pattern are as shown in FIGS. 2A-2D. 2A to 2D are photographs of the surface of the pattern when the exposure doses were irradiated at (a) 40mJ, (b) 50mJ, (c) 70mJ and (d) 80mJ, respectively.

Post-development residual rate

The film thickness before and after image development was measured, and the residual film ratio after image development was calculated using the following formula. Here, the remaining film ratio after the development is derived by the formula of (development film thickness) / (predevelopment film thickness) * 100 (%).

Table 1 below shows the evaluation results of the exposure amount and the residual film rate after development for the thin films coated according to Examples 2-1 to 2-4.

TABLE 1

 Example Organic insulation film composition Pattern properties Binder Resin Photoacid generator Organic solvent Exposure amount (mJ) Residual rate (%) Example 2-1 Formula 17 + 18 Formula 6 PGMEA 30 92 Example 2-2 Formula 17 + 18 + 19 Formula 6 PGMEA 40 88 Example 2-3 Formula 13 Formula 6 PGMEA 40 99 Example 2-4 Formula 13 Formula 6 PGMEA 50 97 Comparative example Noblock resin Formula 6 PGMEA 150 95

As shown in Table 1, the pattern according to the embodiment of the present invention has excellent sensitivity with an exposure dose in the range of 30 to 50 mJ, and excellent residual film ratio. Therefore, by providing photosensitivity to the organic insulating film itself prepared by the composition, it is possible to reduce the process of using a separate photoresist in the conventional insulating layer, it is possible to form a fine pattern more easily.

Next, in Examples 2-6 to 2-8, the transmittance of the pattern was measured.

The transmittance measurement was performed as follows.

Transmittance

Permeability was measured using SPECTROPHOTOMETER, CM-3600d (KONICA MINOLTA, Japan) as a measuring equipment.

Example 2-6

After adding 0.05 g of the antioxidant (IRGANOX 1010, Ciba) of the formula (7) to the composition according to Example 2-1 to prepare an organic insulating film composition, and after applying the organic insulating film composition on a substrate at 1,000 to 2,000 rpm After baking at 90 ° C for 90 seconds to obtain a 3.5 μm-thick coating film, UV light was exposed at 700mJ exposure dose, and then 400nm wavelength on the thin film formed through front exposure and annealing or high temperature baking (220 ° C / 1 hour). The light transmittance was checked to confirm the transmittance.

Example 2-7

50% by weight of the antioxidant of Formula 7 (IRGANOX 1010, Ciba), 33% by weight of the antioxidant of Formula 8 (IRGAFOS 126, Ciba), 17% by weight of the antioxidant (HP-136, Ciba) of Formula 9 ( The same experiment as in Example 2-6 was carried out except that 0.05 g of IRGANOX XP620) was added as an antioxidant.

Examples 2-8 to 2-10

To the organic insulating film composition of Example 2-1, 0.099 g (Example 2-8), 0.132 g (Example 2-9), and 0.165 g (Example 2-) of antioxidant (IRGANOX 1010, Ciba) of Chemical Formula 7, respectively, Experiments were carried out in the same manner as in 2-6, except that 10) was added.

The transmittance was measured using the pattern formed by the said Example 2-1 and the comparative example as a target to compare with Example 2-6-Example 2-10. The transmittance measurement results are shown in Table 2 below.

TABLE 2

division Antioxidant addition amount (g) Permeability (%) Example 2-6 0.05 92.89 Example 2-7 0.05 93.65 Example 2-8 0.099 82.17 Example 2-9 0.132 84.43 Example 2-10 0.165 85.37 Example 2-1 0.00 89.29 Comparative example 0.00 88.89

As shown in Table 2, it was found that the use of an antioxidant showed superior permeability than otherwise.

It has been described in detail above with reference to preferred embodiments of the present invention. However, the scope of the present invention is not limited to the above embodiments, but may be embodied in various forms of embodiments within the appended claims. Without departing from the gist of the invention as claimed in the claims, any person skilled in the art to which the invention pertains is considered to be within the scope of the claims of the invention to the various possible modifications possible.

1 is a cross-sectional view showing a display device to which an organic insulating film according to the present invention is applied.

2A to 2D are surface photographs of the organic insulating film pattern according to the present invention in the case of irradiating with varying exposure amounts, respectively.

Claims (14)

In the chemically amplified ultra-high sensitivity positive type ultra-high sensitivity organic insulating film composition comprising a binder resin, a photoacid generator, and a solvent, The binder resin is a chemically amplified ultra-high sensitivity positive type organic insulating film composition comprising a polymer or copolymer comprising a monomer containing an acid-decomposable acetal protecting group represented by the following formula (1). <Formula 1>

In the above formula, R ₁ , R ₂ is an alkyl group. The method of claim 1, The copolymer is a chemically amplified ultra-high sensitivity positive type organic insulating film composition comprising at least one of the compounds represented by the formula (2) to (5). <Formula 2>

<Formula 3>

<Formula 4>

<Formula 5>

In the above formula, R ₃ , R _{4 ,} and R ₆ is an alkyl group, R ₅ is a hydrogen atom, an alkyl group, an alkoxy group, an acetoxy group or a carboxylic acid group, X is an epoxide group, oxetane ), A tetrahydrofuran group, a tetrahydropyran group, an oxocane group or a phenyl group, Y represents an alkoxy, acetoxy group, carboxylic acid group, or hydroxy group, Z represents an alkyl group, and a, b, c, d, e, f, g and h are molar ratios of each polymerized unit, and 0 <a <1, 0 ≦ b <1, 0 ≦ c <1, 0 ≦ d <1, 0≤e <1, 0≤f <1, 0≤g <1, 0≤h <1, and the sum of at least one of a, b, c, d, e, f, g and h is 1 to be. The method of claim 2, The binder resin, the copolymer; Represented by Formula 2 to Formula 5, wherein in Formula 2 to Formula 5, a, b, c, d, e, f, g and h is the molar ratio of each polymerized unit, 0≤a <1, 0≤b A copolymer of <1, 0 ≦ c <1, 0 ≦ d <1, 0 ≦ e <1, 0 ≦ f <1, and the sum of at least one of a, b, c, d, e and f is 1 Chemically amplified ultra-high sensitivity positive type organic insulating film composition, characterized in that consisting of a mixture of at least one. The method of claim 1, An average molecular weight of the binder resin is 500 to 50,000, the dispersion degree is 1.0 to 5.0 chemically amplified ultra-high sensitivity positive type organic insulating film composition. The method of claim 1, The photoacid generator is a diazonium salt type, a phosphonium salt type, a sulfonium salt type, an iodonium salt type, an imide sulfonate type, an oxime sulfonate type, a diazo disulfone type, a disulfone type, an ortho-nitrobenzyl sulfonate type, And a triazine compound, wherein the chemically amplified ultra-high sensitivity positive type organic insulating film composition is used. The method of claim 1, Wherein the solvent is an organic solvent containing at least one of alcohol, acetate, ether, glycol, ketone, and carbonate-based chemically amplified ultra-high sensitivity positive type organic insulating film composition. The method of claim 1, The chemically amplified ultra-high sensitivity positive type organic insulating film composition includes at least one of a thermal stabilizer, a thermal crosslinking agent, a photocuring accelerator, a surfactant, a base quencher, an antihalation agent, an antioxidant, an adhesive aid, a light stabilizer, and an antifoaming agent. Chemically amplified ultra-high sensitivity positive type organic insulating film composition, characterized in that further comprises an additive made of one. The method of claim 7, wherein The thermal stabilizer is a chemically amplified ultra-high sensitivity positive type organic insulating film composition, characterized in that consisting of at least one of a phenolic, phosphite or lactone compound. The method of claim 7, wherein The thermal crosslinking agent is a chemically amplified ultra-high sensitivity positive type organic insulating film composition, characterized in that made of at least one of polyacrylate resin, epoxy resin, phenol resin, melamine resin, urea resin, organic acid, amine compound, and anhydrous compound. The method of claim 7, wherein The optical stabilizer is a chemically amplified ultra-high sensitivity positive type organic insulating film composition, characterized in that at least one of benzotriazole-based, triazine-based, benzophenone-based, hindered aminoether-based, and hindered amine-based compound . The method of claim 7, wherein The adhesive aid is a chemically amplified ultra-high sensitivity positive type organic insulating film composition, characterized in that the alkoxy silane compound comprising at least one of a cycyanate group, an epoxy group, an acrylate group, a vinyl group, and a mercapto group. The method of claim 7, wherein The base quencher is a chemically amplified ultra-high sensitivity positive type organic insulating film composition, characterized in that consisting of at least one of a primary amine, a secondary amine, a tertiary amine, and an amide compound. The method of claim 1, To about 100 parts by weight of the binder resin, the photo-acid generator is 0.2 to 11 parts by weight of the chemically amplified ultra-high sensitivity positive type organic insulating film composition. The organic insulating film forming method using the organic insulating film composition according to any one of claims 1 to 13, Applying the organic insulating film composition on a substrate of a display device or on a source / drain or silicon nitride layer formed on the substrate; Pre-bake the organic insulating film composition; Selectively exposing and developing the organic insulating film composition to form a pattern; Forming an insulating protective film by exposing and heat-treating the organic insulating film composition over the entire surface.

Images