KR20100005458U - A universal adapter for testing socket of BGA package - Google Patents

Abstract

This design can be mounted and tested on any BGA package, regardless of the size of the BGA type IC Package or the arrangement of the shoulder balls, eliminating the need to replace parts for each package. The present invention relates to a universal adapter for a BGA package test socket, which can increase the contact stability between a ball and a contact pin.

The universal adapter for the BGA package test socket of the present invention for this purpose, the BGA package test socket for the BGA package test socket is assembled to be slidable on the top of the square fixed body constituting the BGA package, the BGA package is mounted or detached on the upper surface In the universal adapter, comprising a sliding part assembled to be slidably planar on an upper portion of the square fixed body and a ball seating portion integrally protruding from a portion of the upper surface of the sliding part, wherein the sliding part has an equal interval in a diagonal direction. And a plurality of through slit holes penetrating the upper and lower surfaces, and a plurality of partition walls arranged integrally at equal intervals inside the through slit holes, wherein the ball seating portions extend in the penetrating direction of the through slit holes. An extension slit hole and the extension slit hole corresponding to the partition wall It is configured to include a rectangular groove formed in each position.

 BGA Package, Burn-in Test, Shoulderball, Slider, Adapter

Description

A universal adapter for testing socket of BGA package}

The present invention relates to a universal adapter for the BGA package test socket, and more specifically, any BGA package can be seated and tested regardless of the outer size of the BGA package or the arrangement of the shoulder balls. The present invention relates to a universal adapter for a BGA package test socket that can increase the contact stability between the shoulder ball and the contact pin by minimizing assembly tolerance by integrating a slider and an adapter.

In general, IC packages undergo a burn-in test for electrical characteristics and / or reliability tests before they are shipped from the semiconductor manufacturing plant, and these tests screen out defective products.

Unlike other types of IC packages, BGA (Ball Grid Array) package is an IC package that improves the size and thickness of the IC package by arranging terminals of the IC package, that is, a shoulder ball, on the entire bottom surface of the IC package. In the BGA package, the spacing between the shoulder balls is 0.5mm, 0.75mm, 0.8mm, 1.0mm, 1.27mm, 1.6mm, etc., and the diameter of the shoulder ball is about 0.3mm to 0.9mm, and the shoulder at the bottom of the IC The height of the ball is used from 0.2mm to 0.6mm. The smaller the pitch between the shoulder balls, the smaller the diameter and height of the shoulder ball.

On the other hand, the BGA package test socket is used to test the BGA package as described above, as an example of the conventional BGA package test socket there is a "structure of the Vigie socket" disclosed in the Utility Model Registration No. 20-0229127.

As shown in FIG. 1, the structure of the BG socket disclosed in Korean Utility Model Registration No. 20-0229127 is a fixed body 10, a slide 20, a spring 30 for latch operation, and a latch 40. ), The adapter 50, the working body 60, the fixing plate 70, the pin guide 80, the contact pin 90, is configured to include a sliding operation spring (100).

The fixed body 10 forms the basis of the test socket, the slide 20 is assembled on the upper side of the fixed body 10, the latch 40 is provided on both sides of the slide 20, respectively, When the BGA package is mounted on the slide 20, the BGA package is prevented from escaping upward.

Here, the latch operation spring 30 is installed below each latch 40 so that the force is always applied in the direction in which the latch 40 is closed.

The adapter 50 is mounted on the upper side of the slide 20, the BGA package is guided to be seated in the correct position when the BGA package is mounted, the operating body 60 is up and down at the top of the fixed body (10) Sliding operation of the furnace, it is sliding up and down in the state that the adapter 50 is accommodated in the inner side of the square hole formed in the center.

Here, the bottom of the four corners of the working body 60 is formed with a receiving groove to accommodate the upper end of the spring for sliding operation 100, the fixed body 10 is formed with four guide protrusions sliding copper The lower end of the action spring 100 is fitted, and is provided to serve as a guide of the sliding action spring 100 by this configuration, thereby causing the sliding action spring 100 to return the operation body 60. do.

On the other hand, the fixed body 10 is formed with a plurality of pin head holes for inserting a plurality of contact pins 90 from the bottom to accommodate a plurality of contact pins 90, respectively, the contact pins below The fixing plate 70 for fixing the shaking by limiting the vertical position of the 90 is formed, the fixing plate 70 is formed with holes for passing the lower portion of the contact pin 90 to hold the contact pin 90.

The pin guide 80 is provided below the fixing plate 70. Guide holes for positioning the contact pins 90 are formed to easily insert the plurality of contact pins 90 into the corresponding pinholes of the PCB. In the socket state, the pin guide 80 is configured to operate up and down slightly above the end position of the contact pin 90 and the bottom surface of the fixing body 10. When the socket is inserted into the PCB, the pin guide 80 is lowered to regulate the front, rear, left and right positions of the ends of the contact pins 90, and then the pins are inserted into the pin holes formed in the PCB without being caught.

Meanwhile, referring to FIG. 2, operation (a) is a natural state of the test socket, and as shown in the detailed view, the inner side 92A and 92B of the two ends of the contact pin 9 are partition walls 21. As close to the side of the contact.

At this time, the inner gap (L1) of the two ends of the contact pin 90 is configured to be smaller than the diameter of the shoulder ball (2) of the BGA package. Herein, the structure of the slide 20 will be described in more detail. In the center, many rectangles are arranged in succession at an angle of 45 degrees from the upper left to the lower right.

The partition wall 21 is formed between the rectangular hole and the rectangular hole, and penetrates through the fixed side end 91A and the movable side end 91B of the contact pin 90 through the rectangular holes on both sides thereof. Although not shown in the drawing, two or three inclined cams formed on the working body 60 are configured to move the slide 20 horizontally when the working body 60 is pressed. The amount of movement is configured such that the distance L2 at the end of the contact pin 90 is slightly wider than the diameter of the shoulder ball 2 of the BGA package, and the moving direction is shown in the detailed view of FIG. As described above, the inner side 92B of the movable side of the contact pin is pushed to open the end of the contact pin.

In the BGA package test socket as described above, an example of the slide 20 and the adapter 50 is shown in FIG. 3.

As shown in FIG. 3, the slide 20 'and the adapter 50' are composed of separate parts, and the adapter 50 'has a square hole 50'-1 for mounting a BGA package at the center thereof. ) Is formed.

However, in the assembly structure of the conventional slide 20 'and the adapter 50' as described above, the BGA package smaller than the size of the square square hole 50'-1 formed in the center of the adapter 50 'is accommodated. The disadvantage is that you can't.

That is, the BGA package having a size smaller than the size of the square hole 50'-1 of the adapter 50 'cannot be seated and penetrates over the square hole 50'-1, thereby making it impossible to test.

Due to this problem, the conventional adapter 50 'requires the use of the respective adapters 50' according to the size of the BGA package and the ball arrangement / number of the BGA package, so that the number of parts increases and the mold manufacturing cost is considerably required. Instead, the test error due to the unavoidable assembly tolerance between the adapter 50 'and the slide 20 is necessary because the adapter 50' must be frequently replaced or a new sized adapter must be manufactured according to the BGA package to be tested. There is another problem that can occur.

In addition, in the conventional BGA package socket, since the slide 20 'and the adapter 50' are composed of separate parts, the number of parts is increased, thereby increasing the assembly process, and thus a disadvantage may occur in mass production. have.

The object of the present invention for solving the problems according to the prior art, regardless of the size of the BGA package or the arrangement of the shoulder ball can be tested by seating any BGA package, there is no need to replace parts for each package, slider It is to provide universal adapter for BGA package test socket that can improve the contact stability of shoulder ball and contact pin by minimizing assembly tolerance by integrating with adapter.

The universal adapter for the BGA package test socket of the present invention for solving the above technical problem is assembled to be slidably flat on the top of the square fixed body constituting the BGA package test socket, the BGA package is mounted or detached on the upper surface A universal adapter for a test socket for a BGA package, comprising: a sliding portion assembled to be slidably planar on an upper portion of the square fixed body, and a ball seating portion integrally protruding from a portion of an upper surface of the sliding portion, wherein the sliding portion is in an oblique direction And a plurality of through slit holes penetrating the upper and lower surfaces so as to have equal intervals, and a plurality of partition walls integrally arranged at equal intervals inside the through slit holes, wherein the ball seating portion is formed in a through direction of the through slit holes. A plurality of extension slit holes extending in the shape and corresponding to the partition wall Characterized in that configured to include a spherical recess formed corresponding to each position of the extending slit hole.

Here, the ball seat portion is characterized in that it comprises a low contact surface formed in the central longitudinal direction, and a high contact surface formed with a step with the low contact surface on both sides of the low contact contact surface.

At this time, the size of the spherical groove formed in the low contact surface is characterized in that less than the size of the spherical groove formed in the high contact surface.

Here, at one side corner of the ball seating portion, the BGA package is characterized in that the fitting groove is formed to match the mounting position and the mounting direction so that the ball seating portion can be mounted in the right position and the forward direction.

Here, the other side corner of the ball seating portion, characterized in that the guide hole penetrating the ball seating portion and the sliding portion integrally is formed.

The present invention as described above, regardless of the size of the BGA package or the outer size of the shoulder ball has an effect that can be tested by mounting any BGA package.

In addition, since all BGA packages of different sizes can be seated, there is no need to replace parts for each package, and the slider and adapter are integrated to minimize the assembly tolerance, thereby increasing the contact stability between the shoulder ball and the contact pin. .

In addition, since mold production is unnecessary for each BGA package having a different size, there is an effect that a competitive advantage can be obtained by reducing investment cost and cost.

The present invention will become more apparent through the following preferred embodiments with reference to the accompanying drawings. Hereinafter will be described in detail to enable those skilled in the art to easily understand and reproduce through the embodiments of the present invention.

The BGA package test socket with the universal adapter 100 for the BGA package test socket of this embodiment is shown in Figures 4 and 5, the BGA package test socket is a fixed body 200, including the universal adapter 100, It comprises a working body 300, pin fixing plate 400, a plurality of contact pins 500 and the like.

Referring to the fixed body 200 and the working body 300, the fixed body 200 is located on the lower side, the working body 300 is coupled to be located on the upper side of the fixed body 200 In this case, the fixed body 200 and the working body 300 are slidably coupled to each other. That is, the operating body 300 is coupled to the upper and lower sides of the fixed body 200 fixed to the upper portion of the fixing part 600 to be slidable up and down.

In detail, the fixed body 200 is a component that is fixedly installed so that the operation body 300 can be operated to slide up and down, the fixed body 200 is a pair of pins that are the upper portion of the contact pin 500 A plurality of pin head holes 200h are formed so that the heads are located through.

Specifically, the fixing body 200 is formed to have a substantially rectangular shape when viewed in a plane, the pin head hole (200h) is formed to be arranged to have a predetermined length in the diagonal direction of the rectangular shape, the pin head hole ( The lower side of the pair of pinheads penetrating 200h) is located.

On the other hand, on both sides of the fixed body 200 limits the vertical movement distance of the working body 300 to be described later, the elastic projection 202 for elastic coupling with the working body 300 is formed, the operating spring 810 An operating spring receiving groove 204 is formed to receive one end of the), and the operating spring 810 is installed to receive the operating spring receiving groove 204.

In detail, the working body 300 is a component that is coupled to the upper and lower sliding upper portion of the fixed body 200, the working body 300 is a square corresponding to the fixed body 200 described above when viewed in plan It is formed to have a shape, the insertion hole (300h) is formed so that the top and bottom are open so that the BGA package can be mounted in the socket.

On the other hand, on both sides of the operating body 300 to guide the vertical sliding movement of the operating body 300, limit the movement distance, the elastic body 302 for elastic coupling with the fixed body 200 is formed, specifically As the elastic piece 302 of the working body 300 is coupled to the elastic protrusion 202 of the fixed body 200, the fixed body 200 and the working body 300 may be coupled to each other. The sliding movement of the operating body 300 in the vertical direction from the body 200 is coupled to be made.

On the other hand, the operating body 300 is formed with a spring guide protrusion 304 in a position corresponding to the above-mentioned operating spring receiving groove 204 of the fixed body 200, the operating spring 810 in the spring guide protrusion 304 The other end of) will be fitted.

Specifically, the fixed body 200 is formed with an operating spring receiving groove 204 for receiving one end of the operating spring 810 to receive one end of the operating spring 810, the operating body 300 to the operating spring 810 A spring guide protrusion 304 is formed to penetrate the other end of the inner side, and to be fitted into the operation spring receiving groove 204 in a state in which the operation spring 810 is compressed when the fixed body 200 and the operation body 300 are coupled to each other. Will be.

As such, the operating spring 810 is interposed between the fixed body 200 and the working body 300, the working spring 810 is the working body 300 from the fixed body 200 upwards Allow elastic support.

The pin fixing plate 400 is provided at the lower portion of the fixing body 200 to guide and align and fix the pin legs, which are the lower portions of the contact pins 500 penetrating the fixing body 200. .

In detail, a pin fixing plate 400 having a plurality of pin guide holes 400h is coupled to the lower portion of the fixed body 200 to guide the pin legs of each contact pin 500, and such pin guide holes 400h. In consideration of the point where the pin legs are pointed, it is preferable that the upper part is formed in a wide, lower and narrow form.

On the other hand, the elastic piece 402 is formed on both sides of the pin fixing plate 400, it is elastically coupled with the projection (not shown) formed on the lower surface of the fixed body 200.

The plurality of contact pins 500 are installed between the fixed body 200 and the working body 300, and the pin head of the contact pin 500 is formed in the fixed body 200. Through 200h) respectively. Each of the contact pins 500 is an element for connecting one end of the contact with the shoulder ball of the BGA package, the other end is connected to the inspection device (not shown), so that the inspection signal is transmitted and received between the inspection device and the BGA package. .

Reference numeral 700 denotes a latch for fixing the BGA package, reference numeral 810 denotes a spring for sliding operation, and reference numeral 830 denotes a latch operating spring.

Hereinafter, a universal adapter for a BGA package test socket (hereinafter, referred to as a universal adapter) according to an embodiment of the present invention will be described in detail.

Universal adapter 100 for the BGA package test socket of the present embodiment, as shown in Figures 4 and 5, is assembled so that the plane sliding on the top of the square fixed body 200 constituting the above-described BGA package test socket. . And the BGA package is mounted or detached on the upper surface of the universal adapter 100.

As shown in FIG. 6, the universal adapter 100 includes a sliding part 110 and a ball seating part 120, and the sliding part 110 is planar sliding on an upper portion of the square fixed body 200. The assembly is possible, the ball seating portion 120 is integrally protruded from a portion of the upper surface of the sliding portion 110 is a portion of the shoulder ball of the BGA package is seated.

First, the sliding unit 110 of the universal adapter 100 will be described.

As shown in FIG. 7 and FIG. 8, the sliding part 110 includes a plurality of through slit holes 112 penetrating the upper and lower surfaces so as to have equal intervals in an oblique direction, and the inside of the through slit holes 112. It is configured to include a plurality of partition wall 114 is formed integrally arranged at intervals.

Preferably, the plurality of through slit holes 112 are formed to have an inclination angle of 45 ° with respect to one side, and the plurality of partition walls 114 correspond to the gap between shoulder balls provided on the bottom surface of the BGA package. The inside of the hole 112 is arranged at equal intervals.

As shown in FIGS. 10 and 11, the partition wall 114 is disposed between a pair of pin heads 502 of each contact pin 500, and each contact pin is provided when the universal adapter 100 is slid. One of the pair of pin heads 502 of the 500 to serve to open in the sliding direction.

Next, the ball seating portion 120 of the universal adapter 100 will be described.

As shown in FIGS. 6 to 8, the ball seating part 120 corresponds to a plurality of extension slit holes 122 formed in the penetrating direction of the through slit hole 112 and the partition wall 114. It is configured to include a spherical groove 124 formed for each corresponding position of the extension slit hole (122). Preferably, it is formed to have an inclination angle of 45 ° in the same direction as the through slit hole 112, and the spherical groove 124 corresponds to the partition wall 114 so as to correspond to the gap of the shoulder ball provided on the bottom surface of the BGA package. The elongated slit hole 122 is formed to be arranged at equal intervals.

On the other hand, the ball seat 120 is composed of a low contact surface (120a) formed in the central longitudinal direction, and a high contact surface (120b) formed with a step with the low contact surface (120a) on both sides of the low contact surface (120a). Can be.

And one side corner of the ball seating portion 120 is formed with a fitting groove 126 for matching the mounting position and the mounting direction so that the BGA package can be mounted on the ball seating portion 120 in the right position and the forward direction.

Specifically, when the BGA package is seated in the socket, the BGA package is matched with the direction of " △ " and the direction of " △ " It is to prevent damage that may be caused by not being mounted in place.

On the other hand, the other side corner of the ball seating portion 120 is formed with a guide hole 128 that penetrates the ball seating portion 120 and the sliding portion 110 integrally.

The guide hole 128 is a mounting arm (not shown) for mounting the BGA package when the guide rod (not shown) provided in the mounting arm is inserted into the socket to pick up the BGA package to be operated vertically downward It serves as a guide.

Finally, an operation of mounting two types of BGA packages to the universal adapter 100 configured as described above will be described with reference to FIGS. 10 to 16.

-A type (large BGA package, shoulder ball diameter = Ra)

As shown in FIG. 10, the pair of pin heads 502 of the contact pins 500 are operated on the through slit holes 112 and the extension slit holes 122 of the universal adapter 100. As the body 300 moves downward, as shown in FIG. 11, the universal adapter 100 is slid to one side so that the partition wall 114 opens one of the pair of pin heads 502 in the sliding direction. .

In the state where the pin heads 502 of the contact pins 500 are opened, the shoulder ball provided on the bottom surface of the A type BGA package is seated in each spherical groove 124 formed in the high contact surface 120b, and the shoulder ball of the BGA package When it is completed to be seated in each of the spherical grooves 124, as shown in Figure 12 as the operating body 300 moves upwards, each of the shoulder ball while returning to the original state between each pin head 502 It is pressurized and connected.

-B type (small BGA package, shoulder ball diameter = Rb)

As shown in FIG. 13, the pair of pin heads 502 of the contact pins 500 are operated on the through slit holes 112 and the extension slit holes 122 of the universal adapter 100. As the body 300 moves downward, as shown in FIG. 12, the universal adapter 100 is slid to one side so that the partition wall 114 opens one of the pair of pin heads 502 in the sliding direction. .

In the state where the pin head 502 of the contact pin 500 is opened, the shoulder ball provided on the bottom surface of the B type BGA package is seated in each spherical groove 124 formed in the low contact surface 120a, and the shoulder ball of the BGA package. When it is completed to be seated in each of the spherical grooves 124, as shown in Figure 15 as the operating body 300 moves upwards, each of the shoulder ball while returning to the original state between each pin head 502 It is pressurized and connected.

As described above, the universal adapter 100 according to the present embodiment can inspect both the large size A type BGA package, the small size B type BGA package, and the size of the shoulder ball is large BGA package and shoulder ball Even small BGA packages can be examined. That is, all types of BGA packages can be inspected regardless of the size of the BGA package or the size of the shoulder ball.

Although the present invention has been described with reference to the accompanying drawings, it will be apparent to those skilled in the art that many various and obvious modifications are possible without departing from the scope of the present invention from this description. Therefore, the scope of the present invention should be construed by the claims described to include many such variations.

1 is a cross-sectional view of a socket of the prior art with the cover in a raised position;

2 is a cross-sectional view of the socket of the prior art with the cover in the lowered position;

3 is a plan view showing an adapter provided in the socket of the prior art;

Figure 4 is a perspective view showing a BGA package test socket equipped with a universal adapter for BGA package test socket of the present invention.

5 is an exploded perspective view of FIG. 4;

Figure 6 is a perspective view showing a universal adapter for BGA package test socket of the present invention.

Figure 7 is a plan view showing a universal adapter for BGA package test socket of the present invention.

8 is a cross-sectional view taken along line AA ′ of FIG. 7.

Figure 9 is a front view showing a universal adapter for BGA package test socket of the present invention.

10 to 12 is an operation diagram showing the operation of mounting a large size BGA package to the universal adapter for BGA package test socket of the present invention.

13 to 15 is an operation diagram showing an operation of mounting a small size BGA package to the universal adapter for BGA package test socket of the present invention.

Figure 16 is a side view showing a large size BGA package and a small size BGA package.

<Description of the symbols for the main parts of the drawings>

100: universal adapter 110: sliding part

112: through slit hole 114: bulkhead

120: ball seating portion 120a: low contact surface

120b: high contact surface 122: extension slit hole

124: spherical groove 126: custom groove

128: guide hole 200: fixed body

Claims (5)

In the universal adapter for the BGA package test socket is assembled on the top of the square fixed body constituting the BGA package test socket, the BGA package is mounted or detached on the upper surface, Is configured to include a sliding portion that is assembled to be slidably planar on the top of the square fixed body and a ball seating portion integrally protruding from a portion of the upper surface of the sliding portion, The sliding part includes a plurality of through slit holes penetrating the upper and lower surfaces so as to have equal intervals in an oblique direction, and a plurality of partition walls integrally arranged at equal intervals inside the through slit holes, The ball seating unit, the BGA package test socket, characterized in that it comprises a plurality of extension slit hole extending in the through direction of the through slit hole, and a spherical groove formed at each corresponding position of the extension slit hole corresponding to the partition wall. adapter. The method of claim 1, The ball seating portion, A universal adapter for a BGA package test socket, comprising a low contact surface formed in a central longitudinal direction and a high contact surface formed at a step with the low contact surface on both sides of the low contact surface. The method of claim 2, The size of the spherical groove formed on the low contact surface is a universal adapter for the BGA package test socket, characterized in that smaller than the size of the spherical groove formed on the high contact surface. The method of claim 1, In one corner of the ball seat, Universal adapter for a BGA package test socket, characterized in that the groove is formed to fit the mounting position and the mounting direction so that the BGA package can be mounted to the ball seat in the right position and the forward direction. The method of claim 1, In the other side corner of the ball seat, Universal adapter for a BGA package test socket, characterized in that the guide hole penetrating the ball seating portion and the sliding portion integrally formed.

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