KR20090109857A - plasma display Apparatus and repair method thereof - Google Patents

Abstract

PURPOSE: A plasma display apparatus and a repair method thereof are provided to repair the defected film device by applying the press or heat through the hole in a short time. CONSTITUTION: A plasma display apparatus and a repair method thereof include the following contents. A frame(300) is positioned at the first plane of the panel, and includes a hole(310). A printed circuit board is fixed at the frame. The printed circuit board produces the driving signal supplied to the panel. The film type element is connected to the second surface of the panel. The film type element applies the driving signal to the panel. The hall(hole) is formed around the panel part, the film type element(400) and connection part of the panel are symmetrical.

Description

Plasma display device and regeneration method

The present invention relates to a plasma display device, and more particularly, to a plasma display device having an improved structure of a frame and a reproduction method using the same.

The plasma display panel (hereinafter referred to as PDP) displays an image by excitation and emitting phosphors by vacuum ultraviolet rays (VUV) generated when the inert gas is discharged.

Such a PDP is not only large in size and thin in thickness, but also has a simple structure and is easy to manufacture, and has a high luminance and high luminous efficiency compared to other flat display devices. In particular, the AC surface-discharge type 3-electrode plasma display panel has advantages of low voltage driving and long life because wall charges are accumulated on the surface during discharge to protect the electrodes from sputtering caused by the discharge.

In the case of a film-type element connecting a drive board to which a driving signal is applied to drive a PDP and an electrode formed on the panel, malfunctions may occur due to heat generation or incorrect fastening. When working with heat, there is a problem in that excessive time and cost are consumed and even good products are damaged.

In the case of a film-type element connecting a drive board to which a driving signal is applied to drive a PDP and an electrode formed on the panel, malfunctions may occur due to heat generation or incorrect fastening. When working with heat, there is a problem in that excessive time and money are consumed and even good products are damaged.

Plasma display device according to the present invention comprises a plasma display panel; A frame disposed on the first surface of the panel and having a hole formed therein; A driving board fixed to the frame and generating a driving signal supplied to the panel; And a film element for applying a driving signal generated by being connected to the second surface of the panel to the panel, wherein the portion where the hole is formed and the connection portion between the film element and the panel have positions symmetrical with each other about the panel. It is configured as a feature.

A regeneration method is used in which a defective film element is replaced by applying heat or pressure through the hole.

According to the present invention, not only the heat dissipation characteristics of the connection part are improved through the holes, but also the rework tool is used to separate the defective film-type elements by separating the panel and the frame or the heat, and it is easier and faster than the regeneration method using heat. It is possible to reproduce the film-like device.

Hereinafter, a plasma display device according to the present invention will be described in detail with reference to the accompanying drawings. 1 is a perspective view illustrating an embodiment of a structure of a plasma display panel.

As shown in FIG. 1, the plasma display panel includes a scan electrode 11, a sustain electrode 12, a sustain electrode pair formed on the upper substrate 10, and an address electrode 22 formed on the lower substrate 20. It includes.

The sustain electrode pairs 11 and 12 generally include transparent electrodes 11a and 12a and bus electrodes 11b and 12b formed of indium tin oxide (ITO), and the bus electrodes 11b and 12b. 12b) may be formed of a metal such as silver (Ag) or chromium (Cr) or a stack of chromium / copper / chromium (Cr / Cu / Cr) or a stack of chromium / aluminum / chromium (Cr / Al / Cr). . The bus electrodes 11b and 12b are formed on the transparent electrodes 11a and 12a to serve to reduce voltage drop caused by the transparent electrodes 11a and 12a having high resistance.

Meanwhile, according to the exemplary embodiment of the present invention, the sustain electrode pairs 11 and 12 may not only have a structure in which the transparent electrodes 11a 12a and the bus electrodes 11b and 12b are stacked, but also the buses without the transparent electrodes 11a and 12a. Only the electrodes 11b and 12b may be configured. This structure does not use the transparent electrodes (11a, 12a), there is an advantage that can lower the cost of manufacturing the panel. The bus electrodes 11b and 12b used in this structure may be various materials such as photosensitive materials in addition to the materials listed above.

Light between the scan electrodes 11 and the sustain electrodes 12 between the transparent electrodes 11a and 12a and the bus electrodes 11b and 11c to absorb external light generated outside the upper substrate 10 to reduce reflection. A black matrix (BM, 15) is arranged that functions to block and to improve the purity and contrast of the upper substrate 10.

The black matrix 15 according to the exemplary embodiment of the present invention is formed on the upper substrate 10, the first black matrix 15 and the transparent electrodes 11a and 12a formed at positions overlapping the partition wall 21. And the second black matrices 11c and 12c formed between the bus electrodes 11b and 12b. Here, the first black matrix 15 and the second black matrices 11c and 12c, also referred to as black layers or black electrode layers, may be simultaneously formed and physically connected in the formation process, or may not be simultaneously formed and thus not physically connected. .

In addition, when physically connected and formed, the first black matrix 15 and the second black matrix 11c and 12c may be formed of the same material, but may be formed of different materials when they are formed separately.

The upper dielectric layer 13 and the passivation layer 14 are stacked on the upper substrate 10 having the scan electrode 11 and the sustain electrode 12 side by side. Charged particles generated by the discharge are accumulated in the upper dielectric layer 13, and the protective electrode pairs 11 and 12 may be protected. The protective film 14 protects the upper dielectric layer 13 from sputtering of charged particles generated during gas discharge, and increases emission efficiency of secondary electrons.

In addition, the address electrode 22 is formed in a direction crossing the scan electrode 11 and the sustain electrode 12. In addition, a lower dielectric layer 24 and a partition wall 21 are formed on the lower substrate 20 on which the address electrode 22 is formed.

In addition, the phosphor layer 23 is formed on the surfaces of the lower dielectric layer 24 and the partition wall 21. The partition wall 21 has a vertical partition wall 21a and a horizontal partition wall 21b formed in a closed shape, and physically distinguishes discharge cells, and prevents ultraviolet rays and visible light generated by the discharge from leaking into adjacent discharge cells.

In an embodiment of the present invention, not only the structure of the partition wall 21 illustrated in FIG. 1, but also the structure of the partition wall 21 having various shapes may be possible. For example, a channel in which a channel usable as an exhaust passage is formed in at least one of the differential partition structure, the vertical partition 21a, or the horizontal partition 21b having different heights of the vertical partition 21a and the horizontal partition 21b. A grooved partition structure having a groove formed in at least one of the type partition wall structure, the vertical partition wall 21a, or the horizontal partition wall 21b may be possible.

Here, in the case of the differential partition wall structure, the height of the horizontal partition wall 21b is more preferable, and in the case of the channel partition wall structure or the groove partition wall structure, it is preferable that a channel is formed or the groove is formed in the horizontal partition wall 21b. something to do.

Meanwhile, in one embodiment of the present invention, although the R, G and B discharge cells are shown and described as being arranged on the same line, it may be arranged in other shapes. For example, a Delta type arrangement in which R, G, and B discharge cells are arranged in a triangular shape may be possible. In addition, the shape of the discharge cell may be not only rectangular, but also various polygonal shapes such as a pentagon and a hexagon.

In addition, the phosphor layer 23 emits light by ultraviolet rays generated during gas discharge to generate visible light of any one of red (R), green (G), and blue (B). Here, an inert mixed gas such as He + Xe, Ne + Xe and He + Ne + Xe for discharging is injected into the discharge space provided between the upper / lower substrates 10 and 20 and the partition wall 21.

FIG. 2 illustrates an embodiment of an electrode arrangement of a plasma display panel, and a plurality of discharge cells constituting the plasma display panel are preferably arranged in a matrix form as shown in FIG. 2. The plurality of discharge cells are provided at the intersections of the scan electrode lines Y1 to Ym, the sustain electrode lines Z1 to Zm, and the address electrode lines X1 to Xn, respectively. The scan electrode lines Y1 to Ym may be driven sequentially or simultaneously, and the sustain electrode lines Z1 to Zm may be driven simultaneously. The address electrode lines X1 to Xn may be driven by being divided into odd-numbered lines and even-numbered lines, or sequentially driven.

Since the electrode arrangement shown in FIG. 2 is only an embodiment of the electrode arrangement of the plasma panel according to the present invention, the present invention is not limited to the electrode arrangement and driving method of the plasma display panel shown in FIG. 2. For example, a dual scan method in which two scan electrode lines among the scan electrode lines Y1 to Ym are simultaneously scanned is possible. In addition, the address electrode lines X1 to Xn may be driven by being divided up and down in the center portion of the panel.

3 illustrates an embodiment of a configuration of a driving apparatus for driving a plasma display panel.

Referring to FIG. 3, the frame 30 is installed on the back of the panel to support the panel and to absorb and release heat generated from the panel. In addition, a printed circuit board (PCB) for applying driving signals to the panel is provided on the rear surface of the frame 30.

On the PCB, an address driver 50 for supplying a drive signal to address electrodes of a panel, a scan driver 60 for supplying a drive signal to scan electrodes of a panel, and a drive for sustain electrodes of a panel A sustain driver 70 for supplying a signal, a drive controller 80 for controlling the drive circuits, and a power supply unit PSU 90 for supplying power to each drive circuit may be disposed.

The address driver 50 supplies a driving signal to the address electrodes formed on the panel so that only the discharge cells that are discharged among the plurality of discharge cells formed on the panel are selected.

The address driver 50 may be installed on any one or both of the upper and lower sides of the panel according to a single scan method or a dual scan method.

In the address driver 50, a data IC (not shown) is installed to control a current applied to the address electrode. In the data IC, a switching is generated to control an applied current so that a large amount of heat may be generated. Therefore, a heat sink (not shown) may be installed in the address driver 50 to eliminate heat generated in the control process.

As shown in FIG. 3, the scan driver 60 may include a scan sustain board 62 connected to the driving controller 80 and a scan driver board 64 connecting the scan sustain board 62 and a panel. Can be.

The scan driver board 64 may be divided into two parts, an upper side and a lower side. Unlike the illustrated in FIG.

The scan driver board 64 is provided with a scan IC 65 for supplying a drive signal to the scan electrodes of the panel, and the scan IC 65 can continuously apply reset, scan and sustain signals to the scan electrodes.

The sustain driver 70 supplies a drive signal to the sustain electrode of the panel.

The driving controller 80 converts the input image signal into data to be supplied to the address electrodes by performing predetermined signal processing on the input image signal using the signal processing information stored in the memory, and sorts the converted data according to a scanning order. have. In addition, the driving controller 80 may supply a timing control signal to the address driver 50, the scan driver 60, and the sustain driver 70 to control the timing of supplying the driving signals of the driving circuits. .

As shown in FIG. 3, the connecting member 66 is a flexible printed circuit (FPC) to connect the printed circuit board (PCB) and the scan electrodes of the panel, which are formed in opposite directions on both sides of the frame 30. It is preferable that it consists of.

In addition, in order to supply a drive signal to the sustain electrode or the address electrode of the panel, a connection member as described above is provided between the sustain driver 70 and the sustain electrode formed on the panel or between the address driver 50 and the address electrode formed on the panel. Can be connected.

4 is a diagram of a frame structure according to an embodiment of the present invention. Since this is only one embodiment to help understanding of the present invention, the present invention is not limited to the embodiment of FIG. 4.

Referring to FIG. 4, it can be seen that the hole 310 is formed in the frame 300 and the film type device 400 and the connection portion of the panel and the panel are in symmetrical positions with respect to the panel.

The frame 300 of a material having excellent thermal conductivity such as aluminum (Al) is attached to the panel so that heat generated from the panel is discharged through the frame 300. Since the hole 310 serves as an air flow path, heat generated from the panel, the film type device 400 and the data IC can be quickly discharged to the back of the frame 300 to uniformly lower the temperature of the panel and the like. .

Hole 310 may be formed in the shape of a circle, oval, etc., preferably, the hole may be configured to have a rectangular shape as shown in FIG. Since the hole 310 is sufficient in size and shape to allow the regeneration work tool to pass through, the hole 310 is preferably formed in a quadrangular shape in order to reduce the possibility of the passage of foreign matter during work or use.

The number of holes 310 may be configured to match the number of film type devices 400.

Since the film device 400 is connected to the top, bottom or left and right sides of the panel according to the arrangement of the driving board, the hole 310 may also be formed on the top, bottom or left and right sides of the frame 300.

The film type device 400 may be configured as a flexible printed circuit (FPC). Flexible printed circuits, unlike printed circuit boards (PCBs), are flexible circuit boards that are flexible and bent, which refers to the formation of electrode patterns or ICs on a flexible film-type substrate or the flexible film. Because of the possible bending, various combinations and configurations are possible in terms of design. The flexible printed circuit includes an input terminal and an output terminal, the input terminal is connected to a driving board, and the output terminal is connected to an electrode of the panel through an electrode pad.

       The film device 400 may be configured as a tape carrier package (TCP). Compared to COF (Chip on Film) where IC is directly mounted on the film constituting COB (Chip on Board) mounted on PCB (Printed Circuit Board) and FPC, TCP has the advantage of small size and low price.

       The TCP is a semiconductor chip package using a tab tape, and a tape automated bonding (TAB) technology is used to mount a driver IC on a tab tape in which a copper lead is formed, and then connect the beam lead to the driver IC. Means technology.

The tab tape has a structure in which circuit wiring is patterned on a polyimide tape, beam leads are exposed in the window region where the driver IC is located in connection with the circuit wiring, and the circuit wiring is protected by a solder resist layer. . In the driver IC, the beam lead of the tab tape is bonded to a bump formed on the chip pad of the driver IC, so that the electrical connection and the attachment state of the driver IC are maintained, and from the external environment by potting epoxy resin. Protected. TCP of the above structure has the advantage of reducing the cost and size than COF.

       When a defect occurs in the film element, a large amount of time and cost are put into the regeneration method. According to the present invention, the film element is easily separated by applying heat or pressure to the film element using the hole. Save time and money.

       5 is a view illustrating an embodiment of a regeneration method according to the present invention. When a defect occurs in a single unit of the film-like device 400, the rework work tool 510 passes through the hole 310 to be defective. A regeneration method comprising the step of separating the device 400.

       If the film type device 400 does not discharge heat efficiently, defects may occur due to problems such as heat generation. Therefore, a regeneration operation is required to check whether a defective product is replaced or a malfunction occurs in the film type device 400 including the IC. In the related art, a portion where the electrode pad of the plasma display device and the film type device 400 are connected to each other is separated by applying heat to the first surface 210 of the lower substrate 200 for regeneration.

        Specifically, first, the case is removed, and all the driving boards disposed on the rear surface of the frame 300 are removed. Subsequently, the driving unit connected to one end of the film type device 400 is separated, and the panel and the frame 300 are separated to separate the electrode pads connected to the other end. However, a heat dissipation sheet having an adhesive force is generally formed between the panel and the frame, and a lot of time and cost are required for separation thereof. Subsequently, heat is applied to the rear surface of the panel to separate the film-like device from the panel and replace it with another film-like device.

          Since the film type device 400 is in the form of a film and the electrode pad is sensitive to heat, it is impossible to directly apply heat, so that the film may not be heated from the front surface of the upper substrate 100 of the panel, and the first substrate of the lower substrate 200 may not be applied. The device was separated by applying heat to the surface 210. Moreover, even a good film type element may be damaged by heat.

          The regeneration work tool 510 passes through the hole 310 of the frame 300 in the upper portion and is compressed to the first surface 210 of the lower substrate 200, and in the lower portion, the regeneration work tool 520 is defective. The film-like device 400 is pressed onto the generated film-like device 400 to physically separate the film-like device 400 connected to the second surface of the panel. Since physically separated, the film-like element, which is a good product, is not damaged and selectively separates only the film-like element 400 in which a defect occurs.

        In addition, the film type device 400 may be separated by applying heat to the first surface 210 of the panel without separating the panel and the frame 300 through the hole 310.

        If the work space between the frame 300 and the lower substrate 200 is secured, the regeneration work tool 510 may be compressed to the rear surface of the lower substrate 200 from the side and may be regenerated. However, there is a problem in that the shape of the structure of the frame 300 is restricted in order to secure a separate working space between the lower substrate 200 and the frame 300. However, according to the regeneration method of the present invention, since the regeneration work tool 510 is squeezed through the hole 310, a separate work space is unnecessary, so there is no restriction on the structure and shape design of the frame 300. 300) is possible.

        The process of connecting the other film-type elements is performed after separating the film-type element in which the defect has occurred. The panel and the tape carrier package are bonded using an anisotropic conductive film (ACF). ACF is a dispersion of conductive particles in a thermosetting or thermoplastic resin film, and realizes electrical connection between terminals by interposing a resin film in a portion subjected to thermal compression. After applying the ACF to the connection portion of the film-like device, the pressure is slightly applied to the applied site and thermocompression bonding. After connecting the plasma display panel to the output terminal of the TCP to which the ACF is thermo-compressed, a connection process is performed by applying a main pressure to thermo-compression. In the connecting process, another film-like device may be pressed onto the panel through the hole to connect the panel and the film-like device. In addition to ACF, anisotropic conductive pastes (ACP) can also be used.

        6 is a view showing a method of reproducing the film device when using UV curing according to an embodiment of the present invention. A UV curing agent may be applied to the connection portion between the panel and the tape carrier package, and the UV curing agent may be adhered again by the UV curing agent in addition to the ACF.

        After the UV curing agent is applied, ultraviolet rays are irradiated to the hole 310 or the side surface of the plasma display panel to cure the UV curing agent. When the UV curing agent is irradiated with ultraviolet rays, the curing is performed by forming a polymer.

        UV curing has the advantage of fast curing speed because curing takes place in a very short time, and does not apply heat directly because it is cured by UV irradiation. Therefore, there is an advantage that is suitable for the material, such as a low heat-resistant temperature film, plastic. When UV curing is used, heat and the like are not applied to the film-type elements other than the defective film-type elements to be replaced, thereby improving manufacturing cost, time, and yield.

        The UV lamp 600 for irradiating ultraviolet rays used for UV curing may be used on the side of the panel, but ultraviolet rays may also be irradiated through the hole 310. Therefore, UV lamps can be placed and operated in consideration of various working environments and efficiencies.

        7 is a block diagram of a regeneration method process according to an embodiment of the present invention.

        If it is determined in step (700) that the film-like device is defective, the film-like device is applied with heat or pressure through a hole formed in the frame (step 710). (Step 720).

        The method may further include pressing another film type device to the panel through the hole to connect the panel and the film type device (step 730).

        In the case of using UV curing, properties such as connection strength may be improved, and thus UV curing may be added (step 740).

        Although a preferred embodiment of the present invention has been described in detail above, those skilled in the art to which the present invention pertains can make various changes without departing from the spirit and scope of the invention as defined in the appended claims. It will be appreciated that modifications or variations may be made to the branches. Accordingly, modifications to future embodiments of the present invention will not depart from the technology of the present invention.

1 is a perspective view illustrating an embodiment of a structure of a plasma display panel.

2 is a diagram illustrating an embodiment of an electrode arrangement of a plasma display panel.

3 is a diagram illustrating an embodiment of a configuration of a driving apparatus for driving a plasma display panel.

4 is a diagram of a frame structure according to an embodiment of the present invention.

5 is a view showing a film-like device separation step according to an embodiment of the present invention.

6 is a view showing a UV curing step according to an embodiment of the present invention.

7 is a block diagram of a regeneration method process according to an embodiment of the present invention.

Claims (4)

A plasma display panel; A frame disposed on the first surface of the panel and having a hole formed therein; A driving board fixed to the frame and generating a driving signal supplied to the panel; And A film type device connected to a second surface of the panel to apply the generated driving signal to the panel; And a portion in which the hole is formed and a connecting portion of the film type device and the panel are symmetrical with respect to the panel. In the method of reproducing the film type device for connecting the plasma display panel and the drive board fixed to the frame to generate a drive signal, Applying heat or pressure to the film-like element through a hole formed in the frame; And Separating the film type device, And the connecting portion between the hole and the film-like element and the panel has a symmetrical position with respect to the panel. The method of claim 2, And pressing the film type device to the panel through the hole, thereby connecting the panel and the film type device. The method of claim 3, wherein the connecting step of the film device       A method of reproducing a film type device comprising irradiating ultraviolet rays to a connection portion between the panel and the film type device through the hole.

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