KR20090098255A - Web camera and manufacturing method thereof - Google Patents

Abstract

A web camera and a manufacturing method thereof are provided to reduce the manufacturing cost by simplifying the structure of the web camera and processes for manufacturing the web camera. A web camera comprises a web cam board(100), an image sensor bare chip(120) and optical units(130, 150). The web cam board is embedded in the main body case of the web camera. Various electronic elements are mounted on the web cam board and an upper-side pad(111) for bonding is formed. An external pad(121) for bonding electrically connected through the upper-side pad and a wire(W) is assembled on an upper side of the image sensor bare chip and a lens(L) is mounted.

Description

Web camera and manufacturing method thereof

The present invention relates to a web camera, and more particularly, to a web camera having a built-in web cam board and having a camera function, and a manufacturing method thereof.

With the spread of video communication network and the development of data processing speed, the spread of application products using video communication module has been increasing rapidly.

The application products include LCD monitors, notebook PCs, UMPCs, interactive TVs, and the like, and the rate of mounting an embedded web camera in the main body of such application products is rapidly increasing.

In general, a web camera is driven in conjunction with a computer application by using a camera or a digital camera connected to an application product such as a personal computer, such as video chat, video call, Perform video chat, video call, and computer camera functions over the web.

Here, a web cam board in which various electronic components related to driving and control of the web camera are mounted is embedded in the web camera, and the web cam board is provided with a small camera module that performs a camera function.

Hereinafter, a web camera according to the prior art will be described in more detail.

As shown in FIG. 1, a conventional web camera includes a web cam board 10 on which various electronic components related to driving and controlling a web camera are mounted.

In addition, the web cam board 10 is equipped with a small camera module for mounting various electronic components 11 and performing a camera function.

In more detail, in the conventional web cam board 10, various electronic components 11 and the image sensor module 20 in a package state are mounted through surface mount technology (SMT).

Here, the image sensor module 20, the substrate 21, the image sensor (not shown) as shown in Figure 1, and the transparent member 22 for protecting the image sensor mounted on the substrate 21 And a chip scale package including a molding part 23 for sealing the image sensor and fixing the transparent member 22 and an external connection part 24 for mounting the image sensor module 20. Although not shown in detail, the module may be provided in the form of a ceramic leaded chip carrier (CLCC) package.

That is, when various electronic components 11 are surface mounted in the conventional web cam board 10, the image sensor module 20 in a CSP package or CLCC package state is surface mounted together, and then the web cam board 10 is mounted. A housing 30 corresponding to the image sensor module 20 is bonded to an upper surface of the lens 30, and a lens barrel 50 having a lens L mounted thereon is fastened to perform focusing adjustment. After fixing, the web cam board 10 is provided with a camera module together with various electronic components 11.

However, the above-described conventional web camera has the following problems.

Since the conventional web camera mounts and uses an expensive image sensor module 20 provided in a package state on the web cam board 10, the manufacturing cost has increased.

In the conventional web camera, since the housing 30 is bonded after the packaged image sensor module 20 is surface-mounted on the web cam board 10, rework is almost impossible when the image sensor is defective. Rework manufacturing costs rose.

In addition, in the conventional web camera, when the CLCC package-type image sensor module is applied to the web cam board 10, a glass filter and an infrared cut-off filter for protecting the light receiver of the image sensor must be used at the same time. Since the light passing through the lens reaches the light-receiving part of the image sensor through the infrared cut filter and the glass filter, there is a problem of causing image defects due to the refraction of light.

In the conventional web camera, since the housing 30 is bonded after the image sensor module 20 is surface-mounted on the web cam board 10, the optical axis is shifted.

Accordingly, the present invention was devised to solve the above-mentioned disadvantages and problems in the conventional web camera, and an object of the present invention is to simplify the structure and the process to reduce manufacturing costs, and to improve performance and productivity. The present invention provides a web camera and a method of manufacturing the same.

According to one embodiment of the present invention for achieving the above object, a web cam board is built in the main body case of the web camera (Web Camera), the various electronic components are mounted on the upper surface and the upper surface pad for bonding; An image sensor bare chip having a bonding outer pad electrically connected to the upper pad for bonding of the web cam board through a wire; And an optical unit assembled to an upper surface of the web cam board and having a lens mounted thereon.

Therefore, in one embodiment of the present invention, since the wire-bonding of the bare image sensor bare chip is not bonded to the web cam board, the process for packaging the image sensor is eliminated, thereby simplifying the manufacturing process and reducing the manufacturing cost. And productivity can be improved.

In addition, since the image sensor bare chip is directly mounted on the web cam board, the mounting space of the packaged image sensor module occupied on the web cam board can be reduced, thereby miniaturizing the product.

The hysteresis distance of the upper surface pad for bonding from the electronic component may have a value greater than or equal to a design value in order to prevent foreign substances generated when mounting the electronic component on the web cam board from entering the upper surface pad for bonding.

The optical unit may include a housing assembled to an upper surface of the web cam board and equipped with an infrared cut filter, and a lens barrel assembled to an upper portion of the housing and incorporating the lens.

Of course, the optical unit may be made of a barrel combined housing of the focusing non-adjustment method in which the housing and the lens barrel are integrally formed.

The wire is preferably made of a gold wire (Gold Wire).

As such, the electrical connection between the web cam board and the image sensor bare chip may be improved through gold wires having a purity of 99.9% or more.

The upper surface pad for bonding the web cam board may be electroplated or electroless plated.

A positioning hole may be formed in the web cam board or the optical unit, and a positioning protrusion corresponding to the positioning hole may be formed in a side corresponding thereto.

At this time, it is preferable that the positioning holes or the positioning protrusions are formed in plural numbers to face each other in a diagonal direction.

Therefore, when the optical unit is mounted on the web cam board, the mounting position of the optical unit on the web cam board can be accurately grasped by being coupled to the positioning hole and the positioning protrusion, so that the image sensor bare It is possible to accurately match the optical axis between the light receiving portion of the chip and the lens provided on the optical unit.

On the other hand, according to another embodiment of the present invention for achieving the above object, a step of preparing a web cam board is mounted on the upper surface of the various electronic components, the upper surface pad for bonding; Mounting the image sensor bare chip on the upper surface of the web cam board by electrically connecting the upper pad for bonding of the web cam board and the outer pad for bonding of the image sensor bare chip to each other by wire bonding; And assembling an optical unit having a lens on the upper surface of the web cam board so as to cover the image sensor bare chip on the upper surface of the web cam board.

The manufacturing method of the web camera may be performed before the mounting of the image sensor bare chip on the upper surface of the web cam board, and further comprising electroplating or electroless plating the upper surface pad for bonding the web cam board. can do.

In addition, the manufacturing method of the web camera may be performed before the step of mounting the image sensor bare chip on the upper surface of the web cam board and may further comprise the step of cleaning the upper surface pad for bonding of the web cam board.

In addition, the manufacturing method of the web camera, is performed before the step of mounting the image sensor bare chip on the upper surface of the web cam board further comprises the step of attaching and fixing the image sensor bare chip on the upper surface of the web cam board. You may.

The wire for electrically connecting the upper pad for bonding of the web cam board and the outer pad for bonding of the image sensor bare chip is preferably made of a gold wire.

As such, the electrical connection between the web cam board and the image sensor bare chip may be improved through gold wires having a purity of 99.9% or more.

The assembling of the optical unit may include assembling a housing having an infrared cut filter on an upper surface of the web cam board to cover the image sensor bare chip, and assembling a lens barrel having the lens on the housing. It may comprise a step.

The manufacturing method of the web camera is performed before the step of mounting the image sensor bare chip on the upper surface of the web cam board, combining the positioning hole formed in the web cam board and the positioning projection formed in the optical unit The method may further include establishing a mounting position of the optical unit.

In this case, the positioning holes may be formed in a plurality of opposite to each other in the diagonal direction on the web cam board, the positioning projections may be formed to correspond to the positioning holes on the lower surface of the optical unit.

As described above, according to the web camera and the manufacturing method thereof according to the present invention, there is an effect that can simplify the structure and the process of the web camera to reduce the manufacturing cost, improve the performance and productivity.

Hereinafter, preferred embodiments of a web camera and a method of manufacturing the same according to the present invention will be described in more detail with reference to the accompanying drawings.

2 is an exploded perspective view schematically showing a web cam board of a web camera according to an embodiment of the present invention, and FIG. 3 is an enlarged perspective view of part A of FIG. 2.

Work of web camera Example

First, with reference to the accompanying drawings will be described in more detail with respect to a web camera according to an embodiment of the present invention.

As shown in FIG. 2 and FIG. 3, the web camera according to the embodiment of the present invention is largely embedded in a main body case (not shown) of a web camera, and various electronic components 110 are mounted on an upper surface thereof. And a bonding outer pad 121 electrically connected to the web cam board 100 through which the upper surface pad 111 for bonding is formed and the upper surface pad 111 for bonding of the web cam board 100 and a wire (W). ) Is formed of an image sensor bare chip (120) and an optical unit (130,150) mounted on the upper surface of the web cam board 100, the lens (L) is mounted.

That is, since the web camera according to an embodiment of the present invention bonds the wires W to the image sensor bare chip 120 in a bare chip state without the package on the web cam board 100, the image sensor is packaged in the past. By eliminating the process, the manufacturing process can be simplified, manufacturing costs can be reduced, and productivity can be improved.

In addition, by directly mounting the image sensor bare chip 120 on the web cam board 100, the mounting space of the packaged image sensor module occupied on the web cam board 100, that is, the horizontal size and height can be reduced. Therefore, the product can be miniaturized and slimmed.

On the other hand, the electronic component 110 to prevent the foreign substances generated when the electronic component 110 is mounted on the web cam board 100 flows into the upper surface pad 111 for bonding of the web cam board 100. It is preferable that the hysteresis distances D1 and D2 of the upper surface pad 111 for bonding from) have a value equal to or greater than a design value.

The optical units 130 and 150 may include a housing 130 assembled to an upper surface of the web cam board 100 and equipped with an infrared cut filter (not shown), and assembled to an upper portion of the housing 130 and the lens L. FIG. The lens barrel 150 may be built-in.

Of course, although not shown, the optical unit (130,150), the housing 130 and the lens barrel 150 may be made of a barrel-less housing of the focusing unadjusted type formed integrally.

On the other hand, the wire (W) for wire bonding the web cam board 100 and the image sensor bare chip 120 is preferably made of a gold wire (Gold Wire).

That is, the electrical connection between the web cam board 100 and the image sensor bare chip 120 is made through a gold wire having a purity of 99.9% or more, thereby the web cam board 100 and the image sensor bare chip 120. Can improve the electrical connectivity.

In this case, the upper surface pad 111 for bonding of the web cam board 100 may be electroplated or electroless in order to further improve electrical connectivity with the outer pad 121 for bonding of the image sensor bare chip 120. Plating may be performed.

As shown in FIG. 3, the wire W is bonded to the upper pad 111 for bonding the web cam board 100 and the outer pad 121 for bonding the image sensor 120 through the solder S. FIG. Each connection can be fixed.

Meanwhile, a positioning hole 100a may be formed in the web cam board 100, and a positioning protrusion 130a corresponding to the positioning hole 100a may be formed in the housing 130 of the optical unit corresponding thereto. Can be formed.

Although not shown, a positioning hole may be formed in the housing 130 and a positioning protrusion may be formed in the web cam board.

Here, the positioning holes 100a or the positioning protrusions 130a may be formed in plural numbers to face each other in a diagonal direction.

Accordingly, when the optical units 130 and 150 are mounted on the web cam board 100, the optical holes on the web cam board 100 may be combined by combining the positioning holes 100a and the positioning protrusions 130a. Since the mounting positions of the units 130 and 150 can be accurately grasped, the optical axis is accurately matched between the light receiving unit 120a of the image sensor bare chip 120 and the lenses L installed on the optical units 130 and 150. Image defects due to distortion can be prevented.

Thing of manufacturing method of web camera Example

Next, with reference to the accompanying drawings will be described in detail with respect to the manufacturing method of the web camera according to an embodiment of the present invention.

As shown in Figure 2 and 3, the manufacturing method of the web camera according to an embodiment of the present invention is to prepare a web cam board 100, and the image sensor on the upper surface of the web cam board 100 And mounting the bare chips 120 and assembling the optical units 130 and 150 on the upper surface of the web cam board 100.

In more detail, first, a web cam board 100 having a top pad 111 for bonding is formed on the top surface, and various electronic components 110 are mounted on the top surface of the web cam board 100, The image sensor bare chip 120 is mounted.

That is, the web camera according to an embodiment of the present invention is mounted by bonding the wire (W) to the image sensor bare chip 120 in a bare chip state without a package on the web cam board 100.

Therefore, by eliminating the process of packaging the image sensor, it is possible to simplify the manufacturing process, reduce manufacturing costs, and improve productivity.

In addition, by directly mounting the image sensor bare chip 120 on the web cam board 100, the mounting space of the packaged image sensor module occupied on the web cam board 100, that is, the horizontal size and height can be reduced. Therefore, the product can be miniaturized and slimmed.

In this case, foreign matters generated when the electronic component 110 is mounted on the web cam board 100 may be prevented from entering the upper pad 111 for bonding of the web cam board 100. It is preferable that the hysteresis distances D1 and D2 of the upper surface pad 111 for bonding from () be equal to or greater than the design value.

Meanwhile, before mounting the image sensor bare chip 120 on the upper surface of the web cam board 100, the upper surface pad 111 for bonding of the web cam board 100 is electroplated or electroless plated to be treated. Electrical connection and connection of the upper surface pad 111 for bonding the cam board 100 may be efficiently performed.

In addition, the electrical connection of the upper surface pad 111 for bonding of the web cam board 100 by cleaning by a separate cleaning process to the bonding upper surface pad 111 of the web cam board 100 plated as described above. Improves connectivity and connectivity.

Meanwhile, when the image sensor bare chip 120 is wire-W bonded to the top surface of the web cam board 100, the image sensor bare chip 120 is separately formed on the top surface of the web cam board 100. It is preferable to bond the wire after fixing through the adhesive member of the.

In addition, the wire W for wire bonding the web cam board 100 and the image sensor bare chip 120 is preferably made of a gold wire.

That is, the electrical connection between the web cam board 100 and the image sensor bare chip 120 is made through a gold wire having a purity of 99.9% or more, thereby the web cam board 100 and the image sensor bare chip 120. Can improve the electrical connectivity.

Next, a housing 130 having an infrared cut filter is assembled on the upper surface of the web cam board 100 to cover the image sensor bare chip 120.

Then, the lens barrel 150 is mounted to the lens (L) is mounted on the housing 130.

Here, a positioning hole 100a is formed in the web cam board 100, and positioning protrusions 130a corresponding to the positioning hole 100a are respectively opposed to the housing 130 in a diagonal direction. Since the housing 130 is mounted on the web cam board 100, the web cam board 100 is coupled by combining the positioning hole 100a and the positioning protrusion 130a. ) To accurately position the mounting position of the housing 130.

Therefore, the optical axis between the light receiving unit 120a of the image sensor bare chip 120 and the lens L of the lens barrel 150 assembled on the housing 130 is accurately matched to prevent image defects due to optical axis distortion. You can prevent it.

Thereafter, the lens barrel 150 is manipulated to adjust the focusing between the image sensor bare chip 120 and the lens L, and the lens barrel 150 is fixed through an adhesive at a position having an optimal focus. Next, a completion inspection is performed to complete the camera module installation process of the web cam board 100.

Preferred embodiments of the present invention described above are disclosed for the purpose of illustration, and various substitutions, modifications, and changes within the scope without departing from the spirit of the present invention for those skilled in the art to which the present invention pertains. It will be possible, but such substitutions, changes and the like should be regarded as belonging to the following claims.

1 is an exploded perspective view schematically showing a web cam board of a web camera according to the prior art.

Figure 2 is an exploded perspective view schematically showing a web cam board of the web camera according to an embodiment of the present invention.

3 is an enlarged perspective view of part A of FIG. 2;

Explanation of symbols on the main parts of the drawings

100: web cam board 100a: positioning hole

110: electronic component 111: upper surface pad for bonding

120: image sensor bare chip 120a: light receiving unit

121: outer pad for bonding 130: housing

130a: positioning protrusion 150: lens barrel

L: Lens W: Wire

S: solder

Claims (15)

A web cam board embedded in a main body case of a web camera, and having various electronic components mounted thereon and having an upper surface pad for bonding; An image sensor bare chip having a bonding outer pad electrically connected to the upper pad for bonding of the web cam board through a wire; And An optical unit assembled to an upper surface of the web cam board and equipped with a lens; Web camera comprising a. The method of claim 1, And a hysteresis distance of the upper surface pad for bonding from the electronic component has a value greater than or equal to a design value so that foreign matter generated when mounting the electronic component on the web cam board is prevented from entering the upper surface pad for bonding. The method of claim 1, The optical unit includes a housing assembled on the upper surface of the web cam board and equipped with an infrared cut filter, and a lens barrel assembled on the housing and incorporating the lens. The method of claim 1, The wire is a web camera, characterized in that made of Gold Wire. The method of claim 1, The upper surface pad for bonding the web cam board is electroplated or electroless plated. The method of claim 1, Positioning holes are formed in the web cam board or the optical unit, and a positioning protrusion corresponding to the positioning holes is formed at a side corresponding thereto. The method of claim 6, The positioning hole or the positioning projection is a web camera, characterized in that formed in a plurality of opposite to each other in a diagonal direction. Preparing a web cam board on which various electronic components are mounted on an upper surface and a top pad for bonding is formed; Mounting the image sensor bare chip on the upper surface of the web cam board by electrically connecting the upper pad for bonding of the web cam board and the outer pad for bonding of the image sensor bare chip to each other by wire bonding; And Assembling an optical unit having a lens on an upper surface of the web cam board to cover the image sensor bare chip on an upper surface of the web cam board; Web camera manufacturing method comprising a. The method of claim 8, The method of manufacturing a web camera further comprising the step of electroplating or electroless plating the upper surface pad for bonding of the web cam board, which is performed before the mounting of the image sensor bare chip on the upper surface of the web cam board. The method of claim 8, A method of manufacturing a web camera, the method comprising: performing before mounting the image sensor bare chip on an upper surface of the web cam board, and cleaning the upper surface pad for bonding the web cam board. The method of claim 8, And before the mounting of the image sensor bare chip on the upper surface of the web cam board, further comprising attaching and fixing the image sensor bare chip to the upper surface of the web cam board. The method of claim 8, And a wire electrically connecting the upper pad for bonding of the web cam board to the outer pad for bonding of the image sensor bare chip is made of a gold wire. The method of claim 8, Assembling the optical unit, Assembling a housing having an infrared blocking filter on an upper surface of the web cam board to cover the image sensor bare chip; Assembling a lens barrel having the lens on an upper portion of the housing. The method of claim 8, The mounting position of the optical unit is established by combining the positioning hole formed in the web cam board and the positioning protrusion formed in the optical unit, before the mounting of the image sensor bare chip on the upper surface of the web cam board. Web camera manufacturing method further comprising the step of. The method of claim 14, The positioning hole is a plurality of positioning holes are opposed to each other in the diagonal direction on the web cam board, the positioning projection is formed on the lower surface of the optical unit to correspond to the positioning holes .

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