KR20090092600A - Grinding die for preparing transmission electron microscope specimens with level controlling means - Google Patents

Grinding die for preparing transmission electron microscope specimens with level controlling means

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Publication number
KR20090092600A
KR20090092600A KR1020080017932A KR20080017932A KR20090092600A KR 20090092600 A KR20090092600 A KR 20090092600A KR 1020080017932 A KR1020080017932 A KR 1020080017932A KR 20080017932 A KR20080017932 A KR 20080017932A KR 20090092600 A KR20090092600 A KR 20090092600A
Authority
KR
South Korea
Prior art keywords
support
specimen
electron microscope
transmission electron
polishing
Prior art date
Application number
KR1020080017932A
Other languages
Korean (ko)
Inventor
신기삼
유정훈
유대황
Original Assignee
창원대학교 산학협력단
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 창원대학교 산학협력단 filed Critical 창원대학교 산학협력단
Priority to KR1020080017932A priority Critical patent/KR20090092600A/en
Publication of KR20090092600A publication Critical patent/KR20090092600A/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/02—Frames; Beds; Carriages
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B24B47/22—Equipment for exact control of the position of the grinding tool or work at the start of the grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/10—Single-purpose machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Sampling And Sample Adjustment (AREA)

Abstract

A grinding die for manufacturing a specimen of a TEM(Transmission Electron Microscope) is provided to manufacture a specimen of desired thickness easily by regulating a grinding pad using a micrometer. A grinding die for manufacturing a specimen of a TEM comprises a supporter(10), a grinding pad support(20), a grinding pad(30), and three or more micrometers(40). The grinding pad support is put on the supporter. The grinding pad is placed on the grinding pad support. The micrometers having measuring rods are arranged on the bottom of the support so that the measuring rods contact to the grinding pad. The horizontality of the grinding pad is controlled by moving the grinding pad up and down through the operation of the micrometers.

Description

수평 조절 수단을 구비한 투과전자현미경 시편 제작용 연마대 {GRINDING DIE FOR PREPARING TRANSMISSION ELECTRON MICROSCOPE SPECIMENS WITH LEVEL CONTROLLING MEANS}Polishing table for the production of transmission electron microscope specimen with horizontal adjustment means {GRINDING DIE FOR PREPARING TRANSMISSION ELECTRON MICROSCOPE SPECIMENS WITH LEVEL CONTROLLING MEANS}

본 발명은 투과 전자 현미경(Transmission Electron Microscope, TEM) 시편 제작용 그라인더에 구비되는 연마대에 관한 것으로, 초보자도 용이하게 수평조절이 가능하여, 투과전자현미경 시편 제작의 편의성과 정확성을 현저하게 개선할 수 있는 투과전자현미경 시편 제작용 연마대에 관한 것이다.The present invention relates to a polishing table provided in a transmission electron microscope (TEM) specimen grinder, and can be easily adjusted for beginners, thereby significantly improving the convenience and accuracy of the transmission electron microscope specimen production. And a polishing table for fabricating a transmission electron microscope specimen.

투과전자현미경 시편은 일반적으로 지름이 약 3mm, 두께가 100㎛인 원반 형태의 시편을 많이 사용한다.Transmission electron microscope specimens generally use disc shaped specimens with a diameter of about 3 mm and a thickness of 100 μm.

이와 같은 시편은, 관찰 대상이 되는 재료를 두께 약 100㎛ 정도로 물리적 연마를 행한 후, 펀치를 이용하여 3mm의 디스크(disc) 형태로 만든 뒤, 투과전자현미경 관찰에 사용하기 알맞은 두께로 연마하기 위하여 딤플 그라인더 및 이온빔 밀링 등의 장비를 사용하여 연마하여 제작한다.In order to polish the material to be observed, the material to be observed is physically polished to a thickness of about 100 μm, made into a 3 mm disc using a punch, and polished to a thickness suitable for use in transmission electron microscope observation. It is manufactured by grinding using equipment such as dimple grinder and ion beam milling.

한편, 금속 시편의 경우 물리적인 연마를 한 후 펀치를 이용하여 지름 3mm의 디스크 형태로 만든 후, 전해연마와 같은 화학 연마법을 통해 용이하게 시편 제작을 완료할 수 있다.On the other hand, in the case of the metal specimen after the physical polishing to make a disk shape of a diameter of 3mm by using a punch, the specimen can be easily produced through a chemical polishing method such as electropolishing.

그런데, 최근 연구가 활발하게 이루어지고 있는 전자재료나 세라믹 재료의 경우, 전기 전도성이 낮아 전해연마와 같은 화학연마법으로는 시편 제작이 거의 불가능하며, 딤플 그라인더나 이온빔 밀링을 통해서만 연마를 하기에는 시간과 비용이 많이 드는 문제점이 있다.However, in the case of electronic or ceramic materials, which are being actively researched recently, it is almost impossible to fabricate specimens by chemical polishing methods such as electropolishing because of their low electrical conductivity. There are a lot of problems.

이런 문제점을 보완하기 위해서는 물리적인 연마로 시편을 최대한 얇게 연마한 후에 이온빔 밀링과 같은 고가의 방법을 병행할 필요가 있다.In order to compensate for this problem, it is necessary to perform an expensive method such as ion beam milling after grinding the specimen as thinly as possible by physical polishing.

한편, 투과전자현미경 시편의 경우, 그 두께도 중요하지만 미세한 두께를 갖기 때문에 시편의 수평도가 중요하다. 특히 전술한 물리적 연마로 시편을 최대한 얇게 가공하는데 있어서는, 그라인더를 구성하는 시편 지지대의 수평도가 매우 중요하며, 시편 지지대의 수평이 정확하게 맞지 않다면 아무리 연마를 잘하였다 하더라도 투과전자현미경 관찰에 부적합한 시편이 될 수밖에 없다.On the other hand, in the case of a transmission electron microscope specimen, its thickness is important, but because of its fine thickness, the horizontality of the specimen is important. In particular, in the processing of the specimen as thin as possible by the above-described physical polishing, the horizontality of the specimen support constituting the grinder is very important. It must be.

그런데, 종래의 그라인더의 경우, 시편의 수평도 제어가 용이하지 않아 상당히 숙련되지 않은 실험자의 경우, 시편의 제작에 큰 어려움을 겪는다.However, in the case of a conventional grinder, the level control of the specimen is not easy to control, so that the experimenter who is not very skilled has a great difficulty in preparing the specimen.

본 발명은 전술한 종래 기술의 문제점을 해결하기 위해 창안된 것으로, 전자재료나 세라믹 재료와 같이 전기전도도가 낮아 화학적 연마법을 사용하기 어려운 시편을 물리적으로 얇게 연마할 수 있는 그라인더에 사용되는 연마대로서, 초보자라 하여도 쉽고 정확하게 수평도 제어가 가능하여, 투과전자현미경 시편 제작 편의성과 정확성을 향상시킨 그라인더용 연마대를 제공하는 것을 해결하고자 하는 과제로 한다.The present invention was devised to solve the above-mentioned problems of the prior art, and the polishing table used in the grinder which can physically thinly grind specimens having low electrical conductivity, such as electronic materials or ceramic materials, which are difficult to use chemical polishing methods. In order to solve the problem, even a beginner can easily and precisely control the level, and to provide a grinder polishing table having improved transmission electron microscope specimen convenience and accuracy.

상기 과제를 해결하기 위한 본 발명에 따른 투과전자혀미경 시편 제작용 연마대는, 지지대와, 상기 지지대상에 놓이는 연마판지지대와, 상기 연마판지지대 상에 놓이는 연마판으로 이루어지고, 상기 지지대의 하부에 배치되며 측정봉이 상기 지지대의 하부를 관통하여 상기 연마판에 접하도록 배치되는 3 이상의 마이크로미터를 포함하며, 상기 마이크로미터의 조작을 통해 상기 측정봉에 접한 연마판을 상하로 이동시킴으로써 상기 연마판의 수평을 조절할 수 있도록 되어 있는 것을 특징으로 한다.According to an aspect of the present invention, there is provided a polishing table for manufacturing a transmission electron tongue microscopic specimen, comprising a support, an abrasive plate support placed on the support object, and an abrasive plate placed on the abrasive plate support, And at least three micrometers disposed in contact with the polishing plate through a lower portion of the support, and by moving the polishing plate in contact with the measuring rod up and down through manipulation of the micrometer. Characterized in that it is possible to adjust the horizontal.

또한, 상기 연마판은 선택적으로 유리판일 수 있으며, 상기 마이크로미터는 3개 이상이면 소정의 수평 조절 기능을 발휘할 수 있으나, 5개의 마이크로미터를 십자 형태로 배치하는 것이 보다 바람직하다.In addition, the abrasive plate may optionally be a glass plate, the micrometer is more than three may exhibit a predetermined horizontal adjustment function, it is more preferable to arrange the five micrometer in the cross shape.

본 발명에 따른 연마대에 의하면, 지지대 하단에 부착된 마이크로미터를 통해 연마판의 수평을 조절하기 때문에, 숙련되지 않은 초보자라도 쉽고 빠르게 원하는 두께의 투과전자현미경 시편을 제작할 수 있다.According to the polishing table according to the present invention, since the level of the polishing plate is adjusted through a micrometer attached to the bottom of the support, even an inexperienced beginner can easily and quickly produce a transmission electron microscope specimen having a desired thickness.

또한, 본 발명에 따른 연마대에 의하면, 금속 시편의 경우에는 전해 연마 전 단계, 세라믹 시편의 경우 딤플 그라인딩 전단계인 70 ~ 80㎛ 두께의 시편을 만드는데 있어서 시편의 손상을 최소화시킬 수 있다.In addition, according to the polishing table according to the present invention, it is possible to minimize the damage of the specimen in the preparation of 70 ~ 80㎛ thick specimens before electrolytic polishing in the case of metal specimens, dimple grinding in the case of ceramic specimens.

도 1은 본 발명의 실시예에 따른 연마대를 위쪽에서 바라본 상태를 나타내는 사시도이다.1 is a perspective view showing a state viewed from above the polishing table according to an embodiment of the present invention.

도 2는 본 발명의 실시예에 따른 연마대를 아래쪽에서 바라본 상태를 나타내는 사시도이다.Figure 2 is a perspective view showing a state viewed from the bottom of the polishing table according to an embodiment of the present invention.

도 3은 본 발명의 실시예에서 사용한 마이크로미터의 측면도이다.3 is a side view of a micrometer used in an embodiment of the present invention.

도 4는 본 발명의 실시예에 따른 연마대 상에 시편 고정장치가 설치되어 있는 상태를 나타내는 사시도이다.4 is a perspective view showing a state in which a specimen fixing device is installed on a polishing table according to an embodiment of the present invention.

이하, 본 발명의 바람직한 실시예를 기초로 본 발명을 구체적으로 설명한다. 그러나 본 발명의 기술적 사상은 이에 한정되거나 제한되지 않고 당업자에 의해 변형되어 다양하게 실시될 수 있음은 물론이다.Hereinafter, the present invention will be specifically described based on the preferred embodiments of the present invention. However, the technical spirit of the present invention is not limited thereto, but may be variously modified and modified by those skilled in the art.

도 1과 2는 각각 본 발명의 실시예에 따른 연마대를 위쪽과 아래쪽에서 바라본 상태를 나타내는 사시도이다.1 and 2 are perspective views showing a state in which the polishing table according to the embodiment of the present invention respectively viewed from above and below.

도시된 바와 같이, 본 발명의 실시예에 따른 연마대(1)는 지지대(10)와, 상기 지지대상에 놓이는 연마판지지대(20)와, 상기 연마판지지대 상에 놓이는 연마판인 유리판(30)과, 상기 지지대의 하부에서 측정봉이 상기 유리판(30)과 접하도록 배치되는 5개의 마이크로미터(40)로 이루어져 있다.As shown, the polishing table 1 according to the embodiment of the present invention is a glass plate 30 which is a support plate 10, an abrasive plate support 20 placed on the support object, and an abrasive plate placed on the abrasive plate support. ) And five micrometers 40 disposed at the bottom of the support to be in contact with the glass plate 30.

상기 지지대(10)는, 도 2에 도시된 바와 같이, 사각형의 하부패널(11)과, 상기 하부패널(11) 상에 설치되며 상부에 내측으로 단면상 "ㄴ"자 형상의 홈에 형성되어 있는 4개의 다리부(12)와, 상기 4개의 다리부에 형성된 홈에 설치되는 높이조절봉(13)과 상기 4개의 높이조절봉(13)에 얹혀지는 사각형의 상부패널(14)로 이루어진다.As shown in FIG. 2, the support 10 is formed in a rectangular lower panel 11 and a groove having a cross-sectional “b” shape installed on the lower panel 11 and inwardly in an upper portion thereof. It consists of four legs 12, a height adjusting rod 13 installed in the grooves formed in the four leg portions and a rectangular top panel 14 mounted on the four height adjusting rods 13.

상기 연마판지지대(20)는, 소정 높이를 갖는 사각형의 고리형상으로 되어 있어 상기 유리판(30)의 평행 움직임을 구속하도록 되어 있으며, 그 하부에는 연마판지지대(20)를 상기 상부패널(14)에 고정하기 위한 플랜지부(21)가 형성되어 있다. 또한 상기 연마판지지대(20)의 내측에는 4개의 유리판지지봉(22)이 설치되어 유리판(30)을 지지하도록 되어 있다. The abrasive plate support 20 has a rectangular annular shape having a predetermined height to restrain parallel movement of the glass plate 30, and the abrasive plate support 20 is disposed at the bottom of the upper panel 14. The flange portion 21 for fixing to is formed. In addition, four glass plate support rods 22 are provided inside the abrasive plate support 20 to support the glass plate 30.

상기 유리판(30)은 단부가 상기 연마판지지대(20)의 고리형상 내부에 수용될 수 있는 크기의 사각형으로 이루어져 있다.The glass plate 30 is formed of a quadrangle having an end portion that can be accommodated in the annular shape of the abrasive plate support 20.

상기 마이크로미터(40)는 0.001㎜ 까지 측정 가능한 것으로, 도 3에 도시된 바와 같이, 측정된 거리를 표시하는 인디케이터부(41)와 조절손잡이(42)의 회전에 따라 길이가 변동하는 측정봉(43)으로 이루어져 있다. 그리고 상기 인디케이터부(41)는 지지대의 상부패널의 하면에 설치되며, 측정봉(43)은 상부패널(14)을 관통하고 상기 연마판지지대(20)를 통과하여 상기 유리판(30)의 하면에 맞닿을 수 있도록 설치된다. 그리고 상기 마이크로미터(40)는 총 5개가 도 1에 도시된 바와 같이 십자 형태로 배치하되, 연마 방향으로 다소 길게 배치한다.The micrometer 40 is capable of measuring up to 0.001 mm, and as shown in FIG. 3, a measuring rod whose length varies according to the rotation of the indicator portion 41 and the adjustment knob 42 indicating the measured distance ( 43). In addition, the indicator part 41 is installed on the lower surface of the upper panel of the support, and the measuring rod 43 passes through the upper panel 14 and passes through the polishing plate support 20 to the lower surface of the glass plate 30. It is installed to abut. A total of five micrometers 40 are arranged in a cross shape as shown in FIG. 1, but are arranged slightly longer in the polishing direction.

이와 같이 구성된 투과전자현미경 시편 제작용 연마대(1)의 경우, 최초 한쪽 귀퉁이 부분에 위치한 마이크로미터의 인디케이터 값을 '0'으로 맞춘 후, 시계방향으로 십자형상으로 배치된 마이크로미터의 인디케이터 값을 '0'으로 맞추고 중앙에 위치한 마이크로미터의 인디케이터 값을 맞춤으로써, 각 유리면의 수평높이를 동일하게 유지할 수 있게 된다.In the case of the polishing table 1 for manufacturing a transmission electron microscope specimen configured as described above, the indicator value of the micrometer located at the first corner is set to '0', and then the indicator value of the micrometer arranged in a crosswise clockwise direction is adjusted. By setting it to '0' and adjusting the indicator of the center micrometer, the horizontal height of each glass surface can be kept the same.

이와 같이 유리판(30)의 수평이 조절된 연마대(1)는 유리판(30)의 표면에 연마제를 도포한 후에, 도 4에 도시된 바와 같이, 시편을 부착한 시편고정수단(50)을 상기 유리판(30) 상에 위치시킨 후, 시편고정수단(50)을 레일(52)을 따라 이동시키면 시편고정수단(50)의 자중에 의해 시편(51)의 연마가 이루어지게 된다.As described above, the polishing table 1 in which the level of the glass plate 30 is adjusted is coated with the abrasive on the surface of the glass plate 30, and as shown in FIG. 4, the specimen fixing means 50 is attached to the specimen. After positioning on the glass plate 30, the specimen fixing means 50 is moved along the rail 52, the specimen 51 is polished by the weight of the specimen fixing means 50.

Claims (2)

투과전자현미경용 시편 제작용 연마대로서, As a polishing table for specimen manufacturing for transmission electron microscope, 지지대와, 상기 지지대상에 놓이는 연마판지지대와, 상기 연마판지지대 상에 놓이는 연마판으로 이루어지고,And a support plate, an abrasive plate support placed on the support object, and an abrasive plate placed on the abrasive plate support, 상기 지지대의 하부에 배치되며 측정봉이 상기 지지대의 하부를 관통하여 상기 연마판에 접하도록 배치되는 3 이상의 마이크로미터를 포함하며,3 or more micrometers disposed below the support and disposed so that the measuring rod penetrates the bottom of the support to contact the polishing plate, 상기 마이크로미터의 조작을 통해 상기 측정봉에 접한 연마판을 상하로 이동시킴으로써 상기 연마판의 수평을 조절할 수 있도록 되어 있는 것을 특징으로 하는 투과전자현미경 시편 제작용 연마대.Transmissive electron microscope specimen polishing table, characterized in that the level of the polishing plate can be adjusted by moving the polishing plate in contact with the measuring rod up and down through the operation of the micrometer. 제 1 항에 있어서, 상기 연마판은 유리로 이루어지고 상기 마이크로미터는 5개가 십자 형태로 배치된 것을 특징으로 하는 투과전자현미경 시편 제작용 연마대.According to claim 1, wherein the polishing plate is made of glass and the micrometer is a polishing table for producing a transmission electron microscope specimen, characterized in that five arranged in a cross shape.
KR1020080017932A 2008-02-27 2008-02-27 Grinding die for preparing transmission electron microscope specimens with level controlling means KR20090092600A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104400625A (en) * 2014-10-14 2015-03-11 梁信宏 Automatic plane grinding height regulating device
CN111571336A (en) * 2020-04-27 2020-08-25 武昌船舶重工集团有限公司 Surface grinding machine and numerical control four-corner base plate machining device thereof

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104400625A (en) * 2014-10-14 2015-03-11 梁信宏 Automatic plane grinding height regulating device
CN111571336A (en) * 2020-04-27 2020-08-25 武昌船舶重工集团有限公司 Surface grinding machine and numerical control four-corner base plate machining device thereof
CN111571336B (en) * 2020-04-27 2021-10-08 武昌船舶重工集团有限公司 Surface grinding machine and numerical control four-corner base plate machining device thereof

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