KR20090089558A - Printed circuit board for camera module and camera module using the same - Google Patents

Abstract

A printed circuit board for a camera module and the camera module using the same are provided to form a ventilation hole for discharging air to the outside on an upper part of a substrate, thereby preventing deformation/damage of an image sensor. A substrate for a camera module(110) is formed in rectangular plate shape. In an upper girth of the substrate for a camera module, a plurality of upper pads(111) is formed. In rectangular outsides of the substrate, a plurality of side pads(112) is formed. A component mount groove(113) having a predetermined depth is formed to mount a plurality of electronic components(120). A ventilating hole(115) discharges air inside the component mount groove to the outside.

Description

Printed circuit board for camera module and camera module using the same}

The present invention relates to a substrate for a camera module and a camera module using the same, and more particularly, by forming a ventilation hole for discharging air to the outside on the substrate for the camera module coupled to the bottom of the housing, when the image sensor is coupled to the substrate It relates to a camera module substrate and a camera module using the same that can prevent deformation and damage of the generated image sensor.

In general, a camera module is a device for converting a photographed subject into an electrical signal after photographing a subject, and is adopted in a digital apparatus for photographing a subject such as a digital camera, a digital camcorder, a mobile phone, and a surveillance camera. In addition, with the development of technology, miniaturization and thinning are gradually increasing, and the demand is increasing exponentially.

Such a camera module is composed of a housing, an IR filter, an image sensor, and a substrate, and is manufactured by combining a lens unit for capturing an image of a subject in front of the housing so that the captured image is collected by an image sensor through an IR filter. do.

In addition, in the recent camera module manufacturing method, a module package is manufactured by combining a housing in which an IR filter is combined with a lens barrel equipped with a lens group, and a board having a plurality of circuit components mounted thereon is separately manufactured so that each corresponding surface is By bonding to each other, manufacturing methods are being adopted that can simplify the manufacturing process of camera module products and reduce manufacturing costs.

Such a camera module will be briefly described with reference to the drawings shown below.

1 is an assembled perspective view of a camera module according to the prior art, and FIG. 2 is an assembled sectional view of the camera module according to the prior art.

First, as shown in FIG. 1, in the camera module according to the related art, an image sensor 30 for converting incident light incident from the outside into an electrical signal is coupled on the substrate 10, and a plurality of lenses (not shown) are provided. IR filter 40 is coupled to the lower portion of the housing 50 to which the lens barrel 60 is mounted, and the housing 50 is tightly coupled to the substrate 10.

Here, the combination of the substrate 10 and the image sensor 30, by applying an adhesive such as epoxy (Polyoxy) to the center of the upper surface of the substrate 10 and seating the image sensor 30 at a predetermined temperature By curing, the substrate 10 and the image sensor 30 are combined.

At this time, before coupling the image sensor 30 to the substrate 10, as shown in Figure 2, a plurality of electronic components 20 in the component mounting groove 13 formed in the center of the substrate 10 Mount it.

After coupling the image sensor 30 on the substrate 10 in this way, by coupling the housing 50, the lens barrel 60 and the IR filter 40 is coupled to the upper outer edge of the substrate 10 Complete the camera module.

However, the camera module according to the prior art as described above has the following problems.

In the camera module according to the related art, when the substrate 10 and the image sensor 30 are coupled to each other, air of the component mounting groove 13 formed at the center of the substrate 10 may not be discharged to the outside, and thus the substrate 10 ) And the expansion of the epoxy applied between the image sensor 30 causes the tilt of the image sensor 30 to occur, thereby deforming the image sensor 30.

In addition, there is a problem in that the crack is generated in the image sensor 30 due to the expansion of the air due to the combination of the substrate 10 and the image sensor 30, the damage to the image sensor 30 As a result, there was a problem that the defective rate of the camera module is increased.

The present invention has been made to solve the above problems, by forming a ventilation hole for discharging the air to the outside on the substrate for the camera module coupled to the bottom of the housing, the deformation of the image sensor generated when the image sensor is coupled to the substrate and It is an object of the present invention to provide a camera module substrate and a camera module using the same that can prevent damage.

The camera module substrate according to the present invention for achieving the above object is made of a rectangular plate shape, a component mounting groove is formed in which a plurality of electronic components are mounted in the center, any one or more outer side relative to the component mounting groove Vent holes are formed through which air can flow.

In this case, the substrate is characterized in that the ceramic substrate, the depth of the vent is characterized in that formed lower than the depth of the component mounting groove.

In addition, the camera module using the substrate according to the present invention for achieving the above object, the lens barrel is equipped with a lens therein is coupled, the IR filter for blocking the infrared light of the incident light incident from the outside is mounted on the inner bottom Housing; And a substrate mounted on an upper surface of the image sensor for converting light incident through the IR filter into an electrical signal, and having an upper outer edge coupled to a lower end of the housing. The substrate has a rectangular plate shape. In the center, a component mounting groove in which a plurality of electronic components are mounted is formed, and a ventilation hole through which air can flow in any one or more outward directions is formed based on the component mounting groove.

At this time, the substrate is characterized in that the ceramic substrate, the depth of the ventilation hole is characterized in that formed lower than the depth of the component mounting groove.

In addition, the end of the ventilation hole is characterized in that it is formed so as to be exposed to the side of the image sensor mounted on the substrate, it is possible to prevent the deformation or damage of the image sensor by discharging the air of the component mounting groove to the outside of the substrate It works.

The camera module substrate and the camera module using the same according to the present invention are formed when the image sensor is coupled to the substrate by forming a vent hole for discharging air to the outside of the camera module substrate coupled to the bottom of the housing There is an effect that can prevent deformation and damage of the image sensor.

In addition, the camera module substrate and the camera module using the same according to the present invention can prevent the deformation and damage of the image sensor has the effect of reducing the defective rate of the camera module.

Details regarding the configuration and effects of the camera module substrate and the camera module using the same according to the present invention will be clearly understood by the following detailed description with reference to the drawings showing preferred embodiments of the present invention.

Example

Hereinafter, a camera module substrate and a camera module using the same according to the present invention will be described in detail with reference to the accompanying drawings.

3 is a plan view of a substrate for a camera module according to the present invention.

First, as shown in FIG. 3, the camera module substrate 110 according to the present invention has a rectangular plate shape, and a plurality of upper pads 111 are formed at an upper edge thereof, A plurality of side pads 112 are formed and electrically connected to an image sensor (see 130 of FIG. 4) to be mounted on the substrate 110. In this case, it is preferable that the substrate 110 uses a ceramic board.

In addition, the substrate 110 has a component mounting groove 113 having a predetermined depth in the center thereof, so that a plurality of electronic components 120 are mounted.

At this time, the depth of the component mounting groove 113 is preferably formed to be deeper than the height of the plurality of electronic components 120. The reason for this is that when the camera module is assembled, the image sensor should be coupled to the substrate 110. The image sensor is formed in a plane so that the depth of the component mounting groove 113 is lower than the height of the electronic component 120. The component 120 causes a problem that the image sensor cannot be coupled horizontally. Accordingly, the depth of the component mounting groove 113 may be formed deeper than the height of the plurality of electronic components 120 to facilitate the coupling of the image sensor and the substrate 110.

In particular, the camera module substrate 110 according to the present invention, based on the component mounting groove 113 formed in the upper center, the air in the component mounting groove 113 in any one or more outer edge direction is discharged to the outside. A vent hole 115 is formed to allow.

As shown, the ventilation holes 115 may be formed only in one of four directions of the quadrangular substrate 110, and a plurality of ventilation holes 115 may be formed in one or more directions for easy discharge of air.

In addition, the depth of the ventilation hole 115 is preferably formed lower than the depth of the component mounting groove 113. The reason is that if the depth of the ventilation hole 115 is formed too deep, it may affect the circuit wiring formed in the substrate 110, so that the air present in the component mounting groove 113 when the image sensor is coupled to each other may be affected. It is desirable to form a depth that can flow to the outside.

In addition, the length of the ventilation hole 115 is formed longer than the length to the outer edge of the image sensor so that the end of the ventilation hole 115 is exposed to the outside when the image sensor is seated on the substrate 110 It should be possible to release the air to the outside.

The camera module using the camera module substrate 110 configured as described above will be described in more detail with reference to the accompanying drawings.

4 is an assembled perspective view of the camera module according to the present invention, Figure 5 is an assembly cross-sectional view of the camera module according to the present invention.

As shown in FIGS. 4 and 5, the camera module using the camera module substrate 110 includes the camera module substrate 110, the image sensor 130, and an IR filter (infrared ray cut filter). 140, the housing 150, and the lens barrel 160.

Here, the lens barrel 160 is mounted with a plurality of lenses (not shown) to collect incident light incident from the outside to the image sensor 130.

The lens 150 is coupled to the housing 150 at an upper portion thereof, and the IR filter 140 is mounted at an inner lower portion to block infrared rays from incident light incident from the outside.

The substrate 110 on which the image sensor 130 is mounted is coupled to a lower portion of the housing 150 in which the lens barrel 160 and the IR filter 140 are mounted.

In this case, the image sensor 130 converts the incident light into an electrical signal and transmits it to the outside, and is mounted on the substrate 110.

The substrate 110 includes a plurality of upper pads 111 and side pads 112 electrically connected to the image sensor 130 and external devices on upper and side surfaces thereof, and a plurality of circuit wirings formed therein. (Not shown) is formed.

In addition, the camera module can be miniaturized by forming a component mounting groove 113 in which a plurality of electronic components 120 are mounted in the center of the substrate 110.

In particular, the substrate 110 of the camera module according to the present invention is formed with a vent hole 115 having a predetermined depth in the outward direction in which the upper pad 111 is formed on the basis of the component mounting groove 113.

At this time, the depth of the ventilation hole 115 is preferably formed to be lower than the depth of the component mounting groove 113 so that the air in the component mounting groove 113 can be discharged to the outside.

In addition, the ventilation hole 115 may be formed in one direction of the quadrangular substrate 110 to discharge air from the component mounting groove 113, and the substrate 110 may be coupled to the image sensor 130. In order to prevent the ventilation hole 115 from being blocked by the adhesive, it may be formed in any one or more of all the outer directions.

In addition, the ventilation hole 115 is preferably formed to extend to the outside of the area where the image sensor 130 is mounted so that the end is exposed to the outer surface of the image sensor 130 to facilitate the discharge of air.

When the camera module having the structure is coupled to the substrate 110 and the image sensor 130, the air existing in the component mounting groove 113 is not expanded in the curing process of the adhesive and is externally provided through the ventilation hole 115. As it is discharged to there is an advantage that can prevent problems such as deformation or damage of the image sensor 130 caused by the expansion of the conventional air.

In addition, since the deformation or damage of the image sensor 130 does not occur by the ventilation hole 115, there is an advantage that the reliability of the camera module may be improved by reducing the failure rate of the camera module.

Preferred embodiments of the present invention described above are disclosed for the purpose of illustration, and various substitutions, modifications, and changes within the scope without departing from the spirit of the present invention for those skilled in the art to which the present invention pertains. It will be possible, but such substitutions, changes and the like should be regarded as belonging to the following claims.

1 is an assembled perspective view of a camera module according to the prior art.

Figure 2 is an assembled cross-sectional view of the camera module according to the prior art.

3 is a plan view of a substrate for a camera module according to the present invention.

4 is an assembled perspective view of the camera module according to the present invention.

5 is an assembled cross-sectional view of the camera module according to the present invention.

<Description of Symbols for Major Parts of Drawings>

110: substrate 111: upper pad

112: side pad 113: component mounting groove

120: electronic component 130: image sensor

140: IR filter 150: housing

160: Lens Barrel

Claims (7)

A substrate for a camera module having a rectangular plate shape, a component mounting groove in which a plurality of electronic components are mounted in the center is formed, and vent holes through which air can flow in any one or more outward directions based on the component mounting groove. The method of claim 1, The substrate for a camera module, characterized in that the substrate is a ceramic substrate. The method of claim 1, The depth of the ventilation hole is a camera module substrate, characterized in that formed lower than the depth of the component mounting groove. A lens barrel having a lens mounted therein and a housing having an IR filter mounted on an inner lower portion thereof to block infrared rays from incident light incident from the outside; And A substrate on which an image sensor for converting light incident through the IR filter into an electrical signal is mounted, and an outer edge of the upper surface coupled to a lower end of the housing; Including; The substrate may be formed in a rectangular plate shape, and a component mounting groove in which a plurality of electronic components are mounted may be formed at a center thereof, and a ventilation hole may be formed in which air may flow in at least one outside direction based on the component mounting groove. Camera module. The method of claim 4, wherein The substrate is a camera module, characterized in that the ceramic substrate. The method of claim 4, wherein The depth of the ventilation hole is a camera module, characterized in that formed lower than the depth of the component mounting groove. The method of claim 4, wherein The end of the ventilation hole is a camera module, characterized in that formed to be exposed to the side of the image sensor mounted on the substrate.

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