KR20090087606A - Dual camera module and production method and device for the same - Google Patents

Abstract

A dual camera module, a manufacturing method and a manufacturing device thereof are provided to remove a protrusion in a housing of a camera module, thereby making the module small and light. Printed circuit boards are formed on both sides of an FPC(Flexible Print Circuit)(330). The first and second image sensors(160,260) are adhered to both sides of the FPC. The first and second image sensors are electrically connected to a terminal part of a printed circuit of the FPC. Housings of the first and second camera modules respectively contain the first and second image sensors. The first lower jig includes the first concave part. The first guide unit positions a housing of the first camera module to be assembled with the first image sensor at a determined location.

Description

Dual Camera Module And Production Method And Device For The Same

The present invention relates to a dual camera module, a method for manufacturing the same, and a manufacturing apparatus thereof, and more particularly, a thickness of a dual camera module by mounting a camera module on a flexible printed circuit (FPC) having circuits formed on both surfaces thereof. While reducing the optical axis when mounted.

Portable electronic devices such as mobile phones are always required to have a multifunction, but there is always a basic challenge to be miniaturized for easy portability. For example, in the case of mobile phones, consumers demand multi-functions such as music playback, photography, schedule management, and video communication, and many components for realizing them must be mounted in the mobile phones. The demand to do is getting stronger.

In addition, as high-resolution cameras are widely installed in mobile phones, and video calls through mobile phones have been introduced, mobile phones are equipped with a camera module capable of taking pictures with high resolution and a low resolution camera module for video calls. Getting started.

Accordingly, while miniaturizing the camera module mounted on the mobile phone, a lot of research has been made on how to mount it.

For example, in the case of Korean Patent 730765, two image sensors 100 and 200 used in a dual camera are bonded to each other and mounted on a PCB 300, a printed circuit board as shown in FIG. The through hole 310 is provided in the PCB 300 to allow the external image signal to be transmitted to the 200. However, in the case of the lower camera module 250 using the PCB-side image sensor 200, there is a problem in that it is difficult to use a housing or a lens that is normally used due to the change in the focal length caused by the through hole 310.

In addition, in the case of Korean Patent No. 769725, the camera modules 150 and 250 are mounted on both sides of the PCB 300 connected to the FPC 330 as shown in FIGS. 2 and 3, but the optical axis of the camera module is not twisted. In order to fix the camera module by forming points on the PCB and the FPC to determine the position of the camera module, respectively. That is, the FPC 330 is provided with a through hole 332 into which the housing 152 of the upper camera module is fitted, and the PCB 300 has its outer edge coinciding with the edge of the housing 252 of the lower camera module. Only when the optical axis is not misaligned, the design of the FPC and the PCB must be reflected in advance, and there is a problem that it is not easy to match them during assembly.

In particular, when mounting the camera module on the PCB with the image sensor, the projections (153, 253) formed on the lower portion of the housing (152, 252) of the camera module, as shown in Figure 4, in addition to the method disclosed in the Republic of Korea Patent 769725 on the PCB 300 The optical axis is prevented from being misaligned by being inserted into the recessed part 301 processed in this way. To this end, the use of a PCB having a predetermined thickness is inevitable, and the use of such a PCB is a factor preventing the miniaturization of the camera module.

PCB described throughout this description refers to a conventional rigid PCB that forms a substrate made of epoxy resin or bakelite resin and forms a printed circuit thereon, and FPC refers to a printed circuit on a flexible film such as polyester. Even if there is a slight increase in thickness, Rigid-Flexible Print Circuit (R-FPC), which is slightly reinforced in some areas of the FPC, is also included in the FPC.

The present invention provides a manufacturing method for mounting the camera module directly on the FPC without the need for a PCB having a through-hole or reference plane for mounting the camera module, and also excellent dual camera that the optical axis is not twisted according to this manufacturing method The purpose is to provide a module.

Dual camera module manufacturing method of the present invention,

Providing an FPC having first and second image sensors mounted on both sides thereof, respectively;

A first lower jig having the FPC mounted so that the first image sensor faces upward, and having a first recess for preventing the second image sensor from interfering with a floor when the FPC is mounted;

A first guide part for positioning the housing of the first camera module to be assembled with the first image sensor at a predetermined position;

Providing an upper jig for bringing the housing of the FPC and the first camera module into close contact with each other;

Applying an adhesive to an adhesive portion of the housing of the FPC or the first camera module;

Pressing the housing of the FPC and the first camera module with each other by the upper jig and the first lower jig and curing the adhesive;

A second lower jig having a second recessed portion for mounting the FPC such that the housing of the first camera module is joined downward with the face of the FPC bonded thereto so that the housing of the first camera module does not interfere with the floor; Mounting the FPC to which the housing of the camera module is bonded;

Providing a second guide portion for positioning the housing of the second camera module to be assembled with the second image sensor at a predetermined position, thereby positioning the housing of the second camera module at the predetermined position;

Applying an adhesive to an adhesive portion of the housing of the FPC or the second camera module;

And pressing the housing of the FPC and the second camera module with each other by the upper jig and the second lower jig and curing the adhesive.

The dual camera module manufactured by the manufacturing method

An FPC having printed circuits formed on both sides thereof;

First and second image sensors respectively attached to both sides of the FPC and electrically connected to terminal portions of a printed circuit of the FPC;

And a housing of the first and second camera modules accommodating the first and second image sensors, respectively, and bonded to the FPC.

In addition, the manufacturing apparatus for manufacturing a dual camera having the first and second camera modules of the present invention

A positioning unit for mounting the FPCs with the first and second image sensors on both sides at a predetermined position, a jig guide portion, and a first concave portion processed so that the second image sensor does not interfere with the floor. A first lower jig;

A first guide part coupled to the jig guide part of the first lower jig and having a through hole for positioning the housing of the first camera module at a predetermined position;

An upper jig engaged with the jig guide of the first lower jig to pressurize the housing of the first camera module on the FPC mounted on the first lower jig;

A positioning unit for mounting the FPC on which the housing of the first camera module is mounted at a predetermined position, a jig guide portion, and a second recessed portion processed so that the housing of the first camera module does not interfere with the floor. A second lower jig;

Coupled with the jig guide of the second lower jig, it is characterized by consisting of a second guide portion having a through hole for positioning the housing of the second camera module in a predetermined position.

The first and second lower jig may be made of one jig if the first and second recesses are properly adjusted.

According to the present invention, there is no need for a PCB having a through hole or a reference plane for mounting the camera module, and the projections provided in the housing of the camera module can be omitted, thereby making it possible to reduce the size and weight of the camera module. You can get a module.

Hereinafter, the present invention will be described in more detail with reference to the accompanying drawings.

5 is a cross-sectional view of the camera module of the present invention to be described below. In the camera module of the present invention, image sensors 160 and 260 are attached to both sides of the FPC 330 on which the printed circuits are formed, and the housings 152 and 252 are accommodated in the FPC 330 while accommodating the image sensors 160 and 260 therein. Will be attached.

Hereinafter, the circuit and the terminal portion of the FPC will be omitted in some drawings.

In order to manufacture the camera module of the present invention as described above, it is required to accurately align and attach the housing of the camera module on the FPC without forming a reference plane or a hole of the PCB to be a reference for position alignment. The manufacturing method peculiar to this invention should be used, and this is demonstrated below.

First, as shown in FIG. 6, the FPC 330 having the first and second image sensors 160 and 260 mounted on both surfaces thereof should be provided. In order to mount the image sensor on the FPC, the image sensor may be bonded to the FPC and then wire-bonded between the connection terminal provided on the FPC and the terminal of the image sensor, and the image sensor may be mounted according to the surface mounting technology (SMT) process. It is also possible to connect to the connection terminal of the FPC, since this process belongs to a known technique, detailed description thereof will be omitted.

The FPC of FIG. 6 is integrally formed as shown in FIG. 7 for mass production, and is manufactured to be cut and used when the manufacturing process is completed.

Next, as shown in FIG. 8, the FPC 330 is mounted on the first lower jig 10 so that the first image sensor 160 faces upward. In this case, the FPC 330 is mounted on the opposite side of the FPC 330 as shown in FIG. 9. The first lower jig 10 is provided with a first recess 12 to prevent the second image sensor 260 from interfering with the first lower jig 10.

That is, the second image sensor 260 is inserted into the first concave portion 12 of the first lower jig 10, and the FPC is fixed at the predetermined position by the position alignment part 14 of the first lower jig 10. Will be.

The alignment unit 14 may be formed of a protruding wall or the like for fixing the outside of the FPC. In addition, the first lower jig 10 is provided with a guide rod 16 so as to guide the first and second guide parts and the upper jig.

Next, the housing 152 of the first camera module is placed on the FPC 330 in which the first image sensor 160 is exposed upward from the first lower jig 10, in which case the first camera Adhesive is applied to the lower portion where the housing 152 of the module contacts the FPC 330. Alternatively, an adhesive may be applied onto the FPC 330 to which the housing 152 of the first camera module is to be bonded. Any adhesive may be used as long as the adhesive is cured through a separate curing process such as a thermosetting or ultraviolet curable adhesive.

In order to position the housing 152 of the first camera module at a predetermined position so that the optical axis is not twisted with respect to the first image sensor 160, the first guide part 20 is used. The guide unit 20 may include a through hole 22 into which the housing 152 of the first camera module may be fitted to allow the housing 152 of the first camera module to be positioned at a predetermined position. The first lower jig 10 and the first guide part 20 are coupled to the guide rod 16 of the first lower jig 10 so that the first lower jig 10 and the first guide part 20 may be coupled at a predetermined position.

Next, as shown in FIG. 12, the upper jig 30, which is in close contact with the FPC 330 and the housing 152 of the first camera module, is pressed together with the first lower jig 10. At this time, it is also preferable to have a fastening portion (not shown) for fixing the upper jig and the first lower jig. In this way, the FPC 330 and the housing 152 of the first camera module closely contacted between the upper jig 30 and the first lower jig 10 are bonded to each other by curing the adhesive in a manner of being placed in an electric furnace or irradiating ultraviolet rays. To keep it.

At this time, the first guide portion 20 may be left as it is between the upper jig 30 and the first lower jig 10 according to the thickness, the first guide portion 20 is the housing of the first camera module ( It is also possible to place the 152 on the FPC 330 and then to remove it and to make the FPC 330 and the housing 152 of the first camera module adhere to each other using only the upper jig 30 and the first lower jig 10. Do.

When the step of adhering the housing of the first camera module to the FPC is completed, the FPC is mounted on the second lower jig 40 again. At this time, as shown in FIG. 13, the housing of the first camera module is inserted into the second recess of the second lower jig 40.

Next, the housing of the second camera module is placed on the second image sensor on the FPC in which the first image sensor is exposed upward from the second lower jig, and the adhesive is applied, and then the position is determined by using the second guide part. 2 The lower jig and the upper jig press the housing of the second camera module to the FPC to cure the adhesive.

Determining and gluing the housing of the FPC and the second camera module through the second lower jig is almost the same process as attaching the housing of the first camera module to the FPC. It will be easy to understand.

In the above description, the guide rods are provided on the first and second lower jigs to guide the first and second guide parts and the upper jig. However, although not shown, guide holes are provided in the first and second lower jigs as another jig guide part. It may be possible to provide a guide rod to the first and second guide parts and the upper jig.

The first and second lower jig may be manufactured as one jig when the depth of the first and second recesses is adjusted to a size such that the housings of the second image sensor and the first camera module do not interfere with the floor.

1 to 4 is a view showing the structure of a conventional camera module.

5 to 13 is a view showing the form, manufacturing method and manufacturing apparatus of the camera module of the present invention.

Claims (4)

An FPC having printed circuits formed on both sides thereof; First and second image sensors respectively attached to both sides of the FPC and electrically connected to terminal portions of a printed circuit of the FPC; And a housing of the first and second camera modules accommodating the first and second image sensors therein and bonded to the FPC, respectively. Providing an FPC having first and second image sensors mounted on both sides thereof, respectively; A first lower jig having the FPC mounted so that the first image sensor faces upward, and having a first recess for preventing the second image sensor from interfering with a floor when the FPC is mounted; A first guide part for positioning the housing of the first camera module to be assembled with the first image sensor at a predetermined position; Providing an upper jig for bringing the housing of the FPC and the first camera module into close contact with each other; Applying an adhesive to an adhesive portion of the housing of the FPC or the first camera module; Pressing the housing of the FPC and the first camera module with each other by the upper jig and the first lower jig and curing the adhesive; A second lower jig having a second recessed portion for mounting the FPC such that the housing of the first camera module is joined downward with the face of the FPC bonded thereto so that the housing of the first camera module does not interfere with the floor; Mounting the FPC to which the housing of the camera module is bonded; Providing a second guide portion for positioning the housing of the second camera module to be assembled with the second image sensor at a predetermined position, thereby positioning the housing of the second camera module at the predetermined position; Applying an adhesive to an adhesive portion of the housing of the FPC or the second camera module; And pressing the housings of the FPC and the second camera module with each other by the upper jig and the second lower jig and curing the adhesive. Manufacturing apparatus for manufacturing a dual camera having a first, second camera module A positioning unit for mounting the FPCs with the first and second image sensors on both sides at a predetermined position, a jig guide portion, and a first concave portion processed so that the second image sensor does not interfere with the floor. A first lower jig; A first guide part coupled to the jig guide part of the first lower jig and having a through hole for positioning the housing of the first camera module at a predetermined position; An upper jig engaged with the jig guide of the first lower jig to pressurize the housing of the first camera module on the FPC mounted on the first lower jig; A positioning unit for mounting the FPC on which the housing of the first camera module is mounted at a predetermined position, a jig guide portion, and a second recessed portion processed so that the housing of the first camera module does not interfere with the floor. A second lower jig; Coupled with the jig guide portion of the second lower jig, the dual camera module manufacturing apparatus characterized in that consisting of a second guide portion having a through hole for positioning the housing of the second camera module at a predetermined position. The apparatus of claim 3, wherein the first and second lower jigs have the same configuration.

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