KR20090085249A - Epoxy composition for adhesion strengthening of prepreg and copper, epoxy adhesive - Google Patents

Abstract

An epoxy composition is provided to apply a stacking process of prepreg and copper through a laminating method, to perform a lamination process of copper and prepreg at a low temperature in a short time, and to improve adhesion power of copper and prepreg. An epoxy composition for enhancing adhesion of prepreg and copper comprises a thermosetting resin 100~500 parts by weight; a rubber 10~200 parts by weight for imparting flexibility; a filler 100~300 parts by weight for compensating mechanical properties of the thermosetting resin; additive 10~100 parts by weight for controlling the surface in the processing of the composition; organic solvent 50~400 parts by weight for processability; and a hardener 100~400 parts by weight for coating properties of the composition.

Description

EPOXY COMPOSITION FOR ADHESION STRENGTHENING OF PREPREG AND COPPER, EPOXY ADHESIVE}

The present invention relates to an epoxy composition and an adhesive for strengthening the adhesion of copper to form a prepreg for forming an insulating layer and a circuit for forming a printed circuit board, and more particularly, it is possible to apply a bonding method of laminating. The present invention relates to an epoxy composition for strengthening the adhesion of prepreg and copper and to an epoxy adhesive processed thereby, which enables the adhesion of the prepreg and copper at a temperature and in a short time, but to increase the adhesion between the prepreg and the copper.

In general, a multilayer printed circuit board refers to a printed wiring board having a conductive pattern (circuit pattern) on at least three layers including a surface conductor layer, in which each layer of the multilayered wiring board (PCB) is separated and bonded with an insulating material. Prepreg is used as an insulating material between the layers of the wiring board, and the conductor pattern is formed of copper (Cu).

The prepreg is a sheet-like material which is cured in a semi-cured state by impregnating epoxy resin on a base material such as glass cloth, and used as a bonding sheet to form an insulating layer between wiring boards.

In the conventional process for manufacturing the multilayer printed circuit board, copper is formed at a high temperature and high pressure by laminating copper for forming a circuit pattern on a prepreg for forming an insulating layer between the multilayer wiring board.

By the way, in the prior art, the high temperature and high pressure process applied for lamination of prepreg and copper can increase the adhesion between the prepreg and copper, but it is urgently needed to improve the problem due to time and cost. Is in.

The present invention has been made to solve the above-mentioned conventional problems, it is possible to apply the bonding method of laminating to perform the lamination process of prepreg and copper at a low temperature and in a short time and between the prepreg and copper It is an object of the present invention to provide an epoxy composition for strengthening adhesion between prepreg and copper and an epoxy adhesive processed thereby, which can increase adhesion.

In addition, the present invention is to increase the adhesion between each other during the process of laminating the copper to the prepreg to reduce the time and cost according to the process progress, to improve the quality and product reliability.

The present invention in the composition of the epoxy composition for strengthening the adhesion of the prepreg and copper, 10 to 200 parts by weight of rubber for adding flexibility to 100 to 500 parts by weight of the thermosetting resin, and for complementing the mechanical properties of the thermosetting resin 100 to 300 parts by weight of the filler, 10 to 100 parts by weight of an additive for controlling the surface condition during processing of the composition, 50 to 400 parts by weight of an organic solvent for workability during processing of the composition, and a curing agent for coating properties of the composition It is characterized in that 100 to 400 parts by weight mixed composition.

At this time, the epoxy composition is preferably configured to have a glass transition temperature lower than the glass transition temperature of the prepreg used.

In addition, by using the epoxy composition described above is characterized in that the epoxy adhesive is processed to manufacture a liquid or thin film.

According to the present invention, it is possible to apply the laminating method of prepreg and copper to the laminating method during the manufacturing process of the printed circuit board, and to perform the laminating process of the prepreg and copper at a low temperature and in a short time by applying the laminating method. As a result, it is possible to reduce the time and cost according to the process progress, and to improve the adhesion problem between the prepreg and the copper, thereby improving the adhesion between the prepreg and the copper, and it is useful to stably form the circuit. In addition, by increasing the adhesion between the prepreg and copper, it is possible to improve the quality of the printed circuit board and increase the product reliability.

Hereinafter, the present invention will be described in detail.

In the epoxy composition for strengthening the adhesion of the prepreg and copper according to the present invention, the copper for circuit formation is laminated on the prepreg for forming an insulation layer during the manufacturing process of the multilayer printed circuit board, wherein the lamination is applied by applying a vacuum laminating technology. An adhesive strengthening composition for making it possible, comprising a mixed composition of a thermosetting resin, a rubber, a filler, an additive, an organic solvent, and a curing agent.

Here, the epoxy composition is 10 to 200 parts by weight of rubber, 100 to 300 parts by weight of filler, 10 to 100 parts by weight of additive, 50 to 400 parts by weight of organic solvent, and 100 to 400 parts by weight of curing agent based on 100 to 500 parts by weight of thermosetting resin. It is preferable to make it consist of the mixing composition which adds a part.

The thermosetting resin serves to influence the overall physical properties such as the coefficient of thermal expansion and tensile strength and insulation properties with respect to the adhesive composition consisting of the mixed composition of the above raw materials, and if the content exceeds 500 parts by weight can reduce the overall physical properties of the composition If it is less than 100 parts by weight, the adhesion may be lowered, and the chemical and heat resistance may be reduced.

The thermosetting resin is a phenol novolak epoxy resin, P-type epoxy, bisphenol A type epoxy resin, bisphenol F type epoxy resin, phenol novolak type epoxy resin, bisphenol S type epoxy resin, alkyl phenol novolak type epoxy resin, naphthalene type epoxy It is preferable to use a resin, a dicyclopentadiene type epoxy resin, and an alicyclic epoxy resin, and any one of them can be used or two or more kinds can be used in combination.

The rubber serves to add flexibility to the composition, and if it exceeds 200 parts by weight, the flexibility is improved, but not only the workability during processing of the adhesive using the composition can lower the physical properties of the composition such as thermal properties, When applied to less than 10 parts by weight, there is a lack of flexibility, the cracking phenomenon occurs in the process for producing an epoxy adhesive in the form of a coating or a thin film film is difficult to apply the process.

As the rubber, polybutadiene rubber, epoxy modified polybutadiene rubber, urethane modified polybutadiene rubber, acrylonitrile modified polybutadiene rubber, carboxyl group-containing acrylonitrile rubber, carboxyl group-containing methacrylonitrile butadiene rubber, acrylic rubber dispersed epoxy resin Any one of them can be selected or used in combination of two or more thereof.

The filler is intended to supplement the mechanical properties of the thermosetting resin, such as tensile strength and surface hardness, and when used in excess of 300 parts by weight may reduce the overall physical properties of the composition, when used in less than 100 parts by weight may decrease the mechanical properties Can be.

The fillers include inorganic fillers such as silica, alumina, barium sulfate, talc, clay, mica powder, magnesium hydroxide, boron nitride, aluminum borate, barium titanate, strontium titanate, calcium carbonate, magnesium titanate and titanium oxide, and powder epoxy resins. Organic fillers such as crosslinked acrylic polymers and thermoset amino resins can be used.

In this case, as the filler, any one of the above-described inorganic fillers or organic fillers may be selected or used in combination of two or more thereof. Among the inorganic fillers, silica, barium sulfate, or calcium carbonate may be more preferable.

The additive serves to control the surface conditions such as bubble prevention and surface leveling when processing the composition of the present invention in the form of a liquid or thin film adhesive, it may lower the physical properties of the composition when used in excess of 100 parts by weight Of course, it adversely affects the poor adhesion due to the stabilization of the bubble and the lower coating film, and if less than 10 parts by weight of the liquid or thin film due to the leveling and foaming of the liquid or thin film to cause a degradation in processing by applying the composition do.

As said additive, it is preferable to use individually or in combination of 2 or more types among silicone, polysiloxane, and acrylate.

The organic solvent has a role of facilitating the workability in the manufacturing process when producing a liquid or film with the composition of the present invention, when used in excess of 400 parts by weight of the viscosity is difficult to proceed the manufacturing process 50 If the amount is less than parts by weight, there is a difficulty in working due to the formation of too high viscosity.

The organic solvents include solvent, NN-dimethylformamide, NN-dimethylacetamide, methyl ethyl ketone, cyclohexanone, ethyl acetate, butyl acetate, cellosolve acetate, propylene glycol monomethyl ether acetate, methyl cellosolve, butyl It is preferable to use one of cellosolve, methyl carbitol, butyl carbitol, propylene glycol monomethyl ether, diethylene glycol dimethyl ether, toluene and xylene, or to use two or more kinds in combination.

The curing agent reacts with the thermosetting resin to serve as a coating material property of the composition, and when used in excess of 400 parts by weight or less than 100 parts by weight, the physical properties of the composition are reduced overall.

As the curing agent, any one of amine, guanine, imidazole, phenol, acid anhydride, phenol novolak resin, alkylphenol novolak resin, and polyvinyl phenol can be selected or used in combination of two or more thereof. have.

The epoxy composition of the present invention is preferably configured to have a glass transition temperature lower than the glass transition temperature (Tg) of the prepreg used. The reason is that when the glass transition temperature (Tg) of the epoxy composition is similar to or higher than that of the prepreg, the compatibility with the prepreg is poor when the laminating process is performed at a relatively lower temperature than the press method. It is because it generate | occur | produces and the adhesive force with a prepreg falls.

That is, the epoxy composition of the present invention has a lower specification than the glass transition temperature of the prepreg applied to the manufacturing of a printed circuit board in providing the physical properties of the glass transition temperature existing only in the polymer material. In order to further increase the adhesion between the prepreg and copper, and control of the glass transition temperature can be made by selecting from the material of the thermosetting resin according to the glass transition temperature of the prepreg used. .

For example, if the glass transition temperature of the prepreg to be bonded to the epoxy composition of the present invention is about 50 ℃ the glass transition temperature of the composition is about 30 ℃, if the glass transition temperature of the prepreg is about 300 ℃ of the composition The glass transition temperature is preferably configured to be about 250 ℃.

Epoxy composition for strengthening the adhesion of the prepreg and copper according to the present invention having such a configuration is used in the process of manufacturing a multilayer printed circuit board by processing with an epoxy adhesive of a liquid or thin film, enabling the application of laminating technology, prepreg The adhesion process between the legs and the copper can be increased while the lamination process can be performed in a short time.

Here, the liquid epoxy adhesive processed with the epoxy composition of the present invention is applied (coated) to one or both sides of the prepreg through a screen printing method or various coating methods using a known coating machine.

In addition, the thin film processed with the epoxy composition of the present invention is applied to one side or both sides of the prepreg.

As such, when the liquid epoxy adhesive or thin film coated with the prepreg is coated with copper for circuit formation in the state of coating the liquid epoxy adhesive or the thin film, the lamination (vacuum laminating) treatment is performed. Alternatively, the film-type epoxy adhesive exhibits a strong adhesive function between the prepreg and copper and acts as a medium to increase the adhesion between the prepreg and the copper.

Claims (9)

In constructing an epoxy composition for strengthening the adhesion of prepreg and copper, 10 to 200 parts by weight of rubber for adding flexibility to 100 to 500 parts by weight of thermosetting resin, 100 to 300 parts by weight of filler for complementing the mechanical properties of the thermosetting resin, and additives for controlling the surface condition during processing of the composition 10-100 parts by weight, 50 to 400 parts by weight of an organic solvent for workability during processing of the composition, and 100 to 400 parts by weight of a curing agent for coating properties of the composition are mixed composition of the prepreg and copper Epoxy composition. The method of claim 1, The thermosetting resin is a phenol novolak epoxy resin, P-type epoxy, bisphenol A type epoxy resin, bisphenol F type epoxy resin, phenol novolak type epoxy resin, bisphenol S type epoxy resin, alkyl phenol novolak type epoxy resin, naphthalene type epoxy resin Epoxy composition for pre-preg and copper adhesion, characterized in that any one selected from dicyclopentadiene type epoxy resin, alicyclic epoxy resin used or used in combination of two or more. The method of claim 1, The rubber is polybutadiene rubber, epoxy modified polybutadiene rubber, urethane modified polybutadiene rubber, acrylonitrile modified polybutadiene rubber, carboxyl group-containing acrylonitrile rubber, carboxyl group-containing methacrylonitrile butadiene rubber, acrylic rubber dispersed epoxy resin Epoxy composition for adhesion strengthening of prepreg and copper, characterized in that any one selected or used in combination of two or more. The method of claim 1, The filler is silica, alumina, barium sulfate, talc, clay, mica powder, magnesium hydroxide, boron nitride, aluminum borate, barium titanate, strontium titanate, calcium carbonate, magnesium titanate, titanium oxide, powder epoxy resin, crosslinked acrylic polymer, thermal Epoxy composition for strengthening the adhesion of prepreg and copper, characterized in that any one selected from among cured amino resins or used in combination of two or more. The method of claim 1, The additive is an epoxy composition for strengthening the adhesion of prepreg and copper, characterized in that any one selected from silicon, polysiloxanes, acrylates, or a combination of two or more. The method of claim 1, The organic solvent is solvent, NN-dimethylformamide, NN-dimethylacetamide, methyl ethyl ketone, cyclohexanone, ethyl acetate, butyl acetate, cellosolve acetate, propylene glycol monomethyl ether acetate, methyl cellosolve, butyl cell Prepreg and copper, which are selected from rosolve, methyl carbitol, butyl carbitol, propylene glycol monomethyl ether, diethylene glycol dimethyl ether, toluene, and xylene, or a combination of two or more thereof. Epoxy composition for adhesion strengthening. The method of claim 1, The curing agent may be any one selected from amines, guanines, imidazoles, phenols, acid anhydrides, phenol novolak resins, alkylphenol novolak resins, and polyvinylphenols. An epoxy composition for strengthening adhesion between a prepreg and copper. The method according to any one of claims 1 to 7, The epoxy composition is epoxy composition for strengthening the adhesion of the prepreg and copper, characterized in that configured to have a glass transition temperature lower than the glass transition temperature of the prepreg used. An epoxy adhesive for strengthening the adhesion of prepreg and copper, which is processed and manufactured into a liquid or thin film using the epoxy composition according to any one of claims 1 to 8.