KR20090084106A - Composition of fluorescent substance and method for fabricating fluorescent layer of plasma display panel using the same - Google Patents

Abstract

A phosphor composition capable of minimizing organic substances remaining in a phosphor layer of a plasma display panel, and a method of manufacturing a phosphor layer of a plasma display panel using the same, comprising a vehicle in which an organic binder and a solvent are mixed, phosphor powder, and an organic binder content It may comprise an organic oxide having 0.1 to 50% by weight of.

Description

Composition of fluorescent substance and method for fabricating fluorescent layer of plasma display panel using the same}

The present invention relates to a phosphor composition, and to a phosphor composition capable of minimizing organic substances remaining in a phosphor layer of a plasma display panel and a method of manufacturing a phosphor layer of a plasma display panel using the same.

With the advent of the multimedia era, display devices that can express more detailed, larger, and more natural colors are required.

However, the current CRT (Cathode Ray Tube) has a limit to compose a large screen of 40 inches or more, and the LCD (Liquid Crystal Display), PDP (Plasma Display Panel), and projection TV (Television) are used for high definition video. It is rapidly developing for expansion.

In general, a plasma display panel is an electronic device that displays an image by using plasma discharge. The plasma display panel applies a predetermined voltage to an electrode disposed in the discharge space of the PDP so that plasma discharge occurs between the plasma display panels. An image is formed by exciting a phosphor layer formed in a predetermined pattern by vacuum ultraviolet (VUV).

Here, the phosphor layer is a vehicle in which a cellulose-based, acryl-based binder and a solvent are mixed, and a phosphor powder is mixed to form a phosphor composition, and then formed in the partition wall of the lower panel of the panel, and then fired and dried. Is produced.

However, the phosphor layer thus produced has a problem in that residual organic substances remain on the surface of the phosphor and the like after the firing process, thereby lowering the function of the phosphor itself.

Therefore, the degradation of the phosphor layer is a cause of lowering not only the overall brightness and efficiency of the plasma display panel but also the color characteristics.

An object of the present invention is to solve these problems, to provide a phosphor composition that can improve the brightness, efficiency and color characteristics by minimizing the organic material remaining in the phosphor layer and to provide a phosphor layer manufacturing method of the plasma display panel using the same. The purpose is.

The phosphor composition according to the present invention may include a vehicle in which an organic binder and a solvent are mixed, a phosphor powder, and an organic oxide having 0.1 to 50% by weight of the organic binder content.

Here, the vehicle may include an organic binder having 5 to 80% by weight and a solvent having 10 to 95% by weight.

In addition, the organic oxide is benzyl peroxide, keton peroxide, hydro peroxide, dialkyl peroxide, diacryl peroxide, peroxy ester (peroxy ester), peroxy carbonate, urea peroxide may include at least one, and if the organic oxide consists of a mixture of two organic oxidizing materials, the mixture is 100 It may have a composition ratio of 0.001 to 0.001: 100.

In addition, the method of manufacturing a phosphor layer of a plasma display panel according to the present invention comprises the steps of making a vehicle by mixing an organic binder and a solvent, making a first phosphor paste by mixing phosphor powder in the vehicle, and a first phosphor paste Mixing the organic oxides to form a second phosphor paste, applying a second phosphor paste to form a phosphor layer, and drying and firing the phosphor layer to remove residual organic material in the phosphor layer. have.

Here, the vehicle may be mixed with an organic binder having 5 to 80% by weight, a solvent having 10 to 95% by weight, the first phosphor paste is a vehicle having 20 to 90% by weight, and 10 to 80% by weight The phosphor powder having may be mixed, and the second phosphor paste may mix the first phosphor paste having 64 to 99.999% by weight with the organic oxide having 0.001 to 36% by weight.

In addition, the drying process may be performed for 5 to 90 minutes in a temperature range of 50 to 250 degrees, and the firing process may be performed for 30 to 60 minutes in a temperature range of 300 to 600 degrees.

Other objects, features and advantages of the present invention will become apparent from the following detailed description of embodiments taken in conjunction with the accompanying drawings.

The phosphor composition according to the present invention and the phosphor layer manufacturing method of the plasma display panel using the same have the following effects.

The present invention can improve the color characteristics of the phosphor by minimizing the residual organic material remaining in the phosphor layer on the lower plate of the plasma display panel.

In addition, due to the improved color characteristics of the phosphor layer, the overall brightness and efficiency of the plasma display panel may be improved.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

The phosphor composition according to the present invention is prepared by including an organic oxide in order to minimize the organic substances remaining in the phosphor layer even after the firing process.

That is, the phosphor composition of the present invention may be prepared by including a vehicle in which an organic binder and a solvent are mixed, a phosphor powder, and an organic oxide having about 0.1-50% by weight of the organic binder content.

Here, the vehicle may be prepared including an organic binder having about 5-80% by weight and a solvent having about 10-95% by weight.

At this time, the organic binder is an organic polymer, it may be a cellulose polymer, an acrylic polymer, a vinyl polymer.

Cellulose-based polymers that can be used in the present invention include methyl, ethyl, nitro cellulose and the like, and the acrylic polymer is polymethyl methacrylate, polymethyl acrylate, polyethyl acrylate, polyethyl methacrylate, polynormal propyl acrylate, Polynormal propyl methacrylate, polyisopropyl acrylate, polyisopropyl, methacrylate, poly normal butyl acrylate, poly normal butyl methacrylate, polycyclohexyl acrylate, polycyclohexyl methacrylate, polyla Uryl acrylate, polylauryl methacrylate, pullystearyl acrylate, polystearyl methacrylate and the like, may be used by copolymerizing two or more monomers of such a polymer.

In addition, the vinyl polymer may be polyethylene, polypropylene, polystyrene, polyvinyl alcohol, polybutyl acetate, polyvinylpyrrolidone, or the like.

These polymers may be used alone, but in some cases, may be used in combination.

The solvent may be any solvent capable of dissolving organic polymers such as cellulose polymers, acrylic polymers and vinyl polymers.

The solvent may be an organic solvent such as benzene, alcohols, chloroform, ester, cyclohexanone, N, N-dimethylacetamide, acetonitrile, or a water-soluble solvent such as water, aqueous potassium sulfate solution or magnesium sulfate aqueous solution. It is also possible to select from these and use alone or in combination of two or more.

In the phosphor powder, blue phosphor, green phosphor, and red phosphor may all be used.

For example, Y (V, P) O4: Eu, or (Y, Gd) BO3: Eu may be used as the red phosphor, and Zn2SiO4: Mn, (Zn, A) 2SiO4: Mn (A May be selected from the group consisting of alkali metals) and mixtures thereof.

Further, green phosphor, BaAl 12 O 19: Mn, (Ba, Sr, Mg) OaAl 2 O 3: Mn (an integer from a = 1 to 23), MgAlxOy: Mn (x = 1 to 10, y = 1 to 30), LaMgAlxOy: Tb, At least one phosphor selected from the group consisting of Mn (x = 1-14, y = 8-47), and ReBO3: Tb (Re is at least one rare earth element selected from Sc, Y, La, Ce, and Gd); It can also be mixed and used.

As the blue phosphor, BaMgAl 10 O 17: Eu, CaMgSi 2 O 6: Eu, CaWO 4: Pb, Y 2 SiO 5: Eu or a mixture thereof may be used.

Next, the organic oxide is benzyl peroxide, keton peroxide, hydro peroxide, dialkyl peroxide, diacryl peroxide, peroxy ester It may be at least one selected from peroxy ester, peroxy carbonate, urea peroxide and the like.

Here, the organic oxide may be composed of a mixture of two organic oxidizing materials, and the mixture may have a composition ratio of 100: 0.001-0.001: 100.

In the present invention, it is preferable to use a mixture of benzyl peroxide, peroxy carbonate, and hydro peroxide as an organic oxide.

Here, the organic oxide preferably has about 0.1-50% by weight of the organic binder content, and preferably has about 0.001-36% by weight from the total weight of the phosphor composition.

The reason is that when the content of the organic oxide is less than about 0.1-50% by weight of the organic binder content, the organic material remains in the phosphor layer during the firing process, so that the color characteristics of the phosphor layer are degraded, and the organic oxide is about the amount of the organic binder content. When more than 0.1-50% by weight, the stability and printability of the phosphor composition may be degraded.

As described above, the phosphor composition of the present invention may include additives such as an acrylic dispersant, a silicone antifoaming agent, a leveling agent, an antioxidant, a dioctylphthalate, etc., in addition to the vehicle, the phosphor powder, and the organic oxide. It may be.

Here, the content of the additive preferably has about 0.1-5% by weight from the total weight of the phosphor composition.

The reason is that when the content of the additive is more than about 0.1-5% by weight from the total weight of the phosphor composition, printability may be lowered.

1 is a process flowchart of manufacturing a phosphor layer of a phosphor composition and a plasma display panel according to the present invention.

As shown in FIG. 1, first, an organic binder and a solvent are mixed to make a vehicle.

Here, the vehicle is prepared by mixing an organic binder having about 5 to 80% by weight and a solvent having about 10 to 95% by weight, and the organic binder is an organic polymer and may be a cellulose polymer, an acrylic polymer, a vinyl polymer, or the like. The solvent may be an organic solvent such as benzene, alcohols, chloroform, ester, cyclohexanone, N, N-dimethylacetamide, acetonitrile, or a water-soluble solvent such as water, aqueous potassium sulfate solution or magnesium sulfate solution. It can also select from these and use individually or in mixture of 2 or more types.

Next, the phosphor powder is mixed with the vehicle to form a first phosphor paste. (S12)

Here, the first phosphor paste is prepared by mixing a vehicle having about 20-90% by weight and a phosphor powder having about 10-80% by weight, and the phosphor powder is a red phosphor, and Y (V, P) O4: Eu Or (Y, Gd) BO3: Eu and the like, and as the green phosphor, one selected from the group consisting of Zn2SiO4: Mn, (Zn, A) 2SiO4: Mn (A is an alkali metal) and mixtures thereof can be used. As the blue phosphor, BaMgAl 10 O 17: Eu, CaMgSi 2 O 6: Eu, CaWO 4: Pb, Y 2 SiO 5: Eu or a mixture thereof can be used.

Next, an organic oxide is mixed with the first phosphor paste to form a second phosphor paste (S13).

Here, the second phosphor paste is prepared by mixing the first phosphor paste having 64 to 99.999% by weight and the organic oxide having 0.001 to 36% by weight, wherein the organic oxide is benzyl peroxide, ketone peroxide ( keton peroxide, hydro peroxide, dialkyl peroxide, diacryl peroxide, peroxy ester, peroxy carbonate, urea peroxide ( urea peroxide) and the like.

Then, the second phosphor paste and the solvent are mixed (S14).

Here, the second phosphor paste may be mixed to have about 5-80% by weight and the solvent has about 10-95% by weight.

Next, a second phosphor paste in which the solvent is mixed is applied into a cell of the lower plate of the plasma display panel to form a phosphor layer (S15).

Here, the coating method of the phosphor layer may be a screen printing method, a doctor blade method, a dip method, a reverse roll method, a direct roll method, or gravure. The method may be selected from a gravity method, an extrusion method, a brush method, and the like, and screen printing is preferably used.

Subsequently, the phosphor layer is dried and calcined to remove residual organic material in the phosphor layer. (S16, S17)

Here, the drying step of the phosphor layer is performed for about 5 to 90 minutes at a temperature range of about 50 to 250 degrees, and fired for about 30 to 60 minutes at a temperature range of about 300 to 600 degrees under a reducing atmosphere of vacuum or inert gas. The process can be carried out.

At this time, the firing process is most preferably performed for about 30-60 minutes at a low temperature of about 400-550 degrees.

If the firing temperature is too low or the firing time is short, it is difficult to remove the organic material from the phosphor layer. If the firing temperature is too high or the firing time is long, deterioration of the phosphor layer may occur.

Next, the upper and lower panels of the panel may be bonded to complete the plasma display panel. (S18, S19)

As described above, examples and comparative examples of the present invention using the prepared phosphor composition and the phosphor layer are as follows.

Example

A vehicle was prepared by mixing about 20% by weight of ethyl cellulose with about 20% by weight of a solvent of butylcarbitol acetate having about 80% by weight, and preparing Zn2SiO4: Mn, which is a green phosphor having about 40% by weight, and then benzyl peroxide (benzyl). about 10% by weight of an organic oxide mixed with peroxide, peroxy carbonate, and hydro peroxide are prepared and mixed to prepare a phosphor paste, and the phosphor paste is applied by screen printing on a lower plate. To form a phosphor layer.

Next, the applied phosphor layer was dried at about 100 degrees for about 60 minutes, and under a reducing atmosphere of argon gas, at about 500 degrees for about 50 minutes.

Comparative example

A vehicle was prepared by mixing about 20% by weight of ethyl cellulose with about 20% by weight of a solvent of butylcarbitol acetate having about 80% by weight, and preparing Zn2SiO4: Mn, which is a green phosphor having about 40% by weight, and then mixing them to paste the phosphor. The phosphor paste was applied to the lower plate by screen printing to form a phosphor layer.

Next, the applied phosphor layer was dried at about 100 degrees for about 60 minutes, and under a reducing atmosphere of argon gas, at about 500 degrees for about 50 minutes.

As such, the example produced from the phosphor composition containing the organic oxide and the comparative example made from the phosphor composition not containing the organic oxide had a difference as shown in Table 1 below.

TABLE 1

Luminance (%) Luminous Efficiency (%) Residual organic matter (%) Example 115 109 0.12 Comparative example 100 100 6.71

In the plasma display panel, when the luminance, the luminous efficiency, and the remaining organic material of the emitted green light are measured, it can be seen that the luminance and the luminous efficiency of the embodiment are relatively higher than those of the comparative example, and the residual organic material in the phosphor layer You can see that much less.

As such, the fabricated phosphor layer minimizes organic materials remaining in the phosphor layer during the firing process, thereby improving the color characteristics of the phosphor, and also improving the color characteristics of the phosphor layer. Brightness and efficiency can be improved.

FIG. 2 is a view illustrating a plasma display panel having a phosphor layer according to the present invention. As shown in FIG. 2, the plasma display panel of the present invention is typically indium tin oxide (ITO) in one direction on the front substrate 170. A pair of sustain electrodes composed of a pair of transparent electrodes 180a and 180b and bus electrodes 180a 'and 180b' is formed.

The dielectric 190 and the passivation layer 195 are sequentially formed on the entire surface of the front substrate 170 while covering the sustain electrode pairs.

The front substrate 170 is formed through a process such as milling and cleaning the glass for the display substrate.

Here, the transparent electrodes 180a and 180b may be formed of indium-tin-oxide (ITO), SnO 2, or the like by a photoetching method by sputtering or a lift-off method by CVD. will be.

The bus electrodes 180a 'and 180b' include a general-purpose conductive metal and a precious metal.

Here, general purpose conductive metals include Al (aluminum), Cu (copper), Ni (nickel), Cr (chromium), Mo (molybdenum), and the like, and the precious metals are Ag (silver), Au (gold), Pt. (Platinum), Ir (iridium), and the like.

Subsequently, when the general purpose metal and the precious metal are mixed, a core may be formed of the general metal and the surface of the core may be wrapped with the precious metal.

The dielectric 190 is formed on the front substrate 170 on which the transparent electrode and the bus electrode are formed.

Here, the dielectric 190 comprises a transparent low melting glass, a specific composition will be described later.

Next, a protective film made of magnesium oxide or the like is formed on the upper dielectric layer 190 to protect the dielectric from the impact of (+) ions during discharge and to increase secondary electron emission.

Meanwhile, an address electrode 120 is formed on one surface of the rear substrate 110 along a direction crossing the sustain electrode pair, and the white dielectric layer 130 is formed on the front surface of the rear substrate 110 while covering the address electrode 120. Is formed.

Here, the address electrode 120 may be formed of a general-purpose conductive metal and a noble metal as in the above-described bus electrode, and the general-purpose conductive metal may include Al (aluminum), Cu (copper), Ni (nickel), and Cr ( Chromium), Mo (molybdenum), and the like, and noble metals include Ag (silver), Au (gold), Pt (platinum), Ir (iridium), and the like.

The white dielectric layer 130 is coated by a printing method or a film laminating method, and then finished through a sintering process, and the partition wall 140 is disposed between the address electrodes 120 on the white dielectric layer 130. Is formed.

Next, the partition wall 140 may be stripe-type, well-type, or delta-type.

The partition wall 140 includes a mother glass and a porous filler. The mother glass includes a flexible mother glass and a lead free mother glass, and the flexible mother glass includes ZnO, PbO, B2O3, or the like. Linked mother glass consists of ZnO, B2O3, BaO, SrO, CaO, etc.

In addition, as the filler, oxides such as SiO 2 and Al 2 O 3 may be included, and although not shown, a black top may be formed on the partition wall 140.

The phosphor layers 150a, 150b, and 150c of red (R), green (G), and blue (B) are formed between the partition walls 140.

Here, the phosphor layers 150a, 150b, and 150c are manufactured by including an organic oxide when forming the phosphor composition in order to minimize organic materials remaining in the phosphor layer even after the firing process.

That is, the phosphor composition of the present invention may be prepared by including a vehicle in which an organic binder and a solvent are mixed, a phosphor powder, and an organic oxide having about 0.1-50% by weight of the organic binder content.

Next, a point where the address electrode 120 on the rear substrate 110 and the pair of sustain electrodes on the front substrate 110 cross each other constitutes a discharge cell.

In addition, the front substrate 170 and the rear substrate 110 are bonded to each other with the partition wall 140 interposed therebetween, and are bonded through a sealing material provided on the outer side of the substrate.

The upper panel and the lower panel are connected to the driving device.

3 is a view showing a driving device and a connecting portion of the plasma display panel according to the present invention.

As shown in FIG. 3, the entire plasma display apparatus includes a panel 220, a driving substrate 230 for supplying a driving voltage to the panel 220, and electrodes for each cell of the panel 220. And a tape carrier package 240, which is a type of flexible substrate connecting the driving substrate 230 to each other.

As described above, the panel 220 includes a front substrate, a rear substrate, and a partition wall.

In addition, an electrical and physical connection between the panel 220 and the TCP 240 and an electrical and physical connection between the TCP 240 and the driving substrate 230 may include an anisotropic conductive film (hereinafter referred to as an ACF). ACF is a conductive resin film made of a ball of nickel (Ni) coated with gold (Au).

4 is a view showing a substrate wiring structure of a typical tape carrier package.

As shown in FIG. 4, the TCP 240 is in charge of the connection between the panel 220 and the driving substrate 230, and the driving driver chip is mounted, and the TCP 340 is on the flexible substrate 342. The wiring 343 is densely arranged, and the driving driver chip 341 is connected to the wiring 343 and receives power from the driving substrate 330 and provides the power to a specific electrode of the panel 320.

Here, the driving driver chip 341 has a structure in which a small number of voltages and driving control signals are applied to alternately output a large number of signals of high power, and thus the number of wirings connected to the driving substrate 330 is small. The wiring connected to the panel 320 side is numerous.

Therefore, since the wirings of the driving driver chip 341 may be connected by utilizing the space on the driving substrate 330 side, the wiring 343 may not be divided by the center of the driving driver chip 341.

5 is a view schematically showing another embodiment of a plasma display device according to the present invention.

In the present embodiment, the panel 320 is connected to the driving device through a flexible printed circuit (FPC) 350.

Here, the FPC 350 is a film having a pattern formed therein using polymide, and in this embodiment, the FPC 350 and the panel 320 are connected through the ACF.

In addition, in this embodiment, the driving substrate 330 is a natural PCB circuit.

Here, the driving device includes a data driver, a scan driver, a sustain driver, and the like. The data driver is connected to the address electrode to apply a data pulse, and the scan driver is connected to the scan electrode to provide a ramp-up ramp, Supply ramp ramp, scan pulse, and sustain pulse.

The sustain driver also applies a sustain pulse and a DC voltage to the common sustain electrode.

The plasma display panel is driven by being divided into a reset period, an address period, and a sustain period.

In the reset period, the rising ramp waveform Ramp-up is simultaneously applied to the scan electrodes, and in the address period, a negative scan pulse scan is sequentially applied to the scan electrodes, and at the same time, the scan electrodes are synchronized with the scan pulses to the address electrodes. Positive data pulses are applied.

In the sustain period, a sustain pulse sus is alternately applied to the scan electrodes and the sustain electrodes.

6A to 6K illustrate an embodiment of a method of manufacturing a plasma display panel according to the present invention. Referring to FIGS. 6A to 6K, a method of manufacturing a plasma display panel according to the present invention is as follows.

First, as shown in FIG. 6A, transparent electrodes 180a and 180b and bus electrodes 180a 'and 180b' are formed on the front substrate 170.

Here, the front substrate 170 is manufactured by milling and cleaning the glass or soda lime glass for the display substrate.

The transparent electrode 180a is formed of ITO, SnO 2, or the like by a photoetching method by sputtering, a lift-off method by CVD, or the like.

Subsequently, bus electrodes 180a 'and 180' are formed, and as described above, a material containing a general-purpose conductive metal and a noble metal is used.

The bus electrode material may produce a paste by mixing the above-mentioned general-purpose conductive metal and the noble metal, and may form the core of the general-purpose metal and the noble metal layer on the surface as described above.

Subsequently, as illustrated in FIG. 6B, a dielectric 190 is formed on the front substrate 170 on which the transparent electrode 180a and the bus electrode 180b are formed.

Here, the dielectric material 190 is laminated by a material including low melting glass or the like by screen printing, coating or laminating the green sheet.

In addition, the above-described bus electrode material and the dielectric 190 may be fired, but each may be fired in a separate process, but may be fired in one process for the simplification of the process.

At this time, the firing temperature is preferably about 500-600 degrees. When the firing process of the bus electrode and the dielectric is performed together, the amount of the bus electrode material oxidized by blocking the dielectric between the oxygen and the bus electrode can be reduced.

Subsequently, a protective film 195 is deposited on the dielectric 190 as shown in FIG. 6C.

The protective film 195 may be made of magnesium oxide, and may include silicon as a dopant. The protective film 195 may be formed by chemical vapor deposition (CVD), electron beam (E-beam), or ion plating (Ion-). It can be formed by plating), sol-gel method, sputtering method and the like.

As shown in FIG. 6D, the address electrode 120 is formed on the rear substrate 110.

Here, the back substrate 110 may be formed of a display substrate glass or soda-lime glass by processing such as milling or cleaning, the address electrode 120 screens silver (Ag), etc. It can be formed by a printing method, a photosensitive paste method or a photoetching method after sputtering.

In addition, the address electrode 120 may be formed using a general-purpose conductive metal and a noble metal, and the specific process is the same as that of the bus electrode described above.

As shown in FIG. 6E, the dielectric 130 is formed on the rear substrate 110 on which the address electrode 120 is formed.

Here, the dielectric 130 may be formed of a material including a low melting point glass and a filler such as TiO 2 by screen printing or laminating green sheets. It is preferable to show white for the sake of simplicity.

In order to simplify the process, the lower dielectric 130 and the address electrode 120 may be fired in one process.

Subsequently, partition walls are formed to distinguish each discharge cell from those shown in Figs. 6F to 6I.

First, a partition material is prepared, and a solvent, a dispersant, a parent glass, and a porous filler are mixed and milled to prepare.

Here, as the base glass, there are flexible base glass and lead-free base glass, and the lead base glass includes ZnO, PbO and B2O3, and the like, and the lead-free base glass includes ZnO, B2O3, BaO, SrO, CaO, and the like. As the filler, oxides such as SiO 2 and Al 2 O 3 are used.

Next, as shown in FIG. 6F, the partition material 140a is applied onto the lower plate dielectric 130.

Here, the coating of the partition material may be performed by a spray coating method, a bar coating method, a screen printing method, a green sheet method, or the like, and is preferably made of green and laminated. Can be.

The partitioning material 140a may be patterned by sanding, etching, or photosensitive. Hereinafter, the etching method will be described in detail.

First, as shown in FIG. 6G, a dry film resist (DFR) 155 is formed on the barrier material 140a at predetermined intervals.

Here, the DFR 155 is preferably formed at the position where the partition wall is to be formed.

6B, the partition material is patterned to form the partition wall 140.

That is, when the etchant is injected from the upper portion of the DFR, the partition material of the portion not provided with the DFR 155 is gradually etched and patterned in the form of the partition wall 140.

Then, when the DFR (155) is removed, the etching solution is removed through the cleaning process, and the firing process is performed, the partition wall 140 structure is completed as shown in FIG. 6I.

Here, as described above, the partition wall 140 may be formed of a striate type, a well type, a delta type, or the like.

Subsequently, as illustrated in FIG. 6J, phosphors 150a, 150b, and 150c are applied to a surface of the lower dielectric layer 130 in contact with the discharge space and a side surface of the partition wall. The phosphors are sequentially coated with phosphors of R, G, and B according to each discharge cell, and are applied by screen printing or photosensitive paste.

Then, as shown in FIG. 6K, the upper panel is bonded to the lower panel with a partition wall therebetween and sealed, and after discharging internal impurities, the discharge gas 160 is injected.

Hereinafter, the sealing process of the upper panel and the lower panel will be described in detail.

The sealing process is performed by screen printing, dispensing, or the like.

The screen printing method is a method of printing a sealing material having a desired shape by holding a patterned screen at a predetermined interval, placing the patterned screen on a substrate, and pressing and transferring the paste necessary for forming the sealing material. The screen printing method has advantages of simple production equipment and high use efficiency of materials.

And the dispensing method is a method of forming a sealing material by directly discharging a thick film paste on a board | substrate using air pressure using the CAD wiring data used for screen mask manufacture. The dispensing method has the advantage of reducing the manufacturing cost of the mask and having a large degree of freedom in the shape of the thick film.

7A is a view illustrating a process of bonding the front substrate and the rear substrate of the plasma display panel, and FIG. 7B is a cross-sectional view taken along line AA ′ of FIG. 7A.

As shown, as shown, the sealing material 600 is applied to the front substrate 170 or the back substrate 110.

Specifically, the substrate is printed or dispensed at the same time with a predetermined interval at the outermost side of the substrate and applied.

Next, the sealing material 600 is fired. In the firing process, the organic material included in the sealing material 600 is removed, and the front substrate 170 and the rear substrate 110 are bonded.

In this firing process, the width of the sealing material 600 may be widened and the height may be low.

In the present embodiment, the sealing material 600 is printed or coated, but may be formed in the form of a sealing tape and adhered to the front substrate or the rear substrate.

And the characteristic of a protective film etc. is improved at predetermined temperature through an aging process.

Subsequently, a front filter may be formed on the front substrate, and the front filter is provided with an electromagnetic shielding film for shielding electromagnetic radiation emitted from the panel to the outside.

The electromagnetic shielding film may be patterned in a specific form in order to shield electromagnetic waves while ensuring the visible light transmittance required by the display device.

In addition, a near infrared shielding film, a color correction film, an antireflection film, and the like may be formed on the front filter.

Those skilled in the art will appreciate that various changes and modifications can be made without departing from the spirit of the present invention.

Therefore, the technical scope of the present invention should not be limited to the contents described in the embodiments, but should be defined by the claims.

1 is a process flowchart of manufacturing a phosphor layer of a phosphor composition and a plasma display panel according to the present invention.

2 illustrates a plasma display panel having a phosphor layer according to the present invention.

3 is a view showing a driving device and a connecting portion of a plasma display panel according to the present invention.

4 is a diagram illustrating a board wiring structure of a typical tape carrier package.

5 is a view schematically showing another embodiment of a plasma display panel according to the present invention;

6A to 6K illustrate an embodiment of a method of manufacturing a plasma display panel according to the present invention.

7A is a view illustrating a process of bonding the front substrate and the rear substrate of the plasma display panel;

FIG. 7B is a cross-sectional view taken along the line AA 'of FIG. 7A

<Explanation of symbols for the main parts of the drawings>

100: core 105: Ag (silver)

110: back substrate 120: address electrode

130: lower plate dielectric 140: partition wall

150a, 150b, 150c: phosphor 160: discharge gas

170: front substrate 180a, 180b: transparent electrode

180a ', 180b': Bus electrode 190: Top dielectric

195: protective film 220: panel

230: driving substrate 240: TCP

241: driver driver chip 242: flexible substrate

243 wiring 250 FPC

260 heat sink

Claims (13)

A vehicle in which an organic binder and a solvent are mixed; Phosphor powder; Phosphor composition comprising an organic oxide having 0.1 to 50% by weight of the organic binder content. The phosphor composition of claim 1, wherein the vehicle comprises an organic binder having 5-80% by weight and a solvent having 10-95% by weight. The method of claim 1, wherein the organic oxide is benzyl peroxide, keton peroxide, hydro peroxide, dialkyl peroxide, diacryl peroxide. ), A peroxy ester (peroxy ester), peroxy carbonate (peroxy carbonate), urea peroxide (urea peroxide) at least one or more phosphor composition comprising a. The phosphor composition according to claim 3, wherein the organic oxide is a mixture of two organic oxidizing materials, and the mixture has a composition ratio of 100: 0.001-0.001: 100. The phosphor composition according to claim 1, wherein the phosphor composition comprises a vehicle having 20 to 90% by weight, a phosphor powder having 10 to 80% by weight, and an organic oxide having 0.001 to 36% by weight. Mixing the organic binder and the solvent to make a vehicle; Mixing a phosphor powder in the vehicle to make a first phosphor paste; Mixing an organic oxide with the first phosphor paste to form a second phosphor paste; Applying a second phosphor paste to form a phosphor layer; Drying and firing the phosphor layer to remove residual organic material in the phosphor layer. 7. The method of claim 6, wherein the vehicle is mixed with an organic binder having 5-80% by weight and a solvent having 10-95% by weight. The method of claim 6, wherein the first phosphor paste is mixed with a vehicle having 20 to 90% by weight and a phosphor powder having 10 to 80% by weight. The method of claim 6, wherein the second phosphor paste is a mixture of the first phosphor paste having 64 to 99.999% by weight and the organic oxide having 0.001 to 36% by weight. The method of claim 6, wherein the drying process is performed for 5 to 90 minutes in a temperature range of 50 to 250 degrees. 7. The method of claim 6, wherein the firing process is performed for 30 to 60 minutes in a temperature range of 300 to 600 degrees. The method of claim 6, further comprising mixing a solvent with the second phosphor paste before forming the phosphor layer. The method of claim 12, wherein the second phosphor paste is mixed in an amount of 5-80% by weight, and the solvent is in an amount of 10-95% by weight.

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