KR20090083614A - Printed circuit board - Google Patents

Abstract

The present invention relates to a printed circuit board, wherein the printed circuit board includes a conductor layer portion having a wiring formed on a first surface thereof and a pad formed on a second surface facing the first surface, and passing through the conductor layer portion. And a contact portion connected to a wire and the pad, and an auxiliary contact portion formed adjacent to the first contact portion and penetrating the conductor layer portion to be connected to the wire and the pad. As a result, since the auxiliary contact is formed without any additional process or significant cost, even if the wiring connected to the contact is damaged or broken, the auxiliary contact makes stable signal transmission between the wire and the pad, thereby reducing the defective rate.

Description

Printed Circuit Board {PRINTED CIRCUIT BOARD}

The present invention relates to a printed circuit board.

In general, a printed circuit board (PCB) is one of the components that are the basis of many electronic products currently manufactured, single-sided printed circuit board, both sides with a wiring pattern formed on only one side of the insulated substrate And a double-sided printed circuit board having a wiring pattern formed thereon and a multi-layered PCB having a wiring pattern formed in multiple layers.

In recent years, the complexity of circuits has increased, the demand for high density and miniaturized circuits has increased, and the miniaturization of surface mount electronic components such as IC chips, resistors, and capacitors has led to the use of double-sided printed circuit boards or multilayer printed circuit boards rather than single-sided printed circuit boards. The use of is increasing.

An example of a conventional multilayer printed circuit board will be described with reference to FIG. 1.

1 is a schematic perspective view of a multilayer printed circuit board according to the prior art.

The multilayer printed circuit board 1 shown in FIG. 1 further includes a conductor layer 30 capable of forming a wiring pattern in order to enlarge the wiring area. Specifically, the multilayer printed circuit board 1 includes two outer conductor layers exposed to the outside, that is, an upper conductor layer and a lower conductor layer, and an inner conductor layer formed between the upper conductor layer and the lower conductor layer, and each conductor layer. The insulating layer 40 is inserted between the 30. The conductive layers 30 are bonded by these insulating layers 40 to form one printed circuit board.

Each conductor layer 30 may use, for example, a copper foil having a thickness of about 18 μm, and a thermosetting glass epoxy resin may be used as the material of the insulating layer 40, or a glass polyimide resin or glass BT (bismaleimide). Heat-resistant resins, such as triazine) resin, can also be used.

Although the multilayer printed circuit board shown in FIG. 1 has a four-layer structure in which two outer conductor layers and two inner conductor layers are pre-bonded, the multilayer printed circuit board has six, eight, and ten layers depending on the complexity of the circuit. The above conductor layer can be provided.

As shown in FIG. 1, the multiple printed circuit board 1 includes a via hole 10 penetrating through the conductor layer 30 and the insulating layer 40. These via holes 10 are connected to the wiring 20 for connection with the component 50 mounted on the conductor layer 30 and plated therein so that a contact portion for signal connection with an external device (not shown) is possible. Used as In this case, as shown in FIG. 1, the outer surface of the lower conductor layer 30 is mounted on another PCB module through soldering or for electrical contact with other components, that is, for contact with external devices. A pad 50 connected to the via hole 10 is formed.

Single-sided, double-sided, or multi-layer printed circuit boards are formed in a plurality of areas divided on a PCB array board, and then cut by each area using a laser or the like and separated into separate printed circuit boards. In this process, a circular via hole 10 formed for connection with an external device is changed to a semi-circular shape as shown in FIG. 1.

However, a defect occurs in which a part of the wire connected to the via hole 10 is damaged or disconnected due to the physical force applied during the cutting operation.

The technical problem to be achieved by the present invention is to reduce the defective rate due to damage or disconnection of the wiring when manufacturing a printed circuit board.

Another technical problem to be achieved by the present invention is to simply reduce the defective rate due to damage or disconnection of wiring without changing the manufacturing process of the printed circuit board.

A printed circuit board according to a feature of the present invention includes a conductor layer portion having a wiring formed on a first surface and a pad formed on a second surface facing the first surface, and formed on the conductor layer portion to form the wiring and the pad. And a contact portion connected to the contact portion, and an auxiliary contact portion formed adjacent to the first contact portion and connected to the wire and the pad.

The conductor layer portion may include at least one conductor layer.

In this case, the printed circuit board according to the features of the present invention may further include an insulating layer formed between the conductive layers.

Preferably, the contact portion has a semicircular shape, and the auxiliary contact portion has a circular shape, and the diameter of the contact portion and the diameter of the auxiliary contact portion are preferably different from each other. In this case, the diameter of the contact portion may be larger than the diameter of the auxiliary contact portion.

The inside of the contact portion and the auxiliary contact portion may be plated, respectively, and connected to the wiring and the pad.

The contacts and the interior of the auxiliary contacts may be plated, respectively, and then filled with a dielectric.

The wiring has a first end connected with the contact portion and a second end connected with the auxiliary contact portion, and the distance between the contact portion and the first end portion is preferably shorter than the distance between the auxiliary contact portion and the second end portion.

According to the present invention, when the printed circuit board is manufactured, stable signal transmission between the wiring and the pad is made by the auxiliary contact even if the wiring connected to the contact is damaged or disconnected.

Moreover, since the auxiliary contact is formed together with the contact without any additional process, the difficulty of the manufacturing process due to the auxiliary contact does not occur, and the additional cost does not occur much.

DETAILED DESCRIPTION Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention. In the drawings, parts irrelevant to the description are omitted in order to clearly describe the present invention, and like reference numerals designate like parts throughout the specification.

Throughout the specification, when a part is "connected" to another part, this includes not only "directly connected" but also "electrically connected" with another element in between. .

Throughout the specification, when a part is said to "include" a certain component, it means that it can further include other components, without excluding other components unless specifically stated otherwise. In addition, the terms “… unit”, “module”, etc. described in the specification mean a unit that processes at least one function or operation, which may be implemented by hardware or software, or a combination of hardware and software.

Now, a multilayer printed circuit board according to an exemplary embodiment of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 2 is a schematic perspective view of a multilayer printed circuit board according to an exemplary embodiment of the present invention, and FIG. 3 is a cross-sectional view taken along line A-A of FIG. 2. 4 is a schematic equivalent circuit diagram of the multilayer printed circuit board shown in FIG. 2.

The structure 100 of the multilayer printed circuit board according to the embodiment of the present invention is similar to that of the conventional multilayer printed circuit board 1 shown in FIG. Therefore, the same reference numerals as those of FIG. 1 are used for components having the same structure and function as those of FIG. 1, and a detailed description thereof will be omitted.

That is, as shown in Figure 2, the multilayer printed circuit board 100 according to the embodiment of the present invention has a four-layer structure, provided with four conductor layers 30 and three insulating layers 40, A via hole 10 serving as a contact portion for connecting the wiring 21 connected to the 50 with an external device is provided. Similar to FIG. 1, since the inside of the via hole 10 is plated, the pad 21 formed on the lower surface of the wiring 21 and the multilayer printed circuit board 100 through the via hole 10 is electrically and physically connected to each other. All conductor layers 30 are also electrically and physically connected to the wirings 21 and the pads 61 through the via holes 10.

However, unlike the multilayer printed circuit board 1 shown in FIG. 1, the multilayer printed circuit board 100 according to the embodiment of the present invention shown in FIG. 2 has an auxiliary via hole between the component 50 and the via hole 10. (11) is further provided.

That is, the auxiliary via hole 11 is formed to extend through the four conductor layers 30 on the wiring 21 formed between the component 50 and the via hole 10 to the pad 61. In addition, since the inside of the auxiliary via hole 11 is plated, the four conductor layers 30 are electrically and physically connected by the auxiliary via holes 11. The periphery of the auxiliary via hole 11 is surrounded by the wiring 21, and the pad 51 also extends to the periphery of the auxiliary via hole 11 and surrounds the periphery of the auxiliary via hole 11. For this reason, the wiring 21 and the pad 61 are also electrically and physically connected through the auxiliary via hole 11.

The shape of the auxiliary via hole 11 is circular, but is not limited thereto, and may have various shapes such as an elliptical shape.

The diameter of the auxiliary via hole 11 is smaller than the diameter of the via hole 10, but is not limited thereto.

In addition, the auxiliary via hole 11 is formed between the part 50 and the via hole 10 as shown in FIG. 2, and the distance between the auxiliary via hole 11 and the part 50 is the auxiliary via hole 11 and the via hole 10. Longer than distance That is, the auxiliary via hole 11 may be formed as close as possible to the via hole 10.

In the present embodiment, the insides of the via holes 10 and the auxiliary via holes 11 are plated, but may alternatively be filled with a dielectric. In this case, the dielectric filled in the via hole 10 and the auxiliary via hole 11 may be plated again.

The multilayer printed circuit board 100 according to this embodiment may be represented by an equivalent circuit as shown in FIG. 4.

That is, as shown in FIG. 4, each conductor layer 30 is represented by four resistors R1-R4, respectively, and is connected to the multilayer printed circuit board 100 through a pad 61 to connect an external device (not shown). Not shown) is represented by a resistor R0. In addition, the auxiliary via hole 11 and the via hole 10 connected to the wiring 21 and the pad 61 are represented by the first signal line L1 and the second signal line L2, respectively.

Therefore, each conductor layer 30 is connected to the external device R0 through the first signal line L1 and the second signal line L2 connected in parallel.

Therefore, during the manufacturing process of the multilayer printed circuit board 100, the wiring 21 formed between the component 50 and the via hole 10 is disconnected or damaged so that the second signal line L2 connected to the external device R0 is disconnected. Even if it is, the connection state between each of the conductor layers R1-R4 and the external device R0 is normally maintained by the first signal line L1 formed in the auxiliary via hole 11. As such, in this embodiment, the auxiliary via hole 11 functions as an auxiliary contact portion that assists the role of the via hole 10.

Therefore, signal transmission between each of the conductor layers R1-R4 and the external device R0 is normally performed, thereby reducing the defective rate of the multilayer printed circuit board.

Furthermore, since the auxiliary via hole 11 is formed at the same time as the via hole 10 is formed, a separate additional process for forming the auxiliary via hole 11 is unnecessary.

The printed circuit board according to the present embodiment is a multilayer printed circuit board, but is not limited thereto. For example, the present invention can be applied to a double-sided printed circuit board in which contact is made with an external device using a via hole.

The embodiments of the present invention described above are not implemented only by the apparatus, but may be implemented through a program for realizing a function corresponding to the configuration of the embodiments of the present invention or a recording medium on which the program is recorded. From the description of the embodiments described above it can be easily implemented by those skilled in the art.

Although the embodiments of the present invention have been described in detail above, the scope of the present invention is not limited thereto, and various modifications and improvements of those skilled in the art using the basic concepts of the present invention defined in the following claims are also provided. It belongs to the scope of rights.

1 is a schematic perspective view of a multilayer printed circuit board according to the prior art.

2 is a schematic perspective view of a multilayer printed circuit board according to an embodiment of the present invention.

3 is a cross-sectional view of the multilayer printed circuit board of FIG. 2 taken along the line A-A of FIG. 2.

4 is a schematic equivalent circuit diagram of the multilayer printed circuit board shown in FIG. 2.

Claims (8)

A conductor layer portion in which wiring is formed on a first surface and a pad is formed on a second surface facing the first surface, A contact portion formed in the conductor layer and connected to the wiring and the pad, and An auxiliary contact portion formed in the conductor layer adjacent to the first contact portion and connected to the wire and the pad Printed circuit board comprising a. In claim 1, The conductor layer portion includes at least one conductor layer. In claim 2, The printed circuit board further comprises an insulating layer formed between the conductive layer. In claim 1, And the contact portion is semicircular, the auxiliary contact portion is circular, and the diameter of the contact portion and the diameter of the auxiliary contact portion are different from each other. In claim 4, A diameter of the contact portion is greater than a diameter of the auxiliary contact portion. The method according to any one of claims 1 to 5, The inside of the contact portion and the auxiliary contact portion are respectively plated and connected to the wiring and the pad. In claim 6, The inside of the contact portion and the auxiliary contact portion are each plated, and then filled with a dielectric. In claim 1, The wiring has a first end connected with the contact portion and a second end connected with the auxiliary contact portion, The distance between the contact and the first end is shorter than the distance between the auxiliary contact and the second end. Printed circuit board.

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