KR20090083567A - Adhesive chuck, apparatus and method for attaching substrates using the same - Google Patents

Abstract

A substrate laminating apparatus and a substrate bonding method canceling the problem that smudge is generated on the display panel are provided to laminate the substrate in a state that the alignment of the substrate is maintained stably. A guide groove is formed in a lower-part of a supporting plate(114). An adhesion plate(115) is arranged in the downward of the supporting plate. A slide shoe slid according to the guide groove is formed on the upper side of the adhesion plate. Adhesion projections adhered to the inter-molecular attraction in the substrate are formed on the lower-part of the adhesion plate. A horizontal movement device passes through the supporting plate and adhesion plate. The outer edge portion of the horizontal shifter contacts in the supporting plate and adhesion plate.

Description

Adhesive chuck, apparatus and method for attaching substrates using the same}

 The present invention relates to an adhesive chuck, a substrate bonding apparatus and a substrate bonding method using the same, and more particularly, to an adhesive chuck for adhering a substrate using intermolecular attraction, a substrate bonding apparatus and a substrate bonding method using the same.

As information society has developed, the demand for display devices has increased in various forms. Recently, various flat panel display devices such as liquid crystal display (LCD), plasma display pannel (PDP), and electro luminescent display (ELD) have been studied, and some of them are widely used in real life.

Among them, LCDs are being used for mobile image display devices because of their excellent image quality compared to CRT (Cathode Ray Tube) and the advantages of light weight, thinness, and low power consumption. A representative example of the liquid crystal display panel used in the LCD is a TFT-LCD panel. In the TFD-LCD panel, an array substrate in which a plurality of thin film transistors (TFTs) are formed in a matrix form and a color filter substrate in which color filters or light shielding films are formed are bonded to each other at intervals of several μm, and bonded together before bonding. The liquid crystal is injected and encapsulated after the polymerization or bonding, thereby producing the panel.

Therefore, in manufacturing a liquid crystal display panel used in LCD, it is essential to manufacture the array substrate and the color filter substrate, and then attach the two substrates and inject the liquid crystal material into the space therebetween. The bonding process is one of the important processes for determining the quality of the LCD.

Substrate bonding is achieved by pressing the array substrate and the color filter substrate together using pressure. To this end, the substrate bonding apparatus includes two electrostatic chucks (ESCs) arranged up and down facing each other, and adheres the substrates to the electrostatic chucks. And while maintaining the parallelism of the two electrostatic chucks close to each other and proceed with the bonding of the two substrates.

Such substrate bonding apparatuses are often formed in a vacuum atmosphere when the substrates are bonded to proceed with the process. Therefore, when the substrate is first loaded, the inside of the substrate bonding apparatus is in an atmospheric pressure state, so that the substrate is adsorbed using a vacuum adsorber. Then, when the substrate bonding apparatus is formed in a vacuum atmosphere, the substrate is bonded using an electrostatic chuck. In other words, two different physical forces are used to support the substrate. Prior art for such a substrate bonding apparatus is disclosed in International Publication No. " WO2004 / 097509 " filed by Fujitsu Co., Ltd., " Joint Substrate Manufacturing Apparatus ", International Publication No. " WO2003 / 091970 filed by Shin-Etsu Engineering Co., Ltd. ”,“ Attaching apparatus for flat panel substrates ”and the like.

Meanwhile, the electrostatic chuck used in the substrate bonding apparatus is most commonly used to support a substrate in a semiconductor manufacturing process and a display panel manufacturing process. As a prior art for the adhesion of the electrostatic chuck and the substrate using the electrostatic chuck, International Publication No. "WO2004 / 084298", "Substrate holding mechanism using an electrostatic chuck and its manufacturing method" filed by Tokyo Electron Co., Ltd. Reference may be made.

The electrostatic chuck is mainly made of alumina sintered body or ceramic made of alumina spray, interposed therein an electrode plate connected to a direct current power source to adsorb the substrate by the electrostatic force generated by the high voltage applied from the direct current power source.

However, there are a number of problems with the use of such electrostatic chucks. That is, since the DC power must be continuously provided to the electrostatic chuck when the substrate is bonded, the power consumption is large, and when the substrate is adsorbed by the electrostatic force, stains may occur on the liquid crystal display panel due to residual static electricity by the electrode-shaped pattern of the electrostatic chuck. And safety problems may occur due to the accumulation of static electricity.

In addition, the electrostatic chuck has a precise mechanical and electrical structure, which is expensive to manufacture. In addition, in the case of the electrostatic chuck to which the polyimide film is applied, there is a problem that the polyimide film applied to the surface of the electrostatic chuck may be damaged by the particles of the damaged substrate when the substrate is broken during the process.

SUMMARY OF THE INVENTION An object of the present invention is to provide a substrate bonding apparatus and a substrate bonding method using the same, in which a substrate is bonded while the alignment of the substrate is stably maintained by using van der Waals forces, which are intermolecular attraction.

Another object of the present invention is to adhere the substrate to a plurality of sticking protrusions using van der Waals force, which is an intermolecular attraction, a horizontal movement means for inclining the sticking protrusions for smooth adhesion when the substrate and the sticking protrusions contact It is to provide the adhesive chuck used.

The present invention provides an adhesive chuck, a substrate bonding apparatus and a substrate bonding method using the same. The adhesive chuck is provided with a support plate having a guide groove formed on a lower surface thereof, and a slide shoe which is disposed below the support plate on an upper surface thereof, and a slide shoe that slides along the guide groove on an upper surface thereof. And a horizontal moving means penetrating the support plate and the pressure-sensitive adhesive plate and having an outer edge thereof contacting the support plate and the pressure-sensitive adhesive plate.

The present invention has the advantage of high efficiency of use compared to the conventional electrostatic chuck by minimizing the use of additional external power and power to adhere and detach the substrate. In addition, it is possible to solve the problem of unevenness generated on the display panel by the residual static electricity generated when using the electrostatic chuck. In addition, since electrical safety problems rarely occur, high safety and efficiency can be exhibited and relatively low cost can be produced compared to conventional electrostatic chucks. In addition, by using the horizontal movement means for smooth adhesion and separation of the substrate and the adhesive projections can be made simpler the configuration of the adhesive chuck.

1 is a schematic cross-sectional view showing a substrate bonding apparatus according to an embodiment of the present invention.

Referring to FIG. 1, the substrate bonding apparatus 100 includes an upper chamber 110, a lower chamber 120, adhesive chucks 111 and 121, and vertical movement means 122 and 123.

The substrate bonding apparatus 100 includes a base frame 130 forming an appearance, a lower chamber 120 is provided inside the base frame 130, and an upper chamber 110 is disposed above the lower chamber 120. ) Is provided. A processing room in which the substrates P1 and P2 are bonded is formed between the upper chamber 110 and the lower chamber 120. That is, the upper chamber 110 and the lower chamber 120 form a bonding space between the substrates P1 and P2. The upper chamber 110 is supported by the lift screw 122 and the lift motor 123 installed in the lower chamber 120 is installed to be able to move up and down. The lift screw 122 and the lift motor 123 constitute vertical movement means 122 and 123 for bonding the substrates P1 and P2.

The vertical movement means 122 and 123 cooperate with each other when the linear actuator 112 and the like and the substrates P1 and P2 are described later. The vertical movement means 122 and 123 may be variously modified and applied by employing a method such as mechanical pressure or gas pressure.

The first adhesive chuck 111 is installed below the center of the upper chamber 110. The first sticking chuck 111 has a plurality of first sticking protrusions 113 on the surface with a high density so that the first substrate P1 is adhered to the first sticking chuck 111 by van der Waals forces which are intermolecular attraction. Equipped. The first adhesive chuck 111 is coupled to the first support plate 114 and the first support plate 114 made of an aluminum-based metal and includes a first adhesive plate 115 having a first adhesive protrusion 113 formed thereon.

The substrates P1 and P2 may be array substrates or color filter substrates. In addition, a plurality of cameras 116 are installed on the upper chamber 110 to align the substrates P1 and P2. The camera 116 photographs alignment marks of the substrates P1 and P2 formed in advance. In addition, an imaging hole 117 penetrating the upper chamber 110 up and down is formed in the upper chamber 110 for capturing the camera 116. In addition, a linear actuator 112 is installed at the outer edge of the upper chamber 110. The linear actuator 112 finely adjusts the gap between the upper chamber 110 and the lower chamber 120 to adjust the gap between the substrates P1 and P2 when the substrates P1 and P2 are bonded.

A second adhesive chuck 121 having a plurality of second adhesive protrusions 124 is provided on a surface of the lower chamber 120 so that the second substrate P2 is adhered by intermolecular attraction. The second adhesive chuck 121 is composed of a second support plate 125 made of aluminum-based metal and a second adhesive plate 126 coupled to the second support plate 125 and having a second adhesion protrusion 124 formed thereon. do. The second substrate P2 adhered to the second adhesive chuck 121 may be a color filter substrate or an array substrate as a substrate different from the first substrate P1.

Subsequently, the lower substrate 120 and the second adhesive chuck 121 are coupled to the lift driver 127 and the lift driver 127 to vertically transfer the second substrate P2 to the lower portion of the second substrate P2. A plurality of lift pins 128 are provided to penetrate up and down.

Therefore, the second substrate P2 is coupled to the second adhesive chuck 121 by the lift pin 128 and the lift driver 127. In addition, the illumination device 129 provided below the lower chamber 120 provides illumination for photographing the alignment marks of the substrates P1 and P2 with the camera 116. In addition, an illumination hole 131 penetrating up and down is formed in the lower chamber 120 so that illumination may be provided to the camera 116 side. The illumination hole 131 and the photographing hole 117 communicate with each other to allow the camera 116 to photograph the alignment mark formed on the first substrate P1 and the second substrate P2.

In addition, a linear gauge 132 for measuring a gap between the upper chamber 110 and the lower chamber 120 and a UVW table 133 for alignment are provided around the second adhesive chuck 121 of the lower chamber 120. do.

On the other hand, the first adhesive chuck 111 and the second adhesive chuck 121 has the same configuration except for a special case. Therefore, in the following description, the first adhesive chuck 111 and the second adhesive chuck 121 are not described separately, but the first adhesive chuck 111 will be described, and the other components of the second adhesive chuck 121 will be described. In the description of the first sticking chuck 111 will be described additionally.

Figure 2 is a cross-sectional view of the internal structure of the adhesive chuck according to an embodiment of the present invention. 3A is an enlarged view of portion “A” of FIG. 2, and FIG. 3B is a side cutaway perspective view of portion “A” of FIG. 2. 4 is an enlarged view of a portion “B” of FIG. 2. Figure 5a is a plan view showing an adhesive chuck according to an embodiment of the present invention, Figure 5b is a plan view showing an adhesive chuck according to another embodiment of the present invention.

Referring to FIG. 2, the first adhesive chuck 111 includes a first support plate 114, a first adhesive plate 115, and a horizontal moving means 118.

The first support plate 114 is made of aluminum metal, and the first support plate 114 includes a guide groove 119 formed on the bottom surface of the first support plate 114. The guide groove 119 allows the slide shoe 134 attached to the first adhesive plate 115 to slide. 3A and 3B, the shape of the guide groove 119 is generally in the form of a recess, and in addition to the shape of the guide groove 119, the slide shoe 134 may be slipped. In addition, when the moving direction of the slide shoe 134 is viewed in the slide direction, the guide groove spring 135 is inserted and fixed between the tip of the guide groove 119 in the slide direction and the tip of the slide shoe 134 in the slide direction. . The guide groove spring 135 is compressed or expanded by the movement of the slide shoe 134.

The first adhesive plate 115 is disposed below the first support plate 114, the slide shoe 134 is in contact with the guide groove 119 is coupled to the upper surface of the first adhesive plate 115, the first adhesive The lower surface of the plate 115 includes a plurality of sticking protrusions 113 which are adhered to the substrate to be bonded by intermolecular attraction. Referring to FIGS. 3A and 3B, the slide shoe 134 may be in contact with the guide groove 119 to slide. Therefore, the guide groove 119 has a groove shape, the slide shoe 134 is coupled to the groove of the guide groove 119 and slides along the guide groove 119. As long as the guide groove 119 and the slide shoe 134 can slide together, the shape of the guide groove 119 and the slide shoe 134 is not limited.

Each of the first adhesive protrusions 113 in the first adhesive plate 115 may be manufactured to a length of about 0.5 to 20 micrometers and a diameter of 50 to 2,000 nanometers (nanometer), the first adhesive protrusions The spacing between 113 can have tens to thousands of micrometers.

As will be described later, the adhesive force of the first adhesive protrusion 113 is due to the van der Waals force, which is an attractive force between molecules. Therefore, the first adhesive protrusion 113 and the first substrate P1 are adhered by the intermolecular attraction. The adhesive force between the first adhesive protrusion 113 and the first substrate P1 exerts an adhesive force of up to 200 μN with respect to one first adhesive protrusion 113, “NATURE”, June 8, 2000, VOL 405, “Adhesive force of a single gecko foot-hair,” says “Kellar Autumn”. Therefore, since tens of thousands of 1st adhesion protrusions 113 can be formed per "1cm <2>, it can exhibit the adhesive force of 200g.f per" 1cm <2>, about 1.9N or more. On the other hand, since the conventional electrostatic chuck is generally known to have an electrostatic adhesive force of about 2g.f per "1cm2", the first adhesive chuck 111 according to the embodiment of the present invention sufficiently adheres even in the case of a large substrate. It can be seen that it can be supported, supported and transported. In addition, the adhesive force may be adjusted by lowering the density of the first adhesive protrusion 113.

An end of the first adhesive protrusion 113 integrally protruded from the first adhesive plate 115 may be formed in a spherical shape, or alternatively, may be formed in a spatula shape. The first adhesive plate 115 and the first adhesive protrusion 113 may be manufactured in a micro or nano sized structure by molding using a wax or the like capable of melting.

In more detail with respect to the manufacturing method of the first adhesive plate 115 and the first adhesive protrusion 113, a nano-sized groove having a high aspect ratio in the cured wax plate to the reactive ion etching, etc. Form in the way. In addition, the molding is filled in the grooves by adding a carbon-based material, which is a liquid molding that is curable by heat or UV (ultraviolet), processed into a wax, a carbonaceous material, or a liquid-based carbonaceous material. The molding is then cured by heat or UV irradiation, and finally the wax plate is removed. The wax plate can be removed by using a separate solvent or by etching or the like. Finally, the first adhesive plate 115 and the first adhesive protrusion 113 are integrally formed by removing the wax plate.

In addition, the first adhesive plate 115 and the first adhesive protrusion 113 may be manufactured by electron beam exposure process and etching, thermal oxidation and etching process, semiconductor manufacturing process such as nano laser processing and micro-electro-mechanical systems (MEMS) manufacturing. Manufacturing is possible using a process. In addition, the first adhesive plate 115 may be manufactured in large quantities using the first adhesive plate 115 manufactured as a master.

Referring to FIG. 4, the horizontal moving means 118 penetrates through the first support plate 114 and the first adhesive plate 115, and an outer edge thereof contacts the first support plate 114 and the first adhesive plate 115. The horizontal movement means 118 includes an air supply device (not shown), a cylinder 136 and a piston 137. The air supply device supplies or blocks air to the cylinder 136 from the outside. The cylinder 136 penetrates through the first support plate 114 and the first adhesive plate 115. In addition, the outer edge portion of the cylinder 136 is in contact with the first support plate 114 and the first adhesive plate 115.

The piston 137 includes a piston body 138 and a piston protrusion 139. The piston body 138 is located at the lower end of the cylinder 136. The piston protrusion 139 is fixed to the outer circumferential surface of the piston body 138 and disposed outside the cylinder 136. When the piston 137 moves by blocking and exhausting air, the piston protrusion 139 allows the piston 137 to return to its original position. One end of the piston 137 having the piston protrusion 139 is present outside the cylinder 136 to contact the first adhesive plate 115, and the other end of the piston 137 is inside the cylinder 136. Located.

The pressure difference between the outside of the cylinder and the inside of the cylinder is generated by the air supplied to the cylinder 136, and the piston 137 moves out of the cylinder 136 by the pressure difference. In addition, when the air supplied to the cylinder 136 is cut off and the air is exhausted to the outside of the cylinder 136, the piston 137 moves inside the cylinder 136 because the pressure inside the cylinder is lower than the pressure outside the cylinder. .

5A and 5B are plan views of the first adhesive chuck 111 viewed from the direction of the first substrate P1 toward the upper chamber 110. 5A and 5B, two or more first adhesive plates 115 in contact with the outer circumferential surface of the horizontal moving means 118 may be provided.

6 is a graph for explaining a state in which the adhesion and separation of the adhesive projection according to an embodiment of the present invention.

Referring to FIG. 6, how the intermolecular attraction acting as van der Waals forces for two molecular models will be described. First, the repulsive force is greatest when the intermolecular distance is closest, and decreases drastically as the intermolecular distance increases. At this time, the energy of repulsion (+) is generated by repulsive interaction, that is, Pauli's exclusion principle. Therefore, as the intermolecular distance is gradually spaced apart, the repulsive interaction repulsion rapidly decreases. In contrast, the energy of attraction (-) is maximal at the minimum intermolecular energy distance at which repulsion is nearly lost. And as the intermolecular distances become further apart, the intermolecular attraction will slowly decrease. Thus, when the distance between the molecular centers is closest, the total energy of interaction occurs with the greatest repulsive force. In addition, when the distance between the molecular centers is at the minimum energy distance, the repulsive force is rapidly lost and the attraction is maximum, so the total interaction force is the maximum attraction. Thereafter, as the distance between the molecular centers increases, the attraction force decreases and the overall interaction force gradually decreases.

Therefore, adhesion of the first substrate P1 is performed by bringing the first substrate P1 into close contact with the first adhesive plate 115 on which the first adhesion protrusion 113 is formed. However, when the adhesion of the first substrate (P1) after the adhesion should be made separately.

7A to 7D are cross-sectional views illustrating an operating state in which a substrate is adhered and separated in an adhesive chuck according to an embodiment of the present invention.

7A to 7C, the cylinder 136 receives air from the air supply device for smooth adhesion of the first adhesive protrusion 113 and the first substrate P1. The piston 137 present in the cylinder 136 is moved by the air to move the first adhesive plate 115 to the outside of the cylinder 136. Therefore, the slide shoe 134 of the first adhesive plate 115 moves along the guide groove 119 of the first support plate 114. At this time, the first adhesive protrusion 113 formed on the first adhesive plate 115 is inclined in the opposite direction due to the inertia force and is inclined. Therefore, the first substrate P1, which has been in contact with the first adhesive protrusion 113, moves together with the first adhesive protrusion 113, and eventually, the first substrate P1 is separated from the first adhesive protrusion 113. As they get closer, smooth adhesion is achieved by intermolecular attraction.

Referring to FIG. 7D, the cylinder 136 is cut off from supply of air from the air supply device, and the cylinder 136 exhausts air. And the piston 137 present in the cylinder 136 is restored to its original position by the pressure is lowered by the blocking and exhaust of air. Therefore, the slide shoe 134 of the first adhesive plate 115 is restored to its original position along the guide groove 119 of the first support plate 114. At this time, the guide groove springs 135 formed on the slide shoe 134 and the first support plate 114 exert an elastic force for smooth restoration of the slide shoe 134. The first adhesive plate 115 moves in the direction of the cylinder 136 and the first adhesive protrusion 113 adhered to the first adhesive plate 115 moves in the opposite direction to the first adhesive plate 115 by inertial force. After it is restored to its original location. Therefore, since the intermolecular attraction becomes weaker as the first substrate P1 adhered to the first adhesion protrusion 113 becomes farther from the first adhesion protrusion 113, the first substrate P1 becomes It is separated from the first adhesive protrusion 113.

8 is a flowchart illustrating a substrate bonding method using the substrate bonding apparatus according to the embodiment of the present invention.

Referring to FIG. 8, first, the first substrate P1 is loaded into the process chamber between the chambers 110 and 120 (S110). Loading of the first substrate P1 may be performed by a robot arm that supports the first substrate P1 by vacuum adsorption. In addition, the first adhesion protrusion 113 formed on the first adhesion plate 115 of the first adhesion chuck 111 is inclined by the piston 137 of the horizontal moving means 118, thereby causing the first substrate P1 to be inclined. ) Is adhered to the first adhesive protrusion 113 (S120). That is, after contacting the first substrate P1 to the first adhesive projection 113, the cylinder 136 is supplied with air by the air supply device. The air causes the piston 137 in the cylinder 136 to move out of the cylinder 136. The first adhesive plate 115 in contact with the piston 137 is moved away from the horizontal moving means 118 by the movement, the first adhesive protrusion 113 formed on the first adhesive plate 115 is inertial force This causes inclination in the opposite direction and tilts. Therefore, the first substrate P1, which has been in contact with the first adhesive protrusion 113, moves together with the first adhesive protrusion 113, and as a result, the first substrate P1 is smooth with the first adhesive protrusion 113. Adhesion is made.

Next, the second substrate (P2) is carried into the chamber (110, 120) by the robot arm (S130). When the second substrate P2 is brought into the predetermined position, the lift pin 128 is raised to support the lower portion of the second substrate P2. The robot arm is then carried out of the chambers 110 and 120. Then, when the lift pin 128 is lowered, the second substrate P2 contacts the upper portion of the second adhesive chuck 121. Then, as in step S120, the second adhesive projection 124 is inclined by the movement of the piston of the horizontal moving means is inclined, the second substrate (P2) is moved together with the second adhesive projection 124, and eventually The second substrate P2 is smoothly adhered to the second adhesion protrusion 124.

Thereafter, the upper chamber 110 descends. As the lowering of the upper chamber 110, the first adhesive chuck 111 also lowers together. Accordingly, the first substrate P1 and the second substrate P2 are aligned to face each other in close proximity to the set distance (S140). The proximity distance at this time is measured by the sensor. Then, the camera 116 photographs the alignment marks of the first and second substrates P1 and P2 to check the alignment of the first and second substrates P1 and P2, and checks the UVW table ( 133 adjusts the alignment state of the first substrate P1 and the second substrate P2 by the UVW driver (not shown). The alignment may be adjusted a plurality of times by pre-alignment, final alignment, etc. according to the distance between the first substrate P1 and the second substrate P2 until the substrates P1 and P2 are finally bonded. .

In addition, when the upper chamber 110 continuously descends to closely contact the lower chamber 120, the process chambers inside the chambers 110 and 120 are blocked from the standby state. When the first substrate P1 and the second substrate P2 are pre-aligned, the process chambers inside the chambers 110 and 120 are in a vacuum state by forced exhaust. The vacuum state may consist of forced exhaust by a dry pump and a turbo molecular pump (TMP).

When the vacuum atmosphere of the predetermined pressure is achieved, the first adhesive chuck 111 is further lowered so that the first substrate P1 is close to the shortest set interval on the second substrate P2, and the first substrate is moved to the camera 116. Final alignment is performed by using the alignment marks P1 and the second substrate P2.

When the final alignment is completed, the first substrate P1 attached to the first adhesive chuck 111 is separated from the first adhesive chuck 111, and then the first substrate P1 and the second substrate P2 are bonded together. (S150). Separation at this time is carried out by the cylinder blocking the air and evacuating the air as already mentioned. That is, the piston 136 of the horizontal moving means 118 is to be restored, the first adhesive protrusion 113 formed on the first adhesive plate 115 is restored to its original state. Therefore, since the intermolecular attraction with the first adhesive protrusion 113 is weakened in the first substrate P1, the first substrate P1 is separated from the first adhesive protrusion 113.

Therefore, when the first substrate P1 is separated from the first adhesive chuck 111, the first substrate P1 falls toward the second substrate P2 and is disposed between the first substrate P1 and the second substrate P2. It adheres by the applied sealant. After the first substrate P1 falls, high-pressure nitrogen gas is injected through an exhaust pipe (not shown) to pressurize the first substrate P1. Accordingly, the inside of the chambers 110 and 120 changes in air pressure from the vacuum state to the atmospheric pressure state again. That is, between the first substrate P1 and the second substrate P2 is in a vacuum state, and the processing chambers inside the chambers 110 and 120 are at atmospheric pressure, so the pressure difference between the substrates P1 and P2 in close contact with each other is different. The adhesion is performed by the pressing force of the pressurized gas. At the same time as the bonding, the liquid crystal coated with the sealant is injected. Injection of the liquid crystal may be performed separately after bonding. Afterwards, the first substrate P1 and the second substrate P2 may be inspected for the bonding state of the first substrate P1 and the second substrate P2, and UV irradiation may be performed to further harden the sealant.

The bonded first substrate P1 and the second substrate P2 are carried out to the outside of the chambers 110 and 120 (S160). When the bonding is completed, the upper chamber 110 is lifted by the lift screw 122 and the lift motor 123 to open between the upper chamber 110 and the lower chamber 120. When the space between the upper chamber 110 and the lower chamber 120 is opened, the lift pins 128 are raised to raise the bonded substrates P1 and P2. At this time, the second adhesive chuck 121 and the second substrate (P2) is a separation operation is performed together or in advance. That is, when the cylinder located in the second adhesion chuck 121 blocks the air and exhausts the air, the piston of the horizontal moving means performs the restoring motion. Thereafter, the second adhesive protrusion 124 formed on the second adhesive plate 126 is also returned to its original state, and the second substrate P2 and the second adhesive protrusion (2) adhered to the second adhesive protrusion 124. The intermolecular attraction between 124) weakens. Therefore, when the lift pin 128 is raised in a state where the intermolecular attraction is weakened, the second substrate P2 is separated from the second adhesion chuck 121 without difficulty. Subsequently, when the lift pins 128 are further raised and the bonded substrates P1 and P2 are positioned at the carrying out position, the robot arm enters the lower portion of the substrates P1 and P2 from the outside of the chambers 110 and 120 and the substrate P1. , P2) is exported. Thereafter, the bonding process for the other substrates waiting outside the chambers 110 and 120 is repeated.

As described above, the adhesive chuck according to the embodiment of the present invention, the substrate bonding apparatus and the substrate bonding method using the same may be differently modified by a part of a component or a method by a person skilled in the art.

In the modified embodiment, the adhesive chuck may be applied to a semiconductor manufacturing process and a bonding device for adhering at atmospheric pressure, and other devices used in the display manufacturing process, and also to a robot arm for transferring a substrate. You can do it.

In addition, in the case of the substrate bonding apparatus, an electrostatic chuck is used as one of the two substrate bonding means, and another adhesion means uses an adhesive chuck according to the embodiment of the present invention, or one electrostatic chuck. The electrostatic force is to be partially generated, and the remaining portion of the electrostatic force is not provided with a pressure-sensitive adhesive projection may be able to bond the substrate by the static electricity and intermolecular attraction.

In this case, the substrate bonding process may be performed by adjusting the adhesion process by the electrostatic force of the substrate and the adhesion process by the adhesion protrusion. In addition, the substrate bonding apparatus can be applied to a substrate bonding apparatus of a different form from the above-described embodiment. Therefore, if the other modified embodiment includes the essential components of the adhesive chuck or substrate bonding apparatus of the present invention all should be considered to be included in the technical scope of the present invention.

1 is a schematic cross-sectional view showing a substrate bonding apparatus according to an embodiment of the present invention.

Figure 2 is a cross-sectional view of the internal structure of the adhesive chuck according to an embodiment of the present invention.

FIG. 3A is an enlarged view of a portion “A” of FIG. 2.

3B is a side cutaway perspective view of the portion “A” of FIG. 2.

4 is an enlarged view of a portion “B” of FIG. 2.

Figure 5a is a plan view showing an adhesive chuck in accordance with an embodiment of the present invention.

Figure 5b is a plan view showing an adhesive chuck according to another embodiment of the present invention.

6 is a graph for explaining a state in which the adhesion and separation of the adhesive projection according to an embodiment of the present invention.

7A to 7D are cross-sectional views illustrating an operating state in which a substrate is adhered and separated in an adhesive chuck according to an embodiment of the present invention.

8 is a flowchart illustrating a substrate bonding method using the substrate bonding apparatus according to the embodiment of the present invention.

** Description of the symbols of the main parts of the drawings **

100: substrate bonding device

110: upper chamber

111: first stick chuck

113: first adhesive protrusion

114: first support plate

115: first adhesive plate

118: horizontal movement means

120: lower chamber

121: second adhesive chuck

124: second adhesive projection

125: second support plate

126: second adhesive plate

130: base frame

Claims (6)

A support plate having a guide groove formed on a bottom surface thereof; An adhesive plate disposed below the support plate, the upper surface having a slide shoe sliding along the guide groove, and the lower surface having a plurality of adhesive protrusions attached to the substrate to be adhered by intermolecular attraction; And And a horizontal moving means penetrating the support plate and the pressure-sensitive adhesive plate and having an outer edge contacting the support plate and the pressure-sensitive adhesive plate. The method of claim 1, And a spring inserted between the front end of the guide groove in the slide direction and the front end of the slide shoe in the slide direction. The method of claim 1, The horizontal movement means is a pressure-sensitive chuck, characterized in that it comprises a cylinder which receives air from the outside or exhausts the air, and a piston located at the lower end of the cylinder. The method of claim 3, wherein And the piston includes a piston body positioned at a lower end of the cylinder, and a piston protrusion fixed to an outer circumferential surface of the piston body and disposed outside the cylinder. An upper chamber for forming a bonding space of the substrate; A support plate having a guide groove formed on a lower surface thereof, a slide shoe disposed below the support plate, a slide shoe sliding along the guide groove on an upper surface thereof, and having a plurality of adhesive protrusions attached to the substrate to be adhered by intermolecular attraction; An adhesive chuck which includes a pressure-sensitive adhesive plate, horizontal movement means penetrating the support plate and the pressure-sensitive adhesive plate, and an outer edge thereof contacts the support plate and the pressure-sensitive adhesive plate, wherein the pressure-sensitive chuck is positioned inside the upper chamber; A lower chamber in contact with the upper chamber to form a bonding space of the substrate; And And a vertical movement means for elevating the upper chamber to the lower chamber. Bringing the first substrate into the chamber; Contacting the plurality of sticking protrusions of the first substrate and the first adhesive chuck to incline the sticking protrusions by a cylinder, and sticking them with intermolecular attraction between the first substrate and the sticking protrusions; Bringing in a second substrate into the chamber; Aligning the second substrate and the first substrate at positions facing each other; Separating the first substrate from the adhesive projection by the cylinder and bonding the first substrate to the second substrate; And And bonding the bonded first and second substrates out of the chamber.

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