KR20090059875A - Electronic ink display device and method for fabricating the same - Google Patents

Abstract

An electronic ink display device and a manufacturing method thereof are provided to etch a glass substrate after forming a thin film transistor array and a color filter array on the glass substrate, thereby realizing a flexible electronic ink display device, increasing productivity and reducing weight of the device. An organic film(400) is formed on a glass substrate. A thin film transistor array and a color filter array are simultaneously formed on the organic film. An electronic ink substrate including an electronic ink film layer is bonded on the substrate. The glass substrate is etched.

Description

Electronic ink display device and manufacturing method therefor {Electronic Ink Display Device and Method For Fabricating the Same}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a color electronic ink display device, and more particularly, to a color electronic ink display device capable of facilitating a manufacturing process and implementing a flexible display.

In accordance with the development of the information society, instead of the conventional CRT (Cathode Ray Tube) to display visual information, PDP (Plasma Display Panel), FED (Field Emission Display Device), LCD (Liquid Crystal Display Device), OLED ( The development of technologies for flat panel display devices such as Organic Light Emitting Diodes is being actively promoted.

Among such various flat panel display devices, an electronic ink display device that uses light power and low power consumption, such as paper, is a new generation of image display devices that are attracting new attention.

Electronic ink display device is a technology to implement a flexible display (Digital Paper Display Device; DPD) using a electronic ink substrate having an electronic ink film layer formed on the substrate, have.

1 is a cross-sectional view for explaining a principle of operation of a conventional mono electronic ink display device capable of realizing a black and white screen.

For reference, like reference numerals in the following drawings refer to like elements.

As shown in Fig. 1, in the conventional monoelectronic ink display device, the electronic ink substrate 30 and the array substrate 10 provided with the pixel electrode 12 for driving each pixel are bonded to each other. It is composed.

Although not shown, the array substrate 10 is provided with a switching element for driving each pixel electrode.

The electronic ink substrate 30 has a common electrode layer 33 formed of a transparent conductive material on the electronic ink substrate, a polymer binder attached to the common electrode layer, and an electrophoretic dispersion fluid 38 is injected therein. A micro capsule 36 is composed of an electronic ink film layer 34 which is densely integrated.

The electrophoretic dispersion injected into the microcapsules includes a positively charged white pigment 37a and a negatively charged black pigment 37b. Dispersion

Therefore, an image formed by moving a pigment embedded in a microcapsule is generated by an electric field formed between the pixel electrode of the array substrate and the common electrode layer of the electronic ink substrate.

For example, when the potential of the pixel electrode 12 is higher than that of the common electrode, negatively charged black pigments 37b are collected on the side near the pixel electrode in the microcapsule, on the contrary, in the microcapsule At the far side from the pixel electrode, positively charged white pigments 37a are collected. Therefore, it becomes possible to implement a black and white image through the light reflected by the black pigment or the white pigment.

However, such a conventional mono-electronic ink display device has a disadvantage in that it cannot implement various color images.

In order to overcome these disadvantages, a color electronic ink display device having a color screen by attaching a color filter substrate to a mono electronic ink display device has been introduced.

2A to 2C are cross-sectional views showing a manufacturing method of a conventional color electronic ink display device.

First, as shown in FIG. 2A, an array substrate 10 having a thin film transistor array including a pixel electrode 12 and a switching element for driving each pixel electrode is formed, and a color filter array including a color filter layer 22 is formed. The color filter substrate 20 is prepared.

Although not shown, the array substrate includes a gate line and a data line crossing each other to define a pixel region, and a thin film transistor formed at an intersection of the gate line and the data line to operate as a switching element.

In addition, a black matrix (not shown) defining a pixel region is formed in the color filter substrate so as to correspond to the pixel region of the array substrate, and the color filter is formed in the pixel region.

Next, as shown in FIG. 2B, an electronic ink film layer in which a microcapsule 36 in which an electrophoretic dispersion fluid 38 is injected into the array substrate is densely integrated. The electronic ink substrate 30 provided with 34 is bonded. At this time, the first adhesive layer 32a and the second adhesive layer 32b are formed on the lower and upper portions of the electronic ink substrate, respectively.

In the microcapsule, white pigment 37a and black pigment 37b, which are electrophoretic particles dispersed in the electrophoretic dispersion liquid and moving in the direction of the electric field, are dispersed.

In addition, a common conductive layer 33 made of a transparent conductive material, for example, indium-tin oxide (ITO), indium-zinc oxide, or the like, is provided on the electronic ink substrate.

Next, as shown in FIG. 2C, the color filter substrate 20, in which the color filter layer 22 is formed on the array substrate to which the electronic ink substrate is bonded, is bonded to complete the color electronic ink display device.

In the color electronic ink display device thus completed, an observer located on the color filter substrate side may recognize the color screen through light reflected through the color filter.

However, such a conventional method of manufacturing a color electronic ink display device has the following problems.

When manufacturing a color electronic ink display device on a plastic substrate or a metal foil substrate in order to realize a flexible display using the color electronic ink display device, the substrate may be bent due to a problem such as bending of the substrate. There was a problem that the process was difficult to carry out.

Therefore, in order to implement a flexible color electronic ink display device, a plastic substrate is attached to the glass substrate using an adhesive on a glass substrate, and then a process is performed. After completion, the plastic substrate is separated from the glass substrate and manufactured. However, in this case, there is a problem in that a process of bonding and separating the plastic substrate to the glass substrate is added.

The present invention has been made to solve this problem,

After manufacturing a color electronic ink display apparatus using a glass substrate, the glass substrate is etched to completely remove the glass or remain only in a thin film form, thereby implementing a flexible electronic ink display apparatus.

In order to achieve the above object, a method of manufacturing an electronic ink display device according to an exemplary embodiment of the present invention includes forming an organic film on a glass substrate, and simultaneously forming a thin film transistor array and a color filter array on the organic film. And bonding the electronic ink substrate having the electronic ink film layer to the substrate, and etching the glass substrate.

According to another aspect of the present invention, there is provided a method of manufacturing an electronic ink display device, including forming an organic film on a glass substrate, forming an array of color filters on the organic film, and forming a metal foil. Forming a thin film transistor array on a substrate, bonding an electronic ink substrate having an electronic ink film layer on the metal foil substrate on which the thin film transistor array is formed, and bonding the glass substrate on the electronic ink substrate. And etching the glass substrate.

As described above, in the method of manufacturing the electronic ink display device according to the embodiment of the present invention, the thin film transistor array and the color filter array are simultaneously formed to have a color-filter on TFT (COT) structure on the glass substrate, This has the effect of reducing the problem of decreasing the aperture ratio.

In addition, after forming a thin film transistor array and a color filter array on the glass substrate, the glass substrate is etched to realize a flexible electronic ink display device, and can also be mass-produced, thereby achieving light weight.

The manufacturing method of the electronic ink display device according to another embodiment of the present invention can implement a flexible electronic ink display device which is also mass-producible, and has an electronic ink display device having a thin film transistor array having a relatively high aperture ratio. Has an effect that can be designed.

Next, a manufacturing method of an electronic ink display device according to an embodiment of the present invention will be described.

Method of manufacturing an electronic ink display device according to an embodiment of the present invention,

Forming an organic film on a glass substrate, simultaneously forming a thin film transistor array and a color filter array on the organic film, and bonding an electronic ink substrate having an electronic ink film layer to the substrate, And etching the substrate.

Method of manufacturing an electronic ink display device according to another embodiment of the present invention,

Forming an organic film on a glass substrate, forming a color filter array on the organic film, forming a thin film transistor array on a metal foil substrate, and forming a thin film transistor array on the metal foil substrate. Bonding the electronic ink substrate having an electronic ink film layer, bonding the glass substrate onto the electronic ink substrate, and etching the glass substrate.

Next, a method of manufacturing an electronic ink display device according to a first embodiment of the present invention will be described in detail with reference to the accompanying drawings.

3A to 3D are sectional views showing the manufacturing method of the electronic ink display device according to the first embodiment of the present invention.

First, as shown in FIG. 3A, the organic layer 400 is formed on the entire surface of the glass substrate 100. As the organic layer, an acryl-based organic material or a polyimide-based organic material may be used, but is not limited thereto.

In addition, although not shown, it may be possible to further form an inorganic film such as a silicon nitride film or a silicon oxide film on the substrate before forming the organic film.

Next, as shown in FIG. 3B, a thin film transistor array and a color filter array including a color filter layer are formed simultaneously on the organic layer.

First, a conductive layer is formed on the organic layer, and then the conductive layer is etched to form a gate line (not shown) and a gate electrode 101 branched from the gate line, and the entire substrate including the gate line and the gate electrode. The gate insulating film 102 is formed to cover the gap.

Subsequently, a semiconductor material layer and a conductive layer are sequentially formed on the gate insulating layer, and then the semiconductor material layer and the conductive layer are patterned at the same time to overlap the semiconductor layer 103 overlapping the gate electrode, and the gate line and the gate insulating layer therebetween. A source line 104a and a drain electrode 104b spaced apart from and facing the source electrode to have a data line crossing the pixel region to define a pixel region and a region overlapping the semiconductor layer by overlapping the data line. To form.

Subsequently, the passivation layer 105 is formed to cover the entire surface of the substrate including the data line and the source electrode and the drain electrode.

Subsequently, after the photoresist is applied on the passivation layer, the photoresist is patterned to expose the pixel region, thereby forming a black matrix 202. Similarly, after applying the photoresist, the color filter layer 204 is applied to the pixel region. ).

Next, the planarization layer 206 is formed to cover the black matrix and the color filter layers, and a portion of the planarization layer, the black matrix layer, and the passivation layer is removed to expose the drain electrode 104b, thereby forming contact holes. The pixel electrode 106 is formed to cover the contact hole.

Next, as shown in FIG. 3C, the electronic ink substrate having the electronic ink film layer is bonded to the glass substrate on which the thin film transistor array and the color filter array are formed at the same time.

The electronic ink substrate 300 may include a common electrode layer 333 formed on the front surface of a flexible substrate, such as a plastic substrate, an electronic ink film layer 334 formed on the common electrode layer, and the electronic ink layer film. An adhesive layer 332 for bonding onto the glass substrate 100 is provided.

The electronic ink film layer 334 is formed by dense integration of the microcapsules 336 into which the electrophoretic dispersion 338 is injected, and a positively charged white pigment 337a in the electrophoretic dispersion; The negatively charged black pigment 337b is dispersed.

Next, as illustrated in FIG. 3D, the glass substrate is etched and removed from the bonded substrate.

As such, when the glass substrate is etched and removed, the organic layer 400 is exposed on the surface. That is, the organic layer has an etching selectivity different from that of the glass to act as an etch stop layer, thereby preventing the inside of the array from being etched and preventing moisture from penetrating into the electronic ink display.

In particular, when the inorganic film is further formed, the effect of preventing moisture penetration is further remarkable.

It is also possible to further attach a protective film to the surface of the exposed organic film.

As the protective film, for example, polycarbonate (PC: polycarbonate), polystyrene (PS: polystyrene), polyether sulfone (PES: polyethersulphone), polyethylene terephthalate (PET: polyethylene terephthalate), polyethylene naphthalate (PEN: polyethylene) naphthalate) and the like, but is not limited thereto.

In addition, it may be possible to coat the organic protective film instead of the protective film.

Meanwhile, when etching the glass substrate, it may be possible to etch the glass substrate so that only the glass film 100a in the form of a thin film remains by partially etching the glass substrate as shown in FIG. 4. As such, when the glass substrate becomes a thin film having a thickness of 100 μm or less, it is possible to implement a flexible display.

As described above, when the glass film in the form of a thin film is present, the effect of protecting the device from external moisture or the like is further improved.

Also, it may be possible to attach a protective film or coat an organic protective film on the glass film in the form of the thin film.

In addition, the protective film may be further attached to the upper portion of the electronic ink substrate.

As described above, in the method of manufacturing the electronic ink display device according to the first embodiment of the present invention, the thin film transistor array and the color filter array are simultaneously formed to have a color filter on TFT (COT) structure on a glass substrate, This has the effect of reducing the problem that the aperture ratio is reduced.

In addition, after forming the thin film transistor array and the color filter array on the glass substrate, the glass substrate is etched to realize a flexible electronic ink display device and increase the productivity.

Next, a method of manufacturing an electronic ink display device according to a second embodiment of the present invention will be described with reference to the accompanying drawings.

5A to 5F are cross-sectional views illustrating a method of manufacturing the electronic ink display device according to the second embodiment of the present invention.

First, as shown in FIG. 5A, the organic layer 400 is formed on the glass substrate 200.

The organic layer may use an acryl-based organic material or a polyimide-based organic material, but is not limited thereto.

In addition, although not shown, it may be possible to further form an inorganic film such as a silicon nitride film or a silicon oxide film on the substrate before forming the organic film.

Next, as shown in FIG. 5B, a color filter array including a color filter layer 222 is formed on the organic layer 400.

More specifically, for example, after forming a photoresist on the organic layer and patterning a black matrix (not shown) to define a pixel region, and after applying a photoresist again patterning to cover the pixel region The color filter layer 222 may be formed.

In addition, it may be possible to further form a planarization layer (not shown) on the black matrix and the color filter layer.

Next, as shown in FIG. 5C, a thin film transistor array having pixel electrodes 106 is formed on the metal foil substrate 100.

Although not shown, a process of forming the thin film transistor array will be described in more detail. First, an insulating material such as a silicon nitride film or a silicon oxide film is deposited on the metal foil substrate 155 to form a buffer film.

The buffer layer may be formed of, for example, an inorganic insulating material such as silicon oxide or silicon nitride, and serves to insulate the thin film transistor array from the metal foil substrate.

Subsequently, a gate line and a gate electrode branched from the gate line are formed on the buffer layer, and a gate insulating layer is formed to cover the entire surface of the substrate including the gate line and the gate electrode.

Next, a semiconductor layer having a region overlapping the gate electrode on the gate insulating layer, a data line crossing the gate line and the gate insulating layer to define a pixel region, and branching from the data line to the semiconductor layer. A source electrode having a region overlapping with the gate electrode and a drain electrode are formed to face each other while being spaced apart from the source electrode.

Subsequently, a passivation layer is formed to cover the entire surface of the substrate including the data line, the source electrode, and the drain electrode, and then the contact layer is formed by removing the passivation layer to expose a portion of the drain electrode.

Subsequently, a transparent conductive material is deposited to cover the contact hole, and then patterned to form a pixel electrode in the pixel region so as to be connected to the drain electrode.

Next, as shown in FIG. 5D, the electronic ink substrate 300 having the electronic ink film layer 334 is bonded to the metal foil substrate 155 on which the thin film transistor array is formed.

The electronic ink film layer 334 is formed by dense integration of the microcapsules 336 into which the electrophoretic dispersion 338 is injected, and a positively charged white pigment 337a in the electrophoretic dispersion; The negatively charged black pigment 337b is dispersed.

In addition, the electronic ink substrate includes a common electrode layer 333 formed on the entire surface of the substrate. In addition, an adhesive layer 332 is provided on the electronic ink film layer to bond the electronic ink film layer to the substrate on which the thin film transistor array is formed.

Next, as shown in FIG. 5E, the glass substrate 200 on which the color filter array is formed is bonded to the upper portion of the electronic ink substrate 300.

Although not shown, it may be possible to bond the two substrates by further forming an adhesive layer between the electronic ink substrate and the glass substrate.

Next, as shown in FIG. 5F, the glass substrate is etched and removed from the bonded substrate.

As such, when the glass substrate is etched and removed, the organic layer 400 is exposed on the surface. That is, the organic layer has an etching selectivity different from that of the glass to act as an etch stop layer, thereby preventing the inside of the array from being etched and preventing moisture from penetrating into the electronic ink display.

In particular, when the inorganic film is further formed, the effect of preventing moisture penetration is further remarkable.

In addition, it is possible to further attach a protective film on the surface of the exposed organic film.

As the protective film, for example, polycarbonate (PC), polystyrene (PS: polystyrene), polyether sulfone (PES: polyethersulphone), polyethylene terephthalate (PET: polyethylene terephthalate), polyethylene naphthalate (PEN: polyethylene) naphthalate) and the like, but is not limited thereto.

In addition, it may be possible to coat the organic protective film instead of the protective film.

Meanwhile, when etching the glass substrate, the glass substrate may be etched such that only the glass film 200a in a thin film form remains by partially etching the glass substrate as shown in FIG. 6. As such, when the glass substrate becomes a thin film having a thickness of 100 μm or less, it is possible to implement a flexible display.

Also, it may be possible to attach a protective film or coat an organic protective film on the glass film in the form of the thin film.

In addition, the protective film may be further attached to the upper portion of the electronic ink substrate.

In addition, although not shown, the anti-corrosion treatment may be further performed, such as coating a protective film on the metal foil substrate before the etching of the glass substrate, or forming a sacrificial layer removed after the etching of the glass substrate. have.

As described above, the manufacturing method of the electronic ink display device according to the second embodiment of the present invention has an effect of implementing the electronic ink display device without changing the conventional process since the color filter array is formed on the glass substrate. Have

In addition, the glass substrate may be etched to realize a flexible electronic ink display device and may have an effect of increasing mass productivity.

Next, an electronic ink display device according to an embodiment of the present invention will be described.

7A is a cross-sectional view showing a cross section of the electronic ink display device according to the first embodiment of the present invention.

As shown in FIG. 7A, the electronic ink display device according to the first embodiment of the present invention includes an organic film 400 having a thin film transistor array and a color filter array formed at the same time, and an electronic ink film layer 334 bonded to the organic film. It is characterized by consisting of an electronic ink substrate having a).

The thin film transistor array may include a gate electrode 101 formed on an organic layer, a gate insulating layer 102 formed to cover an entire surface of the organic layer including the gate electrode 101, and a gate electrode on the gate insulating layer. A semiconductor layer 103 formed to have an area, a source electrode 104a and a drain electrode 104b formed to be spaced apart from each other on the semiconductor layer, and a passivation layer 105 formed on an entire surface of the substrate including the source electrode and the drain electrode. And the pixel electrode 106 formed to be connected to the drain electrode.

The color filter array includes a black matrix 202 formed on the passivation layer and patterned to expose a pixel region, and a color filter layer 204 formed to cover the pixel region, and the black matrix and color filter layers. It may further include a planarization layer 206 formed on the top.

The pixel electrode 106 is formed to be connected to the drain electrode through a passivation layer from which a portion of the passivation layer and the color filter array are removed to expose the drain electrode.

The electronic ink film layer 334 is formed by dense integration of the microcapsules 336 into which the electrophoretic dispersion 338 is injected, and a positively charged white pigment 337a in the electrophoretic dispersion; The negatively charged black pigment 337b is dispersed.

In addition, the electronic ink substrate includes a common electrode layer 333 formed on the entire surface of the substrate. In addition, an adhesive layer 332 is provided on the electronic ink film layer to bond the electronic ink film layer to the substrate on which the thin film transistor array is formed.

The organic layer 400 may be formed of an acryl-based organic material or a polyimide-based organic material, but is not limited thereto.

Although not shown, an inorganic film made of an inorganic insulating material such as a silicon nitride film or a silicon oxide film may be further provided below the organic film.

In addition, a protective film may be further provided below the organic layer to protect the exposed organic layer. The protective film is, for example, polycarbonate (PC: polycarbonate), polystyrene (PS: polystyrene), polyethersulphone (PES: polyethersulphone), polyethylene terephthalate (PET: polyethylene terephthalate), polyethylene naphthalate (PEN: polyethylene naphthalate) and the like, but is not limited thereto.

In addition, it may be possible to further include an organic protective film coated on the lower portion of the organic film instead of a protective film.

On the other hand, in the electronic ink display device according to the first embodiment of the present invention, as shown in Figure 7b, it is also possible to further include a glass film 100a in the form of a thin film below the organic film, also of the thin film form It may be further provided with a protective film or a coated organic protective film attached to the glass film.

For reference, the thin glass film has a thickness of 100 μm or less.

Thus, the electronic ink display device according to the first embodiment of the present invention,

Since a color-filter on TFT (COT) structure, that is, a thin film transistor array and a color filter array, is formed on the glass substrate at the same time, the aperture ratio may be reduced by bonding.

In addition, the glass substrate may be etched to realize a flexible electronic ink display device, and the mass productivity may be increased, and the weight may be reduced.

Next, an electronic ink display device according to a second embodiment of the present invention will be described with reference to the accompanying drawings.

8A is a cross-sectional view showing a cross section of an electronic ink display device according to a second embodiment of the present invention.

As shown in Fig. 8A, the electronic ink display device according to the second embodiment of the present invention,

A metal foil substrate 155 on which a thin film transistor array including a pixel electrode 106 is formed, an electronic ink substrate 300 bonded to the metal foil substrate and having an electronic ink film layer 334, and the electronic ink And a color filter layer formed to have a color filter layer 222 between the organic film 400 formed on the substrate and the organic film and the electronic ink substrate.

Although not shown, a buffer film is formed on the metal foil substrate 155 by depositing an insulating material such as a silicon nitride film or a silicon oxide film.

The buffer layer may be formed of, for example, an inorganic insulating material such as silicon oxide or silicon nitride, and serves to insulate the thin film transistor array from the metal foil substrate.

Although not illustrated, the thin film transistor array may include a gate line formed on the buffer layer and a gate electrode branched from the gate line, a gate insulating layer formed to cover the entire surface of the substrate including the gate line and the gate electrode, and the gate. A semiconductor layer formed to have a region overlapping the gate electrode on the insulating film, a data line crossing the gate line and the gate insulating film to define a pixel region, a branch branched from the data line, and a gate electrode on the semiconductor layer; A source electrode formed to have an overlapping area, a drain electrode formed to be spaced apart from the source electrode, a passivation film formed on the entire surface of the substrate including the source electrode and the drain electrode, and a portion of the drain electrode exposed on the passivation film. Work of shield It is removed through the contact hole so as to be connected to the drain electrode comprises the pixel electrode 106 formed in the pixel region.

Although not shown, the color filter array may include a black matrix formed on the organic layer 400 to define a pixel region, and a color filter layer 222 formed to cover the pixel region. It is also possible to further provide a leveling layer on the color filter layer.

The electronic ink film layer 334 is formed by dense integration of the microcapsules 336 into which the electrophoretic dispersion 338 is injected, and a positively charged white pigment 337a in the electrophoretic dispersion; The negatively charged black pigment 337b is dispersed.

In addition, the electronic ink substrate includes a common electrode layer 333 formed on the entire surface of the substrate. In addition, an adhesive layer 332 is provided on the electronic ink film layer to bond the electronic ink film layer to the substrate on which the thin film transistor array is formed.

In addition, the electronic ink substrate may further include an adhesive layer on a surface facing the organic film.

The organic layer 400 may be formed of an acryl-based organic material or a polyimide-based organic material, but is not limited thereto.

Although not shown, an inorganic film made of an inorganic insulating material such as a silicon nitride film or a silicon oxide film may be additionally provided on the exposed side of the organic film.

In addition, a protective film may be further provided on the exposed surface of the organic film to protect the exposed organic film. The protective film is, for example, polycarbonate (PC: polycarbonate), polystyrene (PS: polystyrene), polyether sulfone (PES: polyethersulphone), polyethylene terephthalate (PET: polyethylene terephthalate), polyethylene naphthalate (PEN: polyethylene naphthalate It may be formed of a material such as), but is not limited thereto.

In addition, the exposed one side of the organic film, it will be possible to be further provided with an organic protective film coated in place of the protective film.

On the other hand, in the electronic ink display device according to the second embodiment of the present invention, as shown in Figure 8b, it is also possible to further include a glass film 200a in the form of a thin film on one side of the organic film, the thin film form It will also be possible to further include a protective film or coated organic protective film attached to the glass film of the.

For reference, the thin glass film has a thickness of 100 μm or less.

In addition, while describing the electronic ink display device according to the second embodiment of the present invention, the electronic filter substrate is bonded to the metal foil substrate and then the color filter substrate is bonded. However, the bonding order may be changed as necessary.

As described above, the electronic ink display device according to the second embodiment of the present invention also can implement a flexible electronic ink display device having fairness, and also have the effect of reducing the weight by glass being etched away or removed. In addition, it has the effect of designing a thin film transistor array having a higher aperture ratio than the COT structure.

On the other hand, the present invention described above is not limited to the above-described embodiment and the accompanying drawings, it is possible that various substitutions, modifications and changes within the scope without departing from the technical spirit of the present invention. It will be apparent to those skilled in the art.

1 is a cross-sectional view of a conventional mono electronic ink display device.

2A to 2C are cross-sectional views showing a manufacturing method of a conventional color electronic ink display device.

3A to 3D are cross-sectional views showing the manufacturing method of the electronic ink display device according to the first embodiment of the present invention.

Fig. 4 is a cross-sectional view showing a case where the glass substrate is partially etched in the manufacturing method of the electronic ink display device according to the first embodiment of the present invention.

5A to 5F are cross-sectional views showing the manufacturing method of the electronic ink display device according to the second embodiment of the present invention.

Fig. 6 is a sectional view showing a case where the glass substrate is partially etched in the method of manufacturing the electronic ink display device according to the second embodiment of the present invention.

Fig. 7A is a sectional view of the electronic ink display device according to the first embodiment of the present invention.

Fig. 7B is a sectional view showing a case where the glass substrate is partially etched in the electronic ink display device according to the first embodiment of the present invention.

Fig. 8A is a sectional view of the electronic ink display device according to the second embodiment of the present invention.

8B is a sectional view showing a case where the glass substrate is partially etched in the electronic ink display device according to the second embodiment of the present invention.

<Description of Symbols for Main Parts of Drawings>

10: array substrate 30: second substrate

12, 106: pixel electrode 34, 334: electronic ink film layer

36, 336: microcapsules 38, 338: dispersion

37a, 337a: white pigment 37b, 337b: black pigment

32a: first adhesive layer 32b: second adhesive layer

332: adhesive layer 20: color filter substrate

22, 204, 222: color filter layer 100, 200: glass substrate

100a, 200a: thinned glass film 400: organic film

101: gate electrode 102: gate insulating film

103: semiconductor layer 104a: source electrode

104b: drain electrode 105: protective film

202 black matrix 206 planarization layer

33, 333: common electrode layer 155: metal foil substrate

Claims (19)

Forming an organic film on the glass substrate; Simultaneously forming a thin film transistor array and a color filter array on the organic film; Bonding an electronic ink substrate having an electronic ink film layer to the substrate; And And etching the glass substrate. Forming an organic film on the glass substrate; Forming a color filter array on the organic film; Forming a thin film transistor array on a metal foil substrate; Bonding an electronic ink substrate having an electronic ink film layer on the metal foil substrate on which the thin film transistor array is formed; Bonding a glass substrate having the color filter array formed thereon onto the electronic ink substrate; And etching the glass substrate. The method according to claim 1 or 2, The etching of the glass substrate may include removing the glass substrate by completely etching the glass substrate so as to expose the organic layer. The method of claim 3, wherein And attaching a protective film on the exposed organic layer. The method of claim 3, wherein A method of manufacturing an electronic ink display device, the method further comprising: coating an organic passivation layer on the exposed organic layer. The method according to claim 1 or 2, The etching of the glass substrate may include etching the glass substrate so that a glass film thinned to a thickness of 100 μm or less remains. The method of claim 6, And attaching a protective film over the thinned glass film. The method of claim 7, wherein And manufacturing an organic protective film on the thinned glass film. The method according to claim 1 or 2, And forming an inorganic film on the glass substrate prior to forming the organic film. The method of claim 2, And before the etching of the glass substrate, further comprising performing an anti-corrosion treatment on the metal foil substrate. An organic film on which a thin film transistor array and a color filter array are formed at the same time; And And an electronic ink substrate bonded to and opposite to the organic film and having an electronic ink film layer. A metal foil substrate having a thin film transistor array having a pixel electrode; An electronic ink substrate bonded to the metal foil substrate and having an electronic ink film layer; An organic film formed on the electronic ink substrate; And And a color filter layer formed to have a color filter layer between the organic film and the electronic ink substrate. The method according to claim 11 or 12, And a protective film attached to one side of the organic film or an organic protective film coated on one side of the organic film. The method of claim 13, The protective film is a polycarbonate (PC: polycarbonate), polystyrene (PS: polystyrene), polyether sulfone (PES: polyethersulphone), polyethylene terephthalate (PET: polyethylene terephthalate), polyethylene naphthalate (PEN: polyethylene naphthalate) An electronic ink display device comprising at least one of the materials. The method according to claim 11 or 12, The electronic ink display device further comprises a glass film having a thickness of 100 μm or less provided on one side of the organic film. The method of claim 15, And an organic protective film coated on one side of the thinned glass film, or an organic protective film coated on one side of the thinned glass film. The method of claim 16, The protective film is a polycarbonate (PC: polycarbonate), polystyrene (PS: polystyrene), polyether sulfone (PES: polyethersulphone), polyethylene terephthalate (PET: polyethylene terephthalate), polyethylene naphthalate (PEN: polyethylene naphthalate) An electronic ink display device comprising at least one of the materials. The method according to claim 11 or 12, And an inorganic film provided on one side of the organic film and formed of any one of a silicon oxide film and a silicon nitride film. The method according to claim 11 or 12, The organic film display device of claim 1, wherein the organic layer is an acryl-based organic material or a polyimide-based organic material.

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