KR20090059016A - Solder ball manufacturing equipment - Google Patents

Abstract

An apparatus for manufacturing a solder ball is provided to improve manufacturing efficiency by forming the solder ball by the surface tension by freefalling a solder in a heating unit. A preheating unit(100) heats a solder with the predetermined weight to the state just before being fused. A heating unit(200) is formed to have a pipe type with an internal space and forms a solder ball is formed by the surface tension by heating and freefalling the preheated solder in the internal space. A tray(400) is positioned in the lower part of the heating unit. The solder ball is soaked in the coolant of the tray.

Description

Solder Ball Manufacturing Device

1 is a view showing the configuration of a solder ball manufacturing apparatus according to a first embodiment of the present invention.

Figure 2 shows another form of the cooling furnace.

3 is a view showing the configuration of a solder ball manufacturing apparatus according to a second embodiment of the present invention.

* Explanation of symbols on the main parts of the drawings

1-solder

100-preheating section 110-transfer section

200-heating furnace 210-heating wire

220-inert gas reservoir 221-heating

230-gas supply line

300-cooling furnace 310-cooling water circuit

320-cold air generator 330-cold air supply pipe

400-tray

The present invention relates to a solder ball manufacturing apparatus, and more particularly, to a solder ball manufacturing apparatus to simplify the device for manufacturing the solder ball to significantly reduce the manufacturing cost of the solder ball.

In recent years, electronic products such as communication equipment and imaging equipment manufactured by assembling various precision components are rapidly changing the speed of development of technology, and rapid development requires high performance, high performance, and miniaturized parts or devices.

This necessity requires a technology for constructing a circuit by mounting an integrated circuit on the surface of a circuit board. In order to mount and electrically connect such a component, a BGA is electrically contacted and mounted between the integrated circuit and the circuit board using solder balls. Surface mount techniques such as Ball Grid Allay are used.

Therefore, the solder ball used in the BGA type surface mounting technology is one of the most important parts, and the electrical properties are very dependent on how precisely it is manufactured.

Various apparatuses are used to manufacture solder balls. In Korean Patent Application No. 10-2001-0029407 (name: solder ball manufacturing apparatus and method for manufacturing the same), solder solution is formed in a melting furnace, and the resulting solder solution is sprayed from a melting furnace nozzle. Technical information for controlling the size of the solder ball flowing out through the nozzle to vibrate the nozzle by vibrating means while flowing out through the outside has been described.

Korean Patent Application No. 10-2002-0051431 (Name: Method for manufacturing solder ball using electromagnetic field and apparatus thereof) forms an alloy molten metal in a molten crucible, and then discharges an electromagnet on the outer circumferential surface of the molten pipe when it flows downward through the molten pipe. The technical details of forming solder balls by separating the droplets flowing out of the molten crucible into the desired size by the electromagnetic field generated therefrom are described.

Republic of Korea Patent Application No. 10-2006-002513 (name: metal ball manufacturing apparatus) is a ball-forming hole formed at the end of the discharge end of the spray hole when the molten metal in the heating device is discharged into the chamber through the spray hole A technique is described in which the rotating plate is brought into close contact and rotated by a motor to cut into solder balls of a predetermined size.

However, the conventional technical matters mentioned above have a very complicated device by forming a solder ball using a technique such as vibration, an electromagnetic field, and cutting by a rotating plate.

That is, the solder ball generating apparatus by vibration should have a control means and a vibration means for precisely controlling the vibration, the solder ball generating apparatus by the electromagnetic field likewise requires a control means and an electromagnet for precisely generating the electromagnetic field.

In addition, when the solder ball is produced by the graphite rotating plate, a mechanical mechanism for rotating it should be provided.

In addition, such a conventional device is to make the solder ball in the liquid state in advance in the smelting furnace to form the solder ball, and then through the process of forming the solder ball by a separate device after the production yield is lowered, the complex precision device requires a solder ball This leads to a rise in manufacturing cost, which ultimately leads to an improvement in the manufacturing cost of such a solder ball-applied component.

Therefore, in view of the above problems, the present invention provides a simple and efficient solder ball by freely dropping a solder cut to a certain weight of release from the upper portion of a cylindrical heating furnace so that the solder is melted by heat and formed into a spherical shape by surface tension. It provides a manufacturing apparatus.

In order to achieve the above object, the solder ball manufacturing apparatus according to the first embodiment of the present invention,

Preheating unit for heating the solder cut to a certain weight of the release to the state just before melting;

A heating furnace which is formed in a tubular shape having an inner space part and is installed in an up-down direction and forms a solder ball by surface tension by heating and melting the preheated solder while freely falling from the inner space part;

It is located in the lower portion of the furnace, the cooling liquid is accommodated in the tray containing the solder ball falling through the heating furnace; consists of,

A cooling furnace is installed between the heating furnace and the tray, and the cooling furnace is installed in the form of a tube having an inner space, and is installed in the form of a straight pipe at the bottom of the heating furnace, and is configured to cool the solder ball freely falling from the heating furnace.

The present invention configured as described above will be described in detail with reference to the accompanying drawings.

The present invention consists of a preheating unit 100, heating furnace 200, cooling furnace 300, tray 400.

The preheating unit 100 heats a solder having a predetermined weight of a mold to the state just before melting. First, the preheating unit 100 is cut into individual solders 1 so that a solder wire or the like has a predetermined weight, and then a preheating unit having a chamber shape. It is conveyed by the conveying part 110 into the inside of 110.

The temperature inside the preheating unit 110 maintains an atmosphere of about 100 to 170 ° C. (preferably about 150 ° C.), and heats the solder 1 to a state immediately before melting into a liquid phase by applying heat to the solder 1. will be.

This is to easily melt in the heating furnace 200 to take the form of a sphere.

The transfer unit 110 passes the solder 1 through the inside of the preheating unit 100 in a chamber form and inputs the upper portion of the heating furnace 200, and may be configured as a conveyor or the like.

The lower portion of the transfer unit 110 is provided with a heating furnace 200 installed in the vertical direction, the heating furnace 200 is empty in the interior, the upper and lower open state in the form of a cylinder, the interior of the 600-1000 ℃ The atmosphere of (preferably about 800 degreeC) is maintained.

Therefore, the body of the heating furnace 200 is provided with a heating wire 210 to maintain the internal temperature by heating the heating furnace 200, any means capable of applying heat as well as heating wire.

The release solder 1 introduced into the upper portion of the heating furnace 200 is melted by heat while changing the inside of the heating furnace 200 freely, and the solder ball having a spherical shape in order to minimize the surface tension is do.

The size of this solder ball is determined according to the size of the solder (1) to be injected.

In addition, since the solder 1 is sufficiently heated by the preheating part 100, the solder 1 may be easily melted while the solder 1 passes through the inside of the heating furnace 200. It can be shortened.

Meanwhile, in order to form a solder ball having good uniformity in the process of becoming a solder ball in the heating furnace 200, an inert gas such as argon or nitrogen is introduced from the lower portion of the heating furnace 200, and for this purpose, the heating furnace 200 is used. The gas supply pipe 230 is connected to the lower side of the body, and the inert gas stored in the inert gas storage unit 220 is introduced into the heating furnace 200 through the gas supply pipe 230.

At this time, the temperature of the inert gas is preferably 20 to 30 ℃ or more than the melting temperature of the solder, for this purpose, the heating unit 221 is installed outside the inert gas storage unit 220 or the gas supply pipe 230 to inert It will heat the gas.

Therefore, the inert gas is diffused in the interior of the furnace 200 to improve the uniformity of the solder ball.

In the lower portion of the heating furnace 200, the cooling furnace 300 is continuously installed while taking the shape of a cylinder in the same manner as the heating furnace 200.

That is, the inside of the heating furnace 200 and the inside of the cooling furnace 300 is installed so as to communicate in the vertical direction, the cooling water circulation pipe 310 is installed in the body of the cooling furnace 300 through which the cool coolant flows through this. As a result, the solder balls, which are melted from the heating furnace 200 and formed into a spherical shape, fall freely and are cooled while being introduced into the cooling furnace 300.

The solder balls cooled while freely falling down the cooling furnace 300 are stacked by falling into the tray 400 provided at the lower part of the cooling furnace 300. The tray 400 contains water or a cooling liquid, and the falling solder balls are contained in the liquid. This prevents cracks from occurring due to the impact and also completely cools the inside of the solder ball.

In this case, when the distance between the heating furnace 200 and the tray 400 is sufficiently installed, it is not necessary to install the cooling furnace 300. In this case, the solder balls are naturally cooled at room temperature and fall into the tray 400.

On the other hand, if the gap between the furnace 200 and the tray 400 is not sufficiently secured, it may be better to provide the cooling furnace 300.

2 illustrates another example of the cooling furnace 300, in which cold air is forcibly injected into the cooling furnace 300. The cold air supply pipe 330 is connected to a side surface of the cooling furnace 300 to form a cold air generating unit. Cold air supplied from the 320 may be introduced into the cooling path 300 through the cold air supply pipe 330, thereby allowing rapid cooling of the solder ball.

3 is a view showing a second embodiment of the present invention, by melting the solder (1) transferred by the conveyor 500 in the inclined heating plate 510 to form a solder ball immediately, for this purpose, high heat transfer rate The lower portion of the heating plate 510 made of a material is provided with a heating wire 520 in the form of a hot wire is configured to apply heat to the heating plate 510 of about 400-600 ℃, and also melted on the upper surface of the heating plate 510 The coating is coated to prevent the solder from sticking.

Therefore, the solder 1 is melted while moving the inclined surface of the heating plate 510 to form solder balls by surface tension.

At this time, the vibrating portion 530 made of an eccentric shaft is applied to the heating plate 510 so as to easily move the solder ball downward, and to prevent the solder 1 from being pressed against the heating plate 510 again. Located at the rear of the 510 to apply a vibration.

On the other hand, in another solution of the present invention, as in the first embodiment, the heating plate 510 is simply preheated as a means, and a solder ball is melted by melting preheated solder using a laser, a high-density energy beam, a light source using a halogen lamp, or the like. Can be formed.

To this end, the same tubular body as the cooling furnace 300 of the first embodiment is installed in the vertical direction, and the cooling water circulation pipe 710 is installed in the body of the tubular body 700.

At this time, if the length of the tubular 700 is sufficiently long that the molten solder ball can be sufficiently cooled, there is no need to install the coolant circulation pipe 710.

In addition, a guide 720 is installed inside the tubular body 700 to collect the solder 1 freely falling from the heating plate 510 into one position of the center part, and the guide 720 is formed inside the tubular body 700. It is formed so as to be inclined from the side wall to the center portion to be guided and collected over the center of the tube body 700.

A light source such as a laser, a high-density energy beam, a halogen lamp, and the like are positioned on the upper part of the tubular body 700, and the light generated therefrom is located at the center of the tubular body 700, that is, at a position where the solder 1 is collected by the guide 720. Energy is concentrated to melt the solder 1.

Due to this, the solder ball of the spherical frame is formed and freely falls to the bottom to be contained in the tray 400.

In addition, fast cooling of the solder ball may be achieved by the coolant circulation pipe 710 installed in the body of the tubular body 700.

As described above, the solder ball manufacturing apparatus according to the present invention by manufacturing a spherical solder ball by the surface tension while freely dropping the solder having the same weight of the release inside the heating furnace, the structure of the device is very simple and ultimately the solder ball There is an effect that can significantly reduce the manufacturing cost.

Claims (4)

A preheating part for heating the solder cut to a certain weight of the release to the state just before melting, A heating furnace which is formed in a tubular shape having an inner space part and is installed in an up-down direction and forms a solder ball by surface tension by heating and melting the preheated solder while freely falling from the inner space part; Located in the lower portion of the furnace, the solder ball manufacturing apparatus, characterized in that consisting of a tray containing the solder ball is dropped through the heating furnace is accommodated in the coolant. The cooling furnace of claim 1, wherein a cooling furnace is installed between the heating furnace and the tray, and the cooling furnace has a tubular shape having an inner space, and is installed in the form of a straight pipe at the bottom of the heating furnace, and cools the solder ball freely falling from the heating furnace. Solder ball manufacturing apparatus, characterized in that configured to. It is installed to be inclined in the form of a plate, the top surface is coated inclined plate, A heating unit for applying heat to the inclined plate, Consists of a vibrating unit for vibrating the inclined plate, The solder ball manufacturing apparatus, characterized in that configured to melt the solder by the heat of the inclined plate to form a solder ball by the surface tension when the solder cut to a certain weight of the release is placed on the upper surface of the inclined plate and transferred to the bottom along the inclined plate. A preheating part for heating the solder cut to a certain weight of the release to the state just before melting, A tubular body having a tubular shape having an inner space part and installed in an up-down direction, and having a guide for guiding to one position while preheated solder falls in the inner space part; Solder ball manufacturing apparatus comprising a light source for irradiating and melting the light energy guided by the guide guide of the tube to form a solder ball by the surface tension.

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