KR20090058273A - Apparatus for transferring a substrate - Google Patents

Apparatus for transferring a substrate Download PDF

Info

Publication number
KR20090058273A
KR20090058273A KR1020070124979A KR20070124979A KR20090058273A KR 20090058273 A KR20090058273 A KR 20090058273A KR 1020070124979 A KR1020070124979 A KR 1020070124979A KR 20070124979 A KR20070124979 A KR 20070124979A KR 20090058273 A KR20090058273 A KR 20090058273A
Authority
KR
South Korea
Prior art keywords
substrate
substrate support
vibration
unit
support
Prior art date
Application number
KR1020070124979A
Other languages
Korean (ko)
Inventor
정용범
한기원
Original Assignee
세메스 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 세메스 주식회사 filed Critical 세메스 주식회사
Priority to KR1020070124979A priority Critical patent/KR20090058273A/en
Publication of KR20090058273A publication Critical patent/KR20090058273A/en

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The substrate transfer apparatus has a body portion having a driving portion for generating a driving force, a substrate connected to the body portion, having a seating portion on which the substrate is placed, and moving to a position for loading / unloading the substrate away from the upper position by the driving force. Vibration is installed in the support and the body portion, the linear movement in the direction opposite to the moving direction of the substrate support to suppress the vibration generated in the substrate support when the substrate support moves to a position for loading / unloading the substrate and stops It includes a suppression unit. As a result, stable substrate transfer can be performed by suppressing vibration of the substrate support.

Description

Apparatus for transferring a substrate}

The present invention relates to a semiconductor manufacturing apparatus, and more particularly to a substrate transfer apparatus for transferring a substrate.

In general, a semiconductor device is manufactured by repeatedly performing various unit processes on a semiconductor substrate such as a silicon wafer. Accordingly, the substrate must be transferred to a position for performing each unit process.

As such, a substrate transfer device is used to transfer the substrate to the performing position of each unit process. The substrate transfer apparatus includes a substrate support on which a substrate is placed and rests, and the substrate support moves to substantially transfer the substrate. For example, the substrate support part operates in a straight line to transfer the substrate to a desired position.

Here, when the substrate support is in operation, in particular, in the case of linear operation, the substrate support is momentarily stopped at the time when the operation is completed by performing the forward operation in the state where the substrate is seated. As a result, the substrate support is vibrated vertically. Will occur. Due to the vibration of the substrate support, it is difficult to stably support the substrate. In particular, when the vibration is severe, there is a problem that the substrate can be broken off from the substrate support.

In view of the above-mentioned problems, one problem to be solved through embodiments of the present invention is to minimize vibrations generated in the substrate support when the substrate support stops momentarily at the end when the substrate support operates in the seated state. It is to provide a substrate transfer device.

In order to achieve the object of the present invention, the substrate transfer apparatus according to the present invention includes a body portion, a substrate support portion, and a vibration suppressing portion. The body portion has a driving portion for generating a driving force. The substrate support portion is connected to the body portion, has a seating portion on which the substrate is placed, and moves from the upper position of the body portion to a position for loading / unloading the substrate by the driving force of the driving portion. The vibration suppressing part is installed in the body part, and the direction opposite to the moving direction of the substrate support part to suppress the vibration generated in the substrate support part when the substrate support part moves to a position for loading / unloading the substrate and stops. Linear motion.

According to an embodiment of the present invention, the vibration suppressing portion linearly operates in a direction opposite to the moving direction of the substrate support portion so as to correspond to the time from when the substrate support portion is operated to stop from the highest speed.

The substrate transfer apparatus according to the present invention configured as described above has a substrate driven by a member for suppressing vibration in the opposite direction to the moving direction of the substrate support when the substrate support on which the substrate is placed is stopped at a time when the substrate support is linearly operated. When the support portion stops momentarily, vibration generated in the substrate support portion can be suppressed.

Hereinafter, a substrate transfer apparatus according to an exemplary embodiment of the present invention will be described in detail with reference to the accompanying drawings. As the inventive concept allows for various changes and numerous embodiments, particular embodiments will be illustrated in the drawings and described in detail in the text. However, this is not intended to limit the present invention to the specific disclosed form, it should be understood to include all modifications, equivalents, and substitutes included in the spirit and scope of the present invention. In describing the drawings, similar reference numerals are used for similar elements. In the accompanying drawings, the dimensions of the structure is shown to be larger than the actual size for clarity of the invention, or to reduce the actual size to illustrate the schematic configuration. Terms such as first and second may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as the second component, and similarly, the second component may also be referred to as the first component.

The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting of the present invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this application, the terms "comprise" or "have" are intended to indicate that there is a feature, number, step, action, component, part, or combination thereof described on the specification, and one or more other features. It is to be understood that the present invention does not exclude the possibility of the presence or the addition of numbers, steps, operations, components, parts, or combinations thereof.

On the other hand, unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art. Terms such as those defined in the commonly used dictionaries should be construed as having meanings consistent with the meanings in the context of the related art and shall not be construed in ideal or excessively formal meanings unless expressly defined in this application. Do not.

1 is a schematic perspective view illustrating a substrate transfer apparatus according to an embodiment of the present invention, and FIG. 2 is a schematic plan view illustrating the substrate transfer apparatus of FIG. 1.

The substrate transfer apparatus 100 according to the present invention may be used to transfer the substrate W to a position for performing a unit process. Here, the substrate W may be a substrate for manufacturing a semiconductor device such as a silicon wafer. However, the substrate is not limited to a substrate for manufacturing a semiconductor device, and may be a substrate used to manufacture a flat panel display panel, which is a core component of the flat panel display apparatus, as a flat substrate made of glass or quartz.

1 and 2, the substrate transport apparatus 100 according to an embodiment of the present invention is connected to the body portion 110 and the body portion 110 to provide a driving force, and the substrate W is Substrate support 120 is placed, and the vibration suppression unit 130 for suppressing the vibration of the substrate support 120.

The body 110 is provided with a driving unit (not shown) for generating a driving force therein. The body portion 110 may include, for example, a lower body 112 and an upper body 114 installed on an upper portion of the lower body 112. The upper part of the upper body 114 is provided with a stage formed to have a planar shape. Here, the upper body 114 may be installed to be rotatable in the upper portion of the lower body (112). In addition, the lower body 112 may have a structure that operates up and down to adjust the height of the upper body (114). That is, the upper body 114 has a structure capable of rotating and vertical movement.

The substrate support part 120 is connected to be positioned above the body part 110. That is, the substrate support part 120 is installed on the upper body 114 to be positioned above the upper body 114 forming the body part 110. At this time, the substrate support unit 120 is installed to be movable in the front-rear direction from the upper portion of the upper body 114. The substrate support unit 120 serves to support (grip) and transport the substrate (W).

The substrate support part 120 moves forward by a driving force generated by a driving part (not shown) provided in the body part 110, thereby loading the substrate W away from an upper position of the body part 110. Move to a location for loading or unloading. In addition, by moving backward by the driving force of the driving unit (not shown), the position moving to the upper position of the body portion 110 from the position for loading / unloading the substrate (W) located outside the body portion 110 (E.g., return).

According to one embodiment, the substrate transfer apparatus 100 may be provided with two substrate supports 120 for the substrate replacement operation. For example, when two substrate supports 120 are provided, one substrate support 120 performs the operation of bringing the substrate W from the process treatment position after the process of the substrate W is performed. do. The other substrate supporter 120 performs the operation of placing the substrate W to be processed in the process processing position. In addition, assuming that the two substrate supports 120 are the first substrate support and the second substrate support, respectively, the first substrate support and the second substrate support may be independently moved in the front-rear direction at different heights. That is, any one substrate support 120 may be disposed above the other substrate support 120. Meanwhile, the substrate transfer apparatus 100 according to the present invention may include only one or three or more substrate support units 120.

The substrate support part 120 may include a seating part 124 on which the substrate W is placed and gripped, and a driving part extending from one side of the seating part 124 and installed inside the body part 110. It has a transfer arm (122) connected to. For example, the seating part 124 may have a ″ U ″ shape, and a grip member 126 may be provided at an edge thereof to prevent the substrate W from being separated. Preferably, the grip member 126 is provided at a position corresponding to the circumference of the substrate W when the substrate W is seated. However, the shape of the seating portion 124 is not limited to a ″ U ″ shape, but may have various shapes in which the support of the substrate W may be stably supported.

On the other hand, the substrate transfer device 100 is loaded / loaded on the substrate (W) in the state in which the substrate support 120 is moved forward (for example, the position moved to a position for loading / unloading the substrate W) The unloading is performed, and the substrate W is transferred in a state in which the substrate support 120 is moved to the rear (for example, the state is moved to the upper position of the body 110). In the drawing, one substrate support 120 is moved to a position for loading / unloading the substrate W, and the other substrate support 120 is moved to an upper position of the body portion 110. The state is shown.

In addition, the substrate support part 120 is moved by a driving part (not shown) installed inside the body part 110. Although not shown, the driving unit may include, for example, a motor, a belt pulley for transmitting power of the motor to the substrate support, and a guide rail for guiding forward and backward movement of the substrate support. Alternatively, the drive may use other devices such as cylinders.

The vibration suppressing unit 130 is installed on one side of the upper portion of the body portion (110). More precisely, the vibration suppressor 130 is installed on one side of the body 110 in a direction opposite to the direction in which the substrate support 120 moves. The vibration suppressing unit 130 is a vibration generated in the substrate support 120 when the substrate support 120 stops at the end of the operation after starting the movement operation to the position for loading / unloading the substrate (W) It serves to suppress. For example, the vibration suppressing unit 130 suppresses the occurrence of vibration of the substrate support unit 120 to prevent the substrate W from falling off or unstable from the substrate support unit 120.

The vibration suppressing unit 130 is the substrate support 120 to enable the suppression of the vibration generated in the substrate support 120 when the substrate support 120 moves to a position for loading / unloading the substrate and stops. It operates in the opposite direction to the direction of movement.

Here, the time point at which the vibration suppressing unit 130 operates in a direction opposite to the moving direction of the substrate support unit 120 in order to suppress vibration, the substrate support unit 120 starts to operate and reaches a maximum speed from the time point when the substrate is operated. It operates in response to the time point until the support part 120 stops. That is, the vibration suppressing unit 130 starts to operate when the movement of the substrate support unit 120 is at the maximum speed, and operates to stop at the time when the substrate support unit 120 stops.

As a result, by forming a force corresponding to the force at a position opposite to the position of the substrate support 120 in response to the force generating vibration in the substrate support 120, the two forces cancel each other, thereby providing a substrate support 120 ) To suppress vibration.

According to one embodiment, the vibration suppressing unit 130 is largely connected to the driving unit 132 and the driving unit 132, the direction opposite to the movement direction of the substrate support 120 by the driving unit 134. It may be made of a moving unit 134 moving to. The driving unit 132 is a driving unit capable of operating the moving unit 134 in a straight line (for example, in the front and rear direction) like a cylinder, and moves the moving unit 134 in accordance with the operation of the substrate support unit 120. Let's do it. The moving part 134 may function as a weight, for example, and may have a square plate shape. However, the moving unit 134 is not limited in form as long as it can function as a weight. In this case, the moving part 134 preferably has a weight corresponding to the substrate support part 120 so as to suppress the vibration generated by the substrate support part 120 by moving.

Such a driving mechanism of the substrate transfer apparatus 100 will be briefly described. In order to transfer the substrate W, the substrate support part 120 moves forward to move to a position for loading the substrate W which is located away from the body part 110. The substrate W is placed and seated on the seating portion of the substrate support 120, and the substrate support 120 moves to the upper position of the body part 110 by moving backward in the state in which the substrate W is seated. In this state, the body portion 110 is moved to a position for transferring the substrate (W). Thereafter, when the target point is reached, the substrate support part 120 moves forward to move to the position for unloading the substrate W.

At this time, the vibration suppressing unit 130 is a substrate support unit so that the vibration generated in the substrate support unit 120 can be suppressed when the substrate W is moved forward and stopped in a state where the substrate W is seated on the substrate support unit 120. The moving unit 134 is moved in the direction opposite to the moving direction of the 130. In particular, the moving part 134 is moved corresponding to the time point from the maximum speed of the board | substrate support part 130 to a stop. Through this, the vibration generated in the substrate support part 120 is minimized.

The substrate support part 120 having the substrate W unloaded moves backward to move to an upper position of the body part 110, and the vibration suppressing part 130 when the substrate support part 120 moves backward. The moving unit 134 also moves to its original state.

On the other hand, in the above description, the vibration suppressing unit 130 is operated to suppress the vibration only when the substrate W is moved to a position for unloading the substrate W in the seated state and stops. . However, the operation of the vibration suppressing unit 130 is not limited to the case mentioned. That is, the vibration suppressing unit 130 moves to a position for loading the substrate W in order to load the substrate W in the state in which the substrate W is not seated on the substrate support 120 and stops. It may be operated to suppress the vibration generated in the substrate support portion 120 in the empty state.

As such, when the substrate supporter 120 moves to the position for loading / unloading the substrate W and stops, vibration occurs in the substrate supporter 120. The vibration is suppressed by the operation of the vibration suppressing unit 130, which is located on the opposite side of the substrate support 120 and moves in the direction opposite to the moving direction of the substrate support 120. Through this, the substrate W may be prevented from being unstablely mounted on the substrate support part 120. In particular, the vibration generated is so severe that it is possible to significantly reduce the possibility that the substrate (W) is broken and broken.

Meanwhile, in the case of the substrate transfer apparatus 100 having two or more substrate support units 120, the other substrate support unit 120 operates to suppress vibration generated in any one of the substrate support units 120. It may have a drive mechanism. For example, when any one of the plurality of substrate supports 120 moves to a position for loading / unloading the substrate W and stops, the other substrate support 120 is preliminary. It is also possible to take a manner of suppressing vibration by moving in the direction opposite to the direction when moving the plate W to the position for loading / unloading (for example, the upper position of the body portion 110). This means that in the case of the substrate transfer device 100 having another member capable of driving in a direction opposite to the moving direction of the substrate support 120, vibration suppression using the member capable of driving is possible.

Although the detailed description of the present invention has been described with reference to the preferred embodiments of the present invention, those skilled in the art or those skilled in the art will have the idea of the present invention described in the claims to be described later. It will be understood that various modifications and variations can be made in the present invention without departing from the scope of the present invention.

As described above, the substrate transfer apparatus according to the preferred embodiment of the present invention is installed in the body portion provided with the substrate support, the vibration suppressing portion which is moved in the direction opposite to the movement direction of the substrate support in response to the operation of the substrate support; This suppresses the vibration generated in the substrate support when the substrate support starts the movement operation and stops at the time for ending the operation, thereby enabling stable transfer of the substrate.

Although the above has been described with reference to a preferred embodiment of the present invention, those skilled in the art will be able to variously modify and change the present invention without departing from the spirit and scope of the invention as set forth in the claims below. It will be appreciated.

1 is a schematic perspective view showing a substrate transfer apparatus according to an embodiment of the present invention.

FIG. 2 is a schematic plan view of the substrate transport apparatus of FIG. 1.

Explanation of symbols on the main parts of the drawings

100: substrate transfer device 110: body portion

112: lower body 114: upper body

120: substrate support 122: transfer arm

124: seating portion 126: grip member

130: vibration suppressing unit 132: drive unit

134: moving part W: substrate

Claims (2)

A body part having a driving part generating a driving force; A substrate support part connected to the body part and having a seating part on which the substrate is placed, and moving to a position for loading / unloading the substrate from an upper position of the body part by a driving force of the driving part; And Is installed in the body portion, and the linear movement in a direction opposite to the movement direction of the substrate support portion to suppress the vibration generated in the substrate support portion when the substrate support portion is moved to a position for loading / unloading the stop Substrate transfer device comprising a vibration suppressing portion. The substrate transfer apparatus of claim 1, wherein the vibration suppressing unit linearly operates in a direction opposite to the moving direction of the substrate support unit so as to correspond to the time from when the substrate support unit operates to stop when the substrate support unit has the highest speed. Device.
KR1020070124979A 2007-12-04 2007-12-04 Apparatus for transferring a substrate KR20090058273A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020070124979A KR20090058273A (en) 2007-12-04 2007-12-04 Apparatus for transferring a substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020070124979A KR20090058273A (en) 2007-12-04 2007-12-04 Apparatus for transferring a substrate

Publications (1)

Publication Number Publication Date
KR20090058273A true KR20090058273A (en) 2009-06-09

Family

ID=40988782

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020070124979A KR20090058273A (en) 2007-12-04 2007-12-04 Apparatus for transferring a substrate

Country Status (1)

Country Link
KR (1) KR20090058273A (en)

Similar Documents

Publication Publication Date Title
WO2015098153A1 (en) End effector and substrate transfer robot
KR102202077B1 (en) Vehicle for Overhead Hoist Transport device
KR101666121B1 (en) Substrate holding device
KR101284483B1 (en) Gripping device, transfer device, processing device, and manufacturing method for electronic device
CN107275268B (en) Robot unit and transfer method
KR20050044531A (en) Device for temporarily loading, keeping and unloading a container
KR102184615B1 (en) Transport device
JP2010142941A (en) Gripper device for mounting electronic component
JP2008235472A (en) Substrate treatment apparatus
KR102289021B1 (en) Unit for supporting cassette and vehicle having the unit
KR101182378B1 (en) Conveying robot
JP2018039659A (en) Article conveyance device
US7266887B2 (en) Substrate transportation apparatus, component mounting apparatus and substrate transportation method in component mounting operation
JP6314161B2 (en) Substrate transfer system and method
JP2010023946A (en) Workpiece conveying device and workpiece handling device
JP2011159738A (en) Wafer transfer robot and method of releasing wafer
KR100188453B1 (en) Transportation-transfer device for an object of treatment
JP2009040563A (en) Pressing mechanism and conveyance device
KR20090058273A (en) Apparatus for transferring a substrate
KR20110081494A (en) Apparatus for transferring a substrate
KR20140061279A (en) Hand for conveying substrate and method for conveying substrate
JP2017109289A (en) Production device module and production device line
JP3246514B2 (en) Processing equipment
JP2020061400A (en) Substrate holding device
JP2013162090A (en) Electronic component mounting apparatus and electronic component mounting method

Legal Events

Date Code Title Description
WITN Withdrawal due to no request for examination