KR20090047352A - H-pin block - Google Patents

Abstract

According to the present invention, an upper through-hole penetrating the upper and lower surfaces is formed, and an upper block formed at the lower portion of the upper through-hole, and a lower through-hole penetrating the upper and lower surfaces in correspondence with the upper through-hole located at the lower portion of the upper block. The upper part of the lower through the lower block formed with a lower space, the upper part is introduced into the upper through the upper part of the upper block protrudes and the lower part is introduced into the lower through the lower part of the lower block protrudes into the center It includes a bent portion is formed H-pin having an elastic force in the axial direction, when the H-pin is compressed in the axial direction, the bent portion of the H-pin is characterized in that the elastic deformation inside the upper space portion and the lower space portion An H-pin block is provided.

According to the disclosed H-pin block, compared to the general pogo pin with a built-in spring, since the structure is very simple and uses an H-pin that does not require a separate accessory, the operation reliability is very high and the price is low. Thus, it is possible to perform a reliable electrical test at a low cost. In addition, the jig function allows the PCB assembly or the semiconductor device to be positioned in the correct position, and even if the PCB assembly or the semiconductor device is not seated in the correct position, the contact of the contact is made accurately, thereby significantly improving the reliability of the inspection. There is an advantage that it can.

Description

H-pin block

The present invention relates to a pin block for electrically connecting a test contact of a PCB assembly or a semiconductor device and a contact of a test equipment to check the electrical characteristics of the PCB assembly or semiconductor device, more specifically, the spring is built-in It relates to an H-pin block that uses a curved H-pin in the center without using a general pogo pin.

In general, a PCB assembly refers to a component on which a PCB and a microelectronic component are formed in which a circuit line pattern is formed of a conductive material such as copper on an electrically insulating substrate. Here, the electrical characteristics of the PCB assembly and the mounted parts are inspected before being mounted and assembled in small and light electronics such as mobile phones, PDAs, camcorders, and digital cameras, in order to prevent defective products in advance.

In addition, the semiconductor device and the like are subjected to electrical characteristics inspection in the state of wafer level or packaging process is completed. This is to determine whether the manufactured semiconductor device or the like conforms to a specific standard.

Recently, as miniaturization and light weight of portable electronic products and high integration of semiconductor devices have progressed, probes called pogo pins or spring pins have been widely used. Such pogo pins are used to form a plurality of through-holes through which the pogo pins can be introduced into the block, and to insert the pogo pins into the through-holes so as to be fixed to the block.

As described above, one end of the block in which the pogo pin is fixed is contacted with the terminal of the PCB assembly or the semiconductor device, and the other end is contacted with the test equipment to electrically connect the PCB assembly or the semiconductor device and the test equipment.

On the other hand, such a general pogo pin is made to have an elastic in the axial direction in order to improve the contact with the contact. To this end, a spring is inserted into the pogo pin, and one end is widely used to make the pogo pin made to contract while maintaining elasticity in the axial direction by the spring.

However, as described above, the pogo pin having a built-in spring has a problem in that the manufacturing process is difficult because the structure thereof is complicated, and the manufacturing cost is high because accessories such as a spring are required.

In addition, since there is an operating part for maintaining elasticity by the spring, there is a disadvantage in that a high probability of a failure occurs in such an operating part, so that the reliability of electrical contact is low.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and provides an H-pin block that has a simple manufacturing process and a low manufacturing cost, and remarkably improves electrical contact reliability of a PCB assembly or semiconductor device and test equipment. There is a purpose.

H-pin block of the present invention for achieving the above object, the upper through the upper surface and the lower through hole is formed, the lower portion of the upper through the upper block formed with an upper space; A lower block positioned below the upper block and formed to pass through upper and lower surfaces corresponding to the upper through hole, and having a lower space in the upper portion of the lower through hole; An upper part is introduced into the upper hole to protrude an upper end to the upper surface of the upper block, a lower part is introduced into the lower hole to protrude a lower part to the lower surface of the lower block, and a bent part is formed in the center to have an elastic force in the axial direction. And an H-pin; wherein the bent portion of the H-pin is elastically deformed in the upper space portion and the lower space portion when the H-pin is compressed in the axial direction.

In addition, the upper block, it is preferable that the groove on which the PCB assembly or semiconductor element for inspection is mounted is formed on the upper surface.

In addition, the H-pin, the upper end portion in contact with the inspection PCB assembly or the semiconductor device may be a pointed shape.

And, the H-pin, the upper end contacting the PCB assembly or the inspection semiconductor element as a whole has a flat shape, one side of the upper end is cut obliquely to have only the other side portion has a flat shape, or the upper end As the diameter decreases, the cross section may have a trapezoidal shape.

Meanwhile, the H-pin may form an angle of 175 ° to 185 ° between the upper part and the lower part based on the bent part.

The stopper plate may further include a stopper plate positioned inside the bent portion of the H-pin to limit vertical movement of the H-pin to maintain a constant moving distance.

Here, the stopper plate may be inserted into a seating portion formed on the upper surface of the lower block to be stably positioned inside the bent portion.

According to the H-pin block of the present invention, compared to the general pogo pin with a built-in spring, the structure is very simple and uses the H-pin that does not require a separate accessory has the advantage of very high operation reliability and low cost. Thus, it is possible to perform a reliable electrical test at a low cost.

In addition, there is a function of a jig for positioning the PCB assembly or the semiconductor device in the correct position, and even if the PCB assembly or the semiconductor device is not seated in the correct position, the contact of the contact is made precisely to significantly improve the reliability of the inspection The advantage is that you can.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. Prior to this, terms or words used in the present specification and claims should not be construed as being limited to the common or dictionary meanings, and the inventors should properly explain the concept of terms in order to best explain their own invention. Based on the principle that it can be defined, it should be interpreted as meaning and concept corresponding to the technical idea of the present invention.

Accordingly, the embodiments described in the specification and the drawings shown in the drawings are only one of the most preferred embodiments of the present invention and do not represent all of the technical idea of the present invention and various equivalents that may be substituted for them at the time of the present application. It should be understood that there may be variations and variations.

FIG. 1 is a perspective view illustrating an H-pin block according to an embodiment of the present invention, FIG. 2 is a cross-sectional view of the H-pin block shown in FIG. 1 taken along the line II-II, and FIG. An exploded view of the illustrated H-pin block shown. 1 to 3, the H-pin block 100 according to an embodiment of the present invention includes an upper block 110, a lower block 120, and an H-pin 130.

The upper block 110 is formed with an upper through hole 117 penetrating the upper surface and the lower surface of the upper block 110, the upper space portion 115 is formed below the upper through hole 117.

The lower block 120 is positioned below the upper block 110 and has a lower through hole 127 penetrating the upper and lower surfaces of the lower block 120 to correspond to the upper through hole 117. .

In addition, a lower space portion 125 is formed in the upper portion of the lower through hole 127 to correspond to the upper space portion 115.

On the other hand, the H-pin 130 has a bent portion formed in the center has an elastic force in the axial direction. This bent portion is preferably bent in a "C" shape, but is not limited thereto.

The upper portion of the H-pin 130 is introduced into the upper through hole 117 formed in the upper block 110 so that the upper portion protrudes to the upper surface of the upper block 110, the lower portion of the H-pin 130 is lower The lower part is protruded into the lower through hole 127 formed in the block 120 and protrudes from the lower surface of the lower block 110.

That is, since the upper and lower portions of the H-pin 130 are introduced into the upper through holes 117 and the lower through holes 127 formed in the upper block 110 and the lower block 120, the H-pins are axially (up and down). Direction) so that it can be moved only in a fixed direction.

In addition, the bent portion of the H-pin 130 is located in the upper space 115 and the lower space 125 is provided with a space that can be freely deformed. Therefore, when the H-pin 130 receives the force in the axial direction, the bent portion may deform and have elastic restoring force.

Here, the number and positions of the H-pin 130, the upper through 117 and the lower through 127 may be formed in various numbers and positions depending on the number and position of the contacts of the PCB assembly or the semiconductor device and the test equipment. Of course.

FIG. 4 is an enlarged partial view of the portion A shown in FIG. 2, and FIG. 5 is a partially enlarged view showing the compressed state of the H-pin shown in FIG. 4. The stopper plate 140 of FIG. The enlarged view is omitted.

First, referring to FIG. 4, the bent portion of the H-pin 130 is positioned inside the upper space 115 and the lower space 125 to receive a space in which the curved portion may be deformed.

Next, referring to FIG. 5, the H-pin 130 may be compressed by being subjected to a compressive force in the axial direction while contacting the test PCB assembly or the semiconductor and the test equipment. As shown, since the bent portion of the H-pin 130 is elastically deformed by the compressive force in the axial direction, the elastic force of the bent portion prevents both ends of the H-pin 130 from contacting the PCB assembly or the semiconductor device and the test equipment. It can be maintained.

The H-pin 130 has an advantage that the operation reliability is very high and the price is low because the structure is very simple and does not require a separate accessory compared to the general pogo pin with a built-in spring.

In order not to interfere with the elastic restoring force of the H-pin 130, by using the H-pin block 100 formed with a space that can be bent freely deformed, the product to test both ends of the H-pin 130 By precisely contacting the contacts of the tester with the contacts of the test machine, a reliable electrical test can be performed at low cost.

In addition, by separating the H-pin block 100 into the upper block 110 and the lower block 120, the H-pin 130 can be easily inserted into the H-pin block 100, and the top hole There is an advantage that the processing of the trunk portion 115 and the lower space portion 125 is easy.

On the other hand, the upper surface of the upper block 110 is preferably formed with a mounting groove 113 for mounting the inspection PCB assembly or semiconductor device. The seating groove 113 may be formed in various shapes according to the PCB assembly or the semiconductor device to be tested.

As such, by forming the mounting groove 113 in the upper block 110 in contact with the PCB assembly or the inspection semiconductor element, the upper block 110 serves as a jig for fixing the inspection PCB assembly or the semiconductor element in the correct position. ) Has the advantage of being able to perform.

In addition, the H-pin 130 has a pointed shape at the upper end that comes into contact with the inspection PCB assembly or the semiconductor device. Therefore, since the contact area of the H-pin 130 and the inspection PCB assembly or the semiconductor device becomes small, the probability of the H-pin 130 contacting another contact of the inspection PCB assembly or the semiconductor becomes low.

In other words, when the inspection of the PCB assembly or the semiconductor device is completed and then replaced with another PCB assembly or the semiconductor device, the latitude is increased according to the position of the PCB assembly or the semiconductor device. Therefore, the PCB assembly or the semiconductor device may not be seated in the correct position. Even if not, the contact of the contact is made accurately has the advantage that can improve the reliability of the inspection.

FIG. 6 is a perspective view showing another embodiment of the upper shape of the H-pin, and FIG. 7 is a front view of FIG. 6. That is, in addition to the shape of the H-pin 130 having a sharp upper end as described above, referring to FIGS. 6 and 7, the H-pins 230 and 330 having a flat shape in contact with the test PCB assembly or the semiconductor device may be in plan view. This is available.

In the H-pin 230 of FIG. 6A, the upper end 231 contacting the test PCB assembly or the semiconductor device has a generally planar shape. In addition, the H-pin 330 of FIG. 6B has a narrower contact area than that of FIG. 6A, and one side surface 332 of the upper end contacting the test PCB assembly or the semiconductor element is obliquely cut. Therefore, only the other side surface 331 is the structure which has a planar shape. In addition, the H-pin 430 of FIG. 6 (c) has a narrower contact area than that of FIGS. 6 (a) and 6 (b) and has an upper end portion 431 in contact with the inspection PCB assembly or the semiconductor device. The diameter is smaller toward the upper end portion 341, and the circumferential side surface 432 has an inclined shape. Referring to FIG. 7, which is a shape viewed from the front, (a) has a rectangular shape, and (b) and (c) have a trapezoidal shape.

Here, in the case of the H-pins 230 and 330 of FIGS. 6 and 7, the upper end portion is manufactured in a flat shape, and as the contact area is wider than that of the H-pin 130 of FIG. 3, both contactability and durability are achieved. Can be improved.

8 is a cross-sectional view illustrating an angle formed between an upper portion and a lower portion of the H-pin 130. That is, the H-pin 130 may be manufactured to form an angle of 175 ° to 185 ° between the upper part and the lower part based on the bent part. The range of angle mentioned above can be changed according to a product. That is, the H-pin 130 is applicable to a variety of products through the change of the above-described angle.

Meanwhile, referring to FIGS. 2 and 3, the H-pin block 100 includes a stopper plate 140. The stopper plate 140 is located inside the bent portion of the H-pin 130 to limit the vertical movement of the H-pin. In more detail, the inner side of the bent portion is caught by the stopper plate 140 when the H-pin 130 moves up and down, thereby limiting its movement range. That is, the stopper plate 140 may solve the problem of excessive movement of the H-pin 130, and thus damage and deformation of the H-pin 130, and may prevent the accuracy of the measurement from being degraded.

The stopper plate 140 may be inserted and installed in the seating part 128 formed on the upper surface of the lower block 120 so as to be stably positioned inside the bent portion. Accordingly, the stopper plate 140 is positioned slightly downward by the depth of formation of the seating portion 128, not the inner center of the bent portion of the H-pin 130. The H-pin 130 may be used upside down in some cases. When the H-pin 130 is installed in an inverted state in the block 100, the inverted upper portion of the H-pin 130 is upper part. Can be directed toward block 130. Here, by inserting the stopper plate 140 into the seating portion 128 of the lower block 120 and installed a little downward, it is possible to further limit the upward movement of the H-pin 130 and to prevent the top tilting phenomenon. . The stopper plate 140 may be more firmly fixed to the lower block 120 by a method such as bolting.

As mentioned above, although this invention was demonstrated by the limited embodiment, this invention is not limited by this and it will be described below by the person of ordinary skill in the art, and the following. Of course, various modifications and variations are possible within the scope of the claims.

1 is a perspective view showing an H-pin block according to an embodiment of the present invention;

FIG. 2 is a cross-sectional view showing a block shown in FIG. 1 by a line II-II; FIG.

3 is an exploded cross-sectional view showing the block shown in FIG. 1 by line II-II;

4 is an enlarged partial view of the portion A shown in FIG. 2;

5 is a partially enlarged view showing a state in which the H-pin shown in FIG. 4 is compressed;

6 is a perspective view showing another embodiment of the upper shape of the H-pin,

7 is a front view of FIG. 6,

8 is a cross-sectional view showing an angle formed between the upper and lower portions of the H-pin.

<Explanation of symbols for the main parts of the drawings>

100 ... block 110 ... top block

113 Seating groove 115 Upper space

117 ... upper air 120 ... lower block

125 Lower part 127 Lower part

128 ... Mounting 130,230,330,430 ... H-pin

140 ... stopper plate

Claims (7)

An upper block having upper and lower surfaces penetrating the upper and lower surfaces, and an upper block formed at an upper portion of the upper and lower holes; A lower block positioned below the upper block and formed to pass through upper and lower surfaces corresponding to the upper through hole, and having a lower space in the upper portion of the lower through hole; An upper part is introduced into the upper hole to protrude an upper end to the upper surface of the upper block, a lower part is introduced into the lower hole to protrude a lower part to the lower surface of the lower block, and a bent part is formed in the center to have an elastic force in the axial direction. H-pin; When the H-pin is compressed in the axial direction, the bent portion of the H-pin H-pin block, characterized in that the elastic deformation inside the upper space and the lower space. The method of claim 1, wherein the upper block, H-pin block, characterized in that the groove is formed on the upper surface of the PCB assembly or semiconductor device for inspection. The method of claim 2, wherein the H-pin, H-pin block, characterized in that the upper end in contact with the inspection PCB assembly or semiconductor element pointed shape. The method of claim 2, wherein the H-pin, The upper end portion contacting the inspection PCB assembly or the semiconductor device as a whole has a planar shape, one side of the upper end is cut obliquely and only the other side portion has a planar shape, or the diameter becomes smaller toward the upper end and the cross section is H-pin block, characterized in that having a trapezoidal shape. The method according to claim 1, wherein the H-pin, The upper and lower portions of the H-pin block, characterized in that the angle between the 175 ° to 185 ° based on the bent portion. The method according to claim 1, It is located on the inside of the bent portion of the H-pin H-pin block further comprises a stopper plate for maintaining a constant moving distance by limiting the vertical movement of the H-pin. The method according to claim 6, wherein the stopper plate, H-pin block is inserted into the mounting portion formed on the upper surface of the lower block to be stably positioned inside the bent portion.

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