KR20090046550A - Apparatus and method for polishing semiconductor wafer - Google Patents

Apparatus and method for polishing semiconductor wafer Download PDF

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Publication number
KR20090046550A
KR20090046550A KR1020070112766A KR20070112766A KR20090046550A KR 20090046550 A KR20090046550 A KR 20090046550A KR 1020070112766 A KR1020070112766 A KR 1020070112766A KR 20070112766 A KR20070112766 A KR 20070112766A KR 20090046550 A KR20090046550 A KR 20090046550A
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KR
South Korea
Prior art keywords
polishing
wafer
plate
pad
polishing pad
Prior art date
Application number
KR1020070112766A
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Korean (ko)
Inventor
문도민
유환수
Original Assignee
주식회사 실트론
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Publication date
Application filed by 주식회사 실트론 filed Critical 주식회사 실트론
Priority to KR1020070112766A priority Critical patent/KR20090046550A/en
Publication of KR20090046550A publication Critical patent/KR20090046550A/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/12—Lapping plates for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor wafer polishing apparatus, comprising: supplying a slurry between a wafer and a polishing pad, and relatively rotating the wafer in contact with the wafer and the polishing pad to polish the surface of the wafer; A plate to which a polishing pad for polishing is attached; A rotatable polishing table on which the plate is detachably mounted; And a rotatable polishing head for fixing the wafer in a state facing the polishing pad, wherein a groove or a hole blows air into the surface of the polishing table when the plate is separated from the polishing table. ) Is formed. According to the present invention, the productivity of the wafer polishing equipment can be increased by shortening the preparation time after replacing the pad.

Wafer, Polishing, Pad, Replacement, Pad Stabilization, Plate, Surface Plate

Description

Apparatus and method for polishing semiconductor wafer

The present invention relates to a semiconductor wafer polishing apparatus and method, and more particularly to a semiconductor wafer polishing apparatus and method capable of shortening the preparation time after pad replacement.

In general, semiconductor wafers are manufactured by thinly cutting a cylindrical ingot (slicing process). At this time, the lapping process of polishing the surface of the front side and back side of the wafer to remove the damage of the wafer surface caused by the slicing process and to improve the flatness, Etching process to etch the wafer surface using chemical reaction to remove fine cracks or surface defects generated on the surface of the wafer, and to improve the surface roughness and flatness of the wafer subjected to the etching process It is manufactured through a series of shaping processes, such as polishing a polish, and polishing and cleaning operations.

In the wafer manufacturing process, the polishing process is largely divided into stock polishing, which removes the surface deterioration layer of the wafer and improves thickness uniformity, and final polishing, in which surface roughness is processed to a mirror surface around 1 mm.

In the above-described stock polishing and final polishing, a polishing pad for polishing a wafer is used, and the stock polishing pad has a structure in which a non-woven fabric is impregnated with polyurethane, and when a removal rate and a certain level of flatness are maintained after replacing a new pad. Normally, the product is not produced for 1 to 2 hours, and the polishing is performed while putting a dummy wafer.

The final polishing pad is a structure in which a foam layer containing carbon is formed on a thin pad surface similar to a stock polishing pad, and after replacement of a new pad, the pad surface is gently scraped to remove debris from the surface of the foam layer forming process. . Then, isopropyl alcohol is applied and rinsed again with ultrapure water to be sufficiently wet to the inside of the foam layer pores, and then polishing is performed while putting a dummy wafer without producing a product for 1 to 2 hours.

As such, the polishing pad used in the polishing process does not produce a product immediately after replacement (does not polish the actual product wafer), and after a stabilization step of stabilizing (taking) the polishing pad for 1 to 2 hours, Production must proceed.

In addition, even after the pad is stabilized, the prime product cannot be added immediately, and the prime product is input by checking the quality after a predetermined time as a test product. That is, there is a problem in that the operation time and the throughput are reduced when the polishing pad is replaced with a considerable preparation time.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object of the present invention is to provide a semiconductor wafer polishing apparatus and method which can improve the operation rate and throughput of the wafer polishing apparatus by improving the polishing pad replacement method and the polishing apparatus.

Other objects and advantages of the present invention can be understood by the following description, and will be more clearly understood by the embodiments of the present invention. Also, it will be readily appreciated that the objects and advantages of the present invention may be realized by the means and combinations thereof indicated in the claims.

In order to achieve the above object, the semiconductor wafer polishing apparatus according to the present invention provides a structure in which a polishing plate and a plate on which a polishing pad is attached can be easily detached.

That is, the semiconductor wafer polishing apparatus according to one aspect of the present invention is a semiconductor wafer polishing apparatus for supplying a slurry between the wafer and the polishing pad, and rotates relative to the wafer in contact with the polishing pad to polish the surface of the wafer. A plate comprising: a plate attached with a polishing pad for polishing the wafer; A rotatable polishing table on which the plate is detachably mounted; And a rotatable polishing head for fixing the wafer in a state facing the polishing pad, wherein a groove or a hole blows air into the surface of the polishing table when the plate is separated from the polishing table. ) Is formed.

In addition, the area of the plate is preferably smaller than the area of the polishing table, it is preferable that the fixing holder for fixing the plate is provided on the edge of the polishing table exposed around the plate.

In addition, the above-described semiconductor wafer polishing apparatus may be further provided as a tamping polishing apparatus for taming the unused new polishing pad by polishing the dummy wafer with the new, unused polishing pad. In this case, the unused new polishing pad is attached to the plate of the taming polishing apparatus, and the dummy wafer is fixed to the polishing head of the tamping polishing apparatus.

On the other hand, according to another aspect of the present invention, the semiconductor wafer polishing method is a semiconductor wafer polishing method for supplying a slurry between the wafer and the polishing pad, and polishing the surface of the wafer by rotating relative to the wafer in contact with the polishing pad. A tamping polishing apparatus separate from the present polishing apparatus for polishing the wafer, wherein the unused new polishing pad is used to tame the unused new polishing pad, and the used polishing pad is not used. When replacing with a new polishing pad of, characterized in that the replacement with a tamed polishing pad in the tamping polishing device.

Here, the present polishing apparatus and the tamping polishing apparatus include a plate to which a polishing pad is attached, a polishing plate that is detachably mounted and a rotatable polishing plate, and a polishing head rotatable while fixing a wafer while facing the polishing pad. It includes, and when replacing the polishing pad is preferably replaced by a plate unit with a polishing pad attached.

In addition, it is preferable that the unused new polishing pad tamed by polishing the dummy wafer with the unused new polishing pad is stored in a state where it can be replaced with the used polishing pad immediately.

According to the present invention, by replacing the plate attached with a polishing pad which is easily tampered with in advance when replacing the polishing pad, it is possible to greatly reduce the operation rate of the equipment due to the preparation time after replacing the polishing pad, thereby increasing the throughput of the equipment.

In addition, since the polishing pad stabilization is performed in a separate equipment, the stabilization time of the polishing pad is shortened, and consumable savings such as slurry are reduced.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. Prior to this, terms or words used in the specification and claims should not be construed as having a conventional or dictionary meaning, and the inventors should properly explain the concept of terms in order to best explain their own invention. Based on the principle that can be defined, it should be interpreted as meaning and concept corresponding to the technical idea of the present invention.

Therefore, the embodiments described in the specification and the drawings shown in the drawings are only the most preferred embodiment of the present invention and do not represent all of the technical idea of the present invention, various modifications that can be replaced at the time of the present application It should be understood that there may be equivalents and variations.

1 is a main configuration of a semiconductor wafer polishing apparatus according to the present invention, Figure 2 is a cross-sectional view showing a coupling structure of the polishing plate and the plate of the semiconductor wafer polishing apparatus of FIG.

1 and 2, a semiconductor wafer polishing apparatus according to the present invention includes a plate 30 to which a polishing pad 20 for polishing a wafer W is attached, and a platen on which a plate 30 is mounted and rotatable. 40, a nozzle for communicating with the polishing head 10 and the slurry tank in which the wafer W to be polished is mounted and rotatably installed and supplying a slurry between the surface of the wafer W and the polishing pad 20 ( 50).

In the present invention, the specific structure of the polishing head 10 may be adopted in the same manner as the configuration provided in the conventional polishing apparatus, and the detailed description thereof will be omitted.

The plate 30 is made of alumina or silicon carbide, and is configured to be easily detachable from the polishing plate 40. More specifically, the plate 30 is configured to be smaller than the area of the polishing plate 40, and as shown in FIG. 3, the plate 30 is attached to the edge of the polishing plate 40 exposed around the plate 30. Fixing holder 60 for fixing is fixed to the bolt 62 is installed.

If the area of the plate 30 is equal to or larger than the area of the polishing table 40, the fixing of the plate 30 and the polishing table 40 is performed only at the contact surface, so that the bonding force is weakened and the polishing table rotates at high speed. 40 and departure may occur. Therefore, it is preferable to configure the area of the plate 30 to be smaller than the area of the polishing table 40 to install the fixing holder 60 at the edge of the polishing table 40 to fix the plate 30.

Here, although the fixing holder 60 shown in the drawing is shown to be fixed by the bolt 62, as long as the fixing means capable of fixing the plate 30 to the polishing plate 40 is not limited to the type and various Of course, variations are possible. Here, by making the plate 30 smaller than the polishing plate 40 and providing the fixing holder 60, the plate 30 and the polishing plate 40 can be easily attached and detached.

In addition, the semiconductor wafer polishing apparatus according to the present invention, as shown in Figs. 4 and 5, the groove 70 and the hole (70) in the polishing plate 40 to facilitate the detachment of the plate 30 and the polishing plate 40. 80) is preferably formed.

Since the surface where the plate 30 and the polishing plate 40 contact each other is a flat machined plane, when the plate 30 is mounted on the polishing plate 40, an air layer is formed on the contact surface between the plate 30 and the polishing plate 40. It may be formed is not in close contact. In addition, it is not easy to separate after being in close contact.

Accordingly, by forming the groove 70 or the hole 80 in the polishing plate 40, the plate 30 is formed on the contact surface between the plate 30 and the polishing plate 40 when the plate 30 is mounted on the polishing plate 40. Easily close contact is possible by removing the air layer, and when separated, it can be easily separated by spraying the high pressure air in the groove 70 or the hole 80. Such, the groove 70 or the hole 80 may have a variety of modifications, such as shape, size, arrangement, etc. according to the size or shape of the polishing apparatus, the present invention in the form shown in Figures 4 and 5 It is not limited.

On the other hand, the semiconductor wafer polishing apparatus according to the present invention may further include a tamping polishing apparatus for taming unused new polishing pads by polishing the dummy wafer with new, unused polishing pads.

The taming polishing apparatus may be configured in the same manner as the semiconductor wafer polishing apparatus according to the present invention described above, and a new unused polishing pad is attached to the plate 30 of the tamping polishing apparatus, and the dummy head is attached to the polishing head 10. Is fixed to polish the dummy wafer with an unused polishing pad.

In this way, by untaming new unused polishing pads using a separate tamping polishing device in advance, the unused new polishing pads tamed by the taming polishing device when replacing the polishing pad 20 in the present polishing apparatus are replaced. The preparation time for stabilizing the new polishing pad can be greatly reduced.

In addition, the tamping polishing apparatus according to the present invention can be reused while circulating the slurry. A typical wafer polishing apparatus has to be tamed over 1 to 2 hours to stabilize unused new polishing pads when replacing the polishing pad 20, and consumes a large amount of slurry. However, the taming polishing apparatus is very economical because the slurry consumption is reduced because the slurry is reused.

Here, when replacing the polishing pad 20, it is preferable to replace the polishing pad 20 by the plate 30 to which the polishing pad 20 is attached. When the polishing pad 20 attached to the plate 30 is removed and replaced, the surface state of the tamed polishing pad 20 may change, and as described above, the plate 30 may be easily detached. It is desirable to replace it.

In addition, the new unused polishing pad may be stored in ultrapure water immediately after being tamed in a tamping polishing apparatus so that it can be immediately replaced with the used polishing pad 20. By storing the unused new polishing pad thus tamed in ultrapure water, it is possible to proceed an efficient polishing process using only this polishing apparatus without the need for taming an unused new polishing pad as a taming polishing apparatus for semiconductor wafer polishing.

On the other hand, the polishing pad 20 may change the polishing conditions such as the surface state of the polishing pad 20, or the frictional force generated during polishing as time passes. Therefore, when the new polishing pad tamed in advance as described above is kept in ultrapure water for a long time, the friction force may be changed. However, as shown in the graph of FIG. 6 showing the change in the frictional force Kgf between the polishing pad 20 and the wafer W with the passage of time s, the tamped, unused new polishing pad was subjected to ultrapure water for 72 hours. It can be seen that the frictional force before and after storage does not occur even when stored in the air. Therefore, according to the method of the present invention, even if the unused new polishing pad is tamed and stored for a long time, it can be directly applied to the polishing of the actual product.

As such, by polishing new unused polishing pads with dummy wafers to tame the new polishing pads and replacing them by plate, it is possible to reduce the time for stabilizing the polishing pads when replacing the polishing pads and to reduce the slurry used during the stabilization. Can greatly improve the efficiency of the equipment.

As described above, although the present invention has been described by way of limited embodiments and drawings, the present invention is not limited thereto and is intended by those skilled in the art to which the present invention pertains. Of course, various modifications and variations are possible within the scope of equivalents of the claims to be described.

The following drawings, which are attached to this specification, illustrate exemplary embodiments of the present invention, and together with the detailed description of the present invention serve to further understand the technical spirit of the present invention, the present invention includes matters described in such drawings. It should not be construed as limited to.

1 is a main configuration diagram of a semiconductor wafer polishing apparatus according to the present invention.

FIG. 2 is a cross-sectional view illustrating a coupling structure of a polishing plate and a plate of the semiconductor wafer polishing apparatus of FIG. 1.

3 is a partial plan view showing a state in which the plate 2 is fixed to the polishing table with a fixing holder.

4 is a plan view showing a polishing table on which grooves are formed in the semiconductor wafer polishing apparatus according to the present invention.

5 is a cross-sectional view showing a polishing table in which holes are formed in the semiconductor wafer polishing apparatus according to the present invention.

6 is a graph showing a change in friction between the polishing pad and the wafer over time.

<Explanation of symbols for the main parts of the drawings>

10 polishing head 20 polishing pad

30: plate 40: polishing plate

50: nozzle 60: fixed holder

62 bolt 70 groove

80: hole W: wafer

Claims (8)

A semiconductor wafer polishing apparatus for supplying a slurry between a wafer and a polishing pad, and polishing the surface of the wafer by relatively rotating the wafer in contact with the polishing pad. A plate to which a polishing pad for polishing the wafer is attached; A rotatable polishing table on which the plate is detachably mounted; And Fixing the wafer while facing the polishing pad and including a rotatable polishing head, And a groove or a hole for blowing air when the plate is separated from the polishing table on the surface of the polishing table. The method of claim 1, And the area of the plate is smaller than that of the polishing platen. The method of claim 2, And a fixing holder for fixing the plate to an edge of the polishing plate exposed around the plate. The method according to any one of claims 1 to 3, A tamping polishing device for taming the unused new polishing pad by polishing a dummy wafer with a new, unused polishing pad, further comprising a pair of the semiconductor wafer polishing apparatus according to any one of claims 1 to 3, And the unused new polishing pad is attached to the plate of the taming polishing device, and the dummy wafer is fixed to the polishing head of the tamping polishing device. A semiconductor wafer polishing method for supplying a slurry between a wafer and a polishing pad, and polishing the surface of the wafer by relatively rotating the wafer in contact with the polishing pad. In the tamping polishing apparatus separate from the present polishing apparatus for polishing the wafer, the unused new polishing pad is tamed by polishing the dummy wafer with the new, unused polishing pad, A method of polishing a semiconductor wafer, characterized in that when replacing a used polishing pad with a new, unused polishing pad, the tamping polishing apparatus is replaced with a polishing pad previously tamed. The method of claim 5, The polishing apparatus and the tamping polishing apparatus include a plate to which a polishing pad is attached, a polishing table detachably mounted and rotatable, and a polishing head rotatable to fix a wafer while facing the polishing pad. and, The method of polishing a semiconductor wafer, wherein the polishing pad is replaced by a plate unit with a polishing pad attached thereto. The method of claim 5, The method of polishing a semiconductor wafer, wherein the unused new polishing pad is tampered with in the tamping polishing apparatus. The method of claim 5, And the unused new polishing pad tamed by polishing the dummy wafer with the new unused polishing pad is immediately replaced with the used polishing pad.
KR1020070112766A 2007-11-06 2007-11-06 Apparatus and method for polishing semiconductor wafer KR20090046550A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102509105B1 (en) 2022-01-26 2023-03-10 케이피엑스케미칼 주식회사 Chemical Mechanical Polishing Equipment for Wafer

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102509105B1 (en) 2022-01-26 2023-03-10 케이피엑스케미칼 주식회사 Chemical Mechanical Polishing Equipment for Wafer

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