KR20090033748A - Pcb strip having reinforce frame and manufacturing method of the same - Google Patents

Abstract

A PCB strip having reinforce frame and manufacturing method of the same are provided to reduce the process step without using the carrier frame by forming the reinforce frame. The copper coating(51) is formed in the surface of the substrate(50) having a plurality of strips. The circuit pattern is formed by etching the copper coating. The solder mask(55) is formed in the upper part of the circuit pattern. The gold plating layer(57) is formed in the part selected by the solder mask. Before forming the circuit pattern by etching the copper coating, the reinforce frame(53) is formed. The reinforce frame is made of the metal layer. The reinforce frame is formed by the electroless plating or electro plating.

Description

Printed circuit board strip having reinforcement frame and manufacturing method thereof {PCB STRIP HAVING REINFORCE FRAME AND MANUFACTURING METHOD OF THE SAME}

The present invention relates to a thin printed circuit board, and more particularly, to a method of manufacturing a printed circuit board which improves workability by forming a metal layer or an ink layer on a printed circuit board strip to reinforce the strength of the strip.

Printed circuit boards used in the semiconductor chips are small in size, and are manufactured by cutting a plurality of sheets on one plate at a time.

1 illustrates a panel in which a plurality of individual printed circuit board pieces are arranged.

In the panel 10 a plurality of pieces 14 are arranged regularly.

One piece 14 constitutes one product, which is too large to handle in units of panel 10, and is too small to handle in units of pieces 14, so that workability This is not good.

Thus, it is common to treat the individual pieces 14 in the state of a strip 12 arranged in one row or in a plurality of rows.

That is, the process of manufacturing a printed circuit board is made of a panel 10 unit, and the panel 10 is cut in units of a strip 12 to be mounted on a mounting process or a chip.

However, as the printed circuit board is thinned, the strip 12 is easily bent or slack because the strength is weak even when the printed circuit board is cut in the unit of the strip 12.

Since the strip 12 has a margin 13 which is a portion where the piece 14 is not formed, the strip 12 is conventionally attached by a method of attaching a frame-shaped metal frame along the margin 13. Strengthened.

2 is an exploded perspective view of a frame and a strip for reinforcing a conventional strip.

As shown, by forming a frame 20 of a frame shape of a metal material and attaching it to the margin 13 of the strip 12 to reinforce the strength of the strip 12 to improve the workability of the process of the strip unit I was letting go.

However, there is a problem in that a work process for manufacturing and attaching a separate metal frame is added, thereby increasing workmanship and cost.

The present invention is to provide a method for manufacturing a printed circuit board having a reinforcing frame that can be performed collectively in the panel manufacturing process of the reinforcing frame to reinforce the strength of the strip.

The present invention is to provide a printed circuit board which is advantageous in workability and cost by allowing the strip to maintain a predetermined strength without using a carrier frame used in the delivery of a separate thin printed circuit board.

In order to achieve the above object, the present invention comprises the steps of forming a copper plating layer on the surface of the substrate is a plurality of strips are arranged; Etching the copper plating layer to form a circuit pattern; Forming a solder mask on the circuit pattern; And

Forming a gold plated layer on the portion selected by the solder mask; Printed circuit board manufacturing method comprising the step of forming a reinforcing frame made of a metal layer on the edge of the strip Provide a method.

And the present invention comprises the steps of forming a copper plating layer on the surface of the substrate is arranged a plurality of strips; Etching the copper plating layer to form a circuit pattern; Forming a solder mask on the circuit pattern; And forming a gold plated layer on a portion selected by the solder mask. The method of manufacturing a printed circuit board comprising: printing a reinforcing frame made of ultraviolet light and thermal curing ink on a strip edge. It provides a printed circuit board manufacturing method.

As described above, according to the method of manufacturing a printed circuit board having a strip reinforcing frame according to the present invention, since a reinforcing frame is formed to reinforce the strength of the strip at the time of manufacturing a printed circuit board without a separate process, a thin printed circuit board Carrier frame used in delivery is not used, which reduces labor and cost.

Hereinafter, with reference to the accompanying drawings will be described an embodiment of a printed circuit board manufacturing method having a reinforcing frame according to the present invention.

In this process, the thickness of the lines or the size of the components shown in the drawings may be exaggerated for clarity and convenience of description.

In addition, terms to be described later are terms defined in consideration of functions in the present invention, which may vary according to a user's or operator's intention or custom.

Therefore, definitions of these terms should be made based on the contents throughout the specification.

On the other hand, for convenience of description, the same parts or structures as the conventional invention and the same parts use the same reference numerals or names.

3 is a flowchart illustrating a method of manufacturing a printed circuit board having a strip reinforcement frame according to a first embodiment of the present invention.

As shown, the method of manufacturing a printed circuit board according to the first embodiment of the present invention comprises the steps of forming a copper plating layer on the surface of the substrate (s-31), and selectively etching the copper plating layer to form a circuit pattern Step (s-32), forming a reinforcing frame made of a metal layer at the edge of the strip (s-33), forming a solder mask on the circuit pattern (s-34), and by the solder mask And forming a gold plated layer on the selected portion (s-35).

In the forming of the copper plating layer (s-31), the copper plating layer may be formed by electrolytic and electroless methods.

Next, in the step of forming the circuit pattern (s-32), the copper plating layer is removed by etching leaving the necessary parts such as the circuit pattern, the pad, the lead, and the terminal. At this time, the copper plating layer of the margin part except the part made of the piece is not removed.

Next, the step (s-33) of forming the reinforcing frame is a metal layer is formed on the copper plating layer of the margin portion not removed. The reinforcement frame is formed on the edge margin of the strip in position, and is formed on the copper plating layer on the laminated structure.

In the forming of the solder mask (s-34), the solder mask is formed except for the portion where the pad is to be formed, and the metal layer reinforcement frame is also covered by the solder mask. Solder masks are formed by printing SR (Solder Resist) inks.

Since a solder mask is formed in the area | region except a pad, the copper plating layer is exposed in the pad part. A gold plated layer is formed on this part (s-35).

This process is carried out collectively when forming a printed circuit board in a panel unit, it is possible to form a reinforcing frame made of a metal layer without additional work.

The metal layer is shaped like a frame at the edge of the strip to reinforce its strength so that the strip can remain in shape without being struck or drooled. The metal layer may be formed by the electrolytic or electroless plating method, and materials such as copper (Cu), nickel (Ni), tin (Sn), silver (Ag), and gold (Au) may be used.

And, in order to secure a predetermined strength, the metal layer forming the reinforcing frame is formed in a thickness of 20 ~ 70㎛ range, 1 ~ 30mm It is preferably formed to have a width of the range.

As shown in the drawing, the process may be simultaneously performed on both sides of the printed circuit board, and in the case of the single-sided printed circuit board, the process may be performed only on the single side.

4 is a process flowchart showing a method of manufacturing a printed circuit board having a strip reinforcement frame according to a second embodiment of the present invention.

As shown, the method of manufacturing a printed circuit board according to the first embodiment of the present invention comprises the steps of forming a copper plating layer on the surface of the substrate (s-41), and forming a reinforcing frame made of a metal layer on the edge of the strip ( s-42), selectively etching the copper plating layer to form a circuit pattern (s-43), forming a solder mask on the circuit pattern (s-44), and And forming a gold plated layer on the selected portion (s-45).

Unlike the first embodiment, in the second embodiment, the reinforcing frame is formed before the copper plating layer is etched to form the circuit pattern.

However, this process sequence difference does not affect the structure of the strip to be produced. In any embodiment, the metal layer is formed on the copper plating layer and has the same laminated structure in which a solder mask is formed thereon. This is because the metal layer is formed in the margin of the strip rather than the piece, and thus the copper plating layer is not etched even when the pattern is formed.

5 is a cross-sectional view illustrating a process of forming a reinforcing frame according to the first or second embodiment of the present invention.

The process of forming the reinforcing frame on the surface of the copper plating layer uses a photoresist.

As shown, first, a photoresist 52 is coated on the copper plating layer 51 formed on the surface of the substrate 50. It is then selectively exposed and developed to remove the photoresist in the area where the reinforcing frame will be formed. Next, the metal layer 53 is formed in the region where the photoresist is removed by the electrolytic or electroless plating method, and the remaining photoresist 52 is removed so that only the metal layer 53 remains on the surface of the copper plating layer 51. The metal layer 53 formed at the edge of the strip serves as a reinforcing frame.

This process can be performed together with the manufacturing process of the printed circuit board as described above.

The printed circuit board panel is cut in strip units to undergo a subsequent process.

6 is a plan view showing a strip manufactured by the manufacturing method according to the first or second embodiment of the present invention.

As shown, a frame-shaped reinforcement frame 53 is formed along the edge of the strip 12 (the same reference numerals are used since the metal layer is eventually reinforced). The reinforcement frame 53 may be formed in a shape as shown in the enlarged view of the upper right corner.

FIG. 7 is a cross-sectional view taken along the line A-A of FIG. 6.

Referring to FIG. 7, a circuit pattern is formed on the surface of the substrate 50 by a copper plating layer 51, and a metal layer 53 is formed on the copper plating layer 51 to serve as a reinforcing frame, and solder is formed thereon. It has a laminated structure in which the mask 55 is formed. This laminated structure uses the manufacturing method of the first embodiment, or uses the same method as the second embodiment. The metal layer 53 is preferably formed on both sides of the printed circuit board as shown, but may be formed only on one surface if necessary.

The gold plating layer 57 is formed on the surface of the copper plating layer 51 in which the solder mask 55 is not formed. The gold plated layer 57 becomes a pad for connecting with an element or the like. Forming the pad with the gold plated layer 57 is to prevent corrosion and to reduce contact resistance.

While the first and second embodiments described above were methods for forming a reinforcement frame with a metal layer, the third and fourth embodiments described below relate to a method for forming a reinforcement frame with an ink layer.

8 is a flowchart illustrating a method of manufacturing a printed circuit board having a strip reinforcement frame according to a third embodiment of the present invention.

As shown, the method of manufacturing a printed circuit board according to the third embodiment of the present invention comprises the steps of forming a copper plating layer on the surface of the substrate (s-81) and selectively etching the copper plating layer to form a circuit pattern Step (s-82), forming a solder mask on the circuit pattern (s-83), and printing a thermal and ultraviolet curing ink on the strip edge to form a strip reinforcement frame with an ink layer (s- 84) and forming a gold plated layer on the portion selected by the solder mask (s-85).

An ink cured by heat and ultraviolet rays is printed on the edge of the strip where the piece is not formed and then cured, thereby forming a strip reinforcement frame with an ink layer to reinforce strength.

Ink layer 10 ~ 100㎛ It is preferred to have a thickness in the range and to be printed in a width in the range of 1 to 30 mm. The printing ink can be used as a reinforcing frame using ink with pencil hardness (KS M 5000-95) ≥ 4H.

9 is a process flowchart showing a method of manufacturing a printed circuit board having a strip reinforcement frame according to a fourth embodiment of the present invention.

As shown, the method of manufacturing a printed circuit board according to the fourth embodiment of the present invention comprises the steps of forming a copper plating layer on the surface of the substrate (s-91), and selectively etching the copper plating layer to form a circuit pattern Step (s-92), forming a solder mask on the circuit pattern (s-93), forming a gold plating layer on the portion selected by the solder mask (s-94), and Printing the thermal and ultraviolet curing ink to form a strip reinforcement frame with an ink layer (s-95).

The difference from the third embodiment is that the order of the steps of forming the gold plated layer is changed, and the difference in the process order does not bring about the difference in cross-sectional structure.

This is because the gold plated layer is formed on the portion where the solder mask is not formed, and the ink layer is formed on the portion where the solder mask is formed, because the portions to be applied to each other are different.

10 is a cross-sectional view illustrating a process of forming a reinforcing frame according to a third or fourth embodiment of the present invention.

As shown, in order to form a frame-shaped reinforcement frame at the edge of the strip by using the ink layer, after the copper plating layer 61 and the solder mask 65 are formed on the surface of the substrate 60 (in the illustrated figure) Although the ink layer is shown to be formed after the gold plated layer 67 is formed, the ink layer is formed before the gold plated layer 67 is formed using the method of the third embodiment.) Solder mask 65 The ink layer 72 is formed on the top.

In this case, the ink used has a property of being cured by heat and ultraviolet rays. After forming the ink layer, the reinforcing frame 73 is formed by irradiating and curing heat and ultraviolet rays.

Although the present invention has been described with reference to the embodiments shown in the drawings, this is merely exemplary, and various modifications and equivalent other embodiments are possible to those skilled in the art. Will understand.

Therefore, the true technical protection scope of the present invention will be defined by the claims below.

1 is a view showing a panel in which a plurality of individual printed circuit board pieces are arranged;

2 is an exploded perspective view of a frame and a strip for reinforcing a conventional strip,

3 is a process flowchart showing a method of manufacturing a printed circuit board having a strip reinforcement frame according to a first embodiment of the present invention;

4 is a process flowchart showing a method of manufacturing a printed circuit board having a strip reinforcement frame according to a second embodiment of the present invention;

5 is a cross-sectional view illustrating a process of forming a reinforcing frame according to the first or second embodiment of the present invention;

Figure 6 is a plan view showing a strip manufactured by the manufacturing method according to the first or second embodiment of the present invention,

7 is a cross-sectional view taken along the line A-A of FIG.

8 is a process flowchart showing a method of manufacturing a printed circuit board having a strip reinforcement frame according to a third embodiment of the present invention;

9 is a process flowchart showing a method of manufacturing a printed circuit board having a strip reinforcement frame according to a fourth embodiment of the present invention;

10 is a cross-sectional view illustrating a process of forming a reinforcing frame according to a third or fourth embodiment of the present invention.

Claims (20)

Forming a copper plating layer on a surface of the substrate on which the plurality of strips are arranged; Etching the copper plating layer to form a circuit pattern; Forming a solder mask on the circuit pattern; And In the printed circuit board manufacturing method comprising; forming a gold plated layer on the portion selected by the solder mask, And forming a reinforcing frame made of a metal layer at an edge of the strip between the step of forming the circuit pattern and the step of forming a solder mask. Forming a copper plating layer on a surface of the substrate on which the plurality of strips are arranged; Etching the copper plating layer to form a circuit pattern; Forming a solder mask on the circuit pattern; And In the printed circuit board manufacturing method comprising; forming a gold plated layer on the portion selected by the solder mask, And forming a reinforcing frame made of a metal layer on the edge of the strip between the step of forming the copper plating layer and the step of forming the circuit pattern. The method according to claim 1 or 2, Forming a reinforcing frame made of the metal layer, After the photoresist is applied, the photoresist is removed at the edge of the strip through exposure and development, and then a metal layer is formed on the portion where the photoresist is removed, and the remaining photoresist is removed. . The method of claim 3, wherein Printed circuit board manufacturing method, characterized in that the thickness of the metal layer forming the reinforcing frame is in the range of 20 ~ 70㎛. The method of claim 3, wherein Printed circuit board manufacturing method characterized in that the width of the reinforcing frame is in the range of 1 ~ 30mm. The method according to claim 1 or 2, The metal layer is a printed circuit board manufacturing method, characterized in that formed by the method of electroless or electroless plating. The method according to claim 1 or 2, The metal layer is a printed circuit board manufacturing method, characterized in that formed of any one of copper (Cu), nickel (Ni), tin (Sn), silver (Ag), gold (Au), aluminum (Al). The method according to claim 1 or 2, The metal layer is a printed circuit board manufacturing method, characterized in that formed on both sides or one side of the substrate. Forming a copper plating layer on a surface of the substrate on which the plurality of strips are arranged; Etching the copper plating layer to form a circuit pattern; Forming a solder mask on the circuit pattern; And In the printed circuit board manufacturing method comprising; forming a gold plated layer on the portion selected by the solder mask, And printing a reinforcing frame composed of ultraviolet ray and thermal curing ink on a strip edge between the step of forming the solder mask and the step of forming the gold plated layer. Forming a copper plating layer on a surface of the substrate on which the plurality of strips are arranged; Etching the copper plating layer to form a circuit pattern; Forming a solder mask on the circuit pattern; And In the printed circuit board manufacturing method comprising; forming a gold plated layer on the portion selected by the solder mask, After the step of forming the gold-plated layer further comprising the step of printing a reinforcing frame consisting of ultraviolet and thermal curing ink on the edge of the strip. The method according to claim 9 or 10, The step of printing the reinforcing frame, A method of manufacturing a printed circuit board, wherein the ink layer is formed only on a region where a reinforcing frame is to be formed using a printing screen that selectively transmits ink, and then cured with ultraviolet rays or heat. The method of claim 11, Printed circuit board manufacturing method characterized in that the thickness of the ink layer forming the reinforcing frame is 10 ~ 100㎛. The method of claim 11, Printed circuit board manufacturing method characterized in that the width of the reinforcing frame is 1 ~ 30mm. The method of claim 11, The ink layer is a printed circuit board manufacturing method, characterized in that formed on both sides or one side of the substrate. In a printed circuit board strip in which a plurality of pieces corresponding to one semiconductor chip are arranged and forming a margin around the pieces, A printed circuit board strip comprising a reinforcing frame having a thickness of 20 to 70 μm at the margin of the strip rim, thereby reinforcing the strength so that the strip maintains a constant shape. The method of claim 15, The reinforcing frame is a printed circuit board strip, characterized in that formed of a metal layer. The method of claim 16, The metal layer is a printed circuit board strip, characterized in that the material of any one of copper (Cu), nickel (Ni), tin (Sn), silver (Ag), gold (Au). The method of claim 16, The metal layer is a printed circuit board strip, characterized in that formed between the copper plating layer and the solder mask. The method of claim 15, The reinforcing frame is a printed circuit board strip, characterized in that formed with a thermal or ultraviolet curing ink layer. The method of claim 15, The reinforcing frame is a printed circuit board strip, characterized in that provided on both sides or one side of the printed circuit board strip.

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