KR20090025126A - Method and apparatus for processing corner of solar cell ingot and product obtained by using the same - Google Patents

Method and apparatus for processing corner of solar cell ingot and product obtained by using the same Download PDF

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KR20090025126A
KR20090025126A KR1020080011291A KR20080011291A KR20090025126A KR 20090025126 A KR20090025126 A KR 20090025126A KR 1020080011291 A KR1020080011291 A KR 1020080011291A KR 20080011291 A KR20080011291 A KR 20080011291A KR 20090025126 A KR20090025126 A KR 20090025126A
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ingot
solar cell
grinding
grinding wheel
wheel
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KR1020080011291A
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Korean (ko)
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KR100933850B1 (en
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정창욱
주현석
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주식회사 실트론
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67167—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers surrounding a central transfer chamber
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

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  • Mechanical Treatment Of Semiconductor (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)

Abstract

According to the present invention, a method of grinding a corner portion of a solar cell ingot manufactured so as to be deformed from a circular shape to a square shape after a growing process, the grinding (grinding) in the longitudinal axis of the solar cell ingot Arranging the grinding wheel around the solar cell ingot such that the rotation axis of the grinding wheel is parallel with respect to the solar cell ingot; And grinding the surface by contacting the edge surface of the grinding wheel with the corner portion of the solar cell ingot. The method of processing a corner portion of a solar cell ingot is disclosed.

Description

Method and apparatus for processing corner part of solar cell ingot, and solar cell ingot and wafer manufactured according to this method {Method and apparatus for processing corner of solar cell ingot and product obtained by using the same}

The present invention relates to the processing of the corner portion of the solar cell ingot, and more particularly, to a method and apparatus for grinding a square corner portion of the solar cell ingot (singot) after square processing (squaring) and the solar cell ingot and wafer manufactured accordingly It is about.

Surface processing of the single crystal silicon ingot for solar cells is a very important process that determines the size of the substrate and the quality of the edge surface when manufacturing a solar cell substrate.

Recently, as the solar cell substrate is gradually thinned, the failure rate of cracking or cracking during the solar cell substrate manufacture is increasing. The failure of the solar cell substrate is due to the physical impact applied during the ingot processing, which is a major cause of product defects in the subsequent solar cell manufacturing process.

In general, a single crystal silicon ingot for a solar cell has a squaring process of transforming an ingot body having a circular cross section into a rectangle (FIG. And a rectangular shape through a cylindrical grinding process (FIG. 1C) to grind the rectangular corner portion.

In the squaring process, the ingot body 1 is processed into a rectangle by cutting all four sides of the non-walled surface placed in a direction perpendicular to the single crystal direction with the cutting wheel 10.

In the surface grinding process, the surface is ground by using the planar portion of the grinding wheel 11 to mitigate the impact of the cut surface. In recent years, a technique has been applied to further mitigate the machining impact of the squaring cut surface by using a dual wheel, brushing, or chemical acid etching process in connection with surface grinding.

In the cylindrical grinding process, a flat portion of the grinding wheel 12 is used to grind a corner portion to a desired diameter along the longitudinal direction of the ingot. In general, the cylindrical grinding process is divided into a rough grinding step using a grinding wheel with a relatively low mesh and a fine grinding step using a grinding wheel with a relatively high mesh. Proceed. Since rough machining has a large amount of processing, it is usually carried out 4 ~ 5 times, and when the work is completed, replace it with the grinding wheel with the highest mesh and perform one fine machining. As such, the conventional cylindrical grinding process takes a long time due to dividing the work into a rough machining step and a fine machining step, which is cumbersome to replace the grinding wheel, and also changes the wheel position after wheel replacement. There is a time-consuming problem. In addition, after rough processing is finished, the ingot needs to be chucked again, thereby changing the ingot, and thus there is a problem that partial polishing occurs during fine processing.

When the cylindrical grinding process is completed, a plurality of grinding marks are formed at a corner of the ingot in a direction perpendicular to the circumferential direction of the ingot.

Product defects caused by the impact of the machining occurs most severely at the corners of the ingot, and methods for effectively improving the processing process of the ingot corners have not been proposed yet. In this regard, many companies use a method of controlling the processing impact through chemical etching. In this case, the development of a solar cell to provide an environmentally friendly energy source because the etching solution generates industrial waste causing environmental pollution. There is a problem that is not consistent with the intent.

After performing the cylindrical grinding process, a slicing process of thinly cutting the single crystal silicon ingot for the solar cell is performed to obtain the solar cell wafer 2 as shown in FIG. 2.

As shown in (c) of FIG. 1, in the conventional cylindrical grinding process, grinding is performed by contacting a flat portion of the grinding wheel 12 with a corner portion of the ingot, but grinding the ingot body 1 along the ingot length direction. The process proceeds while relatively transporting the wheel 12. Therefore, a plurality of grinding marks 4 are formed in the corner portion 3 of the solar cell wafer 2 obtained after the slicing process, which extends in a direction perpendicular to the circumferential direction of the edge of the wafer, that is, in a wafer thickness t direction. In this regard, referring to FIG. 3, the grinding marks of the pattern extending in the wafer thickness direction (see arrow) formed on the edge surface of the actual solar cell wafer can be confirmed.

However, when the grinding marks are formed in the vertical direction with respect to the wafer surface as described above, there is a problem in that defect rates such as cracking and gold increase due to the characteristics of the wafer having single crystallinity.

The present invention was devised to solve the above problems, and the corner portion of the solar cell ingot which can reduce the crack or cracked product defect rate by improving the formation pattern of the grinding marks formed on the edge surface of the solar cell wafer It is an object of the present invention to provide a processing method and apparatus and a solar cell ingot and a wafer manufactured accordingly.

Another object of the present invention is to provide a method for processing a corner portion of a solar cell ingot, a processing apparatus, and a grinding wheel which can simultaneously perform relatively rough processing and fine processing during grinding processing on a solar cell ingot corner portion.

In order to achieve the above object, the present invention in grinding the corner portion of the solar cell ingot, which has undergone a growing process, a squaring process, a surface grinding process, etc., the corner portion of the ingot using the edge surface of the grinding wheel Configured to perform the grinding process.

That is, the corner processing method of the solar cell ingot according to the present invention comprises the steps of arranging the grinding wheel around the solar cell ingot so that the axis of rotation of the grinding wheel (parallel) with respect to the longitudinal axis of the solar cell ingot; And grinding the surface by contacting an edge surface of the grinding wheel to a corner portion of the solar cell ingot.

The grinding process is preferably performed along the longitudinal direction of the ingot while transferring any one of the solar cell ingot and the grinding wheel relative to the other.

Preferably, the grinding wheel may be coarse and finely processed simultaneously using a wheel having both relatively coarse abrasive particles and relatively fine abrasive particles attached thereto.

According to another aspect of the present invention, in the apparatus for processing the corner portion of the solar cell ingot, which is manufactured through a growing process, and processed so that the cross section is deformed from a circle to a square, with respect to the longitudinal axis of the solar cell ingot The rotating wheel of the grinding wheel (grinding wheel) is arranged side by side, the edge portion of the grinding wheel in contact with the edge portion of the solar cell ingot provides a corner processing apparatus of the solar cell ingot, characterized in that for performing grinding processing. do.

The corner processing apparatus of the solar cell ingot is preferably provided with a conveying means for transferring any one of the solar cell ingot and the grinding wheel relative to the other during the grinding process.

It is preferable that the abrasive is formed on the edge surface of the grinding wheel so that a relatively thick particle region and a relatively fine particle region are distinguished.

According to another aspect of the present invention, in the grinding wheel, which is manufactured through a growing process and mounted on an apparatus for grinding a corner portion of a solar cell ingot processed so that its cross section is deformed from a circle to a square, the disc It is provided with a grinding wheel for the ingot corner processing device, characterized in that the wheel body of the form, the abrasive is formed on the edge surface of the wheel body corresponding to the circumferential portion of the disk.

The abrasive is preferably formed on the edge surface so that a relatively thick particle region and a relatively fine particle region are distinguished.

The grinding wheel may be provided in a tapered structure such that a center portion of the edge surface protrudes from the periphery along the circumference. In this case, the abrasive may be formed to be divided into particle areas having different sizes on both inclined surfaces with respect to the center of the edge surface.

Alternatively, the grinding wheel may be provided in a flat structure along the circumference of the edge surface. In this case, the abrasive may be formed to be divided into particle areas having different sizes along the width direction of the edge surface.

As another alternative, the abrasive may have a stepped structure such that the polishing surface gradually decreases from one edge in the width direction of the edge surface to the other edge.

The finest particle region is located near the one edge, and gradually larger particle regions are provided along the width direction of the edge surface, so that the thickest particle region is located at the other edge.

Preferably, the respective particle regions may be disposed to be spaced apart from each other in the width direction of the edge surface.

In the grinding wheel, wheel units having disc shapes in each particle region are stacked in multiple stages to form a wheel body.

According to another aspect of the present invention, in the solar cell ingot manufactured by a growing process and processed so that the cross section is deformed from a circle to a square, a grinding mark is formed at the corners of the ingot body. Is formed, the extending direction of the grinding mark is provided with a solar cell ingot, characterized in that parallel to the circumferential direction of the ingot body.

According to still another aspect of the present invention, a wafer for a solar cell manufactured by slicing a solar cell ingot manufactured to be deformed from a circular to square shape after being manufactured through a growing process, wherein the wafer edge Grinding marks are formed at the corners of the surface, and the extending direction of the grinding marks is provided in parallel with the circumferential direction of the wafer edge.

The method and apparatus for processing a corner portion of a solar cell ingot according to the present invention and the solar cell ingot and wafer manufactured accordingly provide the following effects.

First, since the grinding marks on the edge surface are formed horizontally with respect to the wafer surface of the solar cell, it is possible to reduce the defect occurrence rate of cracking or cracking the wafer. By applying the present invention, the ingot corner part for solar cells is ground and sliced into a thin film having a thickness of 220 μm to finally manufacture a solar cell substrate. Can be reduced.

Second, since the etching process of the solar cell ingot does not use a chemical etching process that is widely used in the past, it is environmentally friendly, and the thickness of the solar cell substrate can be easily implemented.

Third, the grinding wheel of the multi-stage structure is provided so that rough processing and fine processing can be performed collectively using only one wheel, thereby reducing grinding processing time and improving productivity by eliminating wheel replacement work.

Fourth, unlike the prior art, since the ingot rechucking step is not required, it is possible to prevent the occurrence of the unpolished portion during fine processing.

Fifth, in the fine abrasive region and the coarse abrasive regions, which are arranged in the width direction of the edge surface, by forming a step for the rough abrasive regions, the processing quality can be maintained uniformly, and the cutting load can be minimized. It is possible to minimize the dimensional change of the machining surface due to wheel wear without deteriorating the roughness of the ingot corner portion to be processed.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. Prior to this, the terms or words used in this specification and claims should not be construed as having a conventional or dictionary meaning, and the inventors should properly introduce the concept of terms in order to best explain their invention. It should be interpreted as meanings and concepts in accordance with the technical spirit of the present invention based on the principle that it can be defined. Therefore, the embodiments described in the specification and the drawings shown in the drawings are only the most preferred embodiment of the present invention and do not represent all of the technical idea of the present invention, various modifications that can be replaced at the time of the present application It should be understood that there may be equivalents and variations.

4 is a configuration diagram schematically showing a corner processing process of the solar cell ingot 100 according to a preferred embodiment of the present invention.

Referring to FIG. 4, the present invention provides a solar cell ingot such that a direction of rotation axis A W of the grinding wheel 200 is parallel to a longitudinal axis A I of the solar cell ingot 100. The grinding wheel 200 is disposed around 100 to grind the ingot corner portion using the edge surface of the grinding wheel 200.

The solar cell ingot 100 has a substantially rectangular pillar shape in which the cross section is processed into a rectangle through a conventional single crystal drawing process, a squaring process, a surface grinding process, and the like.

Grinding wheel 200 is attached to the abrasive along the circumference of the circumference, the grinding surface of the grinding wheel 200 in contact with the corner of the ingot 100 for solar cells during the grinding process to perform the grinding process. In the present invention, the grinding process for the ingot corner portion from one end to the other end of the ingot while relatively conveying the solar cell ingot 100 and the grinding wheel 200. After the grinding of the corners of any one of the square corners of the solar cell ingot 100 is completed, the grinding process is performed again after the pitch of the solar cell ingot 100 is rotated about its longitudinal axis. For this process, the solar cell ingot 100 has a rotation means (not shown) that provides a rotational force capable of rotating the ingot body by one pitch about its longitudinal axis, and straightens the ingot body at a constant speed along the longitudinal direction of the ingot. It is connected to a conveying means (not shown) that provides a driving force to move.

The edge surface of the grinding wheel 200 is preferably provided with both relatively thick abrasive grain regions and relatively fine abrasive grain regions. At this time, the size range of the abrasive particles is preferably about 120 ~ 300 mesh. According to this configuration, it is possible to simultaneously perform several rough machining and fine machining through one machining process for the solar cell ingot corner portion. Here, the abrasive particles are preferably diamond abrasive, but is not limited to this example, of course.

5 to 10 schematically show a configuration example of the grinding wheel 200 provided in accordance with the present invention.

First, the grinding wheel 200 shown in FIG. 5 is formed in a tapered structure such that the center portion of the edge surface protrudes from the periphery thereof, thereby providing diversified grinding characteristics with respect to the corner portion of the ingot. In this case, the abrasive 201 is formed to be divided into particle regions 201a and 201b having different sizes on both inclined surfaces with respect to the center of the edge surface, thereby simultaneously providing a relatively rough processing and a relatively fine processing function. desirable.

The grinding wheel 200 illustrated in FIGS. 6 and 7 has a flat edge surface along its circumference, and the abrasives 202 and 203 are formed to be divided into particle regions having different sizes along the width direction of the edge surface. do. FIG. 6 shows an example in which differently sized particle regions 202a, 202b and 202c of the abrasive 202 are continuously formed from the edge surface of the grinding wheel 200 to the interior of the wheel body. An example of the different sized particle regions 203a, 203b, 203c constituting the abrasive 203 is formed only on the edge surface of the grinding wheel 200.

The grinding wheel 200 shown in FIG. 8 is provided with wheel units in a substantially disk shape for each of the particle regions 205a, 205b, and 205c of different sizes constituting the abrasive 205, and the wheel units are stacked in multiple stages. It is integrated by the fastening pin 204 has a structure forming a wheel body. Particle regions 205a, 205b, and 205c of different sizes located on the edge surface of the grinding wheel 200 have an inclination in which the mesh gradually increases or decreases from one edge to the other along the width direction of the edge surface. Is formed. At this time, the number of stages of the wheel units constituting the body of the grinding wheel 200 can be variously designed.

9 illustrates an example in which a wheel body is formed by stacking four wheel units. Here, the particle regions 206a, 206b, 206c, and 206d of different sizes constituting the abrasive 206 gradually move from one edge to the other along the width direction of the edge surface, gradually increasing or decreasing the mesh. It is formed to have a slope.

The grinding wheel 200 illustrated in FIG. 10 has a structure in which the polishing surface gradually decreases while going to the other edge based on the polishing surface of the abrasive region provided near one edge in the width direction of the edge surface. To this end, the polishing surface of the abrasive 207 is configured to have a step between the particle regions 207a, 207b, 207c, 207d, and 207e of different sizes. The abrasive 207 goes from the particle region 207a located at one edge along the width direction of the edge surface to the particle region 207e located at the other edge, for example, # 1000, # 150, # 150, # 80, # 80. The mesh is formed to have a slope that gradually decreases in the order of. Here, the particle area 207a having the largest mesh is used for fine processing, while the remaining particle area 207b, 207c, 207d, and 207e having a small mesh are used for rough processing.

Since the grinding wheel 200 has a step formed between the particle regions 207a, 207b, 207c, 207d, and 207e, its grinding surface has a structure inclined at an angle of θ in the width direction of the edge surface. Particle regions 207a, 207b, 207c, 207d, and 207e of the abrasive 207 may be formed to be spaced apart from each other in the width direction of the edge surface so as to adjust the processing amount or processing time for each wheel unit.

According to the structure of the grinding wheel 200 shown in Figure 10, while grinding the ingot corner portion from one end to the other end of the ingot while relatively transferring the solar cell ingot 100 and the grinding wheel 200, the mesh located at the edge end By processing the ingot corner portion once in the order from the smallest particle region 207e to the largest particle region 207a, the mesh roughly performs one rough machining process and one fine machining process. It is possible to minimize the size change of the machining surface due to wheel wear without deteriorating the roughness of the ingot corner portion to be processed.

In FIG. 11, the grinding wheel 200 having the multistage structure shown in FIG. 10 is used, and the abrasive grain area mesh of the micro machining wheel unit is designed as # 1000, and the number of stages of the wheel unit is adjusted to adjust the overall width of the edge surface. The machining surface state when the ingot corner portion is processed by using the wheel widened to an appropriate level is shown, and FIG. 12 compares the surface roughness (R Y ) characteristics of the machining surface with the conventional grinding wheel. Is shown. 11 and 12, it can be seen that by the grinding wheel according to the preferred embodiment of the present invention the average surface roughness of the processing surface is significantly improved to 2.21㎛ level.

After the ingot corner processing, a slicing process of thinly cutting the single crystal silicon ingot for solar cells is performed to obtain a solar cell wafer 101 as shown in FIG.

In the corner portion 102 of the solar cell wafer 101 obtained after the slicing process, a grinding mark 103 extending in a direction parallel to the circumferential direction of the wafer, that is, a direction perpendicular to the wafer thickness t direction. Many are formed. In this regard, referring to FIG. 14, a grinding mark formed on the edge surface of the actual solar cell wafer 101 may be extended in a direction perpendicular to the wafer thickness direction (see an arrow). According to this configuration, since the grinding marks are placed in a horizontal direction with respect to the wafer surface, the incidence rate of cracks, cracks, and the like can be reduced due to the characteristics of the wafer having single crystallinity.

As described above, in the present invention, grinding is performed by rotating the edge surface of the grinding wheel 200 in the circumferential direction of the corner portion of the solar cell ingot 100 so that the direction of forming the grinding marks relative to the surface of the solar cell wafer is vertical. Direction can be changed from horizontal to horizontal.

Although the present invention has been described above by means of limited embodiments and drawings, the present invention is not limited thereto and will be described below by the person skilled in the art to which the present invention pertains. Of course, various modifications and variations are possible within the scope of the claims.

The following drawings, which are attached to this specification, illustrate preferred embodiments of the present invention, and together with the detailed description of the present invention serve to further understand the technical spirit of the present invention, the present invention includes matters described in such drawings. It should not be construed as limited to.

1 is a configuration diagram schematically showing a conventional processing process for processing a solar cell ingot into a square.

FIG. 2 is a diagram illustrating a solar cell wafer obtained by performing a slicing process after the cylindrical grinding process of FIG. 1.

Figure 3 is a photograph showing a grinding mark formed in the corner portion of the wafer for solar cells manufactured according to the prior art.

Figure 4 is a schematic diagram showing a corner processing process of the solar cell ingot according to a preferred embodiment of the present invention.

5 to 10 are cross-sectional views schematically showing a grinding wheel configuration provided according to the present invention.

FIG. 11 is a photograph showing a state of a machining surface processed by the grinding wheel of FIG. 10.

12 is a table showing a result of improved surface roughness according to the application of the grinding wheel of FIG. 10.

FIG. 13 is a diagram illustrating a solar cell wafer obtained by performing a slicing process after the machining process of FIG. 4.

14 is a photograph showing a grinding mark formed at a corner of a wafer for a solar cell manufactured according to an embodiment of the present invention.

<Description of main reference numerals in the drawings>

100 Ingot for Solar Cell 101 Wafer for Solar Cell

Grinding wheels 201,202,203,205,206,207

204. Fastening pin

Claims (18)

In the method for grinding the corner portion of the solar cell ingot, which is manufactured through a growing process and processed so that the cross section is deformed from a circle to a square, Arranging the grinding wheel around the solar cell ingot so that the axis of rotation of the grinding wheel is parallel to the longitudinal axis of the solar cell ingot; And Grinding process by contacting the edge surface of the grinding wheel to the corner portion of the solar cell ingot; The corner portion processing method of the solar cell ingot. The method of claim 1, A method of processing a corner portion of a solar cell ingot, wherein the grinding process is performed along the longitudinal direction of the ingot while transferring one of the solar cell ingot and the grinding wheel relative to the other. The method according to claim 1 or 2, The grinding wheel is a wheel processing method of the corner portion of the solar cell ingot, characterized in that the coarse and fine processing is performed at the same time by using a wheel that is attached to both relatively thick abrasive particles and relatively fine abrasive particles. In the apparatus for processing the corner portion of the solar cell ingot, which is manufactured through a growing process and processed so that the cross section is deformed from circular to square, The axis of rotation of the grinding wheel (grinding wheel) is arranged side by side with respect to the longitudinal axis of the solar cell ingot, The edge portion of the grinding wheel is in contact with the corner portion of the solar cell ingot, the corner processing apparatus of the solar cell ingot, characterized in that for performing the grinding process. The method of claim 4, wherein An apparatus for processing a corner portion of a solar cell ingot, characterized in that it further comprises a conveying means for conveying any one of the solar cell ingot and the grinding wheel relative to the other during the grinding process. The method according to claim 4 or 5, Edge processing apparatus for a solar cell ingot, characterized in that the abrasive is formed on the edge surface of the grinding wheel to be divided into a relatively thick and relatively fine particle area. In the grinding wheel, which is manufactured through a growing process, and is mounted on an apparatus for grinding a corner portion of a solar cell ingot processed so that its cross section is deformed from a circle to a square, Equipped with disk-shaped wheel body, Grinding wheel for ingot corner processing apparatus, characterized in that the abrasive is formed on the edge surface of the wheel body corresponding to the circumferential portion of the disk. The method of claim 7, wherein The abrasive material is a grinding wheel for ingot corner processing apparatus, characterized in that formed on the edge surface so that the relatively thick and relatively fine particle area is divided. The method according to claim 7 or 8, Grinding wheel for ingot corner processing apparatus, characterized in that the tapered (taper) so that the center portion of the edge surface protrudes along the circumference. The method of claim 9, The grinding wheel is a grinding wheel for ingot corner processing apparatus, characterized in that formed on each of the inclined surface with respect to the center of the edge surface divided into different particle areas of different sizes. The method according to claim 7 or 8, Grinding wheel for ingot corner processing device, characterized in that the edge surface is flat along the circumference. The method of claim 11, The grinding wheel is a grinding wheel for ingot corner processing device, characterized in that formed in the width direction of the edge surface divided into different sized particle area. The method according to claim 7 or 8, The grinding wheel is a grinding wheel for ingot corner processing apparatus, characterized in that the stepped structure is formed so that the polishing surface is gradually lowered from one edge in the width direction of the edge surface to the other edge direction. The method of claim 13, Grinding for the ingot corner processing device, characterized in that the finest particle area is located near the one edge, the gradually larger particle area is provided along the width direction of the edge surface, the coarse particle area is located at the other edge. Wheel. The method of claim 14, Grinding wheel for ingot corner processing device, characterized in that the respective particle regions are spaced apart from each other in the width direction of the edge surface. The method of claim 15, Equipped with wheel units in the form of discs for each particle region, And the wheel units are stacked in multiple stages to form the wheel body. In the solar cell ingot manufactured by a growing process and processed so that the cross section is deformed from circular to square, Grinding mark (grinding mark) is formed in the corner of the ingot body, the extending direction of the grinding mark is inline for the solar cell, characterized in that parallel to the circumferential direction of the ingot body. A solar cell wafer manufactured by slicing a solar cell ingot manufactured so as to be deformed from a circular shape to a square shape after being grown through a growing process, Grinding mark (mark) is formed in the corner portion of the wafer edge surface, the extending direction of the grinding mark is parallel to the circumferential direction of the wafer edge, characterized in that the wafer for solar cells.
KR1020080011291A 2007-09-05 2008-02-04 Method and apparatus for processing corner of solar cell ingot and product obtained by using the same KR100933850B1 (en)

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