KR20090024512A - Method for bonding - Google Patents

Abstract

A bonding method is disclosed. Applying a thermosetting adhesive to the first member; Coupling the second member to the first member; The joining method comprising the step of disposing at least one of the first member and the second member inside the high frequency induction coil, by using high frequency induction heating, it is possible to efficiently perform the bonding between the miniaturized member.

Description

Bonding method {Method for bonding}

The present invention relates to a bonding method.

In the manufacture of small parts, due to the limitations of the size of the product itself, the method of fastening and assembling between component parts is limited, and as such assembly methods, adhesives or welding are more frequently used than mechanical elements. It is used.

In particular, in the case of non-assembly between metal materials, adhesives are used rather than welding. Adhesives for special purpose to maintain high temperature, high pressure, and airtightness among commercially available adhesives are caused by UV or high temperature rather than natural curing. It often hardens.

In the case of using ultraviolet (UV) light, curing time can be shortened. However, when the curing agent is not sufficiently exposed to UV light, an uncured portion may be present inside, and a mechanical structure that UV is hard to penetrate. If it has, it becomes difficult to apply.

In the case of using thermal curing, if the thermal conductivity of the part is low or the area is large, it takes a lot of time to apply a high temperature to the product, or a large scale equipment such as an oven is required.

The limitations of the above-described methods such as UV curing and thermal curing are that the component size is only a few millimeters (mm) and the manufacturing environment is a special environment such as a clean room. Greater problems arise when mass production with a few seconds is required.

For example, in the case of an ultraviolet curable adhesive, the use of the ultraviolet curable adhesive is made in a very small gap, so that it is not sufficiently exposed to ultraviolet rays, which may cause uncuring. In addition, in the case of the thermal curing adhesive, due to the large-scale equipment directly related to the size of the clean room, there is a problem that the environmental maintenance cost is increased.

The present invention provides a joining method that can ensure the reliability of joining between miniaturized members.

According to one aspect of the invention, the step of applying a thermosetting adhesive to the first member; Coupling the second member to the first member; It is possible to provide a bonding method comprising disposing at least one of the first member and the second member inside the high frequency induction coil.

The adhesive may comprise a metal, such as aluminum, wherein the first and second members may each be non-conductors.

According to another aspect of the invention, the step of mounting the first member on the first jig of the metal material; Applying a thermosetting adhesive to the first member; Coupling the second member to the first member using a second jig made of metal; It is possible to provide a bonding method comprising disposing at least one of the first member and the second member inside the high frequency induction coil.

The adhesive may comprise a metal, such as aluminum, wherein the first and second members may each be non-conductors.

According to a preferred embodiment of the present invention, by using high frequency induction heating, it is possible to efficiently perform the joining between miniaturized components.

As the invention allows for various changes and numerous embodiments, particular embodiments will be illustrated in the drawings and described in detail in the written description. However, this is not intended to limit the present invention to specific embodiments, it should be understood to include all transformations, equivalents, and substitutes included in the spirit and technical scope of the present invention. In the following description of the present invention, if it is determined that the detailed description of the related known technology may obscure the gist of the present invention, the detailed description thereof will be omitted.

Terms such as first and second may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another.

The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting of the present invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this application, the terms "comprise" or "have" are intended to indicate that there is a feature, number, step, action, component, member, or combination thereof described in the specification, and one or more other features. It is to be understood that the present disclosure does not exclude the possibility of the presence or the addition of numbers, steps, operations, components, members, or a combination thereof.

Hereinafter, a preferred embodiment of the bonding method according to the present invention will be described in detail with reference to the accompanying drawings, in the description with reference to the accompanying drawings, the same or corresponding components are given the same reference numerals and duplicated thereto The description will be omitted.

1 is a flowchart showing a first embodiment of a bonding method according to an aspect of the present invention, Figures 2 to 5 is a process chart showing the bonding method of FIG. 2 to 5, a first member 10, a protrusion 12, a second member 20, a groove 22, an adhesive 30, and a high frequency induction coil 40 are illustrated.

First, as shown in FIG. 2, in order to bond the first member 10 having the protrusions 12 and the second member 20 having the grooves 22 formed thereon, the thermosetting adhesive 30 to the first member. ) Is applied (S110). The adhesive 30 applied to the first member is not yet cured, and may be cured later by heat. This adhesive 30 is applied to the first member 10 is shown in FIG.

In this embodiment, the case in which the protrusions 12 formed on the first member 10 and the grooves 22 formed on the second member 20 are bonded to each other is illustrated as an example, but the first member 10 and the second Of course, even if the grooves 22 or the projections 12 are not formed in the member 20, the method of the present embodiment can be applied.

Next, as shown in FIG. 4, the first member 10 and the second member 20 are combined (S120), and the first member 10 and the second member are hardened to cure the applied adhesive 30. At least one of the 20 is disposed inside the high frequency induction coil 40 (S130). That is, in this embodiment, a high frequency induction heating method is used as a method of heating and curing the applied adhesive 30. Brief description of the high frequency induction heating method is as follows.

When the derivative is placed inside (middle) of the coil through which the high frequency current flows, eddy current occurs in the derivative due to the change of the magnetic field around the coil, and heat loss due to hysteresis can also occur. . These vortices and heat losses can cause the derivative to heat up rapidly. By using the heat generated in the derivative in this way it will be able to cure the adhesive (30).

In order to use the above-described method, the first member 10 and the second member 20 made of metal may be used. By using the metal first member 10 and the second member 20, the first member 10 and the second member 20 are heated, and the heat is used to cure the adhesive 30. It can be.

Alternatively, the adhesive 30 containing the metal component may be used. Rather than curing the adhesive 30 using the heat generated by the first member 10 and the second member 20, the adhesive 30 itself generates heat, and the adhesive 30 uses the heat. To harden. For this purpose, a method of mixing a metal paste or metal powder with the adhesive resin can be used.

As the metal to be mixed with the adhesive resin, aluminum (Al) may be used in consideration of thermal conductivity and economical efficiency. In addition, of course, other kinds of metals, such as copper, can also be used.

The adhesive 30 including the metal component may be usefully used when the member to be bonded is made of a material other than a conductor. It is a matter of course that the member may be applied even when the member is made of a conductor.

Through the method described above, it is possible to enable local heating of the product, to control the heating time and the heating temperature, it is possible to efficiently perform the bonding between the miniaturized member.

Next, a second embodiment of a bonding method according to an aspect of the present invention will be described with reference to FIGS. 6 to 10. 6 is a flowchart illustrating a second embodiment of a bonding method according to an aspect of the present invention, and FIGS. 7 to 10 are process diagrams illustrating the bonding method of FIG. 6. 7 to 10, the first member 10, the protrusion 12, the second member 20, the groove 22, the adhesive 30, the high frequency induction coil 40, and the first jig 50. ), A second jig 60 is shown.

In the present embodiment, a method of curing the adhesive 30 by using the heat generated from the jig using the metal jig (50, 60) will be presented.

First, as shown in FIG. 7, the first member 10 is seated on the metal first jig 50 (S210), and as shown in FIG. 8, the thermosetting adhesive ( 30 is applied (S220), and the second member 20 is coupled to the first member 10 by using the second jig 60 made of metal as shown in FIG. 9 (S230). Then, as shown in FIG. 10, at least one of the first member 10 and the second member 20 is disposed inside the high frequency induction coil 40 (S240).

By using the metal jig (50, 60), the jig can be heated, it is possible to cure the adhesive 30 by allowing the heat generated in the jig to be transferred to the adhesive (30).

This method using the metal jig (50, 60) can be usefully used when the parts (10, 20) to be bonded is made of a material other than a conductor. It is a matter of course that the member may be applied even when the member is made of a conductor.

On the other hand, even when using a metal jig, the adhesive containing a metal component can be used like the case of 1st Example. For this purpose, the metal paste or the metal powder may be mixed with the adhesive resin, as described above.

Although the above has been described with reference to a preferred embodiment of the present invention, those skilled in the art to which the present invention pertains without departing from the spirit and scope of the present invention as set forth in the claims below It will be appreciated that modifications and variations can be made.

Many embodiments other than the above-described embodiments are within the scope of the claims of the present invention.

1 is a flow chart showing a first embodiment of a bonding method according to an aspect of the present invention.

2 to 5 is a process chart showing the bonding method of FIG.

6 is a flow chart showing a second embodiment of the bonding method according to an aspect of the present invention.

7 to 10 is a process chart showing the bonding method of FIG.

<Description of the symbols for the main parts of the drawings>

10: first member 12: protrusion

20: second member 22: groove

30: adhesive 40: high frequency induction coil

50: first jig 60: second jig

Claims (8)

Applying a thermosetting adhesive to the first member; Coupling a second member to the first member; Disposing at least one of the first member and the second member inside the high frequency induction coil. The method of claim 1, Bonding method characterized in that the adhesive comprises a metal. The method of claim 2, And the first member and the second member are insulators, respectively. The method of claim 2, Bonding method, characterized in that the metal is aluminum (Al). Mounting the first member on the first jig made of metal; Applying a thermosetting adhesive to the first member; Coupling a second member to the first member using a second jig made of metal; Disposing at least one of the first member and the second member inside the high frequency induction coil. The method of claim 5, Bonding method characterized in that the adhesive comprises a metal. The method of claim 6, And the first member and the second member are insulators, respectively. The method of claim 6, Bonding method, characterized in that the metal is aluminum (Al).

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