KR20090023063A - Wet processing apparatus - Google Patents

Abstract

A wet processing apparatus of the single wafer type are provided to prevent the outflow of the processing liquid and the mist or the gas generated from the processing liquid. The wet processing apparatus comprises the first chamber(1) and the second chamber(2). The second chamber is positioned in the upward or the downward of the first chamber. Openings (1a,1b) are installed at the opposing position of chambers. The elevator unit(4) is raised to the maintaining mean(3) between the first chamber and the second chamber through the opening. The switching means opens and closes the opening of the first chamber. The first feeding means(6) supplies the processing liquid to the workpiece. The second feeding means(7) supplies the processing liquid to the workpiece.

Description

Wet processing device {WET PROCESSING APPARATUS}

TECHNICAL FIELD This invention relates to the single wafer type wet processing apparatus which performs a wet process by supplying several process liquid in steps, for example, rotating a to-be-processed object, such as a semiconductor wafer and a glass substrate.

For example, in the field of electronic devices, such as a semiconductor device and a liquid crystal display panel, a semiconductor substrate, a glass substrate, a magnetic substrate, etc. are called to-be-processed object, and a washing | cleaning, film-forming, peeling, developing, etching, plating, The wet processing apparatus which processes a to-be-processed object with a process liquid at the time of performing grinding | polishing etc. is widely used.

In the wet treatment, a plurality of treatment liquids, such as sulfuric acid, ammonia-hydrogen peroxide mixed liquid, chemical liquids such as fluorine and hydrochloric acid, pure water, and the like, are used step by step according to each process. It is required to be able to handle a plurality of processing liquids with an apparatus.

In recent years, such a wet processing apparatus has been shifted from an immersion type in which a plurality of substrates are immersed in a processing liquid tank that stores a processing liquid.

The single wafer type wet processing apparatus processes one to-be-processed object, such as a board | substrate, and supplies a process liquid in the state which rotated the to-be-processed object, and performs a wet process.

For example, Japanese Patent Laid-Open No. 11-54475 discloses a single-sheet wet processing apparatus using a plurality of treatment liquids.

Such a wet processing apparatus divides an etching chamber by the movable plate and the edge of a rotating shaft while employing a sheet type for gradually supplying a plurality of processing liquids while rotating the workpiece, and recovering the processing liquid for each of the partitioned regions. In charge, the process liquid after an etching process is divided and collect | recovered for every process liquid.

By the way, in the wet treatment, as described above, various treatment liquids are used in a series of treatment steps, and for example, highly volatile, flammable, flammable, explosive, reactive, and other substances or poisons containing harmful components. This is also used a lot.

Such a processing liquid flows out of an area (a region where another processing liquid is used in a wet processing apparatus or a region other than the wet processing apparatus) outside the region where the processing liquid is used, or when another processing liquid flows in. It may adversely affect water, the wet processing apparatus itself, the human body, or the like, or cause a fire or explosion.

In particular, in the single wafer type wet processing apparatus which has become the mainstream in recent years, the object to be processed is rotated, so that the processing liquid supplied to the processing object flows out into a mist or gaseous form, or the processing liquid is scattered. easy to do.

For this reason, in the single wafer type wet processing apparatus, there is a strong demand to prevent the outflow to the outside or the inflow of other processing liquids to the processing liquids and mists and gases generated from the processing liquids.

However, in the single wafer processing apparatus of Japanese Patent Application Laid-open No. Hei 11-54475, if assuming that the processing liquid is introduced into the wet processing apparatus, a gap is generated between the movable plate and the edge of the rotary shaft. From the gap, the outflow and inflow of mist or gas generated from the treating liquid and the treating liquid occurs.

In addition, since the plurality of processing liquids are supplied step by step while the position of the workpiece is fixed, the processing regions are shared by the plurality of processing liquids, and the processing liquids and mists remaining in the processing regions are subsequently processed. There is a possibility to flow in.

For this reason, it is a present fact that it does not fully satisfy the said request.

In the conventional wet processing apparatus, the processing liquid is collected by the movable plate and the rotary shaft blade, but the movable plate and the rotary shaft blade must be provided for each area to be partitioned, and the mechanism becomes complicated. The control is also very complicated because it needs to be operated while selecting the movable plate.

Moreover, in the said conventional single wafer type | mold wet processing apparatus, when the rotation speed of the rotating holder which hold | maintains a to-be-processed object is reduced, for example, the processing liquid supplied will support the continuous support shaft which continues to the lower surface of the rotating holder from the rotating holder. It flows on the back member.

The ride-through treatment liquid may corrode the device and cause a breakdown.

In the sheet type wet processing apparatus using a plurality of treatment liquids, the present invention prevents the outflow of mist or gas generated from the treatment liquid and the treatment liquid and the inflow of other treatment liquids from the treatment liquid and the treatment liquid. It is also an object of the present invention to propose a wet treatment apparatus capable of recovering a treatment liquid and a control device of which the control liquid is simple and which can prevent corrosion of the apparatus due to the flowing treatment liquid.

The wet processing apparatus of the present invention is a single wafer type wet processing apparatus for supplying a plurality of processing liquids in a stepwise manner while rotating the object to be held in the holding means, and wet processing the first chamber and the first chamber. And a second chamber located above or below, and openings are provided at positions opposite to each other, and the holding means is lifted through the two openings between the first chamber and the second chamber. Elevating means for discharging, opening and closing means for opening and closing the opening of the first chamber, and first supply means for supplying a processing liquid to the object to be held by the holding means when the holding means is located in the first chamber. And second supply means capable of supplying a processing liquid to a workpiece to be held by the holding means when the holding means is located in the second chamber. And that is characterized.

According to the present invention, when using a treatment liquid that adversely affects an apparatus, a workpiece, a human body, or the like, such as a treatment liquid with high risk or a reactive treatment liquid, the workpiece to be held by the holding means is placed in the first chamber. The processing liquid is supplied from the first supply means while rotating the object to be processed with the opening and closing means for opening and closing the opening of the first chamber being closed.

The inside and the outside of the first chamber are blocked by the opening and closing means so that the mist and gas generated from the processing liquid and the processing liquid in the first chamber do not flow out to the outside.

When using a low-risk treatment liquid or the like, the second supply is placed while the object to be processed held by the holding means is placed in the second chamber, and the opening and closing means for opening and closing the opening of the first chamber is closed to rotate the object to be processed. The processing liquid is supplied from the means.

Since the opening of the first chamber is closed by the opening and closing means, no processing liquid or the like flows into the second chamber into the second chamber.

As a result, while adopting a single leaf type, the processing liquid easily scatters because the object is rotated, and mist and gas are generated from the processing liquid, thereby eliminating the single leaf type defect.

When moving the object to be processed between the first chamber and the second chamber, the supply of the processing liquid from each supply means is stopped, and the holding means is lifted by the lifting means with the opening / closing means of the first chamber open. .

Even when the opening / closing means is opened, the supply of the processing liquid is stopped, so that the processing liquid does not flow out of the first chamber or other processing liquid flows in.

Even if the treatment with the high-risk treatment liquid or the like and the treatment with the low-risk treatment liquid are performed continuously, the treatment can be divided into the first chamber and the second chamber, so that the mist or gas remaining in the preceding treatment is followed. Is difficult to flow into the treatment liquid.

In addition, the first chamber and the second chamber may be separate bodies each composed of independent cases, and partition one case, and one region is configured as the first chamber and the other region is configured as the second chamber. It may be an integral type.

By constructing a separate body, the distance between the first chamber and the second chamber can be adjusted, and even if mist or gas of the processing liquid remains in one chamber, the distance as described above is ensured so that Even during the opening and closing operation, it is difficult for the mist and the gas to flow in, and the movement time between the two chambers can be suppressed by leaving the distance to a minimum.

In addition, since a strongly acidic treatment liquid or the like is also used in the first chamber, corrosion is likely to occur, but by making it separate, it is also possible to replace only the first chamber.

The second chamber is characterized in that a plurality of recovery means for recovering the processing liquid are provided along the movement path of the holding means in the second chamber.

According to the present invention, when the processing is performed in the second chamber, the processing liquid is placed by the elevating means in the vicinity of the collecting means responsible for the recovery of the processing liquid, and then the processing liquid is supplied and repeated. The process by a plurality of process liquids can be performed continuously in a 2nd chamber.

The supplied processing liquid is recovered for each processing liquid by the recovery means.

As a result, treatment with a high-risk treatment liquid or the like is independently performed in the first chamber to ensure safety and the like, while treatment with a low-risk treatment liquid or the like is continuously performed in the second chamber to enable rapid treatment. Done.

The said holding means is provided with the recessed part or convex part in the lower surface.

According to this invention, even if the process liquid supplied to the to-be-processed object flows through a holding means, the process liquid which flows in and rides reaches and falls in the convex part or recessed part provided in the lower surface of a holding means.

As a result, the processing liquid can be prevented from being widened by members such as lifting means or the like disposed continuously on the lower surface or the lower surface of the holding means, and corrosion of the apparatus due to the flowing processing liquid can be prevented.

The second chamber is located above the first chamber and includes movable recovery means capable of recovering the processing liquid in the opening and operating in a direction of closing and opening the opening. It features.

According to the present invention, when the movable recovery means is located in the direction of closing the opening, the movable liquid can be recovered so that the processing liquid in the second chamber does not flow out of the opening, and the operating recovery means is located in the direction of opening the opening. The opening is widened to allow passage of the holding means.

Even if there are a plurality of treatment liquids used in the second chamber, the movable recovery means may be provided only in the opening portion, and the treatment liquid can be recovered by a simple configuration and control.

The holding means is provided with a concave portion or a convex portion at a lower surface thereof, and the second chamber is located above the first chamber so as to be able to recover the processing liquid from the opening portion and to close and open the opening portion. A movable recovery means capable of operating in a direction, wherein the convex portion or the recessed portion is provided at a position opposite to the movable recovery means when the movable recovery means is positioned and operated in the closing direction. do.

According to the present invention, when the movable recovery means is positioned in the closing direction, the holding means is provided with a convex portion or a recess at a position opposite to the movable recovery means. Is dropped into the movable recovery means and recovered.

Thereby, while spreading the process liquid flowing through, it can collect | recover the process liquid.

According to the wet processing apparatus of the present invention, when the opening / closing means of the first chamber is in the closed state, mist or gas generated from the processing liquid and the processing liquid inside the first chamber flows out to the outside, or the processing liquid of the second chamber, or the like. The situation which flows into this 1st chamber can be prevented.

Thus, even in the case where the treatment using a highly volatile, flammable, flammable, explosive, reactive treatment liquid or a treatment liquid containing noxious substances is performed, these treatments are carried out in the first chamber, whereby the target object and the wet treatment are performed. It is possible to prevent adverse effects on the device itself and the human body.

For example, the inflow of treatment liquid creates unnecessary reactants on the surface of the workpiece, the treatment liquid is attached to an external device to cause ignition or explosion, or the treatment liquid containing harmful components volatilizes, thereby impairing the safety of the human body. It is possible to prevent such a situation.

In addition, the present invention eliminates the drawback that the process liquid is easily scattered due to the rotation of the processing object or the process liquid becomes a mist or a gas and easily flows out / inflows while taking advantage of the single leaf type. A drastic performance improvement of the lobe wet processing apparatus is aimed at.

Moreover, the said effect is further exhibited by this invention being a sheet type instead of an immersion type.

For example, when the wet processing in the first chamber and the second chamber is immersed, the following problem occurs.

(1) The to-be-processed object is immersed in the processing liquid in the first chamber or the second chamber, and is discharged from the chamber as the processing liquid is excessively attached, so that the excessive processing liquid flows out of the chamber.

(2) When the to-be-processed object in the state in which the process liquid of one chamber was attached too much in this way to the other chamber, the process liquid of one chamber flows into the other chamber.

(3) In order to avoid such a point, when the to-be-processed object is left to volatilize and remove the process liquid, the processing time becomes long by the minutes of the standing time.

In contrast, according to the present invention, the wet treatment in each chamber is a single sheet type, and the following effects can be obtained.

(1) In either of the first chamber and the second chamber, the excessive processing liquid is removed by the rotation of the processing target object, so that excessive discharge of the processing liquid at the time of carrying out the processing object to the outside of each chamber can be prevented. have.

(2) Furthermore, the removal of the excessive process liquid by the said rotation prevents the situation which the process liquid of one chamber flows into the other chamber too much.

(3) Since the outflow or inflow of excess treatment liquid is avoided, the time for leaving the object to be processed is unnecessary, and the processing time does not become long.

In addition, by installing a plurality of recovery means along the movement path of the holding means in the second chamber, the treatment with the high-risk treatment liquid or the like is independently performed in the first chamber, while the treatment with the other treatment liquid is removed. It can carry out continuously in two chambers, and the processing time can be suppressed.

Further, by providing the movable recovery means in the opening of the second chamber, it is possible to prevent the outflow of the processing liquid from the opening.

Even if there are a plurality of treatment liquids used in the second chamber, the movable recovery means may be provided only in the opening portion, and the treatment liquid can be recovered by a simple configuration and control.

In addition, by forming a recessed portion or a convex portion on the lower surface of the holding means, since the process liquid flowing through reaches and falls to the recessed or convex portion, it is possible to suppress the spreading of the process liquid flowing through the process liquid. The device can be protected to prevent corrosion or breakdown.

First embodiment

Hereinafter, the wet processing apparatus S1 of this embodiment is demonstrated in detail, exemplifying a semiconductor wafer as a to-be-processed object.

1 (a), 1 (b) and 1 (c) are diagrams showing the internal structure of the wet processing apparatus S1 of the present invention.

The wet processing apparatus S1 is a single wafer type wet processing apparatus for supplying a plurality of processing liquids in a stepwise manner and wet processing while rotating the semiconductor wafer W held by the holding means 3, and the first chamber 1. And a second chamber 2 disposed above it.

Moreover, the elevating means 4 which supports and elevates the holding means 3 from below, the rotating means 5 which rotates the holding means 3, and the 1st process which supplies a process liquid from the 1st chamber 1, The supply means 6 and the 2nd supply means 7 which supply a process liquid from the 2nd chamber 2 are provided.

The 1st chamber 1 is a substantially cylindrical housing which has an upper surface part, a lower surface part, and a side part, and has the opening part 1a in the position which opposes the 2nd chamber 2, ie near the center of an upper surface part.

The opening part 1a is provided with the opening-closing means 1b which opens and closes the opening part 1a, and when it is closed, the inside and the exterior of the 1st chamber 1 are cut off, and the inside of the 1st chamber 1 is sealed. In the open state, the opening 1a is opened to allow passage of the semiconductor wafer W held by the holding means 3.

Although the opening / closing means 1b is a sliding shutter of both openings, it may be a door which opens and closes by a hinge, for example, and the form is arbitrary.

As in the present embodiment, when the elevating means 4 supports the holding means 3 from below, the opening and closing means 1b forms a through hole 1c that allows the elevating means 4 to penetrate when in the closed state. It is preferable to provide a mechanism for opening and closing the through hole 1c.

The specific structure which implements this is arbitrary, and FIG. 1 and FIG. 2 are an example.

2 (a), 2 (b) and 2 (c) are top views of the opening and closing means 1b, and Fig. 2 (a) shows a state where the through hole 1c is opened, and Fig. 2 (b) shows that 2 (c) shows a state when the opening 1a is opened while the through hole 1c is closed.

The opening-closing means 1b is equipped with the 1st opening-closing means 1b1 and the 2nd opening-and-closing means 1b2, and the 1st opening-and-closing means 1b1 is near the center in the closed state which the one member and the other member joined together. The through hole 1c is formed in the second opening, and the second opening and closing means 1b2 has a function of sliding the opening and closing hole 1 by moving on the upper surface of the first opening and closing means 1b1.

In the case where the lifting means 4 is a hanger that suspends and holds the holding means 3 from above, the through hole 1c becomes unnecessary, and the opening and closing means 1b opens in the closed state 1a. ) Can be sealed as long as it can be sealed.

The bottom part of the 1st chamber 1 is equipped with the discharge means 1d which discharges a process liquid.

The processing liquid discharged from the discharge means 1d may be returned to the recycling tank and reused.

In view of the discharge efficiency, the inner wall of the lower surface portion of the first chamber 1 is preferably inclined toward the discharge means 1d.

Moreover, it is preferable that the exhaust means 1e which exhausts an internal atmosphere and makes it the clean state is provided in the 1st chamber 1.

Further, the first chamber 1 is composed of a member having high durability to the processing liquid, for example, a fluorine-based plastic material such as PFA having chemical resistance and high temperature resistance that can withstand high temperature and strong acid processing liquid. desirable.

The second chamber 2 is a cylindrical housing having a diameter substantially the same as that of the first chamber 1, and is disposed at a position that becomes substantially coaxial above the first chamber 1.

The opening 2a is provided in a position facing the first chamber 1, that is, near the center of the lower surface portion, which is a movement path for the holding means 3 to move in the up and down direction in the second chamber 2 ( 2b).

The upper opening part 2e connected to the movement path 2b is provided in the upper surface part of the 2nd chamber 2, and this upper opening part 2e completes the function of an air vent, and makes an internal atmosphere high efficiency and simultaneously, It is possible to clean at a high level.

A plurality of recovery means 2c for recovering the processing liquid are provided in the second chamber 2 at predetermined intervals along the movement path 2b.

The recovery means 2c may be any one as long as it can recover the processing liquid for each processing liquid. In this embodiment, the planar donut-shaped plate member is concentric in shape so as to protrude from the inner wall of the side part of the second chamber 2. It is installed and configured.

In this embodiment, plural (three) recovery means 2c are provided, thereby partitioning the inside of the 2nd chamber 2 into plural (three) areas, and the process in charge for each area | region (for example, For example, treatment with an acidic treatment liquid, treatment with an alkaline treatment liquid, rinse treatment and drying) are determined.

The recovery means 2c is inclined so that the movement path 2b side becomes high, and an upward protrusion is formed at the side end of the movement path 2b so as to have an L-shaped cross section, and the processing liquid is moved to the movement path 2b. It is desirable to make it difficult to spill.

Moreover, it is preferable to provide the discharge means (not shown) which discharges the process liquid collect | recovered by each collection means 2c.

Moreover, it is preferable to provide the exhaust means 2d which exhausts an internal atmosphere for each area | region divided or over several area | regions in each plate-shaped collection | recovery means 2c.

In addition, the position of the 1st chamber 1 and the 2nd chamber 2 is determined by the fixing means (not shown) which fixes the position of both chambers 1 and 2, and the 1st chamber 1 and the 1st chamber A predetermined distance is provided between the two chambers 2.

In addition, it is preferable that both chambers 1 and 2 are attached to the fixing means in a detachable manner.

Thus, when one chamber 1 or 2 is to be replaced, only the chamber 1 or 2 desired to be removed from the fixing means can be replaced.

In particular, the first chamber tends to easily generate corrosion and the like due to the strong acid treatment liquid and have a shorter lifetime than the second chamber. However, the second chamber 2 continues to be used, and thus the first chamber is used. (1) It becomes possible to exchange only.

The holding means 3 has a function of holding the semiconductor wafer W from below to expose the processing surface.

Although the holding means 3 is a disk shape of the diameter substantially the same as the semiconductor wafer W in this embodiment, the shape may be anything.

The elevating means 4 has a function of elevating the semiconductor wafer W through the two openings 1a and 2a between the first chamber 1 and the second chamber 2.

Specifically, the lifting means 4 has a support shaft shape, penetrates the lower surface portion of the first chamber 1 from below the first chamber 1, and axially supports the center of the lower surface of the holding means 3, The holding means 3 can be moved up and down by expansion and contraction.

The penetration point of the elevating means 4 in the first chamber 1 is sealed tightly, and no processing liquid or gas leaks out.

The rotation means 5 is a motor etc. which are arrange | positioned under the support shaft lifting means 4, The holding means 3 is transmitted by transmitting power to the holding means 3 via the lifting means 4. It has the ability to rotate.

The first supply means 6 has a function of supplying the processing liquid to the semiconductor wafer W held by the holding means 3 when the holding means 3 is located in the first chamber 1, The second supply means 7 has a function of supplying the processing liquid to the semiconductor wafer W held by the holding means 3 when the holding means 3 is located in the second chamber 2.

Either supply means 6 and 7 are comprised by the nozzle introduce | transduced inside from the chamber exterior.

The 1st supply means 6 is provided so that the 1st chamber 1 may penetrate, and it is possible to control the position in a horizontal direction, and the discharge timing of a process liquid.

The penetration point is sealed tightly so that mist and gas do not leak.

The 2nd supply means 7 is inserted inside using the upper opening 2e of the 2nd chamber 2, and the height position and the kind of discharged process liquid, and discharge timing are controllable.

The wet processing apparatus S1 is used as follows.

The processing using the processing liquid which may adversely affect the apparatus, the semiconductor wafer W, and the human body is performed in the first chamber 1 (Fig. 1 (a)), and the processing using the other processing liquid is performed in the second chamber ( 2) (FIG. 1 (b)).

Examples of the treatment liquid used in the first chamber 1 include (1) spontaneous ignition and emphysema (risk of ignition in the air or the risk of igniting in contact with water or generating flammable gas). ), (2) flammable, (3) self-reactive (with risk of explosion or severe overheating), (4) oxidative (liquid and with potential risk of oxidizing power) Treatment liquids such as

Moreover, the processing liquid containing the component which acts as a poison or a foreign substance, such as impairing the health of a human body or making the semiconductor wafer W or an apparatus deteriorate, can be illustrated.

These include, at least, certain dangerous substances determined by the Fire Services Act, treatment liquids composed of poisons and minerals determined by the Toxic Chemical Substances Control Act, and specific chemical substances determined by laws such as regulations on the examination and manufacture of chemical substances. The processing liquid to be contained is included.

Also included is a processing liquid that reacts with another processing liquid to produce a reaction product and contaminate the semiconductor wafer W or the device.

When using these process liquids, as shown to Fig.1 (a), the semiconductor wafer W hold | maintained by the holding means 3 is located in the 1st chamber 1, and the opening-closing means 1b is closed. It is called state.

When the opening-closing means 1b forms the through hole 1c, the said through hole 1c is also called a closed state.

Thereafter, the processing liquid is supplied by the first supply means 6 while rotating the semiconductor wafer W by the rotation means 5.

Since the outside and the inside of the 1st chamber 1 are interrupted | blocked by the opening-closing means 1b, the mist and the gas which generate | occur | produce from the process liquid and process liquid in the 1st chamber 1 do not flow out.

When using other processing liquids or the like, the semiconductor wafer W held by the holding means 3 is placed in the second chamber 2 as shown in FIG. The opening-closing means 1b of this is called closed state.

When the opening / closing means 1d forms the through hole 1c, the first opening / closing means 1b1 is closed and the second opening / closing means 1b2 is opened. It penetrates through the hole 1c.

Thereafter, the processing liquid is supplied by the second supply means 7 while rotating the semiconductor wafer W by the rotation means 5.

Since the outside and the inside of the first chamber 1 are blocked by the opening and closing means 1b, mist or gas generated from the processing liquid and the processing liquid in the second chamber 2 flows into the first chamber 1. There is nothing to do.

At this time, depending on the processing liquid to be used, the semiconductor wafer W is brought close to the vicinity of the recovery means 2c (the vicinity of the region where the recovery means 2c is the lower partition) responsible for the recovery of the processing liquid. Then, the processing liquid is supplied.

By bringing the semiconductor wafer W closer to the recovery means 2c, not only can the mist generated from the processing liquid or the processing liquid be recovered by the predetermined recovery means 2c, but also the recovery rate can be increased.

In addition, it is preferable to keep the atmosphere in the second chamber 2 in a clean state by exhausting the internal atmosphere by the exhaust means 2d.

At this time, if it has the upper opening 2e like the 2nd chamber 2 of this embodiment, this can act as a vent and can implement a clean state with high level and high efficiency.

In addition, in the case where a plurality of treatments with a treatment liquid such as non-reactivity or low volatility are carried out continuously, the second chamber 2 is continuously performed.

For example, when the processing liquid b is used after the processing liquid a, the semiconductor wafer W is first placed in the vicinity of the recovery means 2c that is responsible for the recovery of the processing liquid a, and then the processing liquid a is supplied. It arrange | positions in the vicinity of the collection | recovery means 2c which collect | recovers the process liquid b, and supplies the process liquid b.

At this time, the movement of the semiconductor wafer W is only an up and down movement in the second chamber 2, while a high-risk treatment liquid or the like is independently performed in the first chamber 1, the processing is performed in the second chamber 2. It is performed quickly and suppression of processing time is achieved.

When the semiconductor wafer W is moved between the first chamber 1 and the second chamber 2, the supply of the processing liquid from the respective supply means 6, 7 as shown in FIG. 1C. It stops, moves the 1st supply means 6 to the position which deviates from the movement path of the semiconductor wafer W, and raises and lowers the holding means 3 with opening / closing means 1b of the 1st chamber 1 open. Let's do it.

Even when the opening / closing means 1b is in the open state, the supply of the processing liquid is stopped, so that the processing liquid does not flow out of the first chamber 1 or other processing liquid flows in.

In the case where the treatment with the high risk treatment liquid and the like and the treatment with the low risk treatment liquid are carried out continuously, the semiconductor wafer W can be moved to execute the respective treatments in the other chambers 1 and 2. Therefore, residual mist or gas of the preceding treatment is difficult to flow into the subsequent treatment.

In addition, in this embodiment, since there is a distance between the 1st chamber 1 and the 2nd chamber 2, even if the opening / closing operation | movement of the opening-closing means 1b, the residual mist etc. are different chambers 1 and 2 Hard to get into

In addition, by keeping the distance to a minimum, the movement time between the chambers 1 and 2 is suppressed.

2nd Embodiment

3 is a diagram illustrating the wet processing apparatus S2 of the present embodiment.

In addition to the said embodiment, the wet processing apparatus S2 is provided with the movable collection means 2f which collect | recovers the process liquid from the opening part 2a in the 2nd chamber 2, and the lower surface of the holding means 3 The convex part 3a is provided in this.

Hereinafter, description of the same parts as in the first embodiment will be omitted using the same reference numerals.

The movable retrieval means 2f is provided in the opening part 2a of the 2nd chamber 2, and is operable in the A direction which closes the opening part 2a, and the B direction which opens.

The movable recovery means 2f of the present embodiment may be realized by two plate members sliding horizontally along the outer wall of the lower surface of the second chamber 2 or by other mechanisms.

In the movable recovery means 2f composed of two plate-shaped members, the planar shape of each plate-shaped member is a semi-donut shape, and when the plate-like member is moved toward the closing A direction, both plate-shaped members are combined to form a donut shape. The lifting means 4 penetrates the through hole.

The end of the side of the through-hole is formed with a projection and has a cross-sectional L-shape, so that the recovered processing liquid does not flow into the opening 2a.

The lower part of the holding means 3 is provided with the convex part 3a.

Although the shape of the convex part 3a is arbitrary, in this embodiment, the convex part 3a of fixed width and height is provided in concentric shape near the lower end part of the holding means 3.

It is preferable in that it is possible to narrow the range in which the processing liquid rides by providing near the end of the lower surface, and it is provided in a concentric shape, so that the processing liquid surrounds the elevating means 4 and the elevating means 4 or its connecting point. It is preferable at the point that it can be made not to reach | attain etc.

Moreover, it is preferable that the position of the convex part 3a opposes the movable collection means 2f when it moves to the A direction which closes the movable collection means 2f.

As a result, the processing liquid dropped from the convex portion 3a is recovered by the movable recovery means 2f.

The convex portion 3a may be a concave portion instead of the convex portion 3a, or a convex portion and the concave portion may be combined.

In addition, although the opening / closing means 1b of the 1st chamber may be the same as the said 1st Embodiment, when it is equipped with the movable collection | recovery means 2f, as shown to Fig.4 (a), it is a closed state. In this case, the opening 1a may be sealed without forming the vent hole 1c.

Next, operation | movement of wet processing apparatus S2 is demonstrated.

As shown in Fig. 3A, when the processing is performed in the first chamber 1, the processing liquid flows from the semiconductor wafer W to the holding means 3, but the processing liquid flows through the convex portion ( It reaches 3a) and falls.

Thereby, expansion of the process liquid which rides on can be suppressed, and the lower surface of the holding means 3 and the elevating means 4 following it can be protected from a process liquid.

As shown in Fig. 2 (b), when the processing is performed in the second chamber 2, the movable recovering means 2f of the second chamber 2 is moved in the A direction to close the opening 2a. Narrow it.

At this time, it is preferable to operate the movable recovery means 2f until the convex portion 3a becomes a position facing the movable recovery means 2f.

Thereby, the process liquid falling from the convex part 3a is reliably collect | recovered by the movable collection means 2f, and does not flow out from the 2nd chamber 2. As shown in FIG.

The processing liquid recovered by the movable recovery means 2f is discharged by a discharge means not shown.

In addition, when the rotation of the semiconductor wafer W is high speed, the recovery means 2c tends to be almost recovered, and when the rotation speed is low, the processing liquid tends to flow in and the movable recovery means 2f is low. It may be moved in the direction of A to close only in the case of rotation.

The low speed rotation can (1) suppress generation of static electricity.

(2) There is an effect such that the processing liquid stays on the surface of the semiconductor wafer W for a long time, and according to the wet processing apparatus S2, the semiconductor wafer W is turned at low rotation, and the above effect is exerted. The expansion of the processing liquid flowing through the holding means 3 can be suppressed to prevent corrosion of the apparatus.

At this time, although the 1st opening / closing means 1b is in the closed state, the lifting means 4 is sandwiched between the one side member and the other side member of the opening and closing means 1b, as shown in FIG. 4 (b). Similarly, a gap of that width occurs.

However, since the processing liquid of the second chamber 2 is recovered by the movable recovery means 2f, the possibility of flowing into the second chamber 2 from the gap is extremely low.

For this reason, it is also possible to make the 1st opening / closing means 1b open.

However, if the opening / closing means 1b is moved in the direction A to close, even if a mist or gas leaks from the second chamber 2, the mist or gas will flow into the first chamber 1. Since it is difficult, it is preferable from the viewpoint of ensuring perfection.

In addition, as in the first embodiment, the through hole 1c is preferably provided to enable the opening 1a to be sealed.

As shown in FIG. 3C, when the semiconductor wafer W is lifted between the first chamber 1 and the second chamber 2, the movable recovery means 2f is moved in the direction B to open. The opening 2a is made wide.

As a result, passages of the semiconductor wafer W and the holding means 3 are secured, and the lifting and lowering is possible.

In addition, the wet processing apparatus S2 may be provided with only one of the convex part 3a and the movable collection | recovery means 2f.

Even when only the convex part 3a is provided, expansion of the process liquid which rides through can be suppressed.

In this case, however, it is necessary to make the opening and closing means 1b of the first embodiment, and to prevent the inflow of the processing liquid falling.

In addition, even when only the movable recovery means 2f is provided, an effect of recovering the falling processing liquid and preventing the inflow into the first chamber can be obtained.

Third embodiment

5 (a), 5 (b) and 5 (c) are diagrams showing the internal structure of the wet processing apparatus S3 of the present embodiment.

The wet processing apparatus S3 has a structure in which the first chamber 1 is located above the second chamber 2.

Hereinafter, only the thing different from the said embodiment is demonstrated, the same code | symbol is attached | subjected about the same part, and description is abbreviate | omitted.

The opening portion 1a of the first chamber 1 is provided near the center of the lower surface portion, and the upper opening portion 2e serves as the opening portion 2a of the second chamber 2.

Opening and closing means 1b (1b1, 1b2) are provided in the opening 1a of the first chamber 1 similarly to the first embodiment.

Since the lower surface part of the 2nd chamber 2 is closed so that the lifting means 4 may penetrate without opening, the movable collection means 2f in the said embodiment is unnecessary.

When the process is performed in the first chamber 1, as shown in FIG. 5 (a), the opening / closing means 1b is closed to prevent the outflow of the processing liquid, mist or gas in the first chamber 1. And the processing liquid in the second chamber 2 with the opening / closing means 1b (1b1, 1b2) closed, as shown in FIG. 5 (b) when processing in the second chamber 2. In addition, it is the same as that of the said embodiment regarding the point which prevents inflow of mist and gas into the 1st chamber 1. As shown in FIG.

In addition, the opening-closing means 1b is provided inside the first chamber, is lowered stepwise toward the discharging means 1d, and the processing liquid flows easily.

When raising and lowering the semiconductor wafer W, as shown in FIG. 5C, the second supply means 7 is separated from the moving path of the semiconductor wafer W, and the opening and closing means 1b is opened. .

It is discharged by the discharge means 1d, and the processing liquid of the first chamber 1 does not flow out to the second chamber 2.

Fourth embodiment

FIG. 6: is a figure which shows the internal structure of wet processing apparatus S4 of this embodiment.

The wet processing apparatus S4 partitions one case, and is an integrated type comprised by the 1st chamber 1 in one area | region and the 2nd chamber 2 in the other area | region.

The opening-closing means 1b is provided in the upper lower surface of the 1st chamber 1, and the movable collection means 1f are installed in the lower surface part inside of the 2nd chamber 2 (upper surface of the lowest collection | recovery means 2c1). It is becoming.

Both chambers 1 and 2 are partitioned by the recovery means 2c1 at the bottom of the second chamber 2 and the opening and closing means 1b for opening and closing the opening 1a.

By configuring both chambers 1 and 2 in one case, adjustment of positioning of both chambers 1 and 2 is unnecessary.

Since operation | movement is substantially the same as 2nd Embodiment, description is abbreviate | omitted.

Next, the case where the wet process of the semiconductor wafer W is performed using the wet processing apparatus S2 of the said 2nd Embodiment is demonstrated as an example.

Wet processing on a semiconductor wafer can be divided into four processes: resist removal, pre-cleaning, polymer removal, and etching.

(1) resist removal process

In removing the resist, for example, a treating solution containing at least one of sulfuric acid, hydrogen peroxide, ozone water, and the compound as a component is used.

These are poisons and dramas and are very dangerous.

In particular, sulfuric acid is often used at a high temperature of about 100 ° C or higher.

In addition, due to the high temperature, steam of the processing liquid is easily generated, adversely affecting the human body, and there is a risk of corroding the members (particularly metal members) constituting the apparatus.

Thus, when these treatment liquids are used in the resist removal step, especially when the acidic treatment liquid is used at a temperature of 100 ° C. or higher, it is performed in the first chamber 1.

In this case, the first chamber is preferably made of a fluorine-based plastic material such as PFA having chemical resistance and high temperature resistance.

The processing steps are shown in Figs. 7A and 7B.

As shown in Fig. 7A, first, the treatment with the resist removing treatment liquid is performed in the first chamber.

The semiconductor wafer W is held in the holding means 3 and placed in the first chamber 1.

The opening-closing means 1b is made into the closed state, and the 1st chamber 1 is closed.

After that, while rotating the semiconductor wafer W through the holding means 3 by the rotating means 5, the processing liquid for removing the resist is supplied to the semiconductor wafer W from the first supply means 6, Perform resist removal.

Since the opening-closing means 1b is in the closed state, the processing liquid for removing a resist does not flow out.

When the removal is completed, the supply and rotation of the processing liquid are stopped.

Since the processing liquid is appropriately removed by the rotation by the rotating means 4, the processing liquid does not remain too much in the semiconductor wafer W as in the immersion type, so that the semiconductor wafer W is moved outside the first chamber 1. You can reduce the risk when you take them out.

In addition, the used process liquid is discharged by the discharge means 1d, and the atmosphere in the first chamber 1 is exhausted by the exhaust means 1e.

Thereafter, as shown in Fig. 7B, the second chamber 2 performs the treatment with the rinse processing liquid.

First, the opening-closing means 1b and the movable recovery means 2f are left open, and the lifting means 4 carries the semiconductor wafer W into the second chamber 2 to rinse the treatment liquid (pure water). Etc.) is located in the vicinity of the recovery means 2c (here, the recovery means of the lowest position of the three-stage configuration) in charge of the recovery.

Thereafter, the opening and closing means 1b and the movable recovery means 2f are placed in the closed state.

And the process liquid for rinse is supplied by the 2nd supply means 7, rotating the semiconductor wafer W by the rotation means 3. As shown in FIG.

The supplied rinse processing liquid flows through the holding means 3 and reaches and drops the convex portion 3a. However, the dropped rinse processing liquid is recovered by the movable recovery means 2f, and thus flows out. It doesn't.

When the rinse processing is completed, the supply of the processing liquid is stopped while the rotation is continued, and the processing liquid is removed from the semiconductor wafer W to perform a drying process.

(2) process of polymer removal

When the polymer is removed after the dry etching treatment, for example, organic compounds such as dimethyl sulfoxide (DMSO), ethanol, methanol, alcohols of isopropyl alcohol, and hydroxylamine (hydroxylamine). ), A treatment liquid containing at least one of inorganic compounds such as ammonium fluoride and amine as a component is used.

Many of these have flammability and self-reactivity.

For example, since methanol, methanol, and isopropyl alcohol have a flash point lower than room temperature degree, it is necessary to isolate it from the electrical wiring location, a mechanical drive, and a friction point which may be a source of ignition.

Therefore, since it contains a component with a low flash point, the process using the polymer removal process liquid whose flash point becomes the room temperature degree or less as the whole chemical liquid is performed in the 1st chamber 1.

The operation of the wet processing apparatus S2 is the same as in the case of removing the resist, but the processing liquid supplied into the first chamber 1 becomes the processing liquid for removing the polymer.

The explanatory drawing is omitted since it is the same as in Figs. 7 (a) and 7 (b).

(3) cleaning process and etching process

In the cleaning step or the etching step, the semiconductor wafer W is washed with a fluorine-based treatment liquid containing dilute hydrogen fluoride or the like, followed by rinsing with pure water, followed by a treatment liquid containing isopropyl alcohol (IPA). There is a case of performing a drying treatment by.

Since the fluorine-based treatment liquid completely removes SiO 2 from the surface of the semiconductor wafer and finally makes the wafer surface hydrophobic, pure water at the surface of the wafer after rinsing with the fluorine-based treatment liquid (watermark) ) Is likely to remain.

Therefore, after the treatment with the fluorine-based treatment liquid, drying with the IPA-containing treatment liquid for the purpose of watermark prevention is performed.

The fluorine-based treatment liquid and the rinse treatment liquid are nonflammable, but the IPA-containing treatment liquid has a flash point having a low flash point of 12 ° C.

For this reason, when an IPA containing process liquid scatters and reaches the place where an electrical system, friction, and abrasion generate | occur | produce, there exists a danger of ignition explosion.

Thus, the treatment and rinse treatment using the fluorine-based treatment liquid are performed in the second chamber 2, and the treatment using the IPA-containing treatment liquid is performed in the first chamber 1.

The member constituting the first chamber 1 is preferably a member that is less likely to generate static electricity which may cause a ignition, and is, for example, stainless steel or the like.

In addition, about the flammable process liquid, it is preferable to handle the thing with a flash point of 30 degrees C or less in the 1st chamber 1. As shown in FIG.

The processing steps are shown in Figs. 8 (a), (b), (c) and (d).

Since the operation in each chamber is the same as above, detailed description is omitted.

As shown in Fig. 8 (a), first, in the second chamber 2, the recovery means 2c responsible for the recovery of the fluorine-based processing liquid from the semiconductor wafer W (the recovery means at the uppermost position in the three-stage configuration ( 2c)), the treatment using the fluorine-based treatment liquid is performed.

Subsequently, as shown in Fig. 8 (b), the semiconductor wafer W is lowered by the elevating means 3 to recover the rinse processing liquid 2c (collecting means at the lowest position in the three-stage configuration) 2c)) to perform the treatment using the rinse treatment liquid.

Since the fluorine treatment and the rinse treatment are performed in the second chamber 2, the movement between them can be completed shortly, and the processing time can be shortened and a high rinsing effect can be obtained.

Since the movable recovery means 2f and the opening and closing means 2b are in a closed state, the fluorine-based processing liquid and the rinse processing liquid do not flow into the first chamber 1.

Subsequently, as shown in FIG. 8C, the semiconductor wafer W is positioned in the first chamber 1 to perform a process using the IPA-containing processing liquid.

Although the IPA-containing processing liquid is flammable, since the opening / closing means 1b is in a closed state, the IPA-containing processing liquid does not scatter to the outside even when the semiconductor wafer W rotates, and mist or gas does not flow out, thereby ensuring safety.

Thereafter, as shown in Fig. 8 (d), the supply of the IPA treatment liquid by the first supply means is stopped while the rotation of the semiconductor wafer is continued, and the position of the first supply means is positioned above the semiconductor wafer W. Depart from

Even in this case, the IPA-containing treatment liquid is likely to scatter or rotate due to mist and gas. However, since the opening / closing means 1b is in a closed state, safety is secured without flowing out.

As mentioned above, although the Example using wet processing apparatus S2 of this embodiment was described, the process to be performed and the order of a process are not limited to this, It can change suitably.

In addition, in the said embodiment, although the semiconductor wafer was used as a to-be-processed object, it is not limited to this, For example, as long as it is a board | substrate shape, such as a glass substrate and a magnetic substrate, it is good.

BRIEF DESCRIPTION OF THE DRAWINGS It is a figure which shows the internal structure of the wet processing apparatus of 1st Embodiment, (a) when processing in a 1st chamber, (b) when processing in a 2nd chamber, (c) is a 1st chamber. It is a figure when the semiconductor wafer W is moved between and a 2nd chamber.

2 is a top view of the opening and closing means used in the wet processing apparatus of the above embodiment, (a) a state where the through hole is opened, (b) a state where the through hole is closed, and (c) a state where the opening and closing means is open. Illustrated.

3 is a view showing the internal structure of the wet processing apparatus of the second embodiment, (a) when processing in the first chamber, (b) when processing in the second chamber, (c) is the first chamber It is a figure when the semiconductor wafer W is moved between and a 2nd chamber.

4 is a top view of the opening and closing means used in the wet processing apparatus of the above embodiment, (a) is a state in which the opening and closing means are closed to seal the opening, and (b) is closed so that the opening and closing means is in contact with the lifting means. State, (c) shows the open state of the opening and closing means.

5 is a view showing the internal structure of the wet processing apparatus of the third embodiment, (a) when processing in the first chamber, (b) when processing in the second chamber, (c) is the first chamber It is explanatory drawing explaining the case where the semiconductor wafer W is moved between and a 2nd chamber.

It is a figure which shows the internal structure of the wet processing apparatus of 4th embodiment.

7 is an explanatory diagram for explaining a processing step of Example 1. FIG.

It is explanatory drawing explaining the processing process of FIG.

<Explanation of symbols for the main parts of the drawings>

S1 to S4 wet processing apparatus

1 first chamber

1a opening

1b opening and closing means

1c through hole

1d discharge means

1e exhaust means

2 second chamber

2a opening

2b breadcrumb

2c recovery means

2d exhaust means

2e upward opening (vent)

2f movable recovery means

3 maintenance means

3a convex

4 lifting means

5 rotating means

6 First supply means

7 Second supply means

Claims (6)

In the single-sheet wet processing apparatus for supplying a plurality of processing liquids in a stepwise manner while rotating the object to be held in the holding means, for wet processing. A first chamber and a second chamber positioned above or below the first chamber, and openings are provided at positions facing each other, Elevating means for elevating the holding means through the two openings between the first chamber and the second chamber; Opening and closing means for opening and closing the opening of the first chamber; First supply means capable of supplying a processing liquid to a workpiece to be held by the holding means when the holding means is located in the first chamber; Second supply means capable of supplying a processing liquid to a workpiece to be held by the holding means when the holding means is located in the second chamber; Wet processing apparatus comprising a. The method of claim 1, The second chamber, A plurality of recovery means for recovering a processing liquid are provided in the chamber along a moving path of the holding means. The method according to claim 1 or 2, In the holding means, The wet processing apparatus characterized by the recessed part or convex part provided in the lower surface. The method according to claim 1 or 2, The second chamber, And a movable recovery means located above the first chamber and capable of recovering the processing liquid from the opening, and operable in a direction of closing and opening the opening. . The method according to claim 1 or 2, The holding means is provided with a concave portion or a convex portion on the lower surface thereof, The second chamber, It is located above the first chamber, and is provided with a movable recovery means capable of recovering the processing liquid from the opening, and operable in the direction of closing and opening the opening, The convex portion or the concave portion, When the movable recovery means of the opening is located in the direction of closing, the wet processing device is provided at a position opposite to the recovery means. The method of claim 3, The second chamber, And a movable recovery means located above the first chamber and capable of recovering the processing liquid from the opening, and operable in a direction of closing and opening the opening. .

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