KR20090021843A - Exothermic structure of pcb board - Google Patents

Exothermic structure of pcb board Download PDF

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Publication number
KR20090021843A
KR20090021843A KR1020070086703A KR20070086703A KR20090021843A KR 20090021843 A KR20090021843 A KR 20090021843A KR 1020070086703 A KR1020070086703 A KR 1020070086703A KR 20070086703 A KR20070086703 A KR 20070086703A KR 20090021843 A KR20090021843 A KR 20090021843A
Authority
KR
South Korea
Prior art keywords
pcb board
heat
heat dissipation
generating element
pcb
Prior art date
Application number
KR1020070086703A
Other languages
Korean (ko)
Inventor
이동영
Original Assignee
엘지이노텍 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엘지이노텍 주식회사 filed Critical 엘지이노텍 주식회사
Priority to KR1020070086703A priority Critical patent/KR20090021843A/en
Publication of KR20090021843A publication Critical patent/KR20090021843A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the PCB

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

The present invention relates to a heat dissipation structure of a PCB board for dissipating heat generated in a device mounted on the PCB board.

The present invention is a PCB board; At least one heat dissipation unit is formed in a hole shape in the lower portion of the heat generating element so as to discharge the heat generated by the heat generating element mounted on the PCB board to the outside.

According to the present invention, the heat generated in the device mounted on the PCB board by the hole formed in the lower portion of the PCB board can be effectively dissipated. Therefore, since the device is protected against heat, it is possible to prevent malfunction or destruction of the device, thereby improving the reliability of the circuit.

Description

Heat dissipation structure of PC board {EXOTHERMIC STRUCTURE OF PCB BOARD}

1 is an exploded perspective view of a PCB for explaining a heat radiation structure of a conventional PCB pad.

2 is a coupled state of FIG.

3 is a plan view of a PCB for explaining a heat radiation structure of a PCB board according to an embodiment of the present invention.

Figure 4 is an enlarged perspective view showing the main portion of FIG.

<Description of the code used in the main part of the drawing>

101: PCB

102: device

103: pad

10: PCB board

20: hall

21: curve

The present invention relates to a heat dissipation structure of a PCB board for dissipating heat generated in a device mounted on the PCB board.

In general, the PCB excludes the connection of conventional components by individual wires, and forms a conductive path of the circuit by printing a conductive metal pattern on the substrate, which is essential for the integration of circuits. It is applied to electronic and electric circuits.

When the device is mounted on the PCB and power is supplied, heat is inevitably applied to the device. In particular, since equipment such as a microprocessor, a FET, a regulator, and the like are malfunctioning due to the heat, a variety of techniques for heat dissipation have been actively conducted.

In particular, due to the active development of surface mount devices (SMDs), as many devices (components) are developed to be mounted on a single PCB, the heat generated from one component may be transferred to other components. Influences may occur.

Conventionally, a separate device (heat sink, cooler, etc.) was used to solve the heating problem of the device mounted on the PCB.

1 is an exploded perspective view of a PCB for explaining a heat dissipation structure of a conventional PCB pad, Figure 2 is a coupling state diagram of FIG.

Referring to FIGS. 1 and 2, the device mounting method according to the related art includes mounting the device 102 on one side of the PCB 101 and soldering the lead of the device 102 drawn on the other surface. And the PCB 101 at the same time as the device 102 is electrically connected due to the pattern formed on the PCB 101.

In addition, after the pad 103 for dissipating the device 102 is coupled between the device 102 and the PCB 101, the device 102 and the pad 103 are bonded to each other.

However, by sequentially mounting the pad and the device on the top of the conventional PCB, it does not sufficiently dissipate heat generated in the device. That is, although the pad is installed to dissipate heat generated in the device, there is a problem in that sufficient heat dissipation effect by the pad is not obtained because the effect of thermal insulation occurs between the PCB and the device.

The present invention can effectively dissipate heat generated in the device mounted on the PCB board.

The present invention is a PCB board; At least one heat dissipation unit is formed in a hole shape in the lower portion of the heat generating element so as to discharge the heat generated by the heat generating element mounted on the PCB board to the outside.

Here, the heat radiating portion is preferably a + -shaped hole formed in the lower portion of the heat generating element.

Hereinafter, exemplary embodiment (s) of the present invention will be described in detail with reference to the accompanying drawings.

3 is a plan view of a PCB for explaining a heat dissipation structure of a PCB board according to an embodiment of the present invention, Figure 4 is an enlarged perspective view showing the main portion of FIG.

The heat dissipation structure of the PCB board of the present invention with reference to Figures 3 and 4 and the PCB board 10; A heating element 20 mounted on the PCB board 10; It comprises a heat dissipation unit 30 for dissipating heat generated by the heat generating element 20 to the outside.

Here, the heat generating element 20 is an IC, a FET, an inductor, or the like. In addition, the heat dissipation unit 30 allows the heat generating element 20 to easily contact external air, thereby dissipating heat generated from the heat generating element 20 to the outside.

The heat dissipation unit 30 is preferably a + -shaped hole formed in the lower portion of the heat generating element (20).

Here, the + -shaped hole can be easily installed without the heating element 20 falling into the + -shaped hole.

In addition, the + -shaped hole is preferably formed as large as the width of the heating element 20, but may be formed larger than the width of the heating element 20 may further improve the heat dissipation effect.

In addition, a plurality of + -shaped holes may be formed by the width of the heat generating element 20. At this time, by forming a plurality of holes to increase the area of the heat generating element 20 in contact with the air can increase the effect of heat generation.

On the other hand, if a certain gap is formed between the heat generating element 20 and the + -shaped hole, the air can be more easily flowed.

It is preferable that the inner side surface 31 of the + -shaped hole is formed in a curved line.

Here, the flow of air is smoothly formed by the inner surface 31 of the hole formed in a curve can be easily generated. That is, the vortex is formed by the curve of the + -shaped hole formed to face in a predetermined direction from the center of the bottom surface of the heat generating element 20 so that the air flows smoothly so that the heat generated from the heat generating element 20 can be easily radiated to the outside. Can be.

In addition, the EMI generated from the outside does not collect in the heat generating element, and flows in the external direction along the curve of the hole, thereby protecting the FET, inductor, etc. which are the heat generating elements 20 from EMI.

As described above, in the detailed description of the present invention, specific embodiment (s) have been described, but various modifications are possible without departing from the scope of the present invention. Therefore, the scope of the present invention should not be limited to the described embodiment (s), but should be defined by the claims below and equivalents thereof.

According to the present invention, the heat generated in the device mounted on the PCB board by the hole formed in the lower portion of the PCB board can be effectively dissipated.

In addition, according to the present invention, the area of the element contacted with air by the + -shaped hole increases, and the device can be easily installed without falling into the + -shaped hole.

In addition, in the present invention, the inner surface of the + -shaped hole is formed in a curved line so that the vortex phenomenon of the air is generated by the heat generated in the device so that the air flows easily, and thus the heat dissipation of the device can be more effectively achieved.

As described above, the device is protected against heat, whereby malfunction or destruction of the device can be prevented, thereby improving the reliability of the circuit.

Claims (6)

PCB board; A heat dissipation structure of a PCB board including at least one heat dissipation portion formed in a hole shape in the lower portion of the heat generating element so as to discharge heat generated in the heat generating element mounted on the PCB board to the outside. According to claim 1, wherein the hole shape of the heat radiating portion is Heat dissipation structure of the PCB board, characterized in that the + -shaped hole. The hole shape of claim 1 or 2, wherein The heat dissipation structure of the PCB board, characterized in that the inner surface is formed in a curve. The method according to claim 1 or 2, The heat dissipation structure of the PCB board, characterized in that the hole of the heat dissipation unit does not fall out. The method according to claim 1 or 2, The heat dissipation structure of the PCB board, characterized in that the hole of the heat dissipation unit is formed in a size larger than the width of the heating element. The method according to claim 1 or 2, The heat dissipation structure of the PCB board, characterized in that to form a certain gap between the hole of the heat dissipation portion and the heat generating element.
KR1020070086703A 2007-08-28 2007-08-28 Exothermic structure of pcb board KR20090021843A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020070086703A KR20090021843A (en) 2007-08-28 2007-08-28 Exothermic structure of pcb board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020070086703A KR20090021843A (en) 2007-08-28 2007-08-28 Exothermic structure of pcb board

Publications (1)

Publication Number Publication Date
KR20090021843A true KR20090021843A (en) 2009-03-04

Family

ID=40691813

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020070086703A KR20090021843A (en) 2007-08-28 2007-08-28 Exothermic structure of pcb board

Country Status (1)

Country Link
KR (1) KR20090021843A (en)

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