KR20090021694A - Light emitting diode package and method of fabricating the same - Google Patents

Abstract

The present invention provides a light emitting diode package having a lens on the housing. The package includes a housing having a cavity, an LED chip mounted in the cavity, and a lens that protrudes above the housing onto the LED to form a conical lens surface. According to the present invention, by forming a lens having a conical lens surface, it is possible to provide a light having a low directivity angle for applications requiring local illumination.

Description

LIGHT EMITTING DIODE PACKAGE AND METHOD OF FABRICATING THE SAME}

The present invention relates to an optical device and a method of manufacturing the same, and more particularly, to a light emitting diode package and a method of manufacturing the same.

Light emitting diodes have recently been applied to various lighting fields in that they consume less power and can be miniaturized.

Typically, a light emitting diode package includes an LED chip mounted on a lead frame or a PCB substrate and a housing protecting the LED chip, and a lens for refraction of light is formed on the LED chip.

An object of the present invention is to provide a light emitting diode having a narrow distribution angle (direction angle) of light and a manufacturing method thereof.

Another technical problem to be solved by the present invention is to provide a light emitting diode package having a durable lens and a method of manufacturing the same.

Another technical problem to be solved by the present invention is to provide a light emitting diode package and a method of manufacturing the same that can prevent the lens position error.

In order to solve the above problems, the present invention provides a light emitting diode package having a lens on the housing. The package includes a housing having a cavity; An LED chip mounted in the cavity; And a lens protruding from the LED above the housing and having a conical lens surface.

In order to solve the above problems, the present invention provides a method of manufacturing a light emitting diode package having a lens on the housing. The method includes forming a housing having a cavity; Mounting an LED chip in the cavity; And protruding above the housing onto the LED chip to form a lens having a conical lens surface.

The lens may be manufactured separately and attached to the LED chip, or a light transmissive material may be injected onto the LED chip to form a lens on the LED chip.

In the case of forming a lens on the LED chip by the injection method, there is an advantage that can reduce the error of the lens position, and can also enhance the bonding force.

According to the present invention, by forming a lens having a conical lens surface in the housing having a cavity, it is possible to increase the condensing efficiency by applying to a device requiring local illumination by reducing the direction of light by the lens having a conical lens surface. .

In addition, when the lens is formed by injecting a light-transmissive material, compared to attaching a separately manufactured lens, an error in the lens formation position can be reduced, and the lens can be prevented from being separated.

In the case of injecting a light-transmissive material to form a lens, the contact area of the lens and the housing can be increased compared to the contact area of the lens on the housing of the plate since the housing has a cavity. Therefore, the bonding between the lens and the housing is excellent, so that durability can be remarkably improved.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments described herein and may be embodied in other forms. Rather, the embodiments introduced herein are provided so that the disclosure may be made thorough and complete, and to fully convey the spirit of the invention to those skilled in the art. In the drawings, the thicknesses of layers and regions are exaggerated for clarity. In addition, where a layer is said to be "on" another layer or substrate, it may be formed directly on the other layer or substrate, or a third layer may be interposed therebetween. Portions denoted by like reference numerals denote like elements throughout the specification.

FIG. 1A is a plan view of a light emitting diode package according to a first embodiment of the present invention, and FIG. 1B is a cross-sectional view taken along the line II ′ of FIG. 1.

1A and 1B, a light emitting diode package according to a first embodiment of the present invention includes a housing 10 having a cavity 16, an LED chip 20 mounted on the cavity 16, and the LED chip. And a lens 30 covering 20.

The cavity 16 is an area lower than the top surface of the edge of the housing 10, and the side wall 12 may have an inclination. Although not shown, a reflector may be formed on at least sidewalls of the cavity 16.

The reflective plate may be formed of the ceramic material, and the reflective plate may be formed on the bottom of the cavity 16 defined by the sidewall 12.

Although not shown, electrodes may be formed in the housing 10 to electrically connect the LED chip 20 to an external device. The LED chip 20 may be connected to the electrode through a bonding wire, or when flip chip technology is applied to the LED chip 20, the LED chip 20 may be connected to the electrode through a bumper.

In addition, although not shown, the LED chip 20 may be mounted on the heat sink, and may dissipate heat generated from the LED chip 20 through the heat sink.

The heat sink may be an electrode for connecting the LED chip 20 to an external device, or may be a heat conductive material that is not electrically connected to the LED chip 20.

As shown, the light emitting diode package according to an embodiment of the present invention may include one LED chip 20. The LED chip 20 may be one of red, green, red or white LED chips as necessary.

However, the light emitting diode package according to the embodiment of the present invention is not limited to including one LED chip 20, but may include a plurality of LED chips. For example, the light emitting diode package may include all of red, green, and blue LEDs to emit white light by color mixing.

The lens 30 fills the cavity 16 in which the LED chip 20 is mounted and has a lens surface 30s.

In the first embodiment of the present invention, by forming the lens surface 30s as a conical surface, light emitted through the lens surface 30s may have a narrow directivity angle. The conical lens 30 may be used in applications where a narrow beam angle is desired, such as local lighting or a flashlight.

An edge groove 18 may be further formed around the cavity 16. The rim groove 18 is in the form of a ring surrounding the cavity 16 and is a region lower than the edge top surface of the housing 10 and higher than the cavity 16.

The lens 30 is continuously filled in the cavity 16 and the rim groove 18.

The edge groove 18 defines an edge of the lens 30. That is, the lens 30 is formed in an area defined by the sidewall 14 of the edge groove 18, and is in contact with the sidewall 14 of the edge groove 18. Therefore, even when an external force is applied to the lens 30 in the horizontal direction, the lens 30 is supported by the side wall 14 of the edge groove 18, thereby preventing the lens 30 from being separated.

In the first embodiment of the present invention, the lens 30 is formed of a light transmitting material. For example, the lens 30 may be formed of a moldable and transparent material such as silicone or polymer resin.

As described above, in the light emitting diode package according to the first embodiment of the present invention, the lens 30 is in contact with the surface of the cavity 16 and serves as the mold and the lens to fill the cavity 16 at the same time. Can be.

Since the light emitting diode package according to the first embodiment of the present invention includes a lens having a conical lens surface, the light condensing efficiency can be improved by applying to a device requiring local lighting.

In addition, since the housing 10 has a cavity 16 and a lens 30 is formed on the cavity 16, the contact area between the housing 10 and the lens 30 is wider than a lens formed in a plane. . Therefore, the lens 30 and the housing 10 may be firmly coupled to suppress separation of the lens due to external force or interfacial stress.

In the first embodiment of the present invention, the lens is described as being formed by injecting a mold filling the cavity, the lens may be manufactured separately and attached. For example, a light emitting diode package may be formed by forming a mold filling the cavity and attaching a lens having a conical lens surface manufactured separately on the mold.

2 is a view for explaining a light emitting diode package according to a second embodiment of the present invention.

Referring to FIG. 3, the light emitting diode package according to the second embodiment of the present invention is similar in structure to the light emitting diode package according to the first embodiment described above.

Unlike the light emitting diode package according to the first embodiment, the light emitting diode package according to the second embodiment has a stronger structure for supporting and fixing the lens.

As shown, the LED package covers a housing 60 having a cavity 16 and an LED chip 20 mounted on the cavity 16 and the LED chip 20 and fills the cavity 16. And a lens 30 having a lens surface 30s.

An edge groove 68 is formed in the upper surface of the housing 60 around the cavity 16. The edge groove 68 may be a portion higher than the cavity 16 and lower than the edge top surface of the housing and may have sidewalls 64.

The lens 30 is formed in an area surrounded by the side wall 64 and is defined by the edge groove 68.

The lens 30 is in contact with the large area of the housing by the cavity 16, the edge thereof is in contact with the side wall of the rim groove 68 to prevent separation by external force.

The side wall 64 of the edge groove may serve to strengthen the coupling force between the lens 30 and the housing 60 by supporting the lens 30 from an external force applied in a lateral direction.

In the second embodiment of the present invention, not only the edge groove 68 is formed, but the locking jaw 66 is further formed on the edge groove 68. The latching jaw 66 extends upwardly from the edge groove 68 and again extends laterally and has a gap thereunder.

The lens 30 may be continuously formed to the gap region under the cavity 16, the edge groove 68, and the locking jaw 66, and may be more strongly coupled to the housing 60.

As shown, the light emitting diode package according to the second embodiment of the present invention may have a conical lens surface as in the first embodiment.

3 is a flowchart illustrating a method of manufacturing a light emitting diode according to an embodiment of the present invention.

4 is a view for explaining a method of manufacturing a light emitting diode according to an embodiment of the present invention.

Referring to step S1 of FIG. 3 and (a) of FIG. 4, a frame substrate 110 is manufactured. The frame substrate 110 may be a lead frame on which electrodes are formed or a substrate on which electrodes are formed on an insulating substrate. In general, a plurality of light emitting diode packages are formed on one frame substrate 110.

Referring to step S2 of FIG. 3 and (b) of FIG. 4, a housing 112 is formed on the frame substrate 110. The housing may be formed of silicone or resin.

Referring to step S3 of FIG. 3 and (c) of FIG. 4, an LED chip 114 is mounted on the frame substrate 110, and the frame substrate 110 and the LED chip 114 are electrically connected to each other. do. In the figure, the first electrode is formed on the lower surface of the LED chip 114 and the bonding wire 116 is shown connected to the upper surface of the LED chip 114. However, the LED chip 114 has a two-pole bonding pad formed thereon, and both poles are connected to the frame substrate 110 by bonding wires, or in the case of an LED chip having a flip chip structure having a bumper, the frame substrate without bonding wires. It may be directly connected to the electrode of.

In addition, in the present embodiment, the LED chip 114 is mounted on the electrode of the frame substrate 110, but the LED chip 114 is formed on a heat sink (not shown) formed at the bottom of the housing 112. It may have a structure that is mounted and electrically connected to the electrode of the frame substrate 110 by a bonding wire.

Referring to step S4 of FIG. 3 and (d) of FIG. 4, the lens 118 is formed on the housing 112 on which the LED chip 114 is formed. The lens 118 may be formed using a mold covering an upper portion of the housing 112 and having a shape of the lens 118.

The mold may be formed to have a lens space corresponding to the lens 118 on the housing 112, and the lens 118 may be molded by injecting a light transmitting material into the lens space.

Referring to step S5 of FIG. 3 and (e) of FIG. 4, the light emitting diode package 200 is separated by cutting the frame substrate 110 on which the lens 118 is formed. The light emitting diode package 200 may include an electrode 120 extended out of the housing 112.

As illustrated, the electrodes 120 may have a structure extending from the sidewall of the housing 112. Although not shown, the electrode 120 may be bent along the sidewall of the housing 112, further including the bending of the electrodes 120.

1A is a plan view of a light emitting diode package according to a first embodiment of the present invention

FIG. 1B is a cross sectional view taken along the line II ′ of FIG. 1;

2 is a view for explaining a light emitting diode package according to a second embodiment of the present invention;

3 is a flowchart illustrating a method of manufacturing a light emitting diode according to an embodiment of the present invention.

4 is a view for explaining a method of manufacturing a light emitting diode according to an embodiment of the present invention;

Claims (9)

A housing having a cavity; An LED chip mounted in the cavity; And A light emitting diode package comprising a lens protruding above the housing on the LED chip to form a conical lens surface. The method according to claim 1, The side wall of the cavity is inclined and the light emitting diode package, characterized in that the reflection plate is formed. The method according to claim 1, The LED package of claim 1, further comprising an edge groove defining an edge boundary of the lens. The method according to claim 3, And the lens fills the cavity and the edge groove. The method according to claim 3, The housing is: It further comprises a locking jaw extending in the transverse direction from the upper portion of the upper edge of the rim groove, The lens is a light emitting diode package, characterized in that for filling the gap below the locking step. The method according to any one of claims 1 to 5, The lens may cover the LED chip and fill the cavity. Forming a housing having a cavity; Mounting an LED chip in the cavity; And And forming a lens having a conical lens surface protruding from the housing on the LED chip. The method according to claim 7, Forming the lens is: Forming a lens space on the cavity by covering the mold defining the lens surface; And injecting a light-transmitting material into the lens space to form a lens. The method according to claim 8, The light transmitting material is a light emitting diode package manufacturing method, characterized in that the silicon or polymer resin.

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