KR20090020266A - Printed circuit board and fabricating method thereof - Google Patents

Printed circuit board and fabricating method thereof Download PDF

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Publication number
KR20090020266A
KR20090020266A KR1020070084888A KR20070084888A KR20090020266A KR 20090020266 A KR20090020266 A KR 20090020266A KR 1020070084888 A KR1020070084888 A KR 1020070084888A KR 20070084888 A KR20070084888 A KR 20070084888A KR 20090020266 A KR20090020266 A KR 20090020266A
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KR
South Korea
Prior art keywords
circuit board
insulating layer
printed circuit
circuit pattern
printed
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KR1020070084888A
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Korean (ko)
Inventor
김기현
강석명
박세호
이영민
김상현
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삼성전자주식회사
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Priority to KR1020070084888A priority Critical patent/KR20090020266A/en
Publication of KR20090020266A publication Critical patent/KR20090020266A/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1258—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by using a substrate provided with a shape pattern, e.g. grooves, banks, resist pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
    • H05K3/1291—Firing or sintering at relative high temperatures for patterns on inorganic boards, e.g. co-firing of circuits on green ceramic sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1126—Firing, i.e. heating a powder or paste above the melting temperature of at least one of its constituents

Abstract

A printed circuit board and manufacturing method thereof are provided to simplify the structure and the process of the printed circuit board. The method for manufacturing the printed circuit board is as follows. The circuit pattern is printed on the upper side of the material(210). The insulating layer is formed on the material upper side having the circuit pattern with plasticity(220). The via hole passing through the upper side and the lower side faced in the upper side is formed in the insulating layer(230). The circuit pattern is printed on the insulating layer(240). The cover layers formed on the insulating layer in which the circuit pattern is formed(250).

Description

인쇄회로 기판과 그 제조 방법{PRINTED CIRCUIT BOARD AND FABRICATING METHOD THEREOF}Printed circuit board and its manufacturing method {PRINTED CIRCUIT BOARD AND FABRICATING METHOD THEREOF}

본 발명은 인쇄회로 기판에 관한 발명으로서, 특히 다층의 연성 인쇄회로 기판 및 그 제조 방법에 관한 발명이다. BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board, and more particularly, to a multilayer flexible printed circuit board and a manufacturing method thereof.

근래의 전자 제품들은 소형화 및 경량화되는 반면에, 다양한 기능들이 집적된 고기능화가 요구되는 방향으로 개발되고 있으며, 소형화된 고 기능의 전자 제품을 구현하기 위해서는 다수의 전자 부품들을 집적할 수 있는 인쇄회로 기판이 필요하다. 연성 인쇄회로 기판은 연성이 우수하므로, 슬림(slim)화된 제품에 다양한 형태로 적용될 수 있다. In recent years, electronic products have been miniaturized and lightened, while various functions have been developed in a direction requiring high functionalization. To realize miniaturized high-performance electronic products, a printed circuit board capable of integrating a large number of electronic components is required. This is necessary. Flexible printed circuit board is excellent in flexibility, it can be applied in various forms to slim (slim) products.

상술한 연성인쇄회로 기판은 회로 패턴이 형성된 절연 층들을 접착하고, 접착된 절연 층들을 관통하는 관통 홈(Via hole)을 형성한 후, 다시 다수의 절연 층 및 절연 층들을 형성하는 과정에 의해 형성될 수 있다. The above-described flexible printed circuit board is formed by bonding insulating layers having a circuit pattern, forming a through hole through the bonded insulating layers, and then forming a plurality of insulating layers and insulating layers. Can be.

상술한 회로 패턴은 적층 또는 도금 등에 의해 형성된 구리(Cu)와 같은 도전 금속을 식각해서 형성되며, 상술한 관통 홈은 드릴링(Drilling) 등에 의해 형성될 수 있다. The above-described circuit pattern is formed by etching a conductive metal such as copper (Cu) formed by lamination, plating, or the like, and the aforementioned through grooves may be formed by drilling or the like.

종래의 인쇄회로 기판은 구조와 공정이 복잡한 문제가 있으나, 본 발명은 인쇄회로 기판의 구조와 공정을 단순화시키고자 한다, The conventional printed circuit board has a complicated structure and process, but the present invention intends to simplify the structure and process of the printed circuit board,

본 발명에 따른 인쇄회로 기판의 제조 방법은,Method for manufacturing a printed circuit board according to the present invention,

기재 상면에 회로 패턴을 인쇄하는 과정과;Printing a circuit pattern on an upper surface of the substrate;

회로 패턴이 형성된 기재 상면에 소성에 의해 절연 층을 형성하고 상기 절연 층 상에 회로 패턴을 인쇄하는 과정을 포함한다. Forming an insulating layer by firing on the upper surface of the substrate on which the circuit pattern is formed and printing the circuit pattern on the insulating layer.

본원 발명은 얇은 두께로도 단순화된 공정 및 구조의 인쇄회로 기판을 제공할 수 있다. The present invention can provide a printed circuit board with a simplified process and structure even with a thin thickness.

이하에서는 첨부도면들을 참조하여 본 발명의 실시 예를 상세히 설명하기로 한다. 본 발명을 설명함에 있어서, 관련된 공지기능, 혹은 구성에 대한 구체적인 설명은 본 발명의 요지를 모호하지 않게 하기 위하여 생략한다.Hereinafter, with reference to the accompanying drawings will be described an embodiment of the present invention; In describing the present invention, detailed descriptions of related well-known functions or configurations are omitted in order not to obscure the subject matter of the present invention.

도 1은 본 발명에 따른 인쇄회로 기판의 단면을 도시한 도면이다. 도 1을 참조하면, 본 발명에 따른 인쇄회로 기판(100)은 회로 패턴(111)이 인쇄된 기재(base film; 110)와, 회로 패턴(111)이 인쇄된 상기 기재(110)의 상면에 소성(sintering)된 절연 층(120) 및 상기 절연 층(120) 상에 인쇄된 회로 패턴(122)과, 상기 절연 층(120)의 상면에 소성된 커버 층(cover layer; 130)을 포함한다. 1 is a cross-sectional view of a printed circuit board according to the present invention. Referring to FIG. 1, a printed circuit board 100 according to the present invention may be formed on a base film 110 on which a circuit pattern 111 is printed and on an upper surface of the substrate 110 on which a circuit pattern 111 is printed. A sintered insulating layer 120, a circuit pattern 122 printed on the insulating layer 120, and a cover layer 130 fired on an upper surface of the insulating layer 120. .

상기 기재(110)는 폴리이미드(polyimide) 또는 폴리 에틸렌 테레파탈레이트(PET; Poly Ethylene Terephthalate) 재질로 구성될 수 있으며, 상기 기재(110)의 상면에는 회로 패턴(111)이 인쇄에 의해 형성될 수 있다. The substrate 110 may be made of polyimide or polyethylene terephthalate (PET), and a circuit pattern 111 may be formed on the upper surface of the substrate 110 by printing. Can be.

상기 절연 층(120)과 커버 층(Cover layer;130)은 패이스트(paste) 또는 액상 물질의 소성(sintering)에 의해 형성될 수 있으며, 상기 커버 층(130)은 회로 패턴(122)이 인쇄된 절연 층(120) 상면에 형성된다.The insulating layer 120 and the cover layer 130 may be formed by pasting or sintering a liquid material, and the cover layer 130 may be printed by a circuit pattern 122. Formed on the insulating layer 120.

또한, 상기 절연 층(120)은 상면 및 하면을 관통하는 관통 홈(121)이 형성되며, 상기 관통 홈(121)에는 도전성 충진 부재가 충진되어 상기 기재(110) 상에 인쇄된 회로 패턴(111)과 상기 절연 층(120) 상에 인쇄된 회로 패턴(122)을 전기적으로 연결시킬 수 있다. In addition, the insulating layer 120 has a through groove 121 penetrating through an upper surface and a lower surface, and a conductive pattern is filled in the through groove 121 so as to be printed on the substrate pattern 111. ) And the circuit pattern 122 printed on the insulating layer 120 may be electrically connected.

상기 기재(110)와 상기 절연 층(120) 상에 형성되는 회로 패턴들(111,121)은 은(Ag) 또는 구리(Cu) 등의 도전성 금속의 인쇄 공정에 의해 형성될 수 있으며, 고진 공 상태에서 도전성 물질들(금속; Al, Au, Ag, Cu)의 용융, 증착에 의해서도 형성될 수 있다.The circuit patterns 111 and 121 formed on the substrate 110 and the insulating layer 120 may be formed by a printing process of a conductive metal such as silver (Ag) or copper (Cu), and in a high vacuum state. It may also be formed by melting and depositing conductive materials (metals; Al, Au, Ag, Cu).

도 2는 본 발명에 따른 인쇄회로 기판의 제조 단계를 도시한 순서도이다. 도 2를 참조하면, 본 발명에 따른 인쇄회로 기판(100)은 기재(110) 상면에 회로 패턴(111)을 인쇄하는 과정(210)과, 회로 패턴(111)이 형성된 상기 기재(110) 상면에 절연 층(120)을 소성하는 과정(220)과, 상기 절연 층(120) 내에 관통 홈(121)을 형성하는 과정(230)과, 상기 절연 층(120) 상에 회로 패턴(122)을 인쇄하는 과 정(240)과, 상기 절연 층(120) 상에 커버 층을 소성하는 과정(250)을 포함한다.  2 is a flowchart illustrating a manufacturing step of a printed circuit board according to the present invention. Referring to FIG. 2, in the printed circuit board 100 according to the present invention, a process 210 of printing a circuit pattern 111 on an upper surface of the substrate 110 and an upper surface of the substrate 110 on which the circuit pattern 111 is formed Baking 220 the insulating layer 120, forming a through hole 121 in the insulating layer 120, and forming a circuit pattern 122 on the insulating layer 120. A process 240 for printing and a process 250 for baking the cover layer on the insulating layer 120.

상기 기재(110) 상에 형성된 절연 층(120)은 소성에 의해서 상기 기재(110) 상면에 형성된 회로 패턴(111)을 덮도록 형성될 수 있으며, 상면과 하면을 관통하는 관통 홈(121)이 형성된다. 상기 관통 홈(121)은 상기 기재(110) 상면의 회로 패턴(111)이 노출되도록 형성되어 상기 기재(110)의 회로 패턴(111)은 상기 관통 홈(121)에 충진된 도전성 충진재 등에 의해서 전기적 접점이 형성된다. The insulating layer 120 formed on the substrate 110 may be formed to cover the circuit pattern 111 formed on the upper surface of the substrate 110 by firing, and the through groove 121 penetrating the upper surface and the lower surface is formed. Is formed. The through groove 121 is formed so that the circuit pattern 111 on the upper surface of the substrate 110 is exposed so that the circuit pattern 111 of the substrate 110 may be electrically charged by the conductive filler filled in the through groove 121. The contact is formed.

상기 커버 층(130)은 소성에 의해 상기 절연 층(120) 상면의 회로 패턴(122)을 덮도록 형성되며, 상기 절연 층(120)과 상기 커버 층(130)은 페이스트(paste) 또는 액상 물질이 사용될 수 있다. The cover layer 130 is formed to cover the circuit pattern 122 on the upper surface of the insulating layer 120 by firing, and the insulating layer 120 and the cover layer 130 are a paste or a liquid material. This can be used.

도 1은 본 발명에 따른 인쇄회로 기판의 단면을 도시한 도면,1 is a cross-sectional view of a printed circuit board according to the present invention;

도 2는 본 발명에 따른 인쇄회로 기판의 제조 단계를 도시한 순서도.2 is a flow chart showing the manufacturing steps of a printed circuit board according to the present invention.

Claims (7)

인쇄회로 기판의 제조 방법에 있어서,In the manufacturing method of a printed circuit board, 기재 상면에 회로 패턴을 인쇄하는 과정과;Printing a circuit pattern on an upper surface of the substrate; 회로 패턴이 형성된 기재 상면에 소성에 의해 절연 층을 형성하고 상기 절연 층 상에 회로 패턴을 인쇄하는 과정을 포함함을 특징으로 하는 인쇄회로 기판의 제조 방법.Forming an insulating layer by firing on the upper surface of the substrate on which the circuit pattern is formed and printing the circuit pattern on the insulating layer. 제1 항에 있어서, According to claim 1, 상기 기재는 상면과 상기 상면에 대향된 하면을 관통하는 관통 홈이 형성됨을 특징으로 하는 인쇄회로 기판의 제조 방법.The substrate is a manufacturing method of a printed circuit board, characterized in that the through groove penetrating the upper surface and the lower surface opposite to the upper surface is formed. 제1 항에 있어서, 상기 인쇄회로 기판의 제조 방법은,The method of claim 1, wherein the manufacturing method of the printed circuit board is 회로 패턴이 형성된 상기 절연 층 상에 커버 층을 형성하는 과정을 더 포함함을 특징으로 하는 인쇄회로 기판의 제조 방법.And forming a cover layer on the insulating layer having the circuit pattern formed thereon. 제1 항에 있어서, According to claim 1, 상기 기재는 폴리이미드 또는 폴리 에틸렌 테레파탈레이트로 이루어짐을 특징으로 하는 인쇄회로 기판의 제조 방법.The substrate is a method of manufacturing a printed circuit board, characterized in that consisting of polyimide or polyethylene terephthalate. 인쇄회로 기판에 있어서,In a printed circuit board, 회로 패턴이 인쇄된 기재와;A substrate on which a circuit pattern is printed; 회로 패턴이 인쇄된 상기 기재의 상면에 소성된 절연 층 및 상기 절연 층 상에 인쇄된 회로 패턴과;An insulating layer fired on the upper surface of the substrate on which the circuit pattern is printed and a circuit pattern printed on the insulating layer; 회로 패턴이 형성된 상기 절연 층의 상면에 소성된 커버 층을 포함함을 특징으로 하는 인쇄회로 기판.Printed circuit board comprising a cover layer fired on the upper surface of the insulating layer on which a circuit pattern is formed. 제5 항에 있어서,The method of claim 5, 상기 절연 층은 상면 및 하면을 관통하는 관통 홈을 포함함을 특징으로 하는 인쇄회로 기판.The insulating layer is a printed circuit board, characterized in that it comprises a through groove penetrating the upper and lower surfaces. 제5 항에 있어서,The method of claim 5, 상기 기재는 폴리이미드 또는 폴리 에틸렌 테레파탈레이트로 이루어짐을 특징으로 하는 인쇄회로 기판.The substrate is a printed circuit board, characterized in that consisting of polyimide or polyethylene terephthalate.
KR1020070084888A 2007-08-23 2007-08-23 Printed circuit board and fabricating method thereof KR20090020266A (en)

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