KR20090016077A - Apparatus for repairing defective lcd panels using the laser and method therefor - Google Patents

Abstract

An apparatus for repairing a defective liquid crystal panel by using the laser and a method thereof are provided to repair the faults which are generated due to the short-circuit or disconnection during a liquid crystal panel manufacturing process. An apparatus for repairing a defective liquid crystal panel by using the laser comprises the followings: a loading means for loading a liquid crystal panel(800) to be repaired on a stage(100); a defect detection means for detecting defect patterns within the liquid crystal panel(200); a laser oscillation means for oscillating the laser beam(300); a beam forming means(400) which adjusts the oscillated laser beam according to the size of a defect part; an optical means(500) for controlling the route of the oscillated laser beam; and a control means(700) for controlling the loading means, defect detection means, laser oscillation means, beam forming means and optical means.

Description

Apparatus for repairing defective LCD panels using the laser and method therefor}

The present invention relates to an apparatus for repairing a defective liquid crystal panel using a laser and a method thereof, and more particularly to an apparatus and a method for repairing a defective liquid crystal panel using a laser for repairing a short circuit and disconnection of a semiconductor substrate or a liquid crystal panel.

As shown in FIG. 1, a typical liquid crystal panel 11 includes an upper substrate 5 having a transparent common electrode 18 formed on a color filter including a black matrix 6 and a sub color filter 7, and a pixel. And a lower substrate 22 having a pixel electrode 17 formed on the region P and the pixel region, and a switching element T and a wiring formed therebetween, and between the upper substrate 5 and the lower substrate 22, a liquid crystal ( 14) is filled.

The lower substrate 22 is also referred to as an array substrate, and the thin film transistor T, which is a switching element, is positioned in a matrix type, and includes a gate line 13 and a data line 15 passing through the plurality of thin film transistors. Is formed.

The pixel P area is an area where the gate line 13 and the data line 15 cross each other. As the pixel electrode 17 formed on the pixel region P, a transparent conductive metal having relatively high light transmittance, such as indium-tin-oxide (ITO), is used.

In the liquid crystal display configured as described above, the thin film transistor T and the pixel electrode 17 connected to the thin film transistor are present in a matrix to display an image.

The gate line 13 transmits a pulse voltage for driving a gate electrode that is a first electrode of the thin film transistor T, and the data line 15 receives a source electrode that is a second electrode of the thin film transistor T. It is a means for transmitting the driving signal voltage. At this time, if a voltage capable of driving the liquid crystal is applied to an arbitrary source electrode by the signal of the gate electrode, and a voltage smaller than the liquid crystal driving voltage is applied to the rest, only the pixel to which the liquid crystal driving voltage is applied is operated.

By this operation principle, it is possible to drive all the pixel electrodes of the liquid crystal display by applying pulses sequentially to all the gate electrodes and applying signal voltages to the corresponding source electrodes.

As described above, in order to independently drive the millions of pixel electrodes, the gate lines 13 and the data lines 15 are arranged in a matrix form on the entire display area, and the gate lines 13 and the data lines 15 are arranged. ) Is used to drive the thin film transistor T, which is a switching element.

In manufacturing a display device in which a switching device must be provided for each pixel to drive millions of pixels, it is important to form a fine pattern and simultaneously control the characteristics of the thin film device. In such a board structure, defects such as disconnection or short circuit of the wire may occur, and such defects may be caused by a process deviation depending on the cause, such as a defect caused by a characteristic value exceeding a design standard, a cleaning defect or dirt at a membrane interface. Defects caused by the static electricity, and defects caused by the static electricity due to the characteristic change and destruction of the thin film transistor or the liquid crystal cell.

These defects may be classified into dot defects, line defects, or marking stains according to their shape. Point defects are caused by defects such as thin film transistor elements or pixel electrodes. This is caused by the destruction of the thin film transistor and the like due to short circuit and static electricity.

These defects are becoming more important as the display area of the image device becomes larger, and a redundancy and repairable design has been introduced as a way to proactively cope with such defects.

Conventionally, a technology for repairing a liquid crystal panel has been disclosed and published in a number of applications other than Korean Patent Publication No. 008193 'Liquid Crystal Display Device and Repair Method thereof'.

The prior art is a transparent insulating substrate; Gate lines and data lines intersecting in the horizontal and vertical directions on the transparent insulating substrate to define a plurality of pixels; A gate electrode extending from the gate line, a semiconductor layer on the gate electrode, a source electrode branched from the data line, and the semiconductor layer interposed between the gate lines and the data lines; A thin film transistor having a drain electrode facing the source electrode; A pixel electrode formed to be connected to the drain electrode; And a repair pattern configured to partially overlap the data line or the pixel electrode.

As can be seen from the prior art, it is designed to allow repair in the event of a failure from the design stage.

In the related art, when a short circuit or disconnection defect occurs, it is repaired by using a method such as having a separate repair line to repair it.

In particular, when disconnection occurs in the array substrate, an additional patterning process for repair wiring formation is required to repair the disconnection, and there is a problem in that the production cost increases. In order to remedy this problem, a repair method for forming a metal wiring on a disconnected portion using laser CVD has been disclosed.

However, such laser CVD can be repaired on a single plate like a TFT substrate, but there is a problem in that the repair of the short lead of the cell is impossible.

Disclosure of Invention An object of the present invention is to solve the above problems, and to provide an apparatus and method for repairing a defective liquid crystal panel using a laser for repairing a defect caused by a short circuit or disconnection during a liquid crystal panel manufacturing process.

And another object of the present invention, by using a Q-switched laser method, when a short circuit defect occurs in the substrate, by irradiating the laser to the shorted portion to cut the short circuited part, in the event of a disconnection failure, disconnected metal wiring The present invention provides a repair apparatus and a method for repairing a defective liquid crystal panel using a laser that electrically connects a portion disconnected by welding by irradiating a laser to a portion where the repair wiring overlaps.

Defective liquid crystal panel repair apparatus using a laser according to the present invention, the loading means for loading the liquid crystal panel to be repaired on the stage; Defect detection means for detecting defect pattern information in the liquid crystal panel; Laser oscillation means for oscillating a laser beam; Beam forming means for adjusting a laser beam to a size of a defective portion of the liquid crystal panel; Optical means for adjusting the path of the laser beam; And control means for controlling the loading means, the defect detection means, the laser oscillation means, the beam forming means and the optical means; The control means includes a control signal for cutting a short circuited part by irradiating a laser beam to the shorted part when a short circuit failure occurs in the liquid crystal panel, and in case of a short circuit failure in the liquid crystal panel, a disconnected metal wiring. And a control signal is transmitted to irradiate a laser beam to a portion where the repair wiring overlaps and electrically connect the disconnected portion.

On the other hand, a defect repair method using a defective liquid crystal panel repair apparatus according to the present invention, (a) loading a liquid crystal panel to be repaired on the stage; (b) receiving bad position information in the liquid crystal panel; (c) moving the stage or the gantry to irradiate the laser beam to the defective location according to the received defective location information; (d) irradiating a laser beam to a defective position in the liquid crystal panel; (e) determining whether a short circuit or a disconnection corresponding to the defect in the liquid crystal panel exists; And (f) unloading the liquid crystal panel when there is no defect to be repaired as a result of the determination of step (e); Characterized in that it comprises a.

According to the present invention, by irradiating laser to the defective portion of the liquid crystal panel and repairing it, there is an effect of reducing the production cost and improving productivity.

According to the present invention, when a short circuit defect occurs in a substrate using a Q-switched laser method, the short circuited portion is cut by irradiating a laser to the short circuited portion, and in the case of a disconnection defect, the disconnected metal wiring and repair wiring This overlapping portion is irradiated with a laser to electrically connect the portions disconnected by welding.

The features and advantages of the present invention will become more apparent from the following detailed description based on the accompanying drawings. Prior to this, the terms or words used in the present specification and claims are defined in the technical spirit of the present invention on the basis of the principle that the inventor can appropriately define the concept of the term in order to explain his invention in the best way. It should be interpreted to mean meanings and concepts. In addition, when it is determined that the detailed description of the known function and its configuration related to the present invention may unnecessarily obscure the subject matter of the present invention, it should be noted that the detailed description is omitted.

Hereinafter, with reference to the accompanying drawings will be described in detail the present invention.

The defective liquid crystal panel repair apparatus using the laser according to an embodiment of the present invention will be described with reference to FIGS. 2 to 5.

2 is a block diagram of a defective liquid crystal panel repair apparatus using a laser according to an embodiment of the present invention, Figure 3 is a view showing before and after using a beam shaper according to an embodiment of the present invention, Figure 4 5 is a view showing the size adjustment of the beam slit according to an embodiment of the present invention, Figure 5 is a schematic diagram of a defective liquid crystal panel repair apparatus using a laser according to an embodiment of the present invention.

The defective liquid crystal panel repair apparatus using a laser according to an embodiment of the present invention, as shown in Figure 2, the loading means 100, defect detection means 200, laser oscillation means 300, beam forming means 400 ), An optical means 500, a monitoring means 600, a control means 700, and a liquid crystal panel 800.

The loading means 100 loads the liquid crystal panel 800 to be repaired on a stage (not shown).

The loading means 100 according to the present embodiment is a rotating part 110 for rotating the TFT substrate surface of the liquid crystal panel 800 instead of the color filter substrate surface of the liquid crystal panel 800 to be irradiated with a laser beam on the stage. ). The rotating unit 110 rotates the liquid crystal panel 800 so that the TFT substrate surface of the liquid crystal panel 800 is irradiated with a laser beam on the stage.

In addition, the defect detecting means 200 performs a function of detecting defective position information in the liquid crystal panel.

In addition, the laser oscillation means 300 performs a function of oscillating the laser beam in a Q-switched manner, and oscillates a uniform laser by using a laser stabilizer 310. Using such a laser stabilizer 310 has the advantage that a uniform laser is irradiated to the irradiation area.

The Q-switch method of the laser oscillation means 300 according to the present embodiment is as follows.

The Q-switch method is a laser oscillation control method that generates pulsed light with a large pulse output and a narrow occupancy on the time axis. For example, a ruby laser can produce hundreds of megawatts of power using a Q-switch and a few GW of power when amplified again. When the light is pumped to the laser medium of the laser oscillation means 300, energy is accumulated not to go out. At this time, the laser that is instantaneously amplified by the Q value of the following Equation 1 is started.

는 공진각 주파수이고, W는 레이저 발진수단(300)의 공진회로 내부에 저장되는 최대 에너지이며, P는 레이저 발진수단(300)의 공진회로 내부에서 소비되는 에너지의 평균값이다.In Equation 1,

Is the resonance angle frequency, W is the maximum energy stored in the resonant circuit of the laser oscillation means 300, P is the average value of the energy consumed in the resonant circuit of the laser oscillation means 300.

That is, the laser oscillation means 300, when the energy of the excited state is accumulated in the laser oscillation means 300 by the optical pumping, if the Q value of the equation (1) momentarily high, the gain coefficient oscillation threshold The value becomes larger than the value, which causes an instantaneous oscillation of a high density laser. At this time, the pulse energy of the laser beam due to the Q-switch method is 10uJ to 50mJ.

In addition, the laser oscillation means 300 is capable of driving a single pulse of 1Hz or repeated pulses of 1kHz.

In addition, the laser oscillation means 300 according to the present embodiment uses an Nd: YAG laser, the Nd: YAG laser will be described as follows.

Nd: YAG lasers have a wavelength of 1064 nm and a medium of Nd: YAG. In this case, in Nd: YAG, YAG is a material called yttbium aluminum garnet, and is doped with neodymium (Nd) in YAG.

Although the light source used for the laser oscillation means 300 according to the present embodiment is set to Nd: YAG laser, the present invention is not limited thereto, and various embodiments such as Nd: YLF laser, Nd: YVO 4 laser, titanium sapphire laser, and the like are provided. Lasers can be used.

In addition, according to the excitation method of the laser oscillation means 300 may be configured as a diode pumped solid state laser (DPSS) or flash lamp pumped solid state laser (Flash Pumped Solid State: FPSS). At this time, the pumping (pumping) is to supply energy to the laser medium from the outside, it is called pumping (excitation).

The diode-pumped solid-state laser method is low in noise, expensive to replace, and the cooling method is air-cooled or primary water-cooled, and has high output stability. In addition, the flash lamp pumped solid state laser method has a high noise, a replacement cost is cheaper than a diode pumped solid state laser method, the cooling method is secondary water cooling, and the output stability is low.

The laser oscillation means 300 oscillates a laser having wavelengths in the near infrared (NIR), visible light (GR), and near ultraviolet (NUV) ranges. Although not shown in the drawing, the intensity of the laser may be adjusted through a separate laser intensity controller. An attenuator or an ND filter may be used as the laser intensity controller.

In addition, the beam forming unit 400 extends and adjusts the laser beam according to the size of the defective portion of the liquid crystal panel. In order to perform this function, the beam forming means 400 includes a beam shaper 410 and a beam slit 420, or a beam shaper 410 and a mask 430.

Beam shaper 410 is composed of a beam expander (411) for expanding the size of the laser beam oscillated by the laser oscillation means 300 and a homogenizer (412) for evening the energy distribution of the laser If necessary, only the beam expander can be used.

In addition, the beam slit 420 is extended by the beam shaper 410, the laser beam is formed evenly distributed by the beam shaper 410, and the mask 430 is extended by the beam shaper 410 The laser beam is evenly distributed in a predetermined pattern. Although the shape of the mask 430 is set to a predetermined pattern in this embodiment, the present invention is not limited thereto, and various shapes may be formed according to the shape of the object to be processed.

The initial beam oscillated by the laser oscillation means 300 has a small Gaussian shape, and energy is concentrated in the center. Since such a beam is not suitable to irradiate a large area at a time, the beam forming means 400 is used. The beam profile is enlarged to a size large enough to irradiate the processing part at once to flatten the profile of the beam.

As shown in FIG. 3, the left side is a graph before using the beam shaper 410, and it can be seen that it is a Gaussian curve distribution. 3 is a graph showing the energy distribution of the beam after using the beam shaper 410, and it can be confirmed that the energy distribution has an even shape.

As shown in FIG. 4, the size of the beam slit 420 may be adjusted according to the area to be irradiated, that is, the size of the object to be processed.

In addition, the optical means 500 adjusts the path of the beam to irradiate the liquid crystal panel.

As shown in FIG. 5, the optical means 500 according to an embodiment of the present invention includes a first mirror 510, a second mirror 520, and an objective lens 530.

The first mirror 510 reflects the laser beam oscillated by the laser oscillation means 300.

In addition, the second mirror 520 transmits the laser beam passing through the beam forming unit 400 and reflects the reflected light reflected from the liquid crystal panel 800.

The objective lens 530 collects and transmits a laser beam transmitted through the second mirror 520.

The optical means according to the present embodiment may be mounted on a gantry (not shown) to move the gantry or move a stage (not shown) on which the liquid crystal panel 800 is placed, thereby accurately irradiating a laser irradiation position.

In addition, the monitoring means 600 receives the reflected light from the second mirror 120 and monitors in real time whether the laser irradiation and repair work is correctly performed or performs a function of adjusting the focus of the laser beam. The monitoring means 600 includes a CCD camera 610 for monitoring the process in real time and a focus control unit 620 for automatically adjusting the focus of the laser beam irradiated to the liquid crystal panel 800.

The control means 700 controls the loading means 100, the defect detection means 200, the laser oscillation means 300, the beam forming means 400, the optical means 500, and the monitoring means 600. Do this.

The control means sends a control signal to cut the short circuited part by irradiating a laser beam to the shorted part when a short circuit failure occurs in the liquid crystal panel, and repairs the disconnected metal wiring and repaired when the short circuit failure occurs in the liquid crystal panel. The laser beam is irradiated to the overlapping portions of the wires, and a control signal is sent to electrically connect the disconnected portions.

In this embodiment, the type of liquid crystal panel to be processed is not limited. Therefore, the liquid crystal panel is not limited to the LCD glass substrate, and may be a semiconductor wafer as well as various substrates.

For reference, the liquid crystal panel 800 as an object according to an embodiment of the present invention will be described with reference to FIGS. 6 to 8.

FIG. 6 is a view showing a liquid crystal panel in which metal wiring is disconnected according to an embodiment of the present invention. FIG. 7 is a cross-sectional view of a liquid crystal panel in which repair is performed according to an embodiment of the present invention. A diagram showing a laser machining surface according to an embodiment.

6 and 7, the liquid crystal panel includes a TFT substrate 810, a liquid crystal layer 820, and a color filter substrate 830.

The TFT substrate 810 includes a first glass substrate 811, a metal wiring 812, an insulator layer 813, and a repair wiring 814.

The color filter substrate 830 includes a second glass substrate 831, a black matrix 832, a color filter 833, an insulating film 834, and transparent electrodes ITO 835.

As shown in FIG. 6, when the metal wire 812 connected to the LCD driving chip 801 is disconnected (part A is disconnected), the liquid crystal panel 800 includes the metal wire 812 and the repair wire 814. You can connect the disconnected part by irradiating the laser to the part where) cross.

Conventionally, in the case where a single wire break occurs in a single board such as an array board (lower board), a repair wire is added and laser irradiation is used to repair the wire break.

In this prior art, a separate additional patterning process is required to configure the repair wiring on the outer periphery of the substrate, thereby increasing the production cost. However, according to the present invention, the process is performed in a state where the TFT substrate and the color filter substrate are bonded together. Therefore, the laser passes through the TFT substrate glass and is irradiated to the processed portion. At this time, since the repair wiring is formed together when forming the transparent electrode (ITO), there is an advantage that no additional process is required.

As shown in FIG. 7, when the laser beam is irradiated to the disconnected area A, the laser passes through the first glass substrate 811 to generate holes in the insulator layer 813. At this time, the metal of the metal wiring 812 is melted and is connected to the repair wiring 814 past the insulator layer 813. In this case, the laser beam is preferably irradiated in the form of a single pulse having a suitable pulse energy.

In addition, in the defective liquid crystal panel repair apparatus using the laser according to the present embodiment, when a short circuit defect occurs in the liquid crystal panel, the TFT substrate is installed to face the laser, and then the short circuited portion is irradiated with a laser to cut the short circuited portion. If the disconnection failure occurs, the TFT substrate is installed facing the laser, and then the disconnected metal wiring and the repair wiring are irradiated with the laser to irradiate the laser to electrically connect the disconnected portion.

Laser processing surface according to an embodiment of the present invention is as shown in FIG.

In the defective liquid crystal panel repair apparatus using a laser according to an embodiment of the present invention, when cutting a pattern of the defective liquid crystal panel, a laser beam of a pulse shape which is repeatedly repeated is cut or fixed to a region to be cut. Irradiation in the form is preferable.

In addition, since the wavelength of the laser used for processing according to the embodiment of the present invention should be transmitted through the glass substrate and the polarizing film and the protective film may be attached to the surface of the glass substrate, near infrared (NIR), visible It is preferable to use a laser in the wavelength range of the light beam GR and the near ultraviolet light (NUV).

Meanwhile, the overall flow of the method (hereinafter, referred to as a defective repair method) using a defective liquid crystal panel repair apparatus according to an embodiment of the present invention will be described with reference to FIG. 9.

9 is a general flowchart of a defect repair method according to an embodiment of the present invention.

As shown in FIG. 9, the control means 700 of the defective liquid crystal panel repair apparatus adjusts the TFT substrate surface of the liquid crystal panel 800 to receive a laser beam through the rotating part 110 of the loading means 100. (S2).

The control means 700 of the defective liquid crystal panel repair apparatus loads the liquid crystal panel 800 to be repaired through the loading means 100 on the stage (S4).

Next, the control means 700 receives the defective position information in the liquid crystal panel 800 through the defect detection means 200 (S6).

As the reception method, both an automatic method and a manual method may be used. The automatic receiving method is a method of detecting defective position information through the defect detecting means 200, and the manual receiving method is a method of grasping and inputting the defective position information to the repair process worker when visually inspected.

Next, the control means 700 moves the laser beam to be irradiated to the defective position in accordance with the received defective position information (S8).

That is, the laser beam is accurately irradiated to the defective position by moving the stage on which the liquid crystal panel 800 is placed or by moving the gantry equipped with optical means such as an objective lens.

Next, the control means 700 repairs the short circuit or disconnection corresponding to the defect of the liquid crystal panel 800 by irradiating the laser beam to the defective position (S10).

In this case, the laser beam may be irradiated in various ways. For example, a spot beam may be irradiated while the gantry or the stage is moved, or the gantry and the stage may be irradiated in a scanning manner in a stationary state, or may be selectively irradiated in a line form.

Next, the control means 700 determines whether there is a short circuit or disconnection corresponding to the defect of the liquid crystal panel 800 to be repaired further through the defect detecting means 200 (S12). If not present, the liquid crystal panel 800 is unloaded (S14).

Then, the control means 700 performs a procedure to the step S8, if there is a defect to be repaired as a result of the determination in the step S12.

A detailed flow of a laser beam irradiation step according to an embodiment of the present invention will be described with reference to FIG. 10 as follows.

10 is a detailed flowchart of a laser beam irradiation step according to an embodiment of the present invention.

As shown in FIG. 10, the control means 700 oscillates a laser beam through the laser oscillation means 300 (S20).

Next, the control means 700 adjusts the beam to the size of the defective portion through the beam forming means 400 via the laser beam via the first mirror 510 (S22).

Next, the control means 700 irradiates the laser beam to the liquid crystal panel 800 through the objective lens 530 via the second mirror 520 (S24).

1 is a plan view schematically showing a typical liquid crystal panel.

Figure 2 is a block diagram of a bad liquid crystal panel repair apparatus using a laser according to an embodiment of the present invention.

3 is a view showing before and after using a beam shaper according to an embodiment of the present invention.

4 is a view showing the adjustment of the size of the beam slit according to an embodiment of the present invention.

5 is a schematic diagram of a bad liquid crystal panel repair apparatus using a laser according to an embodiment of the present invention.

6 is a view showing a liquid crystal panel in which metal wiring is disconnected according to an embodiment of the present invention.

7 is a cross-sectional view of a liquid crystal panel undergoing repairs in accordance with one embodiment of the present invention.

8 is a view showing a laser machining surface according to an embodiment of the present invention.

9 is a general flow diagram for a defect repair method according to an embodiment of the present invention.

10 is a detailed flowchart of a laser beam irradiation step in accordance with an embodiment of the present invention.

<Description of Drawing>

100: loading means 110: rotating part

200: defect detection means 300: laser oscillation means

310: laser stabilizer 400: beam forming means

410: beam shaper 411: beam expander

412 homogenizer 420 beam slit

430: mask 500: optical means

510: first mirror 520: second mirror

530: objective lens 600: monitoring means

610: CCD camera 620: focus control unit

700 control means 800 liquid crystal panel

801: LCD driving chip 810: TFT substrate

811: first glass substrate 812: metal wiring

813: Insulator layer 814: Repair wiring

820: liquid crystal layer 830: color filter substrate

831: second glass substrate 832: black matrix

833: color filter 834: insulating film

835: transparent electrode

Claims (17)

In the defective liquid crystal panel repair apparatus using a laser, Loading means 100 for loading a liquid crystal panel 800 to be repaired on a stage; Defect detection means (200) for detecting a defect pattern in the liquid crystal panel; Laser oscillation means 300 for oscillating a laser beam; Beam forming means (400) for adjusting the laser beam oscillated by the laser oscillation means to the size of the defective portion of the liquid crystal panel; Optical means (500) for adjusting the path of the laser beam oscillated by the laser oscillation means; And Control means (700) for controlling the loading means, defect detection means, laser oscillation means, beam forming means and optical means; Including; The control means sends a control signal to cut the short circuited part by irradiating a laser beam to the shorted part when a short circuit failure occurs in the liquid crystal panel, and repairs the disconnected metal wiring when the short circuit failure occurs in the liquid crystal panel. Apparatus for repairing a defective liquid crystal panel using a laser, characterized in that for transmitting a control signal to electrically connect the disconnected portion by irradiating a laser beam to the overlapping portion of the wiring. The method of claim 1, The laser oscillation means 300, And a laser stabilizer (310) for stabilizing the oscillation of the laser beam. The method of claim 1, The loading means 100, A rotating unit 110 rotating the liquid crystal panel 800 so that the TFT substrate surface of the liquid crystal panel 800 is irradiated with a laser beam on the stage; Defective liquid crystal panel repair apparatus using a laser, characterized in that it further comprises. The method of claim 1, The laser oscillation means 300, Device for repairing a defective liquid crystal panel using a laser, characterized in that at least one of Nd: YAG laser, Nd: YLF laser, Nd: YVO4 laser and Ti: Sapphire laser. The method of claim 1, The laser oscillation means 300, An apparatus for repairing a defective liquid crystal panel using a laser, characterized by oscillating a laser having a wavelength in the near infrared (NIR), visible light (GR), and near ultraviolet (NUV) ranges. The method of claim 1, The laser oscillation means 300, Device for repairing a bad liquid crystal panel using a laser, characterized in that single pulse driving or repetitive pulse driving is possible. The method of claim 1, The laser oscillation means 300, Device for repairing a bad liquid crystal panel using a laser, characterized in that oscillation by a diode-pumped solid-state laser method or a flash lamp pumped solid-state laser method. The method of claim 1, The laser oscillation means 300, Device for repairing a bad liquid crystal panel using a laser, characterized in that the laser beam is oscillated by a Q-switch method and the pulse energy is 10uJ to 50mJ. The method of claim 1, The beam forming means 400, A beam shaper 410 including a beam expander 411 for expanding the size of the laser beam oscillated by the laser oscillation means 300 and a homogenizer 412 for evening the energy distribution of the laser; Defective liquid crystal panel repair device using a laser, characterized in that it comprises a. The method of claim 9, The beam forming means 400, A beam slit 420 that is extended by the beam shaper and adjusts a laser beam having an even energy distribution according to the size of a defective portion of the liquid crystal panel; Defective liquid crystal panel repair apparatus using a laser, characterized in that it further comprises. The method of claim 9, The beam forming means 400, A mask 430 extended by the beam shaper and configured to pass a laser beam having an even energy distribution in a predetermined pattern; Defective liquid crystal panel repair apparatus using a laser, characterized in that it further comprises. The method of claim 1, The optical means 500, A first mirror 510 reflecting the laser beam oscillated by the laser oscillation means 300; A second mirror 520 for transmitting the laser beam passing through the beam forming means 400 and reflecting the reflected light reflected from the liquid crystal panel 800; And An objective lens 530 which focuses and transmits a laser beam transmitted through the second mirror; Defective liquid crystal panel repair device using a laser, characterized in that it comprises a. The method of claim 1, Monitoring means 600 for monitoring the laser irradiation and repair work in real time or for adjusting the focus of the laser beam; Defective liquid crystal panel repair apparatus using a laser, characterized in that it further comprises. The method of claim 13, The monitoring means 600, A CCD camera 610 for real-time monitoring of laser irradiation and repair work using the reflected light reflected from the liquid crystal panel 800; And A focus adjuster 620 for automatically adjusting a focus of the laser beam irradiated onto the liquid crystal panel; Defective liquid crystal panel repair device using a laser, characterized in that it comprises a. In the defect correction processing method using a defective liquid crystal panel repair device, (a) the control means of the defective liquid crystal panel repair apparatus loading the liquid crystal panel to be repaired through the loading means on the stage; (b) the control means receiving defective position information in the liquid crystal panel; (c) moving the stage or the gantry to irradiate the laser beam to the defective position according to the defective position information received by the control means; And (d) the control means irradiating a laser beam to a defective position; Defect repair method comprising a. The method of claim 15, Before step (a), (a-1) adjusting the control means such that the TFT substrate surface of the liquid crystal panel is irradiated with a laser beam through the rotating unit of the loading means; Defect repair method characterized in that it further comprises. The method of claim 15, In step (d), (d-1) the control means for oscillating the laser beam through the laser oscillation means; (d-2) the control means adjusting the oscillated laser beam through beam forming means; And (d-3) condensing and irradiating the laser beam adjusted to a defective position in the liquid crystal panel to be controlled by the control means; Defect repair method comprising a.

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