KR20090013423A - The manufacturing method of the antenna function which uses the copper plating, nickel plating, gold plating in the circuit pattern due to the duplex shooting out of handset housing - Google Patents

Abstract

A manufacturing method of antenna function using copper plating, nickel plating, and gold plating in circuit pattern is provided to perform antenna function in an inner surface or an inner part of a transmitting and receiving housing. Base material is PBT(PolyButylene Terephthalate), PA(PolyAmide), or PPS(PolyPhenylene Sulfide) resin. A housing part or an insertion part of a cell phone or a wireless device is injected by molding LCP(Liquid Crystal Polymer) and SPS(Syndiotactic PolyStyrene) resin(1). A free etching process is performed(2). A bath cleaning process is performed(3). An etching process is performed in order to form a micro pore on a surface(5). A catalyst is absorbed in the micro pore(11). A catalyst reaction is activated by an accelerator process(13). An electro less copper plating process is performed(16). A copper plating surface is activated by a catalyst activated process(18). A nickel metal film is formed by an electro less nickel plating process(19).

Description

Manufacturing method of antenna function using copper plating, nickel plating, and gold plating on the circuit pattern by the double injection method of the transceiver housing etc. TO THE DUPLEX SHOOTING OUT OF HANDSET HOUSING}

According to the present invention, electroless copper plating, nickel plating, gold plating, and the like are applied only to a base circuit pattern portion in which a base injection molded product for plating with a circuit pattern is formed on an inner surface or an inner part of a housing of a transceiver device by a double injection method. The antenna circuit pattern configuration by double injection of mobile phone or various transmission / receiver housings that add the function of antenna by plating sequentially and the circuit pattern can be performed by electroless copper plating, electroless nickel plating, and electroless gold plating. The present invention relates to a method of manufacturing an antenna function that acts on an inner surface or an interior of a housing by plating so as to perform an antenna function on an inner surface or an interior of a transmission / reception housing.

In general, antenna phones protruding from the outside of a transmitting / receiving device or a mobile phone are difficult to diversify or slim down in the design of the mobile phone.

This antenna can not only design a variety of mobile phone designs, but also has the advantage of making the phone thinner and slimmer.

This intenna is currently manufactured in two main ways.

Plastic injection mold designed according to the shape of the interior and interior space according to the design of the housing and PCB circuit determined according to the design of the mobile phone, and the antenna circuit pattern is designed on the injection molded base, and the press mold according to the designed pattern is manufactured In other words, intenna manufacturers are now manufacturing them by adding them to the base by punching and bending them into stainless steel sheets, fixing them to the base, and fixing them by heat fusion.

Another method is to design the antenna circuit pattern on the base designed according to the shape of the housing and PCB circuit design according to the design of the mobile phone, and to design the antenna circuit pattern on the base and connect the base injection mold and the circuit pattern injection mold to make plastic double injection. When the injection material of the base part and the circuit pattern part is double-injected with the plastic material of different components by using a machine, an injection molded product having a circuit pattern formed on the base is produced.

Only the circuit pattern part of this injection molded product is plated with electroless copper plating over 12 microns of copper and electroless nickel plating over 3 microns of nickel to add antenna functions. The company supplies exclusively to S.

If you compare the two methods above,

First of all, if you look at the method of domestic intenna maker, you need base injection mold, circuit pattern press press mold, heat welding work jig, etc. in the mold manufacturing, and the base material is plastic resin for base injection, nickel plating and partial gold plating. A 0.3 mm copper sheet or stainless steel sheet is prepared, and the equipment used as a press is used to attach a thin plate pressed on a copper plate or a stainless plate using a heat welding machine on a base plate injected using an injection molding machine. As a result, productivity is low because there are many work processes such as injection molding work of base part, press work of circuit pattern part, assembling work and heat fusion work, etc., and the labor cost increases because equipment manpower and assembly work manpower are needed. Need much and purchase cost of raw materials such as copper foil and stainless steel foil The high cost, high labor cost and labor costs, and low productivity led to high production costs.

In addition, if you look at the manufacturing method of the US T Intenna,

Since the injection mold is connected with the circuit pattern, the plastic resin for the circuit pattern is used, the base product and the circuit pattern gyeongpyeong are produced through the injection molding machine, and the electroless plating line is formed to produce the plating process. The post-plating work is also more productive and more automated than the domestic intena manufacturing industry, which is produced by heat-sealing copper or stainless steel plates by mass production automation, so the raw material purchase cost is low and the productivity is high. This is incomparable. Therefore, mobile phone manufacturers such as S have been encouraging the development of double injection intenna to domestic intenna manufacturers, but there is no problem in mold making and injection, but the electroplating on the circuit pattern has not been successful. I was hugging.

Also, technically, when electroless copper plating attempts to plate the thickness of the circuit pattern portion to perform the antenna function, copper plating precipitates or electroless copper plating on the base portion other than the circuit pattern portion due to instability of the electroless copper plating solution during a long plating time. There was a problem that it is difficult to perform the desired plating due to the decomposition of the amount of money.

The present invention has been made in order to solve all the problems of the intenna manufactured by the conventional intenna manufacturing method, by analyzing the various processes and the like that can proceed to the circuit pattern configuration by double-injecting the base and circuit pattern components It is an object of the present invention to provide a method of manufacturing an antenna that can function as an antenna of a mobile phone or a wireless transmitting / receiving device by electroless copper plating, electroless nickel plating, and electroless gold plating on a circuit pattern.

In order to achieve the above object, the present invention is in the process of proceeding copper plating, nickel plating, gold plating, etc. to the double injection circuit pattern having a base and a circuit pattern by the injection molding,

By adding an electroless copper striker process, it is reacted for 2-5 minutes in a somewhat high concentration plating solution based on copper concentration of 2.5 to 3 g / L to form a primary copper film on the circuit pattern, and the second electroless copper plating liquid has a liquid stability. Air stirrer with medium concentration of copper concentration 2 ~ 2.3g / L, sodium hydroxide 6.5 ~ 7.5g / L, formalin 2.5 ~ 2.8g / L, EDTA 25 ~ 30g / L, stabilizer 0.05 ~ 0.1g / L It supplies 3 ~ 5L / min of air injection amount through to maximize oxygen supply amount in copper plating solution to promote plating solution stability. The load that can be plated per 1L of plating solution is generally 2 ~ 3dm², but this is 1 ~ 1 load per 1L. The liquid stability is maintained by minimizing the liquid fluctuation rate by minimizing the consumption rate of electroless copper plating solution by managing below 1.5dm².

Supplying copper ions to the object by operating the speed of moving left and right at 70 ~ 100 mm / sec through 200 ~ 250 mm / sec through the stirring device to move the workpiece left and right and the stirring device moving up and down It was smoothly and evenly dispersed in the liquid to form a uniform coating film.

As a result of managing the electroless copper plating solution as above, the result was satisfactory in the stability of copper plating solution, and it was possible to stably thicken the plating on the circuit pattern to be plated without causing decomposition of plating solution, and the plating speed was about 2㎛ or more per hour. It is to be produced.

The present invention is produced by the same manufacturing method as in the manufacturing process diagram and the embodiment produced in the world better than the product produced by the US T electronics, which is the world's only production and supply to the global market It is to provide a breakthrough invention that can be produced and supplied. The present invention is an invention that can replace the antenna market depending on the import of the antenna pattern of the antenna by the double-injection of the cell phone antenna and to exhibit the excellent antenna function by electroless copper plating, nickel plating, gold plating, etc. Not only that, but the manufacturing technology of constructing the circuit pattern and plating the circuit pattern to add the function of the antenna as in the present invention is a technology that can manufacture a three-dimensional electronic circuit board if applied, and its field of application is only electric and electronic In addition, there is an effect that can be applied to automobiles, semiconductors, and the like.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings of FIG. 1.

The electroless copper plating process technology uses synthetic resin when constructing a circuit pattern by double injection. However, depending on the properties of the resin, the processing in the manufacturing process is somewhat different.

Electroless copper plating and electroless plating on the circuit pattern portion of the double injection molding product, which is manufactured based on PBT and PA or PPS resin manufactured by proceeding from (1) to (25) in the manufacturing process diagram and composed of LCP and SPS resin. It is a method of manufacturing intena which is composed of PBT, PA and PPS resins by plating nickel plating and electroless gold plating, and plating high-heat-resistance high-impact engineering plastics such as LCP and SPS onto a circuit pattern composed of double injection. ,

15-30% of isopropyl alcohol, 5-20% of ethyl acetate, 5-10% of toluene, 15-30% of acetone, 10% of methyl ethyl ketone, and soaked for 3-10 minutes at a temperature of 30-70 ℃ Preetch to swell the resin surface, wash once with water temperature of 50 ~ 70 ℃, and once wash at room temperature, then change the temperature of chromic anhydride (CrO₃) 400 ~ 450g / L and sulfuric acid 200 ~ 250g / L Etch (Etchimg) at 75 ° C for 5-10 minutes and rinse 3-4 times. The solution was neutralized for 2 to 3 minutes at room temperature in 100 ml / L hydrochloric acid, washed three times, and immersed in a sodium chloride-based conditioner solution at room temperature for 3 to 5 minutes to impart a negative charge to the resin surface. After treatment to be adsorbed well and washed three times, the catalyst was added by dipping for 2 to 3 minutes at room temperature in a solution of 20-50 ml / L of palladium catalytic solution and 150 ml / L of hydrochloric acid and washed three times. In addition, the catalyst was activated by immersion in 50 ~ 100ml / L sulfuric acid at a temperature of 50 ~ 55 ℃ for 2 to 3 minutes and washed three times, followed by copper concentration of 2.5 ~ 3 g / L, sodium hydroxide 8 ~ 9g / L, and formalin 3 ~. Striker-plated in 3.8g / L, EDTA 30-35g / L for 2-5 minutes at 45-55 ℃. Since copper concentration 2 ~ 2.3 g / L, sodium hydroxide 6.5 ~ 7.5 g / L, formalin 2.5 ~ 2.8 g / L, EDTA 25 ~ 30 g / L, stabilizer 0.005 ~ 0.1 ml / L in a liquid temperature 45 ~ 55 ℃ 4 3 ~ 4 washes after plating for 10 hours. Subsequently, it is rinsed three times by immersing in a catalytically active liquid based on 100 to 150 ml / L hydrochloric acid at room temperature for 30 to 60 seconds. Next, rinse three times after plating for 8-12 minutes at an electroless nickel plating solution 85-90 ° C based on nickel concentration 5.5-6.5g / L and sodium hypophosphite 27-33g / L. After the gold concentration of 1g / L electroless gold plating solution at a temperature of 85 ~ 90 ℃ for 5 to 10 minutes and then washed once washed three times.

Finally, electroless copper plating and electroplating on the circuit pattern part of the double-injection product, which is composed of PBT and PA or PPS resin, which is completed by plating, and dried by LCP and SPS resin, which is formed by washing with distilled water, drying and drying. The electroless nickel plating and the electroless gold plating method will be described below with reference to the manufacturing process with reference to the embodiment. First, the process (1) is based on the PBT and PA or PPS resins, and the LCP and SPS resins are double-injected to form the circuit pattern through the injection process. The parts are injected and the pre-etching process of step (2) is carried out. The solution is immersed for 3 to 10 minutes at a temperature of 30 to 70 degrees Celsius in a mixture of isopropyl alcohol, ethyl acetate, toluene, acetone, and methyl ethyl ketone. After the resin surface of the circuit pattern part is expanded, the secondary etching process is performed to allow micropores to occur in the etching of the next process. In the hot water washing process of Step (3), the resin is washed in hot water of 60 ° C or higher. After that, wash with water at room temperature of step (4) once. (5) The etching process is an etching process, in which 1 liter of water is mixed 400-450 g / L of chromic anhydride (CrO₃) and 200-250 g / L of sulfuric acid and deposited 5 to 10 minutes at a temperature of 65 to 80 degrees Celsius to deposit micropores on the surface. It has a process to make it. (6) Three steps of washing with water in the process again. Three stages of washing means going through a washing container three times. As a neutralization step (7), neutralize the solution in 100ml / L hydrochloric acid at room temperature for 2 to 3 minutes, and wash with water in three steps. (7) The neutralization step of the step is a step of reducing and removing the hexavalent chromium from the etching step to trivalent chromium. After the process of (9), (7) process, soak the sodium chloride-based conditioner liquid at room temperature for 3 ~ 5 minutes to give negative charge to the resin surface, and treat the palladium catalyst in the next process. Wash three steps. (11) The process is an activator process, in which a catalyst is deposited by dipping for 2 to 3 minutes at room temperature in 20-50 ml / L of palladium catalytic solution and 150 ml / L hydrochloric acid. 20 to 25 milliliters of a catalytic solution made by mixing tin tin with palladium chloride, followed by deposition for 2 to 3 minutes at a temperature of 25 to 45 degrees Celsius to adsorb the catalytic catalyst to the micropores formed in the etching. (11) The adsorption of the catalytic catalyst in step (11) is carried out again to the water washing in step (12), and the temperature of 50 to 55 ° C in 50 to 100 ml / L of sulfuric acid in 1 liter of water by the accelerator process of (13). It is a process of activating the catalyst by immersing for 2 to 3 minutes at activating the catalyst and removing the tin component adsorbed in the micropores. After the three-stage washing of (14) process, the electroless copper striker process of (15) process has copper concentration of 2.5-3g / L, sodium hydroxide 8-9g / L, formalin 3-3.8g / L, EDTA 30-35g / 2 ~ 5 minutes at temperature 45 ~ 55 ℃ in L liquid, stabilizer based on copper ion complexing agent reducing agent, 0.05 ~ 0.1ml / L, increase the concentration of reducing agent in electroless copper plating solution, increase the initial reaction rate, and To form. The following is the electroless copper plating process of (16) process, copper concentration of 2 ~ 2.3g / L, sodium hydroxide 6.5 ~ 7.5g / L, formalin 2.5 ~ 2.8g / L, EDTA 25 ~ 30g / L, stabilizer 0.05 ~ 0.1ml After plating for 4 to 10 hours at a temperature of 45 to 55 ° C in / L liquid, wash the water in three steps of (17). Step (18) is a catalytically active process that activates copper plating surfaces by depositing for 30 to 60 seconds in catalytically active extracts based on 100 to 150 ml / L hydrochloric acid. (19) The electroless nickel plating process is used to form a nickel metal film. The electroless nickel plating solution based on nickel concentration 5.5 to 6.5 g / L and sodium hypophosphite 27 to 33 g / L is used at 85 to 90 ° C. After 12 minutes plating is subjected to three washes of the (20) process. (21) As electroless gold plating of process, plate gold concentration 1g / L in electroless gold plating solution for 5-10 minutes at 85 ~ 90 ℃ and recover once. (4) Wash 4 times in process. The reason for the gold plating here is to solder (solder) on the base plate. If the gold plating is not performed, it may be a cause of poor soldering in soldering. After the process (23) is washed with distilled water, and then dehydrated and dried, the method for producing intenna is made. On the inner surface or the interior of the mobile phone or wireless transmitting / receiving device which has undergone the above process, a manufacturing method is performed in which a dense coating film having a copper thickness of about 12 μm or more and a nickel thickness of about 3 μm or more and a gold thickness of 0.5 μm or more is formed. will be.

1: Drawing process of the present invention

2: Example Photo

3: Intena photograph carried out by the present manufacturing method

<Organization of Terms by Process>

▶ Washing: It is the process of washing the chemical ingredients from the previous process by using tap water. The 2nd or 3rd stage is the process of washing 2 or 3 washing tanks in order.

▶ Old name: Process to make micropores on the surface by mixing 400g of chromic anhydride (CrO ₃ ) and 400g of sulfuric acid in 1 liter of water and depositing it for 5-10 minutes at 65 ~ 80 degrees Celsius.

▶ Neutralization: The process of reducing hexavalent chromium from the etching process by reducing it to trivalent chromium.

▶ Activator: Finely formed by etching by mixing 20 ~ 50 milliliters of catalytic liquid made by mixing 15% hydrochloric acid, tin chloride and palladium in 1 liter of water, and immersing for 2 ~ 3 minutes at 25 ~ 45 degrees Celsius A process of adsorbing a catalytic catalyst to pores.

▶ Electroless Copper Striker: A process of forming a coating on a circuit pattern by increasing the concentration of reducing agent in an electroless copper plating solution based on copper ions, complexing agents and reducing agents to increase the initial reaction speed.

▶ Electroless Copper Plating: A process that raises the thickness of copper plating stably on the coating film formed in the electroless copper striker process.

▶ Catalytic activity: Process that causes electrolytic nickel plating precipitation reaction by catalytic activation because electroless nickel plating is not directly on copper plating.

▶ Electroless Nickel Plating: Process of forming nickel metal film.

▶ Electroless Gold Plating: A process of depositing gold to form a coating film.

▶ Preetching: Etching the next process by dipping the resin surface of the circuit pattern part by immersion for 3 to 10 minutes at a temperature of 30 to 70 degrees in a mixture of isopropyl alcohol, ethyl acetate, toluene, acetone and methyl ethyl ketone. Etching process that allows micropores to form in the

▶ Washing: Washing in hot water over 60 ° C.

Conditioner: A process of forming Cl ^_ groups on the etched circuit pattern part surface to facilitate the adsorption of Pd ⁺ ions in the activator process.

▶ Drying: The process of removing moisture on the product by attaching hot air supply to the rotary dehydrator.

Claims (2)

Housing of mobile phones and wireless transceivers completed by electroless copper plating, electroless nickel plating, and electroless gold plating on the circuit pattern part of the double injection products based on PBT and PA or PPS resin and consisting of LCP and SPS resin. A method of manufacturing an antenna, which is formed on an inner surface or a built-in product and functions as an antenna. The method of manufacturing an intena comprising a synthetic resin base and a circuit pattern according to claim 1, isopropyl alcohol 15-30%, ethyl acetate 5-20%, toluene 5-10%, acetone 15-30%, methyl ethyl ketone 5- Preetch to swell the surface of the resin by dipping at a temperature of 30 to 70 ° C for 3 to 10 minutes in a mixture of 10% or the like, washing with water once at a temperature of 50 to 70 ° C, washing with water once at room temperature, and then CrO₃) Etchimg for 5-10 minutes at 400-450 g / L sulfuric acid and 200-250 g / L sulfuric acid at a temperature of 65-75 ° C and rinse 3-4 times. Neutralizing treatment for 2 ~ 3 minutes at room temperature in 100ml / L hydrochloric acid, washing with water three times, and immersing in sodium chloride-based conditioner solution for 3 ~ 5 minutes at room temperature to give negative charge to the resin surface. Treated to be adsorbed well, washed three times, and then immersed in a solution of palladium catalytic solution 20 ~ 50ml / L and hydrochloric acid 150ml / L for 2 to 3 minutes at room temperature to impart a catalyst and washed, sulfuric acid 50 ~ 100ml / L The catalyst is immersed in a temperature of 50 to 55 ° C. for 2 to 3 minutes to activate the catalyst and wash. Copper concentration 2.5 ~ 3 g / L, sodium hydroxide 8 ~ 9g / L, formalin 3 ~ 3.8g / L, EDTA 30 ~ 35g / L in a liquid striker plating for 2-5 minutes at a temperature of 45 ~ 55 ℃ 2 to 2.3 g / L, sodium hydroxide 6.5 to 7.5 g / L, formalin 2.5 to 2.8 g / L, EDTA 25 to 30 g / L, stabilizer 0.005 to 0.1 ml / L in liquid 4 to 10 hours at temperature 45 to 55 ° C After the plating process, the copper plating surface is catalytically active and washed by immersing in a catalytically active solution based on hydrochloric acid at 100 to 150 seconds at room temperature. Electroless nickel plating solution based on nickel concentration 5.5 to 6.5 g / L and sodium hypophosphite 27 to 33 g / L, washed with water for 8 to 12 minutes at 85 to 90 ° C, and washed with gold concentration to 1g / L for electroless gold plating solution Plating for 5 to 10 minutes at 85 ~ 90 ℃, washed once, washed with distilled water and then dehydrated and dried to complete the plating work, so the antenna function is configured on the inner surface or the interior of the housing of the mobile phone and wireless transceiver to be completed Method of manufacturing the intenna.

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