KR20090011757A - Nozzle and apparatus for coating a processing liquid having the same - Google Patents

Nozzle and apparatus for coating a processing liquid having the same Download PDF

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Publication number
KR20090011757A
KR20090011757A KR1020070075671A KR20070075671A KR20090011757A KR 20090011757 A KR20090011757 A KR 20090011757A KR 1020070075671 A KR1020070075671 A KR 1020070075671A KR 20070075671 A KR20070075671 A KR 20070075671A KR 20090011757 A KR20090011757 A KR 20090011757A
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KR
South Korea
Prior art keywords
process liquid
nozzle
rear suction
unit
injection
Prior art date
Application number
KR1020070075671A
Other languages
Korean (ko)
Inventor
김대성
김성언
Original Assignee
세메스 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 세메스 주식회사 filed Critical 세메스 주식회사
Priority to KR1020070075671A priority Critical patent/KR20090011757A/en
Publication of KR20090011757A publication Critical patent/KR20090011757A/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
    • B05B1/005—Nozzles or other outlets specially adapted for discharging one or more gases
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
    • B05B1/02—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to produce a jet, spray, or other discharge of particular shape or nature, e.g. in single drops, or having an outlet of particular shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Coating Apparatus (AREA)

Abstract

In the process liquid applying apparatus, the spray nozzle is connected to the process liquid supply source by a supply line, and sprays the process liquid on the upper surface of the substrate. The rear suction valve is connected to the supply line and sucks back the process liquid after the injection nozzle is completed. The rear suction display unit may be a scale formed in the spray unit of the spray nozzle for spraying the process liquid, or may be an optical sensor disposed on the side of the spray unit. The rear suction display unit displays the position of the process liquid sucked backward and stopped in the process liquid discharge passage in the spray unit. The back suction position of the photoresist solution in the plurality of jetting parts is uniformly adjusted automatically by the back suction control part manually or by the automatic control part. Therefore, the thickness of the photoresist film may be uniformly formed on the plurality of substrates.

Description

Nozzle and APPARATUS FOR COATING A PROCESSING LIQUID HAVING THE SAME}

The present invention relates to a spray nozzle and a process liquid coating apparatus having the same. More specifically, the present invention relates to a spray nozzle for spraying a process liquid such as a photoresist onto a substrate such as a semiconductor wafer, and a process liquid applying apparatus having the same.

In general, a manufacturing process of a substrate employed in a display panel of a semiconductor substrate or a liquid crystal display device includes a thin film process for coating a thin film on a glass substrate, a photolithography process for forming the thin film in a desired pattern, and etching the thin film according to the pattern. It can be subdivided into an etching process and the like. By repeatedly performing the above processes, a thin film transistor substrate and a color filter substrate employed in a semiconductor substrate or a display panel may be manufactured.

The photoresist application apparatus used in the photolithography process sprays a photoresist solution through a nozzle connected to a photoresist source and applies it to the loaded wafer surface. The sprayed photoresist solution is cured after a certain time, and the wafer is unloaded and transferred to a subsequent process.

The photoresist solution remains at the end of the nozzle where the injection of the photoresist solution is completed. If the remaining photoresist solution falls on the surface of the wafer, it may cause defects and adversely affect subsequent processes.

In order to prevent this, the photoresist application apparatus includes a suck back valve for suck back operation of the nozzle. For example, the rear suction valve may include a diaphragm therein.

The photoresist coating apparatus processes the rear suction operation of sucking the photoresist solution remaining at the nozzle end into the pipe by using the rear suction valve when the injection of the photoresist solution is completed. Due to back suction, the photoresist solution is sucked from the nozzle end into the tubing to prevent the photoresist solution from curing at the nozzle.

Since the thin film pattern formed on the substrate has a very fine thickness and line width, the thickness of the photoresist film needs to be uniform between the substrates in order to form a high quality thin film pattern.

However, in the conventional photoresist coating apparatus, the height of the photoresist sucked backward in the plurality of injection nozzles is frequently different. In the photoresist coating apparatus, since the injection amount of the photoresist is very small, the thickness of the photoresist film formed on the plurality of substrates becomes uneven when the heights of the photoresist sucked back by the plurality of injection nozzles are different. As a result, there is a problem that the yield of the substrate is lowered by lowering the reliability of subsequent processes such as a developing step.

Accordingly, the technical problem of the present invention is to solve such a conventional problem, and the present invention provides a spray nozzle capable of confirming the position of the rear sucked process liquid.

In addition, the present invention provides a process liquid coating apparatus that can check and control the position of the back sucked process liquid.

In order to realize the above object of the present invention, a nozzle unit includes an injection nozzle and a rear suction display unit. The spray nozzle is connected through a process solution source and a supply line to spray the process solution to form a thin film on the upper surface of the substrate. The injection nozzle is connected to a suck back valve that sucks back the process liquid after the injection is completed. The rear suction display unit is formed in the spray unit of the spray nozzle for spraying the process liquid. The rear suction display unit displays the position of the process liquid sucked backward and stopped in the process liquid discharge passage in the spray unit.

In one embodiment, the rear suction indicator includes a scale formed in the jetting portion of the jetting nozzle. The injection portion is transparent so that the position of the process liquid in the process liquid discharge passage can be visually recognized from the outside using the scale portion. The process solution may comprise a photoresist.

In order to realize the above-mentioned other object of the present invention, the process liquid applying apparatus includes a process liquid supply source, a supply line, and a nozzle unit. The nozzle unit includes a spray nozzle, a rear suction valve and a rear suction indicator. The supply line communicates with one side of the process liquid source to supply the process liquid. The injection nozzle communicates with the other side of the supply line to inject the process liquid onto the upper surface of the substrate. The rear suction valve is connected to the supply line and sucks back the process liquid after the injection nozzle is completed. The rear suction display unit is formed in the spray unit of the spray nozzle for spraying the process liquid. The rear suction display unit displays the position of the process liquid sucked backward and stopped in the process liquid discharge passage in the spray unit.

In one embodiment, the rear suction indicator includes a scale formed in the jetting portion of the jetting nozzle. The process liquid applying device may further include a rear suction control unit for manually operating the rear suction valve to move the position of the process liquid to a designated position on the scale.

In another embodiment, the rear suction indicator may include an optical sensor. The optical sensor may be disposed on the side surface of the injection unit to output the optical sensor signal by observing the position of the process liquid stopped in the process liquid discharge passage. The process liquid coating device may further include an automatic controller. The automatic control unit receives the optical sensor signal and operates the rear suction valve to move the process liquid stopped in the discharge passage to a designated position on the discharge passage.

The spray nozzle may spray a photoresist as a process solution on the upper surface of the substrate disposed on the spin coater.

According to the present invention, there is provided a spray nozzle and a process liquid applying device having the same, which uniformly adjusts rear suction positions of spray nozzles respectively disposed on a plurality of substrates to precisely spray the process liquid to apply the process liquid between the substrates. Uniformity can be improved.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

Injection nozzle and process liquid applying device

The process liquid coating apparatus according to the embodiment of the present invention may be employed in a photolithography process for manufacturing a substrate such as a thin film transistor substrate and a color filter substrate constituting a display panel of a semiconductor substrate or a liquid crystal display device.

The photolithography process includes a process of forming a photoresist film on a substrate, an exposure process of irradiating light to a predetermined region of the photoresist film, and a portion exposed by applying a developer to the photoresist film on which the exposure process is performed. Or developing the unexposed portions.

The process solution coating device may supply a photoresist solution to the substrate to perform such a photolithography process.

1 is a block diagram of a process liquid application apparatus according to an embodiment of the present invention. 2 is a side view of the nozzle unit according to the embodiment of the present invention.

Referring to FIG. 1, the process liquid applying device 100 includes a process liquid supply source 10, a supply line 20, a spray nozzle 30, a suck back valve 40, and a rear suction display unit 50. ).

The process solution source 10 stores a photoresist solution as a main tank, and a nitrogen pressurization line may be connected to a side of the process solution.

One side of the supply line 20 communicates with the process solution source 10 to transfer the photoresist solution.

Referring to FIG. 2, the spray nozzle 30 communicates with the other side of the supply line 20 to spray the photoresist solution on the upper surface of the substrate. The injection nozzle 30 may include a nozzle body part 31 and an injection part 35.

The nozzle body 31 is in communication with the other side of the supply line 20 and arranged side by side to the upper surface of the substrate. The injection part 35 is arrange | positioned toward the center of the board | substrate 5 in the direction orthogonal to the nozzle body part 31. As shown in FIG.

Process liquid coating device 100 is a buffer tank 60 is sequentially installed between the process liquid supply source 10 and the injection nozzle 30, the main valve 70 for opening and closing the supply line 20, a constant photoresist solution The supply pump 80 and the process liquid filter 90 for supplying the injection nozzle 30 at a pressure may be further included.

The photoresist solution stored in the process liquid supply source 10 is temporarily stored in the buffer tank 60, and the received photoresist solution is supplied to the supply line according to the operation of the supply pump 80 and the opening and closing of the main valve 70. 20 is transferred along the photoresist filter 90 and the rear suction valve 40, and then sprayed on the upper surface of the substrate 5 through the spray unit 35 of the spray nozzle 30.

3 is a cross-sectional view of an injection part of the nozzle unit according to the embodiment of the present invention.

1 and 3, a process liquid discharge passage 37 is formed inside the injection part 35. When the injection nozzle 30 sprays the photoresist solution 7 by a set value and the injection is completed, the photoresist solution 7 may remain at the outlet of the process liquid discharge passage 37. The photoresist solution 7 remaining at the outlet may be cured or dropped on the substrate 5 to adversely affect subsequent processes such as a developing process.

The rear suction valve 40 suctions the photoresist solution 7 remaining in the process liquid discharge passage 37 of the injection nozzle 30 after the injection nozzle 30 sprays the photoresist solution 7 by a set value. (suck back) The rear suction valve 40 may include a diaphragm therein.

Due to the action of the leg diaphragm of the rear suction valve 40, the photoresist solution 7 is sucked inwardly (backward) from the outlet of the injection part 35, as shown in FIG. It is moved inward of 37.

As a result, the photoresist solution 7 remaining in the process liquid discharge passage 37 of the spray unit 35 is prevented from being cured at the end of the spray nozzle 30 or dropped onto the substrate 5.

The rear suction display unit 50 may be formed in the injection unit 35. The rear suction display unit 50 may be a scale unit 50 displayed on an outer surface of the jet unit 35. The scale 50 may be embossed or engraved on the outer surface of the sprayer 35. Alternatively, the scale 50 may be drawn in a line on the outer surface of the injection unit 35.

The injection part 35 may be formed of a transparent resin that transmits light. Therefore, the photoresist solution 7 having a predetermined color can be visually confirmed from the outside at which position of the process liquid discharge passage 37 of the injection unit 35 is stopped.

The scale unit 50 may be formed at a constant scale upward from the outlet of the injection unit 35. Therefore, the scale unit 50, as shown in Figure 3, can display the position of the rear-suctioned photoresist to the outside in an objective value.

The combination of the jet nozzle 30 and the rear suction indicator 50 may be defined as a nozzle unit. Alternatively, a combination of the injection nozzle 30, the rear suction valve 40, and the rear suction display unit 50 may be defined as a nozzle unit.

Figure 4 is a plan view of a process equipment for applying the process liquid to the upper surface of the substrate using a process liquid applying apparatus according to an embodiment of the present invention.

Referring to FIG. 4, the process facility performs a photolithography process during the manufacturing process of the substrate 5. Process liquid coating apparatus 100 according to an embodiment of the present invention may be disposed in the photoresist coating process line of the photolithography process.

The process equipment includes a cassette 310, a loader unit 311, a process liquid applying apparatus 100, a vacuum drying apparatus 320, a soft baker 330, an exposure apparatus 340, and a developing apparatus 350. The cleaning device 360 may include a hard baker 370 and a robot 380.

The cassette 310 accommodates the substrate 5 to be loaded therein by several dozen sheets. A plurality of cassettes 310 are placed in the loader portion 311. The process liquid coating device 100 applies a photoresist to the substrate 5. The vacuum drying apparatus 320 removes the solvent of the substrate 5 to which the photoresist is applied by drying in a vacuum state. The soft baker 330 heats the vacuum dried substrate 5. The exposure apparatus 340 forms a photomask on the heat-treated substrate 5 and irradiates light to form a photoresist pattern. The developing apparatus 350 develops the exposed substrate 5, and the cleaning apparatus 360 cleans the developed substrate 5. The hard baker 370 heat-treats the cleaned substrate 5 again. The robot 380 removes the substrate 5 from the cassette 310 and loads it on the process liquid applying apparatus 100 or removes the substrate 5 placed on the hard baker 370 and loads the cassette 5 into the cassette 310.

5 is a cross-sectional view of an injection part of a nozzle unit illustrating a back sucked process liquid.

In order to improve the process efficiency in such a process equipment, a plurality of process liquid coating apparatus 100, as shown in Figure 4 and 5 may be arranged. That is, the plurality of substrates 5 may be added to the process liquid coating device 100, respectively.

The position of the photoresist solution 7 sucked backward and stopped in the process liquid discharge passage 37 of the spraying unit 35, that is, the height from the reference plane, is between the spraying units 35 of the plurality of process liquid applying apparatus 100. Can be different. FIG. 5 shows that the heights of the photoresist solutions back sucked in the three spraying portions 35 (height measured from the outlet of the spraying portion) may be different from each other by h1, h2, and h3.

 The thickness of the photoresist film formed on each substrate 5 in the plurality of substrates 5 introduced into the process liquid applying apparatus 100 greatly affects the reliability of the subsequent process, for example, the developing process. Therefore, it is preferable that the thickness of the photoresist film be uniformly formed between the substrates 5.

The thickness of the photoresist film may be determined by parameters such as the number of revolutions w of the spin coater for fixing and rotating the substrate 5, the viscosity and the flow rate of the photoresist solution 7.

The flow rate of the photoresist solution 7 used to form the photoresist film on the substrate 5 may vary depending on the size of the substrate 5. When manufacturing the semiconductor substrate 5 or the substrate 5 used for the liquid crystal display device, the spray nozzle 30 sprays the photoresist solution 7 onto the substrate 5 at approximately several cc / sec. That is, the flow rate of the photoresist used is very finely adjusted, and the photoresist film may have a thickness of several tens to hundreds of micrometers.

On the other hand, the separation distance between the substrate 5 and the injection portion 35 of the injection nozzle 30 is also an important parameter for determining the thickness of the photoresist film. Specifically, the separation distance is substantially, as shown in Figure 5, and the photoresist solution 7 is sucked back in the process liquid discharge flow path 37 of the injection unit 35 disposed on the substrate 5 and left It may be a separation distance between the substrate (5).

When the separation distances between the spraying portions 35 of the plurality of process liquid applying devices 100 are different from each other initially, the spraying nozzle 30 starts spraying and the photoresist solution 7 first collides with the substrate 5. Speeds may vary. As a result, the thickness of the photoresist film may be different between the substrates 5. This may lower the reliability of subsequent processes.

Therefore, the thickness of the photoresist film can be made more uniform by uniformly adjusting the rear suction position of the photoresist solution 7 which is stopped in the injection parts 35.

6 is a cross-sectional view of an injection part of a nozzle unit illustrating a process liquid whose position of rear suction is adjusted.

Referring back to FIG. 1, in the present embodiment, the process solution coating device 100 may further include a rear suction adjusting part 45.

The rear suction adjusting unit 45 may operate the rear suction valve 40. The rear suction adjusting unit 45 may be manually operated. For example, it is possible to control the compression and recovery of the diaphragm of the rear suction valve 40 by operating the rear suction adjustment unit 45, thereby increasing or decreasing the rear suction amount of the photoresist solution 7. have.

When the user operates the rear suction control unit 45 with the naked eye referring to the scale 50 displayed on the spray unit 35, the photoresist solution 7 in the process liquid discharge passage 37 of the spray unit 35 is operated. Can be moved to a designated position on the process liquid discharge passage 37.

Therefore, in the plurality of injection parts 35, as shown in FIG. 6, the position, that is, the height of the back suction photoresist solution 7 may be uniformly adjusted to h0. As a result, the thickness of the photoresist film formed on the substrate 5 can be formed more uniformly.

7 is a block diagram of a process liquid application device according to another embodiment of the present invention.

Referring to FIG. 7, the process liquid applying apparatus 500 includes a process liquid supply source 510, a supply line 520, a spray nozzle 530, a rear suction valve 540, a rear suction display unit 550, and an automatic control unit ( 545).

The process liquid source 510, the supply line 520, the injection nozzle 530 and the rear suction valve 540 may be substantially identical to those described in FIGS. 1 to 6, respectively.

The rear suction display unit 550 may be disposed on a side surface of the jet unit of the jet nozzle 530. The rear suction display unit 550 may detect the position of the photoresist solution which is sucked backward and stopped in the process liquid discharge flow path of the injection unit, and may output a detection signal.

For example, the rear suction display unit 550 may include an optical sensor 550. The light sensor 550 may include a light emitter 551 and a light receiver 555.

The light emitting unit 551 may be disposed on one side of the jetting unit to emit sensing light such as a laser and an infrared ray to the jetting unit. The light receiving unit 555 may be disposed on the other side of the injection unit to face the light emitting unit 551. Light emitted from the light emitter 551 is received by the light receiver 555. The optical sensor 550 may output the optical sensor 550 signal by determining the position of the photoresist on the process liquid discharge passage from the light received through the photoresist or the injection unit and received by the light receiving unit 555.

The automatic controller 545 may be electrically or mechanically connected to the rear suction display unit 550 and the rear suction valve 540. The automatic controller 545 may receive the light sensor 550 signal from the rear suction display unit 550. The automatic controller 545 may increase or decrease the amount of rear suction of the photoresist solution by automatically operating the rear suction valve 540 by comparing the signal of the photosensor 550 with the rear suction position of the set photoresist.

When the back suction set values of the photoresist are the same in the plurality of process solution coating apparatuses 500, the back suction position of the photoresist solution may be uniformed among the plurality of injection parts. As a result, the thickness of the photoresist film can be made more uniform between the substrates 5.

In the detailed description of the present invention described above with reference to the preferred embodiments of the present invention, those skilled in the art or those skilled in the art having ordinary skill in the art will be described in the claims to be described later It will be understood that various modifications and variations can be made in the present invention without departing from the scope of the present invention.

 The spray nozzle and the process liquid coating apparatus having the same according to an embodiment of the present invention may be applied to a device for forming a thin film such as a photoresist film on a substrate such as a semiconductor wafer or a thin film transistor substrate and a color filter substrate. When the present invention is applied as described above, the thickness of a thin film, such as a photoresist film, may be more uniformly formed on the plurality of substrates, thereby improving reliability of a subsequent development process and the like, thereby improving the yield of the substrate.

1 is a block diagram of a process liquid application apparatus according to an embodiment of the present invention.

2 is a side view of the nozzle unit according to the embodiment of the present invention.

3 is a cross-sectional view of an injection part of the nozzle unit according to the embodiment of the present invention.

Figure 4 is a plan view of a process equipment for applying the process liquid to the upper surface of the substrate using a process liquid applying apparatus according to an embodiment of the present invention.

5 is a cross-sectional view of an injection part of a nozzle unit illustrating a back sucked process liquid.

6 is a cross-sectional view of an injection part of a nozzle unit illustrating a process liquid whose position of rear suction is adjusted.

7 is a block diagram of a process liquid application device according to another embodiment of the present invention.

<Explanation of symbols for the main parts of the drawings>

5: substrate 7: photoresist solution

10: process liquid supply source 20: supply line

30: injection nozzle 35: injection unit

37: process liquid discharge passage 40: rear suction valve

45: rear suction control unit 50: rear suction display unit

60: buffer tank 70: main valve

80: supply pump 90: process liquid filter

100: process liquid coating device

Claims (8)

A spray nozzle connected to a process liquid supply source through a supply line to inject a process liquid to form a thin film on an upper surface of the substrate, and a suck back valve to suck back the process liquid after completion of spraying; And And a rear suction display unit which is formed on an injection unit of the injection nozzle and sucks backward and displays a position of the process liquid stopped in the process liquid discharge passage in the injection unit. The nozzle unit of claim 1, wherein the rear suction display unit comprises a scale formed on the injection unit of the injection nozzle. 3. The nozzle unit according to claim 2, wherein the injection part is transparent, and the position of the process liquid in the process liquid discharge passage is visually recognized from the outside using the scale part. Process liquid source; A supply line communicating with one side of the process liquid supply source to transfer the process liquid; And A spray nozzle in communication with the other side of the supply line for injecting the process liquid onto the upper surface of the substrate, a rear suction valve connected to the supply line to back suck the process liquid after completion of the spray nozzle, and the process Process liquid coating comprising a nozzle unit which is formed in the jetting portion of the jetting nozzle for jetting liquid, and includes a rear suction indicator that is sucked backward and displays the position of the process liquid stopped in the process liquid discharge flow path in the jetting part. Device. The process liquid application apparatus of claim 4, wherein the rear suction display unit comprises a scale formed on the injection unit of the injection nozzle. The process liquid application apparatus according to claim 5, further comprising a rear suction control unit for manually operating the rear suction valve to move the position of the process liquid to a designated position on the scale. The process of claim 4, wherein the rear suction display unit comprises an optical sensor disposed on a side surface of the injection unit and outputting an optical sensor signal by observing a position of the process liquid stopped in the process liquid discharge passage. Liquid coating device. The method of claim 7, further comprising an automatic control unit for receiving the optical sensor signal to operate the rear suction valve to move the process liquid of the process liquid discharge flow path to a designated position on the process liquid discharge flow path. Process solution coating device.
KR1020070075671A 2007-07-27 2007-07-27 Nozzle and apparatus for coating a processing liquid having the same KR20090011757A (en)

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KR1020070075671A KR20090011757A (en) 2007-07-27 2007-07-27 Nozzle and apparatus for coating a processing liquid having the same

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Application Number Priority Date Filing Date Title
KR1020070075671A KR20090011757A (en) 2007-07-27 2007-07-27 Nozzle and apparatus for coating a processing liquid having the same

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KR20090011757A true KR20090011757A (en) 2009-02-02

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101516342B1 (en) * 2013-10-21 2015-05-04 주식회사 말콤 Syringe for led package having temperature indicating means and manufacturing method using the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101516342B1 (en) * 2013-10-21 2015-05-04 주식회사 말콤 Syringe for led package having temperature indicating means and manufacturing method using the same

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