KR20090005106A - Radiation-sensitive insulating resin composition - Google Patents

Abstract

Disclosed is a radiation-sensitive insulating resin composition which enables to obtain a cured product excellent in electrical insulation, resolution, adhesion and thermal shock resistance in a balanced manner. Specifically disclosed is a radiation-sensitive insulating resin composition which is characterized by containing a compound (A) having a disulfide structure, a resin (B) and a radiation-sensitive compound (D). It is preferable that the radiation-sensitive insulating resin composition further contains, if necessary, a compound (C) having a functional group reactive with an alkali-soluble resin (B1) and a crosslinked fine particles (E) having an average particle diameter of 30-500 nm.

Description

Radiation-sensitive insulating resin composition {RADIATION-SENSITIVE INSULATING RESIN COMPOSITION}

The present invention relates to a radiation-sensitive insulating resin composition. More specifically, the present invention relates to a radiation sensitive insulating resin composition comprising a compound having a disulfide structure, a resin, and a radiation sensitive compound.

Background Art Various photosensitive resin compositions have been used in order to form an interlayer insulating film (passivation film) or a surface protective film (overcoat film) in a semiconductor element of an electronic device. For example, as a negative photosensitive resin composition, the resin composition containing the polyimide precursor which introduce | transduced the photocrosslinking group by ester bond or an ionic bond is mentioned, As a positive photosensitive resin composition, a polyimide precursor and quinonediazide are mentioned. The composition which consists of a compound (refer patent document 1 and patent document 2), and the composition (refer patent document 3 below) which consists of a polybenzoxazole precursor and a quinonediazide compound are mentioned.

However, in the said resin composition, there existed a problem with resolution, film formation, etc. in the case of a negative type, and there existed a problem with adhesiveness to a board | substrate with heat resistance and electrical insulation in the case of the said positive type.

On the other hand, Patent Document 4 below discloses a cured product formed using a positive photosensitive resin composition containing an alkali-soluble resin having a phenolic hydroxyl group, a compound having a quinonediazide group, a crosslinked fine particle, a curing agent, and a solvent. Attempts have been made to improve the characteristics such as insulation and adhesion.

However, each characteristic of the hardened | cured material formed from the said resin composition had room for improvement. For this reason, the resin composition which can form the hardened | cured material improved by the balance of resolution and thermal shock resistance favorable with electrical insulation and adhesiveness was calculated | required.

On the other hand, Patent Document 5 discloses a curable resin composition containing a disulfide compound having a disulfide structure as an epoxy resin, a curing agent, and a modifier in order to improve low hygroscopicity, heat resistance, and adhesion.

Patent Document 1: Japanese Patent Application Laid-Open No. 5-5996

Patent Document 2: Japanese Patent Application Laid-Open No. 2000-98601

Patent Document 3: Japanese Patent Application Laid-Open No. 11-237736

Patent Document 4: Japanese Patent Application Laid-Open No. 2003-215789

Patent Document 5: Japanese Patent Application Laid-Open No. 2005-2221

<Start of invention>

Problems to be Solved by the Invention

An object of the present invention is to provide a radiation-sensitive insulating resin composition in which a cured product improved in a good balance of electrical insulation, resolution, adhesion and thermal shock resistance is obtained.

Means for solving the problem

MEANS TO SOLVE THE PROBLEM As a result of earnestly researching in order to solve the said subject, when using the compound which has a disulfide structure, the present inventors discovered that hardened | cured material excellent in electrical insulation, the resolution, adhesiveness, and crack resistance was obtained, and completed this invention, Reached.

That is, the radiation sensitive insulating resin composition which concerns on this invention is characterized by including the compound (A), resin (B), and radiation sensitive compound (D) which have a disulfide structure.

It is preferable that resin (B) is alkali-soluble resin (B1).

It is preferable that alkali-soluble resin (B1) is alkali-soluble resin (B2) which has a phenolic hydroxyl group.

It is preferable that the said radiation sensitive insulating resin composition further contains the compound (C) which has a functional group which can react with alkali-soluble resin (B1).

It is preferable that a radiation sensitive compound (D) is a quinone diazide compound (D1).

It is preferable that a radiation sensitive compound (D) is a photosensitive acid generator (D2).

It is preferable that the said radiation sensitive insulating resin composition further contains bridge | crosslinking microparticles | fine-particles (E) whose average particle diameter is 30-500 nm.

It is preferable that the compound (A) which has a disulfide structure is represented by following General formula (A1).

(In the formula, A 'represents a monovalent organic group which may have a substituent, A represents a divalent organic group which may have a substituent, and when A is plural, each may be the same or different, n is 1 to 1 Represents an integer of 10)

It is preferable that the compound (A) which has a disulfide structure has a reactive active group.

It is preferable that the said radiation sensitive insulating resin composition further contains 50-1000 ppm of surfactant (H).

The hardened | cured material which concerns on this invention is obtained using the said radiation sensitive insulating resin composition, It is characterized by the above-mentioned.

The semiconductor device which concerns on this invention is characterized by having a cured film formed using the said radiation-sensitive insulating resin composition.

Effect of the Invention

According to the radiation-sensitive insulated resin composition which concerns on this invention, the hardened | cured material improved by the favorable balance of electrical insulation, the resolution, adhesiveness, and thermal shock resistance is obtained. Moreover, the said hardened | cured material is used suitably as an interlayer insulation film (passivation film) and surface protection film (overcoat film), such as a semiconductor element.

1 is a cross-sectional view showing an example of a semiconductor device according to the present invention.

2 is a cross-sectional view showing an example of a semiconductor device according to the present invention.

3 is a cross-sectional view of a substrate for thermal shock evaluation.

4 is a top view of a substrate for thermal shock evaluation.

5 is a top view of the electrically insulating substrate.

<Explanation of symbols for the main parts of the drawings>

1 board

2 metal pads

3, 6 insulating film (cured film)

4 metal wiring

5 semiconductor element material

10 copper foil

11 Copper foil with gold on the surface

12 boards

13 description

Best Mode for Carrying Out the Invention

EMBODIMENT OF THE INVENTION Hereinafter, this invention is demonstrated concretely.

The radiation sensitive insulating resin composition which concerns on this invention is characterized by including the compound (A), resin (B), and a radiation sensitive compound (D) which have a disulfide structure. The said radiation-sensitive insulated resin composition is a compound (C) which has a functional group which can react with alkali-soluble resin (B1), and average particle diameter is 30-500, when resin (B) is alkali-soluble resin (B1) as needed. It is preferable to further include crosslinked microparticles | fine-particles (E) which are nm.

<Compound (A) having a disulfide structure>

The compound (A) having a disulfide structure (also referred to herein as "disulfide compound (A)") used in the present invention is not particularly limited as long as it has a disulfide structure (-SS-). The compound represented by is used preferably.

<Formula A1>

In the formula, A 'represents a monovalent organic group which may have a substituent.

An aryl group, an alkyl group, and derivatives thereof are mentioned as said monovalent organic group, An aryl group and an alkyl group are preferable.

As said aryl group, a C6-C20 aryl group is preferable, A phenyl group, a naphthyl group, etc. are mentioned specifically ,.

The alkyl group may be either linear or branched, and an alkyl group having 1 to 9 carbon atoms is preferably used. Specific examples of the alkyl group having 1 to 9 carbon atoms include methyl group, ethyl group, propyl group, isopropyl group, cyclopropyl group, butyl group, isobutyl group, tert-butyl group, cyclobutyl group, pentyl group and isopentyl group And neopentyl group, cyclopentyl group, hexyl group, cyclohexyl group, heptyl group, cycloheptyl group, octyl group, and nonyl group.

In said formula, A represents the bivalent organic group which may have a substituent.

An arylene group and an alkylene group are mentioned as said bivalent organic group. When there are multiple A, they may be same or different, respectively.

As said arylene group, a C6-C20 arylene group is preferable, A p-phenylene group, m-phenylene group, o-phenylene group, 2, 6- naphthalene group, etc. are mentioned specifically ,.

The alkylene group may be either linear or branched, and a methylene group or an alkylene group having 2 to 9 carbon atoms is preferably used. As said C2-C9 alkylene group, an ethylene group, trimethylene group, a propylene group, etc. are mentioned specifically ,.

Each of A 'and A may have one or more substituents, and examples of the substituent include an aryl group, an alkyl group, an alkoxy group, an aralkyl group, and the like. Specific examples of the aryl group and alkyl group include the same groups as the above, and specific examples of the aralkyl group include benzyl group and phenethyl group.

Moreover, it is preferable that a disulfide compound (A) has a reactive active group. Thereby, the disulfide compound (A), the compound (C) which has a functional group which can react with alkali-soluble resin (B1), and alkali-soluble resin (B1) react, and the hardened | cured material excellent in adhesiveness, the resolution, and thermal shock resistance is obtained.

Specifically, it is preferable that at least one of the substituents of A 'and / or A in the general formula (A1) is a reactive activating group. As said reactive activator, a hydroxyl group, a carboxyl group, a vinyl group, a mercapto group, an amino group, an aldehyde group, etc. are mentioned. Among these, a hydroxyl group and a carboxyl group are more preferable.

The compound represented by the formula (A1) may have a repeating structure, n represents an integer of 1 to 10, preferably 1 to 4. Of these, compounds in which n is 1 are particularly preferably used. According to the compound whose n is 1, the hardened | cured material which is excellent in insulation is obtained, even when it refine | miniaturizes and is used under severe conditions, maintaining adhesiveness, resolution, etc ..

In the above, as a disulfide compound (A), dithiobisphenol and 2-hydroxyethyl disulfide are used preferably.

The disulfide compound (A) may be in a crystalline state or an amorphous state at room temperature. Moreover, it may be a dendritic substance which is liquid or solid. The molecular weight of the disulfide compound (A) is not particularly limited and may be a low molecule or a polymer, but is preferably 150 to 10,000, more preferably 200 to 3000, particularly preferably 200 to 1000.

The disulfide compound (A) may be used alone or in combination of two or more thereof.

From the standpoint of the insulation, adhesion, resolution and thermal shock resistance of the cured product obtained in the resin composition according to the present invention, the amount of the disulfide compound (A) is alkali-soluble when an alkali-soluble resin (B1) (phenol compound (B ') is used). Preferably it is 0.1-30 weight part, More preferably, it is 0.1-10 weight part with respect to 100 weight part of resin (B1) and the sum total of resin (B ').

<Resin (B)>

As resin (B) used by this invention, alkali-soluble resin (B1) is preferable.

The alkali-soluble resin (B1) is not particularly limited as long as it is alkali-soluble, but an alkali-soluble resin (B2) having a phenolic hydroxyl group (also referred to herein as "phenol resin (B2)"), a polyimide precursor, and the like are preferable.

As a phenol resin (B2), besides novolak resin, polyhydroxy styrene and its copolymer, phenol- xylylene glycol condensation resin, cresol- xylylene glycol condensation resin, phenol- dicyclopentadiene condensation resin, polybenzo And oxazole precursors. Of these, novolak resins, polyhydroxystyrenes and copolymers thereof, and polybenzoxazole precursors are preferable. These resins may be used alone or in combination of two or more thereof.

The novolak resin is obtained by condensing phenols and aldehydes in the presence of a catalyst. Examples of the phenols include phenol, o-cresol, m-cresol, p-cresol, o-ethylphenol, m-ethylphenol, p-ethylphenol, o-butylphenol, m-butylphenol and p-butylphenol. , 2,3-xylenol, 2,4-xylenol, 2,5-xylenol, 2,6-xylenol, 3,4-xylenol, 3,5-xylenol, 2 , 3,5-trimethylphenol, 3,4,5-trimethylphenol, catechol, resorcinol, pyrogallol, α-naphthol, β-naphthol and the like.

Moreover, as said aldehyde, formaldehyde, paraformaldehyde, acetaldehyde, benzaldehyde, etc. are mentioned, for example.

Specific examples of such novolak resins include phenol / formaldehyde condensation novolac resins, cresol / formaldehyde condensation novolac resins, and phenol-naphthol / formaldehyde condensation novolac resins.

Specific examples of the polyhydroxy styrene and copolymers thereof include a structural unit (b1) represented by the following formula (1) and a structural unit (b2) represented by the following formula (2) in view of the insulating properties and thermal shock resistance of the cured product obtained. Copolymer (b3) is used preferably. Copolymer (B3) is a copolymer of the monomer which can form the structural unit (b1) represented by following formula (1), and the monomer which can form the structural unit (b2) represented by following formula (2).

(Ra represents an alkyl group, an alkoxy group or an allyl group having 1 to 4 carbon atoms. Rb represents a hydrogen atom or a methyl group. N is an integer of 0 to 3 and m is an integer of 1 to 3)

As a monomer which can form a structural unit (b1), p-hydroxy styrene, m-hydroxy styrene, o-hydroxy styrene, p-isopropenyl phenol, m-isopropenyl phenol, o-isopropenyl Phenol etc. are mentioned, Among these, p-hydroxy styrene and p-isopropenyl phenol are preferable.

A structural unit (b1) can also be obtained by polymerizing the monomer in which the hydroxyl group was protected, for example by t-butyl group, an acetyl group, etc. The obtained polymer or copolymer is converted into a hydroxystyrene-based structural unit by known protection, for example by deprotection under an acid catalyst.

(Rc represents an alkyl group, an alkoxy group or an allyl group having 1 to 4 carbon atoms. Rd represents a hydrogen atom or a methyl group. N is an integer of 0 to 3)

As a monomer which can form a structural unit (b2), For example, styrene, (alpha) -methylstyrene, o-methylstyrene, m-methylstyrene, p-methylstyrene, o-methoxy styrene, m-methoxy styrene, p-methoxy styrene etc. are mentioned. Among these, styrene and p-methoxy styrene are preferable and styrene is more preferable.

These monomers may be used independently, respectively and may be used in combination of 2 or more type.

Copolymer (B3) is a copolymer of a monomer capable of forming a structural unit (b1) and a monomer capable of forming a structural unit (b2), and is essentially composed of only structural units (b1) and structural units (b2). It is preferred to make, but other monomers may be copolymerized.

As said other monomer, For example, unsaturated carboxylic acid or these acid anhydrides, ester of the said unsaturated carboxylic acid, unsaturated nitrile, unsaturated amide, unsaturated imide, the compound which has alicyclic skeleton, unsaturated alcohol , N-vinyl-ε-caprolactam, N-vinylpyrrolidone, N-vinylimidazole, N-vinylcarbazole and the like.

More specifically, for example

Unsaturated carboxylic acids such as (meth) acrylic acid, maleic acid, fumaric acid, crotonic acid, mesaconic acid, citraconic acid, itaconic acid, maleic anhydride, citraconic acid anhydride, or acid anhydrides thereof;

Methyl ester, ethyl ester, n-propyl ester, i-propyl ester, n-butyl ester, i-butyl ester, sec-butyl ester, t-butyl ester, n-amyl ester, n-hexyl of the above unsaturated carboxylic acid Ester, cyclohexyl ester, 2-hydroxyethyl ester, 2-hydroxypropyl ester, 3-hydroxypropyl ester, 2,2-dimethyl-3-hydroxypropyl ester, benzyl ester, isoboroyl ester, tri Esters such as cyclodecanyl ester and 1-adamantyl ester;

Unsaturated nitriles such as (meth) acrylonitrile, malenitrile, fumaronitrile, mesaconitrile, citraconnitrile, and itaconitrile;

Unsaturated amides such as (meth) acrylamide, crotonamide, maleamide, fumaramide, mesaconamide, citraconamide, and itaconeamide;

Unsaturated imides such as maleimide, N-phenylmaleimide, and N-cyclohexylmaleimide;

Bicyclo [2.2.1] hept-2-ene (norbornene), tetracyclo [4.4.0.1 ^2,5 .1 ^7,10 ] dodeca-3-ene, cyclobutene, cyclopentene, cyclooctene, dicy Compounds having an alicyclic skeleton such as clopentadiene and tricyclo [5.2.1.0 ^2,6 ] decene;

Unsaturated alcohols such as (meth) allyl alcohol;

N-vinyl aniline, vinyl pyridines, N-vinyl-ε-caprolactam, N-vinylpyrrolidone, N-vinylimidazole, N-vinylcarbazole, etc. are mentioned.

These monomers may be used alone or in combination of two or more thereof.

The amount of the structural unit formed from the other monomers is 100 parts by weight or less, preferably 50 parts by weight or less, based on 100 parts by weight of the total of the structural unit (b1) and the structural unit (b2) in the copolymer (B3). More preferably, it is 25 weight part or less.

In the copolymer (B3), the content of the structural unit (b1) is 10 to 99 mol%, preferably 20 to 97 mol%, more preferably 30 to 95 mol%, and the content of the structural unit (b2) is It is 90-1 mol%, Preferably it is 80-3 mol%, More preferably, it is 70-5 mol% (Here, the whole quantity of the structural unit which comprises copolymer (B3) is 100 mol%). When content of a structural unit (b) and a structural unit (b2) is outside the said range, patterning characteristics may fall, and physical properties, such as thermal shock property of hardened | cured material, may fall.

When a copolymer (B3) is comprised from the said structural unit and content of each structural unit exists in the said range, the hardened | cured material which is excellent in various characteristics, such as a resolution, electrical insulation, thermal shock, and adhesiveness, especially electrical insulation and thermal shock are all Excellent cured products can be formed.

In the copolymer (B3), the arrangement of the structural unit (b1), the structural unit (b2), and the structural unit formed from the other monomers is not particularly limited, and the copolymer (B3) is a random copolymer or a block copolymer. It may be either.

In order to obtain a copolymer (B3), the compound which can form the structural unit (b1) or the compound which protected its hydroxyl group, the monomer which can form the structural unit (b2), and the said other monomer are a solvent in presence of an initiator. It can superpose | polymerize in the inside. The polymerization method is not particularly limited and may be carried out by radical polymerization, anionic polymerization, or the like in order to obtain a compound having a desired molecular weight.

Usually, as a monomer which can form the structural unit represented by structural unit (b1), the monomer in which the hydroxyl group was protected is used. After the polymerization of the hydroxyl group, the monomer is deprotected by reaction at a temperature of 50 to 150 ° C. for 1 to 30 hours under an acid catalyst such as hydrochloric acid or sulfuric acid in a solvent to be converted into a phenol ring-containing structural unit.

Although the molecular weight of alkali-soluble resin (B1) is not specifically limited, The weight average molecular weight (Mw) of polystyrene conversion measured by the gel permeation chromatography (GPC) method is 200,000 or less, for example, Preferably it is 2,000-100,000. When Mw is less than 2,000, physical properties, such as heat resistance and elongation of hardened | cured material, may fall, and when it exceeds 200,000, compatibility with other components may fall or patterning characteristics may fall.

On the other hand, as a phenol resin (B2), in order to improve alkali solubility, you may use the mixture of a copolymer (B3) and a novolak resin. With respect to 100 parts by weight of copolymer (B3), the novolak resin is preferably in the range of 1 to 200 parts by weight, more preferably in the range of 1 to 150 parts by weight, still more preferably in the range of 1 to 100 parts by weight. Is used.

Moreover, in the resin composition which concerns on this invention, alkali-soluble resin (B1) and phenolic low molecular compound (it may also call "phenol compound (B ') in this specification) can also be used together.

As a phenol compound (B '), 4,4'- dihydroxy diphenylmethane, 4,4'- dihydroxy diphenyl ether, tris (4-hydroxyphenyl) methane, 1, 1-bis, for example. (4-hydroxyphenyl) -1-phenylethane, tris (4-hydroxyphenyl) ethane, 1,3-bis [1- (4-hydroxyphenyl) -1-methylethyl] benzene, 1,4- Bis [1- (4-hydroxyphenyl) -1-methylethyl] benzene, 4,6-bis [1- (4-hydroxyphenyl) -1-methylethyl] -1,3-dihydroxybenzene, 1,1-bis (4-hydroxyphenyl) -1- [4- {1- (4-hydroxyphenyl) -1-methylethyl} phenyl] ethane, 1,1,2,2-tetra (4- Hydroxyphenyl) ethane and the like.

When mix | blending a phenol compound (B '), although the said resin composition is mix | blended to the extent which can express sufficient alkali solubility, Specifically, it is 1-200 weight part with respect to 100 weight part of alkali-soluble resin (B1). In the range, more preferably in the range of 1 to 150 parts by weight, still more preferably in the range of 1 to 100 parts by weight.

In the resin composition according to the present invention, the amount of the alkali-soluble resin (B1) (when the phenol compound (B ') is used, the sum of the flow rates of the alkali-soluble resin (B1) and the phenol compound (B')) is the resin. It is 40-95 weight part normally with respect to 100 weight part of compositions (excluding a solvent), Preferably it is 50-80 weight part.

<Compound (C) having a functional group capable of reacting with alkali-soluble resin (B1)>

Compound (C) (also referred to herein as "crosslinking agent (C)") having a functional group capable of reacting with alkali-soluble resin (B1) used in the present invention is an alkali-soluble resin (B1) and a phenol compound (B '). It is a crosslinking component which reacts.

As a crosslinking agent (C), for example, a methylol group and / or an alkoxymethyl group containing aromatic compound (except the aromatic compound containing an amino group) (c1), an aromatic aldehyde compound (c2), an aliphatic aldehyde compound (c3), And at least one compound selected from the group consisting of alkyl etherified amino group-containing compounds (c4) and epoxy group-containing compounds (c5). Of these, one selected from the group consisting of a methylol group and / or an alkoxymethyl group-containing aromatic compound (except for an aromatic compound containing an amino group) (c1), an aromatic aldehyde compound (c2) and an aliphatic aldehyde compound (c3) At least one compound (C2) selected from the group consisting of the above compound (C1) or an alkyl etherified amino group-containing compound (c4) and an epoxy group-containing compound (c5) is preferable.

The methylol group and / or the alkoxymethyl group-containing aromatic compound (except the aromatic compound containing an amino group) (c1) is not particularly limited as long as it has a methylol group and / or an alkoxymethyl group and does not have an amino group in the molecule, For example 1,2-benzenedimethanol, 1,3-benzenedimethanol, 1,4-benzenedimethanol, 2,6-bis (hydroxymethyl) -p-cresol, 2,6-bis (hydroxy Methyl) -4-methylphenol, 5- [1,1-dimethyl-ethyl] 2-hydroxy-1,3-benzenedimethanol, 2-hydroxy-1,3,5-benzenetrimethanol, 2,6 -Dimethoxymethyl-4-methylphenol, 2,6-dimethoxymethyl-4- (1,1-dimethylethyl) phenol, 3,3'-methylenebis (2-hydroxy-5-methyl-benzenemethanol) , 4,4 '-(1-methylethylidene) bis (2-methyl-6-methoxymethylphenol), 4,4'-(1-phenylethylidene) bis (2-hydroxyethoxyphenol ), 3,3 ', 5,5'-tetramethylol-2,2-bis (4-hydroxyphenylpropane), 3,3', 5,5'-tetramethoxymethyl-2,2-bis (4-he Hydroxyphenyl propane), 1,2,4,5-tetramethyl-ol benzene, 1,2,4,5-tetramethoxy-methylbenzene.

The aromatic aldehyde compound (c2) and the aliphatic aldehyde compound (c3) are not particularly limited as long as they contain an aldehyde group in the molecule. For example, formaldehyde, benzaldehyde, acetaldehyde, propylaldehyde, phenylacetaldehyde, α-phenylpropylaldehyde, β-phenylpropylaldehyde, o-hydroxybenzaldehyde, m-hydroxybenzaldehyde, p-hydroxybenzaldehyde, o-methylbenzaldehyde, m-methylbenzaldehyde, p-methylbenzaldehyde, furfural, glyoxal, glutaraldehyde, terephthal Aldehyde, isophthalaldehyde, etc. are mentioned.

As the alkyl etherified amino group-containing compound (c4), for example, active methylol groups such as (poly) methylol melamine, (poly) methylol glycoluril, (poly) methylolated benzoguanamine and (poly) methylolated urea The nitrogen containing compound which alkylated all or part of is mentioned. Here, the alkyl group which comprises an alkyl ether is a methyl group, an ethyl group, or a butyl group, and may be same or different from each other. In addition, unalkylated methylol groups may be self-condensed in one molecule or condensed between two molecules, resulting in the formation of oligomer components. Specifically, hexamethoxymethylated melamine, hexabutoxymethylated melamine, tetramethoxymethylated glycoluril, tetrabutoxymethylated glycoluril and the like are preferably used.

As an epoxy group containing compound (c5), if an oxirane ring is contained in a molecule | numerator, it will not specifically limit, For example, a phenol novolak-type epoxy resin, a cresol novolak-type epoxy resin, a bisphenol-type epoxy resin, a trisphenol-type epoxy resin, tetra Phenol type epoxy resin, phenol-xylylene type epoxy resin, naphthol-xylylene type epoxy resin, phenol-naphthol type epoxy resin, phenol-dicyclopentadiene type epoxy resin, alicyclic epoxy resin, aliphatic epoxy resin and the like. have.

Compounds (c1) to (c5) may be used alone, or two or more kinds thereof may be used in combination.

In the resin composition according to the present invention, the amount of the crosslinking agent (C) is 100 parts by weight of an alkali-soluble resin (B1) (a total of alkali-soluble resin (B1) and a phenol compound (B ') when using a phenol compound (B')). It is preferably 1 to 100 parts by weight, more preferably 2 to 70 parts by weight. When the amount is less than 1 part by weight, the chemical resistance of the resulting cured film may decrease, and when the amount exceeds 100 parts by weight, resolution may decrease.

<Radiation compound (D)>

As a radiation sensitive compound (D) used by this invention, a quinone diazide compound (D1) and a photosensitive acid generator (D2) are mentioned.

The quinonediazide compound (D1) is, for example, a compound having a quinonediazide group and having at least one phenolic hydroxyl group, and 1,2-naphthoquinonediazide-4-sulfonic acid or 1,2-naphtho. Ester compound with quinonediazide-5-sulfonic acid. According to this compound, a positive pattern can be formed by irradiation of radiation or the like.

Although it does not specifically limit as a compound which has one or more of said phenolic hydroxyl groups, The compound of the structure shown below is preferable.

In Formula 3, X ₁ to X ₁₀ may be the same as or different from each other, and each represents a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, an alkoxy group having 1 to 4 carbon atoms, or a hydroxyl group. ₁ of X ₁ to X ₅ More than one is a hydroxyl group, and A is a single bond, O, S, CH ₂ , C (CH ₃ ) ₂ , C (CF ₃ ) ₂ , C═O or SO ₂ )

(A X ₁₁ to X ₂₃ are each the same or different each other, X ₁₁ to about the same as X ₁₅ cases: one or more in the combination of X ₁₁ to X ₁₅ is a hydroxyl group according to general formula 4. In addition, R ₁ to R ₄ is a hydrogen atom or an alkyl group having 1 to 4 carbon atoms)

In Formula 5, X ₂₅ to X ₃₉ may be the same as or different from each other, and the same as in the case of X ₁ to X _{10. 1} in each combination of X ₂₅ to X ₂₉ and X ₃₀ to X ₃₄ Is a hydroxyl group, and R ₅ is a hydrogen atom or an alkyl group having 1 to 4 carbon atoms)

In Formula 6, X ₄₀ to X ₈₈ may be the same as or different from each other, and the same as in the case of X ₁ to X _10. X ₄₀ to X ₄₄ , X ₄₅ to X _49, and X ₅₀ to X ₅₄ At least one is a hydroxyl group in each combination, and R ₆ to R ₈ are a hydrogen atom or an alkyl group having 1 to 4 carbon atoms)

In Formula 7, X ₅₉ to X ₇₂ may be the same as or different from each other, and the same as in the case of X ₁ to X _{10. 1} in each combination of X ₅₉ to X ₆₂ and X ₆₃ to X ₆₇ More than is hydroxyl)

As such a quinone diazide compound (D1), 4,4'- dihydroxy diphenylmethane, 4,4'- dihydroxy diphenyl ether, 2,3,4- trihydroxy benzophenone, 2,3,4 , 4'-tetrahydroxybenzophenone, 2,3,4,2 ', 4'-pentahydroxybenzophenone, tris (4-hydroxyphenyl) methane, tris (4-hydroxyphenyl) ethane, 1, 1-bis (4-hydroxyphenyl) -1-phenylethane, 1,3-bis [1- (4-hydroxyphenyl) -1-methylethyl] benzene, 1,4-bis [1- (4- Hydroxyphenyl) -1-methylethyl] benzene, 4,6-bis [1- (4-hydroxyphenyl) -1-methylethyl] -1,3-dihydroxybenzene, 1,1-bis (4 1,2-naphthoquinone diazide-4-sulfonic acid ester compound, such as -hydroxyphenyl) -1- [4- {1- (4-hydroxyphenyl) -1-methylethyl} phenyl] ethane, or 1, 2-naphthoquinone diazide-5-sulfonic acid ester compound etc. are mentioned.

These quinonediazide compounds (D1) may be used alone or in combination of two or more thereof.

In the resin composition according to the present invention, the amount of the quinonediazide compound (D1) is an alkali-soluble resin (B1) (when the phenol compound (B ') is used, the sum of the alkali-soluble resin (B1) and the phenol compound (B')). It is preferably 10 to 50 parts by weight, more preferably 15 to 30 parts by weight based on 100 parts by weight. When the amount is less than 10 parts by weight, the residual film ratio of the unexposed portion may be lowered or an image faithful to the mask pattern may not be obtained. Moreover, when the said quantity exceeds 50 weight part, a pattern shape may deteriorate or foam at the time of hardening.

The photosensitive acid generator (also called "acid generator (D2)" in this specification) used by this invention is a compound which generate | occur | produces an acid by irradiation, such as radiation. When an alkyl ether group is contained in a crosslinking agent (C), a negative pattern can be formed, such that the said alkyl ether group and a phenol resin (B2) react with dealcohol by reaction of this acid.

It will not specifically limit, if it is a compound which generate | occur | produces an acid by irradiation of radiation etc. as an acid generator (D2), For example, an onium salt compound, a halogen containing compound, a diazo ketone compound, a sulfone compound, a sulfonic acid compound, sulfonimide A compound, a diazomethane compound, etc. are mentioned.

As said onium salt compound, an iodonium salt, a sulfonium salt, a phosphonium salt, a diazonium salt, a pyridinium salt, etc. are mentioned, for example. Specific examples of preferred onium salts include diphenyl iodonium trifluoromethanesulfonate, diphenyl iodonium p-toluenesulfonate, diphenyl iodonium hexafluoroantimonate and diphenyl iodonium hexafluoro Lophosphate, diphenyliodonium tetrafluoroborate, triphenylsulfonium trifluoromethanesulfonate, triphenylsulfonium p-toluenesulfonate, triphenylsulfonium hexafluoroantimonate, 4-t-butyl Phenyl diphenylsulfonium trifluoromethanesulfonate, 4-t-butylphenyl diphenylsulfonium p-toluenesulfonate, 4,7-di-n-butoxynaphthyltetrahydrothiophenium trifluoro Methane sulfonate is mentioned.

As said halogen containing compound, a haloalkyl group containing hydrocarbon compound, a haloalkyl group containing heterocyclic compound, etc. are mentioned, for example. Specific examples of preferred halogen-containing compounds include 1,10-dibromo-n-decane, 1,1-bis (4-chlorophenyl) -2,2,2-trichloroethane, phenyl-bis (trichloromethyl) -s-triazine, 4-methoxyphenyl-bis (trichloromethyl) -s-triazine, styryl-bis (trichloromethyl) -s-triazine, naphthyl-bis (trichloromethyl) -s S-triazine derivatives such as -triazine and the like.

As said diazo ketone compound, a 1, 3- diketo-2- diazo compound, a diazo benzoquinone compound, a diazonaphthoquinone compound etc. are mentioned, for example, The 1,2-naphtho of phenols is mentioned as a specific example. And quinone diazide-4-sulfonic acid ester compounds.

As said sulfone compound, the (beta) -keto sulfone compound, the (beta) -sulfonyl sulfone compound, and the (alpha)-diazo compound of these compounds are mentioned, for example, 4-trisfenacyl sulfone, mesityl penacyl sulfone, bis (Phenacylsulfonyl) methane etc. are mentioned.

As said sulfonic acid compound, alkyl sulfonic acid ester, haloalkyl sulfone acid ester, aryl sulfonic acid ester, imino sulfonate, etc. are mentioned, for example. Preferred specific examples include benzointosylate, pyrogallol tristrifluoromethanesulfonate, o-nitrobenzyltrifluoromethanesulfonate, o-nitrobenzyl p-toluenesulfonate, and the like.

Examples of the sulfonimide compound include N- (trifluoromethylsulfonyloxy) succinimide, N- (trifluoromethylsulfonyloxy) phthalimide, and N- (trifluoromethylsulfonyloxy ) Diphenylmaleimide, N- (trifluoromethylsulfonyloxy) bicyclo [2.2.1] hept-5-ene-2,3-dicarboxyimide, N- (trifluoromethylsulfonyloxy) naph Thylimide, etc. are mentioned.

As said diazomethane compound, bis (trifluoromethylsulfonyl) diazomethane, bis (cyclohexylsulfonyl) diazomethane, bis (phenylsulfonyl) diazomethane, etc. are mentioned, for example.

These acid generators (D2) may be used alone or in combination of two or more thereof.

In the resin composition according to the present invention, the amount of the acid generator (D2) is an alkali-soluble resin (B1) (phenol compound (B ')) from the viewpoint of securing the sensitivity, resolution, pattern shape, and the like of the resin composition. When using, it is preferably 0.1 to 10 parts by weight, more preferably 0.3 to 5 parts by weight based on 100 parts by weight of the total of the alkali-soluble resin (B1) and the phenol compound (B '). When the said amount is less than 0.1 weight part, hardening may become inadequate and heat resistance may fall, and when the said amount exceeds 10 weight part, transparency to a radiation line may fall and it may cause deterioration of a pattern shape. .

<Crosslinked fine particles (E)>

Examples of cross-linked fine particles (E) used in the present invention, when the glass transition temperature (T _g) of the polymer constituting the crosslinked fine particles below 100 ℃ not particularly limited, and cross-linking monomer having an unsaturated polymerizable group at least two (herein Also referred to as "crosslinkable monomer (e1)" and one or more other monomers selected from one or more T _g of the crosslinked fine particles (E) to be 0 ° C or less (in this specification, "other monomer (c2) (Also referred to as &quot;&quot;)). As other monomer (e2), the monomer which has functional groups other than a polymeric group, for example, carboxyl group, an epoxy group, an amino group, an isocyanate group, a hydroxyl group, etc. is preferable.

On the other hand, the crosslinked fine particles (E) in the present specification is the T _g of the dispersion of the particulate cross-linked coagulation and dried, Seiko Instruments SSC / 5200H DSC using a rate of temperature increase in the range of -100 ℃ to 150 ℃ 10 ℃ / Measured in minutes.

As a crosslinkable monomer (e1), for example, divinylbenzene, diallyl phthalate, ethylene glycol di (meth) acrylate, propylene glycol di (meth) acrylate, trimethylolpropane tri (meth) acrylate, pentaerythritol The compound which has two or more polymerizable unsaturated groups, such as a tri (meth) acrylate, polyethyleneglycol di (meth) acrylate, and a polypropylene glycol di (meth) acrylate, is mentioned. Among these, divinylbenzene is preferable.

The proportion of the crosslinkable monomer (e1) constituting the crosslinked fine particles (E) is preferably in the range of 1 to 20% by weight, and more preferably in the range of 2 to 10% by weight, based on the total monomers used for copolymerization.

As another monomer (e2), for example

Diene compounds such as butadiene, isoprene, dimethylbutadiene, chloroprene and 1,3-pentadiene;

(Meth) acrylonitrile, α-chloroacrylonitrile, α-chloromethylacrylonitrile, α-methoxyacrylonitrile, α-ethoxyacrylonitrile, crotonic acid nitrile, cinnamic acid nitrile, diitaconate dinitrile, Unsaturated nitrile compounds such as dinitrile maleate and dinitrile fumarate;

(Meth) acrylamide, N, N'-methylenebis (meth) acrylamide, N, N'-ethylenebis (meth) acrylamide, N, N'-hexamethylenebis (meth) acrylamide, N-hydroxy Unsaturation, such as methyl (meth) acrylamide, N- (2-hydroxyethyl) (meth) acrylamide, N, N-bis (2-hydroxyethyl) (meth) acrylamide, crotonic acid amide, cinnamic acid amide Amides;

Methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl (meth) acrylate, hexyl (meth) acrylate, lauryl (meth) acrylate, polyethylene glycol (meth) acrylate, polypropylene glycol (meth (Meth) acrylic acid esters, such as an acrylate;

Aromatic vinyl compounds such as styrene, α-methylstyrene, o-methoxystyrene, p-hydroxystyrene, and p-isopropenylphenol;

Epoxy (meth) acrylate and hydroxyalkyl (meth) acryl obtained by reaction with diglycidyl ether of bisphenol A, diglycidyl ether of glycol, etc. (meth) acrylic acid, hydroxyalkyl (meth) acrylate, etc. Epoxy group-containing unsaturated compounds such as urethane (meth) acrylates, glycidyl (meth) acrylates and (meth) allyl glycidyl ethers obtained by the reaction of a rate and a polyisocyanate;

(Meth) acrylic acid, itaconic acid, succinic acid-β- (meth) acryloxyethyl, maleic acid-β- (meth) acryloxyethyl, phthalic acid-β- (meth) acryloxyethyl, hexahydrophthalic acid-β- (meth Unsaturated acid compounds such as acryloxyethyl;

Amino group-containing unsaturated compounds such as dimethylamino (meth) acrylate and diethylamino (meth) acrylate;

Amide-group containing unsaturated compounds, such as (meth) acrylamide and dimethyl (meth) acrylamide;

And hydroxyl group-containing unsaturated compounds such as hydroxyethyl (meth) acrylate, hydroxypropyl (meth) acrylate, and hydroxybutyl (meth) acrylate.

Among these, butadiene, isoprene, (meth) acrylonitrile, (meth) acrylic acid alkyl esters, styrene, p-hydroxy styrene, p-isopropenylphenol, glycidyl (meth) acrylate, and (meth) acrylic acid , Hydroxyalkyl (meth) acrylates and the like are preferably used.

As such other monomer (e2), it is preferable to use 1 or more types of diene compounds, specifically, butadiene. Such diene compound is preferably used in an amount of 20 to 80% by weight, preferably 30 to 70% by weight based on the total monomers used for copolymerization. The crosslinked fine particles (E) used in the present invention, when the diene compound is copolymerized in the above amount as other monomers (e2), become rubbery soft fine particles, and particularly prevent cracking (breaking) in the resulting cured film. A cured film excellent in durability can be obtained. Moreover, when styrene and butadiene are used together as other monomer (e2), it is preferable at the point which can obtain the cured film with low dielectric constant.

The average particle diameter of crosslinked microparticles | fine-particles (E) is 30-500 nm, Preferably it is 40-200 nm, More preferably, it is 50-120 nm. The method for controlling the particle size is not particularly limited, and for example, in the case of synthesizing the crosslinked fine particles by emulsion polymerization, the number of micelles in the emulsion polymerization can be controlled and the particle size can be controlled by the amount of the emulsifier used. .

In addition, in this specification, the average particle diameter of crosslinked microparticles | fine-particles (E) is the value measured by diluting the dispersion liquid of crosslinked microparticles | fine-particles according to the conventional method using the light-scattering flow distribution measuring apparatus LPA-3000 by Otsuka Denshi.

These crosslinked fine particles (E) may be used alone or in combination of two or more thereof.

In addition, in the resin composition which concerns on this invention, the quantity of crosslinked microparticles | fine-particles (E) is the sum total of alkali-soluble resin (B1) and a phenolic compound (B ') when using alkali-soluble resin (B1) (phenol compound (B'). It is preferably 0.1 to 50 parts by weight, more preferably 1 to 20 parts by weight based on 100 parts by weight. When the amount is less than 0.1 part by weight, the thermal shock resistance of the resulting cured film may be lowered. When the amount is more than 50 parts by weight, heat resistance may be lowered or compatibility (dispersibility) with other components may be lowered.

<Others>

The resin composition which concerns on this invention may further contain a solvent (F), an adhesion | attachment adjuvant (G), surfactant (H), other additives, etc. as needed.

[Solvent (F)]

The solvent (F) used by this invention is added in order to improve the handleability of a resin composition, or to adjust a viscosity and storage stability.

It does not restrict | limit especially as such a solvent (F), For example, Ethylene glycol monoalkyl ether acetates, such as ethylene glycol monomethyl ether acetate;

Propylene glycol monoalkyl ethers such as propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol monopropyl ether, and propylene glycol monobutyl ether;

Propylene glycol dialkyl ethers such as propylene glycol dimethyl ether, propylene glycol diethyl ether, propylene glycol dipropyl ether, and propylene glycol dibutyl ether;

Propylene glycol monoalkyl ether acetates such as propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, propylene glycol monopropyl ether acetate, and propylene glycol monobutyl ether acetate;

Carbitols such as ethyl cellosolve and butyl cellosolve and butyl carbitol;

Lactic acid esters such as methyl lactate, ethyl lactate, n-propyl lactate, and isopropyl lactate;

Aliphatic carboxylic acid esters, such as ethyl acetate, n-propyl acetate, isopropyl acetate, n-butyl acetate, isobutyl acetate, n-amyl acetate, isoamyl acetate, isopropyl propionate, n-butyl propionate, and isobutyl propionate Ryu;

Other esters such as methyl 3-methoxypropionate, ethyl 3-methoxypropionate, methyl 3-ethoxypropionate, ethyl 3-ethoxypropionate, methyl pyruvate and ethyl pyruvate;

Aromatic hydrocarbons such as toluene and xylene;

Ketones such as 2-heptanone, 3-heptanone, 4-heptanone, and cyclohexanone;

Amides such as N-dimethylformamide, N-methylacetamide, N, N-dimethylacetamide and N-methylpyrrolidone;

lactones such as γ-butyl lactone

Etc. can be mentioned. These solvents (F) may be used independently or may be used in combination of 2 or more type.

In the resin composition which concerns on this invention, the quantity of a solvent (F) is 40-900 weight part normally with respect to a total of 100 weight part of components other than the solvent (F) in the said resin composition, Preferably it is 60-400 weight part.

[Adhesive Aids (G)]

As an adhesion | attachment adjuvant (G) used by this invention, a functional silane coupling agent is preferable, For example, the silane coupling agent which has reactive substituents, such as a carboxyl group, a methacryloyl group, an isocyanate group, an epoxy group, is mentioned. Specifically, trimethoxysilylbenzoic acid, γ-methacryloxypropyltrimethoxysilane, vinyltriacetoxysilane, vinyltrimethoxysilane, γ-isocyanatepropyltriethoxysilane, γ-glycidoxypropyltrimethoxy Silane, β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, 1,3,5-N-tris (trimethoxysilylpropyl) isocyanurate, and the like. These adhesion adjuvant (G) may be used independently, or may be used in combination of 2 or more type.

In the resin composition according to the present invention, the amount of the adhesion aid (G) is 100% by weight of the alkali-soluble resin (B1) (when using the phenolic compound (B '), the total amount of the alkali-soluble resin (B1) and the phenolic compound (B')). The amount is preferably 0.01 to 20 parts by weight, more preferably 0.01 to 10 parts by weight.

Surfactant (H)

Surfactant (H) is normally added in order to improve the applicability | paintability of a resin composition.

There is no restriction | limiting in particular as such surfactant (H), For example, Polyoxyethylene alkyl ethers, such as polyoxyethylene lauryl ether, polyoxyethylene sterile ether, polyoxyethylene cetyl ether, polyoxyethylene olefin ether;

Polyoxyethylene aryl ethers such as polyoxyethylene octylphenyl ether and polyoxyethylene nonylphenyl ether;

Polyoxyethylene dialkyl esters such as polyoxyethylene dilaurate and polyoxyethylene distearate;

Polyoxyethylene alkyl allyl ethers such as polyoxyethylene octyl phenol ether and polyoxyethylene nonyl phenol ether;

Polyoxyethylene polyoxypropylene block copolymers;

Sorbitan fatty acid esters such as sorbitan monolaurate, sorbitan monopalmitate and sorbitan monostearate;

Polyoxyethylene sorbitan such as polyoxyethylene sorbitan monolaurate, polyoxyethylene sorbitan monopalmitate, polyoxyethylene sorbitan monostearate, polyoxyethylene sorbitan trioleate, polyoxyethylene sorbitan tristearate Nonionic surfactants of non-fatty acid esters;

F-top EF301, EF303, EF352 (TOCHEM PRODUCTS), Megapack F171, F172, F173 (Dainitbon Ink Chemical Co., Ltd.), Floroid FC430, FC431 (Sumitomo 3M), Asahigard AG710, Suplon S-381, S -382, SC101, SC102, SC103, SC104, SC105, SC106, Surfinol E1004, KH-10, KH-20, KH-30, KH-40 (Asahi Glass), Psent 250, 251, 222F, FTX-218 Fluorine-based surfactants such as (neos);

Organosiloxane polymers KF-640, 642, 643, KP341, X-70-092, X-70-093 (Shin-Etsu Chemical Co., Ltd.), SH-28PA, SH-190, SH-193, SZ-6032, Silicone surfactants such as SF-8428, DC-57, and DC-190 (Toray Dow Corning Silicone);

Acrylic acid type or methacrylic acid type copolymer polyflow No.75, No.77, No.90, No.95 (Kyoeisha Chemical Co., Ltd.), etc. are mentioned.

These can be used individually or in combination of 2 or more types.

As for the compounding quantity of surfactant (H), 50-1000 ppm is preferable normally in a resin composition, More preferably, it is 70-800 ppm, More preferably, it is 100-500 ppm. When it is less than 50 ppm, the uniform applicability to a substrate having a step or the like may deteriorate, and when it exceeds 1000 ppm, the adhesion at the time of development or after curing may be deteriorated.

[Other additives]

In the resin composition which concerns on this invention, as other additives, a sensitizer, a leveling agent, an acid generator (acid generators other than an acid generator (D2)), etc. can also be contained to the extent which does not impair the characteristic of this resin composition. .

<The manufacturing method of a radiation sensitive insulating resin composition>

The manufacturing method of the resin composition which concerns on this invention is not specifically limited, A conventional manufacturing method can be applied. For example, each component is put in a sample bottle, it is fully closed, and it prepares by stirring on a wave rotor. In use of a resin composition, it is preferable to use the thing which filtered suitably.

<Hardened product>

The hardened | cured material which concerns on this invention is obtained using the said radiation sensitive insulating resin composition. According to the present invention, a cured product having excellent balance of adhesion, electrical insulation, resolution, and thermal shock resistance to various metals such as silicon, gold, copper, titanium, solder, and aluminum can be obtained.

In order to form the cured product of the present invention, first, the resin composition according to the present invention is coated on a support (a copper foil with a resin, a copper-clad laminate, a silicon wafer with a metal sputtering film, an alumina substrate, etc.), dried and volatilized a solvent or the like. A coating film is formed.

Then, in the case of a positive resin composition, when it exposes through a desired mask pattern, it develops with alkaline developing solution, and melts and removes an exposure part, a desired positive pattern is obtained. On the other hand, in the case of a negative resin composition, it exposes through a desired mask pattern, and heat-processes (this heat treatment is also called "PEB" in this specification), and promotes reaction of a phenol resin and a crosslinking agent. Subsequently, when developing with alkaline developing solution and melt | dissolving and removing an unexposed part, a desired negative pattern will be obtained.

In order to fully express the insulating film characteristic of the pattern obtained as mentioned above, you may heat-process further after image development, and the said coating film may be fully hardened.

As a method of coating a resin composition on a support body, coating methods, such as an immersion method, a spray method, a bar coating method, a roll coating method, and a spin coating method, are used, for example. In addition, the thickness of a coating film can be suitably controlled by adjusting solid content concentration and a viscosity of a coating means and a composition solution.

As radiation used for exposure, ultraviolet-rays, electron beams, a laser beam, etc., such as a low pressure mercury lamp, a high pressure mercury lamp, a metal halide lamp, a g-ray stepper, and an i-ray stepper, are mentioned, for example. Although the exposure amount is suitably selected by the light source used, the resin film thickness, etc., for example, when it is the ultraviolet irradiation from a high pressure mercury lamp, it is about 1,000-50,000 J / m <^{2> in} resin thickness of 10-50 micrometers.

As described above, in the case of using a negative resin composition, PEB treatment is performed after exposure and prior to development. Although this condition changes with the compounding quantity, film thickness, etc. of the said resin composition, it is about 70 to 150 degreeC normally, Preferably it is about 1 to 60 minutes at 80 to 120 degreeC.

As a developing method after exposure, the shower developing method, the spray developing method, the immersion developing method, the puddle developing method, etc. are mentioned. The developing conditions are usually about 1 to 10 minutes at 20 to 40 ° C. As said alkaline developing solution, the alkaline aqueous solution whose density | concentration is about 1 to 10 weight% obtained by dissolving alkaline compounds, such as sodium hydroxide, potassium hydroxide, aqueous ammonia, tetramethylammonium hydroxide, and choline, in water is mentioned, for example. . A suitable amount of water-soluble organic solvents, such as methanol and ethanol, surfactant, etc. can also be added to the said alkaline aqueous solution. On the other hand, the coating film is developed with an alkaline developer, washed with water and dried.

In addition, in the said heat processing performed after image development, hardening conditions are not specifically limited, According to the use of hardened | cured material, it can heat at the temperature of 50-200 degreeC for about 30 minutes-10 hours, and can harden the said coating film.

Moreover, in order to fully advance hardening of the obtained patterned coating film, or to prevent deformation | transformation of the obtained patterned coating film, you may perform the said heat processing in the process of two or more steps. For example, in the first step, the patterned coating film obtained by heating at a temperature of 50 to 120 ° C. for about 5 minutes to 2 hours, and heating in a second step at a temperature of 80 to 200 ° C. for 10 minutes to 10 hours is cured. You can also

If it is such hardening conditions, a hotplate, oven, an infrared furnace, etc. can be used as a heating installation.

The semiconductor element according to the present invention has a cured film formed as described above. This cured film can be used suitably as a surface protective film, an interlayer insulation film, etc. in a semiconductor element.

As said semiconductor element, the semiconductor element (substrate with a circuit) shown in FIGS. 1 and 2 is mentioned, for example. In the board | substrate with a circuit shown in FIG. 1, first, the metal pad 2 is formed in pattern shape on the board | substrate 1, and the insulating film (cured film) 3 is formed in pattern shape using the said resin composition. Subsequently, it is obtained by forming the metal wiring 4 in a pattern form and forming the insulating film (cured film) 6 further. In addition, the circuit board with a circuit shown in FIG. 2 forms the metal wiring 4 further in a pattern form on the board with a circuit shown in FIG. 1, and then forms the insulating film (cured film) 6 using the said resin composition, Obtained.

Hereinafter, although this invention is demonstrated further more concretely based on an Example, this invention is not limited to these Examples. In addition, "part" in a following example and a comparative example is used by the meaning of a weight part unless there is particular notice.

In addition, the characteristic of hardened | cured material was evaluated by the following method.

<Resolution>

The radiation-sensitive insulating resin composition was spin-coated on a 6-inch silicon wafer, and heated at 100 ° C. for 5 minutes using a hot plate to prepare a coating film having a uniform thickness of 20 μm. Then, using the aligner (MA-150 by Suss Mictotec), the ultraviolet-ray from a high pressure mercury lamp was exposed through the pattern mask so that the exposure amount in wavelength 350nm might be 3,000 J / m <^2>. . Subsequently, 3 minute immersion was developed at 23 degreeC using 2.38 weight% tetramethylammonium hydroxide aqueous solution. The minimum dimension of the obtained pattern was made into the resolution.

<Thermal shock>

As shown to FIG. 3, 4, the base material 13 for thermal shock evaluation which has the copper foil 11 which has gold on the surface in pattern form on the board | substrate 12 was used. The resin composition was apply | coated on this base material 13, and it heated at 110 degreeC for 3 minutes using the hotplate. Thereby, the resin coating film whose thickness is 10 micrometers was manufactured on the copper foil 11 which has gold on the surface. Then, it heated at 190 degreeC for 1 hour using the convection oven, hardened | cured the resin coating film, and obtained the cured film. This substrate was subjected to a resistance test using a cold impact tester (TSA-40L, manufactured by Tabe Espec Co., Ltd.) at -65 ° C / 30 minutes to 150 ° C / 30 minutes. The number of cycles until defects, such as a crack, generate | occur | produce in a cured film was confirmed every 100 cycles.

<Electric insulation (migration test)>

As shown in FIG. 5, the base material 13 for thermal shock evaluation which has the patterned copper foil 10 on the board | substrate 12 was used. The resin composition was apply | coated on this base material 13, and it heated at 110 degreeC for 3 minutes using the hotplate. This produced the resin coating film whose thickness is 10 micrometers on the copper foil 10. Then, it heated at 190 degreeC for 1 hour using the convection oven, hardened | cured the resin coating film, and obtained the cured film. This base material was put into the migration evaluation system (AEI, EHS-221MD by the Tabe Espec Co., Ltd.), and it processed for 200 hours on conditions of 121 degreeC of temperature, 85% of humidity, 1.2 atmospheres of pressure, and 10V of applied voltages. Thereafter, the resistance value (Ω) of the test substrate was measured, and insulation was confirmed.

<Adhesiveness>

The resin composition was apply | coated to the silicon wafer which sputter | spattered copper, gold, and aluminum, and it heated at 120 degreeC with a hotplate for 5 minutes, and produced the resin coating film of uniform thickness of 10 micrometers. Then, it heated at 250 degreeC for 1 hour using inert gas oven (under nitrogen), hardened | cured the resin coating film, and obtained the cured film. This cured film was processed by the pressure vessel test apparatus (Taby Chemical Co., Ltd. product) for 168 hours on condition of temperature 121 degreeC, humidity 100%, and pressure 2.1 atmospheres. The adhesiveness before and after a test was evaluated by performing the cross cut test (checker tape method) based on JISK5400.

In addition, the applicability | paintability of the resin composition was evaluated as follows.

<Applicability>

The resin composition was apply | coated by spin coating to the 4-inch silicon wafer in which the metal wiring pattern shown in FIG. 5 was formed, and it heated at 110 degreeC for 3 minutes using the hotplate. The obtained resin coating film was evaluated visually on the following references | standards.

AA: No coating unevenness (the metal wiring upper surface, the metal wiring side, and the silicon wafer upper surface are also uniformly applied).

BB: Striation is slightly scratched based on metal wiring.

CC: There is a nonuniform thickness in the whole board | substrate.

Synthesis Example 1

Synthesis of Polybenzoxazole Precursor (B2-1)

58.6 g of 2,2-bis (4-amino-3-hydroxyphenyl) hexafluoropropane was dissolved in 400 mL of N-methyl-2-pyrrolidone and 10.0 g of triethylamine. A solution of 400 mL of γ-butyrolactone 400. 28 g of isophthalic acid chloride was added dropwise at 10 占 폚 or lower. After completion of the dropwise addition, the reaction was carried out at room temperature for 3 hours and at 3O &lt; 0 &gt; C for 3 hours.

Synthesis Example 2

Synthesis of cresol novolac resin (B2-2) consisting of m-cresol / p-cresol = 60/40 (molar ratio)

m-cresol and p-cresol were mixed at a molar ratio of 60:40, and formalin was added thereto, followed by condensation by a conventional method using an oxalic acid catalyst, thereby obtaining a cresol novolak resin (B2-2) having a Mw of 6,500. .

Synthesis Example 3

Synthesis of p-hydroxystyrene / styrene copolymer (B2-3)

A total of 100 parts by weight of a mixture of pt-butoxystyrene and styrene (pt-butoxystyrene: styrene = 80: 20 (molar ratio)) is dissolved in 150 parts by weight of propylene glycol monomethyl ether, and the reaction temperature is 70 ° C. under a nitrogen atmosphere. It was maintained and polymerized for 10 hours using 4 parts by weight of azobisisobutyronitrile. Thereafter, sulfuric acid was added to the reaction solution, the reaction temperature was maintained at 90 ° C, reacted for 10 hours, and p-t-butoxystyrene was deprotected and converted into hydroxystyrene. Ethyl acetate was added to the obtained copolymer, water washing was repeated 5 times, the ethyl acetate phase was fractionated, the solvent was removed, and the p-hydroxy styrene / styrene copolymer (B2-3) was obtained.

As a result of measuring the molecular weight of the copolymer (B2-1) by gel permeation chromatography (GPC), the weight average molecular weight (Mw) of polystyrene conversion was 10,000, the weight average molecular weight (Mw), and the number average molecular weight (Mn). The ratio (Mw / Mn) was 3.5. Further, as a result of ¹³ C-NMR analysis, the copolymer molar ratio of p-hydroxystyrene and styrene was 80:20.

Synthesis Example 4

1,1-bis (4-hydroxyphenyl) -1- [4- [1- (4-hydroxyphenyl) -1-methylethyl] phenyl] ethane and 1,2-naphthoquinonediazide-5- 2.0 molar condensate with sulfonic acid (D1-1)

1 mole of 1,1-bis (4-hydroxyphenyl) -1- [4- [1- (4-hydroxyphenyl) -1-methylethyl] phenyl] ethane and 1,2-naphthoquinonediazide- 1.5 mol of 5-sulfonic acid chloride was dissolved with stirring in dioxane. Subsequently, the flask containing this solution was immersed in a water bath controlled at 30 ° C, and when the internal temperature was constant at 30 ° C, 1.5 mol of triethylamine was added to this solution using a dropping funnel so that the internal temperature did not exceed 35 ° C. Was slowly added dropwise. Thereafter, the precipitated triethylamine hydrochloride was removed by filtration, and the filtrate was poured into a large amount of diluted hydrochloric acid to precipitate. Subsequently, the precipitate was filtered off and dried in a vacuum drier controlled at 40 ° C. for one day to obtain a quinonediazide compound (D1-1).

Example 1

As shown in following Table 1a, 5 weight part of disulfide compounds (A-1), 100 weight part of polybenzoxazole precursors (B2-1), 30 weight part of quinonediazide compounds (D1-1), and an adhesion | attachment adjuvant (G -1) 3 parts by weight was dissolved in 200 parts by weight of solvent (F-1) to prepare a resin composition. The characteristic of the cured film obtained from this composition and the applicability | paintability of this composition were measured by the said evaluation method. The results obtained are shown in Tables 2 and 3 below.

[Examples 2 to 4]

The composition which consists of a component shown in Table 1a was manufactured like Example 1, the characteristic of the cured film obtained from this composition, and the applicability | paintability of this composition were measured similarly to Example 1. The obtained results are shown in Tables 2 and 3.

[Comparative Examples 1 to 3]

The composition which consists of a component shown in Table 1a was manufactured like Example 1, the characteristic of the cured film obtained from this composition, and the coating property of this composition were measured similarly to Example 1. The obtained results are shown in Tables 2 and 3.

Example 5

As shown in following Table 1b, 5 weight part of disulfide compounds (A-1), 100 weight part of cresol novolak resins (B2-2), 15 weight part of hexamethoxymethylmelamine (C-1), and propylene glycol digly 5 parts by weight of cylyl ether (C-3), 3 parts by weight of photoacid generator (D2-1), 3 parts by weight of adhesion aid (G-1), and Prudent 251 (H-1) as solvent (F-1) It melt | dissolved in 200 weight part and prepared the resin composition. The characteristic of the cured film obtained from this composition and the applicability | paintability of this composition were measured by the said evaluation method. The obtained results are shown in Tables 2 and 3.

Example 6

The composition which consists of a component shown in Table 1b was produced like Example 5, the characteristic of the cured film obtained from this composition, and the coating property of this composition were measured similarly to Example 5. The obtained results are shown in Tables 2 and 3.

Each component of Table 1a, 1b is as follows.

<Disulfide Compound (A)>

A-1: dithiobisphenol (Toyo Kasei)

A-2: 2-hydroxyethyl disulfide (made by Aldrich)

<Alkali-soluble resin (B1)>

[Phenol Resin (B2)]

B2-1: polybenzoxazole precursor

B2-2: cresol novolak resin (Mw = 6,500) consisting of m-cresol / p-cresol = 60/40 (molar ratio)

B2-3: copolymer consisting of p-hydroxystyrene / styrene = 80/20 (molar ratio), polystyrene reduced weight average molecular weight (Mw) = 10,000

<Cross-linking system (C)>

C-1: Hexamethoxymethylmelamine (Mitsui Cytec Co., Ltd. make, brand name; Cymel 300)

C-2: Bisphenol A epoxy resin (Japan Epoxy Resin Co., Ltd. make, brand name; EP-828)

C-3: propylene glycol diglycidyl ether (Kyosei Co., Ltd. make, brand name; Epolite 70P)

<Radiation compound (D)>

[Quinonediazide compound (D1)]

D1-1: 1,1-bis (4-hydroxyphenyl) -1- [4- [1- (4-hydroxyphenyl) -1-methylethyl] phenyl] ethane and 1,2-naphthoquinonedia 2.0 molar condensate with zide-5-sulfonic acid

[Mine generator (D2)]

D2-1: 4,7-di-n-butoxynaphthyltetrahydrothiopheniumtrifluoromethanesulfonate

<Crosslinked fine particles (E)>

E-1: butadiene / hydroxybutyl methacrylate / methacrylic acid / divinylbenzene = 60/32/6/2 (wt%), Tg = -40 ° C., average particle diameter = 65 nm

E-2: butadiene / styrene / hydroxybutyl methacrylate / divinylbenzene = 60/24/14/2 (wt%), Tg = -35 ° C., average particle diameter = 70 nm

<Adhesive Aids (G)>

G-1: (gamma)-glycidoxy propyl trimethoxysilane (Tosoh Co., Ltd. make, brand name; S-510)

G-2: 1,3,5-N-tris (trimethoxysilylpropyl) isocyanurate (GE Toshiba Silicone Co., Ltd .; Y11597)

<Solvent (F)>

F-1: N-methylpyrrolidone

F-2: ethyl lactate

<Surfactant (H)>

H-1: Pgentgent 251 (Neos Co., Ltd. make, brand name)

H-2: Polyflow No. 90 (Kyoeisha Chemical Co., Ltd. make, brand name)

According to the radiation-sensitive insulated resin composition which concerns on this invention, the hardened | cured material which is excellent in the balance with electrical insulation, the resolution, adhesiveness, and thermal shock resistance is favorable is obtained. For this reason, the said hardened | cured material is used suitably as an interlayer insulation film (passivation film) and surface protection film (overcoat film), such as a semiconductor element.

Claims (12)

A radiation sensitive insulating resin composition comprising a compound (A), a resin (B) and a radiation sensitive compound (D) having a disulfide structure. The radiation sensitive insulated resin composition of Claim 1 whose resin (B) is alkali-soluble resin (B1). The radiation sensitive insulating resin composition of Claim 2 whose alkali-soluble resin (B1) is alkali-soluble resin (B2) which has a phenolic hydroxyl group. The radiation sensitive insulating resin composition of Claim 2 or 3 which further contains the compound (C) which has a functional group which can react with alkali-soluble resin (B1). The radiation-sensitive insulating resin composition according to any one of claims 1 to 4, wherein the radiation-sensitive compound (D) is a quinone diazide compound (D1). The radiation-sensitive insulating resin composition according to any one of claims 1 to 4, wherein the radiation-sensitive compound (D) is a photosensitive acid generator (D2). The radiation-sensitive insulating resin composition according to any one of claims 1 to 6, further comprising crosslinked fine particles (E) having an average particle diameter of 30 to 500 nm. The radiation-sensitive insulated resin composition according to any one of claims 1 to 7, wherein the compound (A) having a disulfide structure is represented by the following general formula (A1). <Formula A1>

(In the formula, A 'represents a monovalent organic group which may have a substituent, A represents a divalent organic group which may have a substituent, and when A is plural, each may be the same or different, n is 1 to 1 Represents an integer of 10) The radiation-sensitive insulating resin composition according to any one of claims 1 to 8, wherein the compound (A) having a disulfide structure has a reactive active group. The radiation-sensitive insulating resin composition according to any one of claims 1 to 9, further comprising 50 to 1000 ppm of a surfactant (H). Hardened | cured material obtained using the radiation sensitive insulating resin composition in any one of Claims 1-10. It has a cured film formed using the radiation-sensitive insulated resin composition in any one of Claims 1-10, The semiconductor element characterized by the above-mentioned.

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