KR20090001036A - Method for manufacturing led package using batch encapsulation technology - Google Patents

Method for manufacturing led package using batch encapsulation technology Download PDF

Info

Publication number
KR20090001036A
KR20090001036A KR1020070065097A KR20070065097A KR20090001036A KR 20090001036 A KR20090001036 A KR 20090001036A KR 1020070065097 A KR1020070065097 A KR 1020070065097A KR 20070065097 A KR20070065097 A KR 20070065097A KR 20090001036 A KR20090001036 A KR 20090001036A
Authority
KR
South Korea
Prior art keywords
mold
led
lead frame
strip
resin
Prior art date
Application number
KR1020070065097A
Other languages
Korean (ko)
Other versions
KR101380385B1 (en
Inventor
서정후
김도형
조문호
전민규
Original Assignee
서울반도체 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 서울반도체 주식회사 filed Critical 서울반도체 주식회사
Priority to KR1020070065097A priority Critical patent/KR101380385B1/en
Priority to PCT/KR2008/003728 priority patent/WO2009005257A2/en
Priority to TW097124566A priority patent/TWI451594B/en
Publication of KR20090001036A publication Critical patent/KR20090001036A/en
Application granted granted Critical
Publication of KR101380385B1 publication Critical patent/KR101380385B1/en

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/2608—Mould seals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/561—Batch processing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations

Abstract

An LED package production method is provided to prevent resin of liquid from being leaked out through pattern holes of a lead frame by supply the resin of the liquid in a lump to the place where an LED chip is positioned with preventing pattern holes with a dummy frame. A plurality of lead frames(14) are restricted to a predetermined shape with pattern holes(12). A lead frame strip(10) in which lead frames are connected is prepared. LED chips are positioned in the predetermined places of the lead frame strip. A dummy frame(30) blocks pattern holes off and exposes the places. The dummy frame is overlapped with the lead frame strip. The lead frame strip is located within a mold(40). The resin of the liquid is injected within the mold and LED chips located in the place are soldered in a lump.

Description

일괄 봉지 기술을 이용하는 ＬＥＤ 패키지 제조방법{METHOD FOR MANUFACTURING LED PACKAGE USING BATCH ENCAPSULATION TECHNOLOGY}Method for manufacturing LED package using batch encapsulation technology {METHOD FOR MANUFACTURING LED PACKAGE USING BATCH ENCAPSULATION TECHNOLOGY}

도 1은 LED 패키지들이 형성된 하나의 리드프레임 스트립을 도시한 평면도.1 is a plan view of one leadframe strip having LED packages formed thereon;

도 2는 도 1의 I-I를 따라 취해진 단면도.2 is a sectional view taken along the line I-I of FIG.

도 3 내지 도 6은 리드프레임 스트립 상의 여러 개소에 실장된 LED칩들을 수지를 이용하여 일괄 봉지하는 공정을 설명하기 위한 도면들.3 to 6 are views for explaining a process of collectively encapsulating LED chips mounted in various places on a lead frame strip using resin.

도 7은 리드프레임 스트립에 겹쳐져서 액상 수지를 이용한 LED칩들의 일괄 봉지 공정에 이용되는 더미프레임의 예들을 보인 도면.7 is a view showing an example of a dummy frame which is superimposed on a lead frame strip and used in a batch encapsulation process of LED chips using a liquid resin.

<도면의 주요부분에 대한 부호 설명><Description of Signs of Major Parts of Drawings>

10: 리드프레임 스트립 12: 패턴홀10: lead frame strip 12: pattern hole

14: 리드프레임 20: LED 패키지14: Leadframe 20: LED Package

22: 하우징 24: LED칩22: housing 24: LED chip

26: 봉지부재26: sealing member

본 발명은 LED 패키지 제조방법에 관한 것으로서, 더욱 상세하게는, 리드프 레임 스트립 상에서 복수의 LED 패키지를 제조함에 있어서, 각 LED 패키지의 LED칩을 보호하는 복수의 봉지재를 일괄적으로 형성하는 일괄 봉지 기술을 이용하는 LED 패키지 제조방법에 관한 것이다.The present invention relates to a method for manufacturing an LED package, and more particularly, in manufacturing a plurality of LED packages on a lead frame strip, a batch for forming a plurality of encapsulation materials for protecting the LED chip of each LED package collectively It relates to a LED package manufacturing method using the sealing technology.

일반적으로, LED(Light Emitting Diode)는 전류 인가에 의해 P-N 반도체 접합(P-N junction)에 의해 전자와 정공이 만나 빛을 발하는 소자로서, 통상, LED칩이 탑재된 패키지의 구조로 제작되며, 이러한 것은 흔히, 'LED 패키지'라고 칭해지고 있다. 위와 같은 LED 패키지는 외부로부터 전류를 인가받아 발광 동작하도록 구성된다.In general, a light emitting diode (LED) is a device in which electrons and holes meet and emit light by a PN semiconductor junction by applying a current, and are generally manufactured in a package structure in which an LED chip is mounted. Often referred to as an 'LED package'. The LED package as described above is configured to emit light by receiving a current from the outside.

LED 패키지는 크게 LED칩이 PCB 상의 도전성 패턴 상에 실장되어 전류를 인가받는 "PCB 타입"의 LED 패키지와 리드프레임으로부터 전류를 인가받는 "리드프레임 타입"의 LED 패키지로 구분된다. PCB 타입의 LED 패키지는, 하나의 큰 PCB 상에 복수의 LED칩 및 그 LED칩을 덮는 봉지재를 형성한 후 PCB를 다수개로 절단하는 것에 의해 다수의 개별 LED 패키지로 제작된다. 그와 달리, 리드프레임 타입의 LED 패키지는 복수의 리드프레임을 한정하는 패턴홀들을 구비한 판상의 리드프레임 스트립 상에 복수의 LED칩을 여러 개소에 실장하고 그 LED칩을 보호하는 봉지재 및/또는 하우징을 형성한 후, 리드프레임 스트립을 절단하는 공정에 의해, 복수의 LED 패키지로 제작된다.The LED package is largely divided into a "PCB type" LED package in which an LED chip is mounted on a conductive pattern on a PCB, and a "lead frame type" LED package in which current is applied from a lead frame. PCB type LED packages are manufactured into a plurality of individual LED packages by forming a plurality of LED chips and an encapsulant covering the LED chips on one large PCB and then cutting the PCB into a plurality. In contrast, a lead frame type LED package includes a plurality of LED chips mounted on a plate-shaped lead frame strip having pattern holes defining a plurality of lead frames, and an encapsulant for protecting the LED chips. Alternatively, after the housing is formed, the lead frame strip is cut into a plurality of LED packages.

종래에는 LED칩을 덮는 복수의 봉지재를 일괄적으로 형성하는 기술이 본 출원인에 의해 개발된 바 있다. 이러한 기술은 에폭시 태블릿(epoxy tablet)을 압력 및 열을 이용하여 액상화하고, 그 액상화된 에폭시 수지를 PCB 상의 여러 개소에 위치한 LED칩들 주변에 일괄적으로 제공하는 방식으로 이루어지며, 이러한 방식은 "트랜스퍼 몰딩"으로 칭해지고 있다.In the related art, a technique of collectively forming a plurality of encapsulation materials covering an LED chip has been developed by the present applicant. This technique is achieved by liquefying an epoxy tablet using pressure and heat, and providing the liquefied epoxy resin in a batch around LED chips located in various places on the PCB. Molding ".

위 종래의 기술은 PCB 타입의 LED 패키지와 같이 앞 뒷면이 전체적으로 막혀 있는 기판(특히, PCB) 상에 봉지재를 형성하는 경우에 제한적으로 이용되고 있다. 하지만, 리드프레임들이 절단되기 전 상태인 하나의 리드프레임 스트립 상에, 복수의 봉지재를 형성하는 것이 요구되는 리드프레임 타입의 LED 패키지 제조공정에서는, 리드프레임들을 한정하는 패턴홀들로 인해 복수의 봉지재를 일괄적으로 형성하는 것이 어려웠다. 그 이유는, 리드프레임 스트립을 금형 내에 위치한 후 그 금형에 액상 수지를 공급하여 봉지재를 형성하는 경우, 그 액상의 수지가 패턴홀들을 통해 새나가는 문제가 발생하기 때문이다. The prior art is limited in the case of forming an encapsulant on a substrate (particularly, a PCB) in which the front and back are entirely blocked, such as a PCB type LED package. However, in a lead frame type LED package manufacturing process that requires forming a plurality of encapsulants on one lead frame strip that is in a state before the lead frames are cut, a plurality of lead holes are formed due to pattern holes defining lead frames. It was difficult to form a sealing material collectively. This is because, when the lead frame strip is placed in the mold and then the liquid resin is supplied to the mold to form an encapsulant, the liquid resin leaks through the pattern holes.

위와 같은 이유로, 리드프레임 스트립 상에서 복수의 LED 패키지를 제조하는 경우에는, 리드프레임 상의 여러 개소에 복수의 LED칩과 그 LED칩 주변을 한정하는 캐비티를 포함한 복수의 하우징을 마련하고, 하우징들의 캐비티 각각에 액상 수지를 주입하는 인젝션 방식으로 복수의 봉지재를 형성한다. 이와 같은 인젝션(injection) 방식의 봉지재 형성기술은 번거롭고 많은 시간 및 비용의 낭비가 뒤따르는 문제점이 있다.For the above reasons, in the case of manufacturing a plurality of LED packages on the lead frame strip, a plurality of housings including a plurality of LED chips and the cavity defining the LED chips surrounding the lead frame in several places on the lead frame, each of the cavity of the housing A plurality of encapsulants are formed by an injection method of injecting a liquid resin into the liquid. Such an injection-type encapsulant forming technology has a problem that it is cumbersome and wastes a lot of time and money.

따라서, 본 발명의 기술적 과제는, 리드프레임 스트립의 패턴홀들을 막은 상태로 복수의 봉지재를 리드프레임 스트립 상에 일괄적으로 형성하는, 일괄 봉지 기술을 이용하는 LED 패키지 제조방법을 제공하는 것이다.Accordingly, the technical problem of the present invention is to provide a method of manufacturing an LED package using a batch encapsulation technique, in which a plurality of encapsulation materials are collectively formed on a lead frame strip while blocking pattern holes of the lead frame strip.

전술한 기술적 과제를 달성하기 위해, 패턴홀들에 의해 복수의 리드프레임들이 한정된 채 그 리드프레임들이 서로 연결되어 있는 리드프레임 스트립을 준비하는 단계와; 상기 리드프레임 스트립의 미리 정해진 개소들에 LED칩들을 실장하는 단계와; 상기 패턴홀들을 막고 상기 개소들을 노출시키는 더미프레임(dummy frame)을 상기 리드프레임 스트립과 겹쳐 놓는 단계와; 상기 더미프레임과 겹쳐진 상기 리드프레임 스트립을 금형 내에 위치시키는 단계와; 액상화된 수지를 상기 금형 내에 주입하여, 상기 개소들에 위치한 LED칩들을 일괄 봉지하는 단계를; 포함하는 일괄 봉지 기술을 이용하는 LED 패키지 제조방법이 제공된다.In order to achieve the above technical problem, preparing a lead frame strip in which the lead frames are connected to each other while a plurality of lead frames are defined by pattern holes; Mounting LED chips at predetermined locations of the leadframe strip; Superimposing a dummy frame with the lead frame strip that closes the pattern holes and exposes the points; Placing the leadframe strip in the mold overlapping the dummy frame; Injecting a liquefied resin into the mold to collectively encapsulate the LED chips located in the places; An LED package manufacturing method using a batch encapsulation technology is provided.

바람직하게는, 상기 리드프레임 스트립은 상기 개소들 주변을 한정하는 캐비티들을 포함하는 하우징들이 형성된 것이고, 상기 LED칩을 일광 봉지하는 단계에서는 상기 금형 내로 주입된 상기 수지가 상기 캐비티들에 채워져서 각 캐비티 내에 위치한 상기 LED칩을 봉지한다.Preferably, the lead frame strip is formed with housings including cavities that define the periphery of the points, and in the step of encapsulating the LED chip, the resin injected into the mold is filled in the cavities so that each cavity Encapsulate the LED chip located inside.

바람직하게는, 상기 더미프레임은, 상기 개소들의 노출을 위해 상기 하우징에 끼워지는 노출홀들을 포함하는 판상의 프레임으로 이루어진다. 상기 금형은 상기 더미프레임과의 사이에 상기 캐비티들과 연결되는 러너(runner)를 한정하도록 구성된다. 또한, 상기 금형은 상기 LED칩을 봉지하는 봉지재의 형상을 결정하는 복수의 몰딩 형상부를 포함한다. 상기 수지는 실리콘 수지인 것이 바람직하다.Preferably, the dummy frame is composed of a plate-shaped frame including exposure holes fitted to the housing for exposing the points. The mold is configured to define a runner connected to the cavities between the dummy frame and the dummy frame. In addition, the mold includes a plurality of molding features for determining the shape of the encapsulant for encapsulating the LED chip. It is preferable that the said resin is silicone resin.

이하, 첨부된 도면들을 참조하여 본 발명의 실시예들을 상세히 설명하기로 한다. 다음에 소개되는 실시예들은 당업자에게 본 발명의 사상이 충분히 전달될 수 있도록 하기 위해 예로서 제공되는 것이다. 따라서, 본 발명은 이하 설명되는 실시예들에 한정되지 않고 다른 형태로 구체화될 수도 있다. 그리고, 도면들에 있어서, 구성요소의 폭, 길이, 두께 등은 편의를 위하여 과장되어 표현될 수 있다. 명세서 전체에 걸쳐서 동일한 참조번호들은 동일한 구성요소들을 나타낸다.Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The following embodiments are provided as examples to ensure that the spirit of the present invention can be fully conveyed to those skilled in the art. Accordingly, the present invention is not limited to the embodiments described below and may be embodied in other forms. And, in the drawings, the width, length, thickness, etc. of the components may be exaggerated for convenience. Like numbers refer to like elements throughout.

도 1은 복수의 LED 패키지가 완성되어 있는 리드프레임 스트립을 도시한 평면도이고, 도 2는 도 1의 I-I를 따라 취해진 단면도이다.1 is a plan view illustrating a leadframe strip having a plurality of LED packages completed, and FIG. 2 is a cross-sectional view taken along the line I-I of FIG. 1.

도 1 및 도 2에 도시된 바와 같이, 리드프레임 스트립(10)은 복수의 패턴홀(12)들이 형성된 대략 판형의 구조를 갖는다. 그리고, 상기 리드프레임 스트립(10) 상에는 복수의 LED 패키지(20)들이 일체화되어 있다. 상기 복수의 패턴홀(12)들에 의해 리드프레임(14)들이 한정되며, 그 리드프레임(14)들은 후에 리드프레임 스트립(10)으로부터 절단되는 것이다. 그리고, 상기 절단에 의해, 상기 리드프레임(14)들은 개별 LED 패키지(20)의 일부분이 된다. As shown in FIGS. 1 and 2, the leadframe strip 10 has a substantially plate-like structure in which a plurality of pattern holes 12 are formed. In addition, a plurality of LED packages 20 are integrated on the leadframe strip 10. The lead frames 14 are defined by the plurality of pattern holes 12, and the lead frames 14 are later cut from the lead frame strip 10. And, by the cutting, the leadframes 14 become part of the individual LED package 20.

도 1의 확대도 "A"에 도시된 것과 같이, 상기 LED 패키지(20)는 리드프레임(14)을 지지하는 하우징(22)을 포함한다. 상기 하우징(22)은 캐비티(22a)를 구비하며, 그 캐비티(22a)는 리드프레임 스트립(10)의 여러 개소에 실장된 LED칩(24)들 중 하나를 수용하고 있다. 이때, 상기 캐비티(22a) 각각에는 복수의 LED칩(24)이 수용될 수도 있다. 상기 LED칩(24)은 하나의 리드프레임(14)에 실장되며 그 하나의 리드프레임(14)과 이웃하는 다른 리드프레임(14)과는 본딩와이어에 의해 전기 배선되어 있다. 상기 리드프레임 스트립(10)으로부터 리드프레임(14)들 각각을 일정 위 치들에서 절단하면, 각 LED 패키지(20)들은 리드프레임 스트립(10)으로부터 분리된다. As shown in enlarged view “A” of FIG. 1, the LED package 20 includes a housing 22 supporting the leadframe 14. The housing 22 has a cavity 22a, which houses one of the LED chips 24 mounted at various places of the leadframe strip 10. As shown in FIG. In this case, a plurality of LED chips 24 may be accommodated in each of the cavities 22a. The LED chip 24 is mounted on one lead frame 14 and is electrically wired by bonding wires with one lead frame 14 and another lead frame 14 adjacent to the lead frame 14. When each of the lead frames 14 is cut from the lead frame strip 10 at predetermined positions, the respective LED packages 20 are separated from the lead frame strip 10.

도 1 및 도 2에 도시된 것과 같이, 상기 하우징(22)의 캐비티(22a) 내에는 리드프레임 스트립(10)의 여러 개소에 실장되어 있는 LED칩(24)을 보호하는 봉지재(26)들이 형성된다. 본 발명에 따라, 상기 봉지재(26)들은 이하 자세히 설명되는 금형 내에 액상 수지를 주입하는 것에 의해 일괄적으로 형성되는 것으로서, 이하에서는, 상기 봉지재(26)들을 일괄적으로 형성하는 방법이 도 3 내지 도 6을 참조로 하여 보다 구체적으로 설명된다.As shown in FIGS. 1 and 2, in the cavity 22a of the housing 22, encapsulants 26 protecting the LED chip 24 mounted at various positions of the lead frame strip 10 are provided. Is formed. According to the present invention, the encapsulants 26 are formed collectively by injecting a liquid resin into a mold, which will be described in detail below. Hereinafter, a method of collectively forming the encapsulants 26 is illustrated. This will be described in more detail with reference to 3 to 6.

먼저, 도 3에 도시된 것과 같이, LED칩(24)이 여러 개소들에 실장되어 있고, 그 LED칩(24)을 캐비티(22a) 내측에 수용하는 하우징(22)이 설치되어 있는, 판상의 리드프레임 스트립(10)이 준비된다. 상기 리드프레임 스트립(10)에는 복수의 패턴홀(12)들이 형성되어 있으며, 그 패턴홀(12)들에 의해 일정 형상으로 한정된 복수의 리드프레임(14)들이 서로 연결된 구조를 이룬다.First, as shown in FIG. 3, the LED chip 24 is mounted in several places, and the board | substrate 22 in which the housing 22 which accommodates the LED chip 24 inside the cavity 22a is provided. The leadframe strip 10 is prepared. A plurality of pattern holes 12 are formed in the lead frame strip 10, and a plurality of lead frames 14 defined in a predetermined shape by the pattern holes 12 are connected to each other.

다음, 도 4에 도시된 것과 같이, 상기 리드프레임 스트립(10)의 상면에는 판상의 더미프레임(30)이 겹쳐 올려진다. 상기 더미프레임(30)은 상기 하우징(22)에 끼워지는 노출홀(32)들을 포함하는데, 상기 노출홀(32)들에 의해, 상기 하우징(22)의 캐비티(22a)가 상측으로 노출된다. 반면, 하우징(22) 없이 봉지재가 하우징의 역할을 함께 하는 것도 고려될 수 있는데, 이 경우, 상기 노출홀(32)들은 LED칩(24)이 실장된 리드프레임 스트립(10)의 여러 개소들을 노출시킨다.Next, as shown in Figure 4, the dummy frame 30 of the plate is placed on the upper surface of the lead frame strip (10). The dummy frame 30 includes exposure holes 32 inserted into the housing 22, and the cavity 22a of the housing 22 is exposed upward by the exposure holes 32. On the other hand, it can be considered that the encapsulant acts as a housing without the housing 22, in which case the exposure holes 32 expose various portions of the leadframe strip 10 on which the LED chip 24 is mounted. Let's do it.

본 실시예에서, 상기 노출홀(32)들은, 하우징(22)의 외형에 상응하는 도 7 의 (a)에 도시된 것과 같은 사각형으로 이루어지지만, 상기 하우징(22)이 원형인 경우 도 7의 (b)에 도시된 것과 같이 원형일 수 있다. 또한, 상기 하우징(22)의 형상에 따라 상기 노출홀(32)들의 형상은 다양한 기하학적 형상으로 변경될 수 있다.더미프레임(30)은, 상기 리드프레임 스트립(10)에 겹쳐진 상태에서, 상기 리드프레임 스트립(10)에 형성된 복수의 패턴홀(12)들을 전체적으로 막고 있다. In the present embodiment, the exposure holes 32 are formed in a quadrangle as shown in FIG. 7 (a) corresponding to the outer shape of the housing 22, but the housing 22 is circular in FIG. It may be circular as shown in (b). In addition, the shape of the exposure holes 32 may be changed to various geometric shapes according to the shape of the housing 22. The dummy frame 30 is overlapped with the lead frame strip 10 to form the lead. The plurality of pattern holes 12 formed in the frame strip 10 are entirely blocked.

다음, 도 5에 도시된 것과 같이, 더미프레임(30)에 의해 패턴홀(12)들이 막힌 리드프레임 스트립(10)이 봉지재(26; 도 2 참조)의 몰딩 성형을 위한 금형(40) 내에 위치된다. 상기 금형(40)은 임의의 구동수단에 의해 개폐되는 금형 상부(42)와 금형 하부(44)로 이루어지는 것이 바람직하며, 상기 금형(40)은, 닫힌 상태에서, 상기 더미프레임(30) 및 그것과 겹쳐 있는 리드프레임 스트립(10)을 수용하는 공간을 형성한다. 상기 금형(40)의 공간 크기 및 형상은 리드프레임 스트립(10), 더미프레임(30) 및 하우징(22)들의 형상 및 크기에 의해 결정된다. Next, as shown in FIG. 5, the lead frame strip 10 in which the pattern holes 12 are blocked by the dummy frame 30 is inserted into the mold 40 for molding the encapsulant 26 (see FIG. 2). Is located. Preferably, the mold 40 includes a mold upper part 42 and a mold lower part 44 opened and closed by an arbitrary driving means, and the mold 40 is in the closed state with the dummy frame 30 and the mold lower part 44. And a space for accommodating the leadframe strip 10 overlapping with each other. The space size and shape of the mold 40 is determined by the shape and size of the leadframe strip 10, the dummy frame 30 and the housing 22.

특히, 상기 금형 상부(42)에는 봉지재(26)들 각각의 형상을 결정하는 대략 반구형의 몰딩 형상부(422)가 형성되어 있다. 그리고, 상기 금형 상부(42)와 상기 더미프레임(30) 사이에는 상기 몰딩 형상부(422)와 상기 캐비티(22a)에 의해 한정된 공간과 전체적으로 연결되는 러너(424)가 마련된다. 상기 러너(424)는 상기 금형 상부(42)에 형성된 수지 주입구(425)와 통해 있다.In particular, the mold upper part 42 is formed with a substantially hemispherical molding shape portion 422 that determines the shape of each of the encapsulant 26. In addition, a runner 424 is provided between the mold upper portion 42 and the dummy frame 30 to be connected to the space defined by the molding shape portion 422 and the cavity 22a as a whole. The runner 424 is in communication with a resin inlet 425 formed in the upper part of the mold 42.

다음, 액상 수지, 가장 바람직하게는 실리콘 수지를 이용하여 캐비티(22a) 내에 봉지재(26)를 형성하는 공정이 도 6에 도시된 것과 같이 이루어진다. 이를 위해, 열에 의해 액상화된 실리콘 수지를 상기 수지 주입부(425)를 통해 상기 금 형(40) 내에 주입한다. 주입된 액상 수지는 러너(424)를 통해 상기 LED칩(24)이 위치한 리드프레임 스트립(10) 상의 각 개소들에 공급되며, 그 공급된 액상의 수지는 상기 캐비티(22a)를 채우고 상기 몰딩 형상부(422)에 의해 반구형으로 형상화된다. 상기 액상의 수지가 상기 캐비티(22a)와 몰딩 형상부(422) 사이에 한정된 공간 내에서 경화되면, 도 1 및 도 2에 도시된 것과 같은 봉지재(26)가 형성된다. Next, a process of forming the encapsulant 26 in the cavity 22a using a liquid resin, most preferably a silicone resin, is performed as shown in FIG. To this end, the silicone resin liquefied by heat is injected into the mold 40 through the resin injection portion 425. The injected liquid resin is supplied to the respective places on the lead frame strip 10 where the LED chip 24 is located through the runner 424, and the supplied liquid resin fills the cavity 22a and the molding shape. The portion 422 is shaped into a hemispherical shape. When the liquid resin is cured in the space defined between the cavity 22a and the molding portion 422, an encapsulant 26 as shown in Figs. 1 and 2 is formed.

다음, 상기 금형 상부(42) 및/또는 상기 금형 하부(44)를 이동시켜, 상기 금형(40)을 개방하고, 다음, 복수의 봉지재(26)들이 각 LED칩(24)을 덮도록 형성되어 있는 리드프레임 스트립(10)을 금형(40)으로부터 분리 제거한다. 그 후, 리드프리임 스트립(10)의 리드프레임(14)들을 정해진 위치에서 절단하면, 리드프레임(14)을 두개씩 구비한 LED 패키지가 최종적으로 제조될 수 있으며, 그 최종적으로 제조된 LED 패키지들 각각은 두개의 리드프레임(14)들 중 하나의 리드프레임(14) 상에 LED칩(24)이 실장되어 있고, 그 LED칩(24)은 봉지재(26)에 의해 봉지된다. 그리고, 그 봉지재(26)는 앞서 설명한 것과 같은 더미프레임(30)을 이용한 일괄 봉지 공정에 의해 형성된 것이다. Next, the mold upper part 42 and / or the mold lower part 44 are moved to open the mold 40, and the plurality of encapsulants 26 are formed to cover each LED chip 24. The leadframe strip 10 is removed from the mold 40. Thereafter, if the lead frames 14 of the lead frame strip 10 are cut at a predetermined position, an LED package having two lead frames 14 may be finally manufactured, and the finally manufactured LED packages may be manufactured. Each LED chip 24 is mounted on one of the two lead frames 14, and the LED chip 24 is sealed by the encapsulant 26. The encapsulant 26 is formed by a batch encapsulation process using the dummy frame 30 as described above.

본 발명의 실시예들에 의하면, 패턴홀들을 갖는 리드프레임 스트립 상의 여러 개소에 LED칩들 실장하고, 그 LED칩들을 액상의 수지로 봉지함에 있어서, 패턴홀들을 더미프레임을 막은 상태로, 액상의 수지를 LED칩이 위치한 각 개소에 일괄 공급하여, 리드프레임의 패턴홀들을 통해 액상의 수지가 새나감 없이, 복수의 LED칩들 일괄 봉지하는 것이 가능하다. 특히, 더미프레임을 이용한 위의 일괄 봉지 기 술은 경도가 낮고 경화시간이 길어 종래 트랜스퍼 몰딩에 의한 봉지재 형성이 어렵던 실리콘 수지를 이용하는 적용에 특히 접합하다. According to the embodiments of the present invention, in mounting the LED chips in several places on the lead frame strip having the pattern holes, and encapsulating the LED chips with the liquid resin, the liquid resin in the state in which the pattern holes are blocked from the dummy frame It is possible to collectively supply to each location where the LED chip is located, a plurality of LED chips can be encapsulated collectively without leaking the liquid resin through the pattern holes of the lead frame. In particular, the above batch encapsulation technique using a dummy frame is particularly bonded to applications using a silicone resin, which is difficult to form the encapsulant by transfer molding due to low hardness and long curing time.

Claims (6)

패턴홀들에 의해 복수의 리드프레임들이 한정된 채 그 리드프레임들이 서로 연결되어 있는 리드프레임 스트립을 준비하는 단계와;Preparing a lead frame strip in which the lead frames are connected to each other while the plurality of lead frames are defined by the pattern holes; 상기 리드프레임 스트립의 미리 정해진 개소들에 LED칩들을 실장하는 단계와;Mounting LED chips at predetermined locations of the leadframe strip; 상기 패턴홀들을 막고 상기 개소들을 노출시키는 더미프레임(dummy frame)을 상기 리드프레임 스트립과 겹쳐 놓는 단계와; Superimposing a dummy frame with the lead frame strip that closes the pattern holes and exposes the points; 상기 더미프레임과 겹쳐진 상기 리드프레임 스트립을 금형 내에 위치시키는 단계와;Placing the leadframe strip in the mold overlapping the dummy frame; 액상화된 수지를 상기 금형 내에 주입하여, 상기 개소들에 위치한 LED칩들을 일괄 봉지하는 단계를;Injecting a liquefied resin into the mold to collectively encapsulate the LED chips located in the places; 포함하는 일괄 봉지 기술을 이용하는 LED 패키지 제조방법.LED package manufacturing method using a batch encapsulation technology comprising. 청구항 1에 있어서, 상기 리드프레임 스트립은 상기 개소들 주변을 한정하는 캐비티들을 포함하는 하우징들이 형성된 것이고, 상기 LED칩을 일광 봉지하는 단계에서는 상기 금형 내로 주입된 상기 수지가 상기 캐비티들에 채워져서 각 캐비티 내에 위치한 상기 LED칩을 봉지하는 것을 특징으로 하는 일괄 봉지 기술을 이용하는 LED 패키지 제조방법.The method of claim 1, wherein the lead frame strip is formed with housings including cavities that define the periphery around the points, in the step of encapsulating the LED chip, the resin injected into the mold is filled in the cavities LED package manufacturing method using a batch encapsulation technology, characterized in that for encapsulating the LED chip located in the cavity. 청구항 2에 있어서, 상기 더미프레임은, 상기 개소들의 노출을 위해 상기 하우징에 끼워지는 노출홀들을 포함하는 판상의 프레임인 것을 특징으로 하는 일괄 봉지 기술을 이용하는 LED 패키지 제조방법.The method of claim 2, wherein the dummy frame is a plate-shaped frame including exposure holes fitted to the housing for exposing the portions. 청구항 3에 있어서, 상기 금형은 상기 더미프레임과의 사이에 상기 캐비티들과 연결되는 러너(runner)를 한정하도록 구성된 것임을 특징으로 하는 일괄 봉지 기술을 이용하는 LED 패키지 제조방법The method of claim 3, wherein the mold is configured to define a runner connected to the cavities between the dummy frame and the dummy frame. 청구항 3에 있어서, 상기 금형은 상기 LED칩을 봉지하는 봉지재의 형상을 결정하는 복수의 몰딩 형상부를 포함하는 것을 특징으로 하는 일괄 봉지 기술을 이용하는 LED 패키지 제조방법.The method of claim 3, wherein the mold includes a plurality of molding shapes that determine a shape of an encapsulant encapsulating the LED chip. 청구항 1 내지 청구항 5 중 어느 한 항에 있어서, 상기 수지는 실리콘 수지인 것을 특징으로 하는 일괄 봉지 기술을 이용하는 LED 패키지 제조방법.The method of manufacturing an LED package using a batch encapsulation technique according to any one of claims 1 to 5, wherein the resin is a silicone resin.
KR1020070065097A 2007-06-29 2007-06-29 Method for manufacturing led package using batch encapsulation technology KR101380385B1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020070065097A KR101380385B1 (en) 2007-06-29 2007-06-29 Method for manufacturing led package using batch encapsulation technology
PCT/KR2008/003728 WO2009005257A2 (en) 2007-06-29 2008-06-27 Method for manufacturing led package
TW097124566A TWI451594B (en) 2007-06-29 2008-06-30 Method for manufacturing led package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020070065097A KR101380385B1 (en) 2007-06-29 2007-06-29 Method for manufacturing led package using batch encapsulation technology

Publications (2)

Publication Number Publication Date
KR20090001036A true KR20090001036A (en) 2009-01-08
KR101380385B1 KR101380385B1 (en) 2014-04-10

Family

ID=40226646

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020070065097A KR101380385B1 (en) 2007-06-29 2007-06-29 Method for manufacturing led package using batch encapsulation technology

Country Status (3)

Country Link
KR (1) KR101380385B1 (en)
TW (1) TWI451594B (en)
WO (1) WO2009005257A2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016035992A1 (en) * 2014-09-02 2016-03-10 네이버비즈니스플랫폼 주식회사 Device for establishing interior map
KR20170002945A (en) * 2015-06-30 2017-01-09 삼성전기주식회사 Semiconductor package module manufacturing apparatus and method

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104290253B (en) * 2014-09-04 2017-04-12 万林华 LED light bar pipeline processing machine

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0799765B2 (en) * 1986-06-09 1995-10-25 京セラ株式会社 Manufacturing method of package for storing semiconductor devices
JP3308461B2 (en) * 1996-11-14 2002-07-29 富士通株式会社 Semiconductor device and lead frame
JP2002009349A (en) 2000-06-26 2002-01-11 Koha Co Ltd Surface emission led and its manufacturing method
US7692206B2 (en) * 2002-12-06 2010-04-06 Cree, Inc. Composite leadframe LED package and method of making the same
US7824937B2 (en) * 2003-03-10 2010-11-02 Toyoda Gosei Co., Ltd. Solid element device and method for manufacturing the same
KR100585014B1 (en) * 2004-07-01 2006-05-29 서울반도체 주식회사 Light-emitting diode package with heat transfer slug and method for manufacturing the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016035992A1 (en) * 2014-09-02 2016-03-10 네이버비즈니스플랫폼 주식회사 Device for establishing interior map
KR20170002945A (en) * 2015-06-30 2017-01-09 삼성전기주식회사 Semiconductor package module manufacturing apparatus and method

Also Published As

Publication number Publication date
WO2009005257A2 (en) 2009-01-08
KR101380385B1 (en) 2014-04-10
TWI451594B (en) 2014-09-01
WO2009005257A3 (en) 2009-03-05
TW200913325A (en) 2009-03-16

Similar Documents

Publication Publication Date Title
EP1922762B1 (en) Manufacturing method of light emitting diode
US6395579B2 (en) Controlling packaging encapsulant leakage
KR101488448B1 (en) Led package and method for fabricating the same
US6137224A (en) Electronic device encapsulated directly on a substrate
KR101766299B1 (en) Light emitting device package and method of manufacturing the light emitting device package
KR19980024503A (en) Semiconductor Package and Formation Method
JP2008004570A (en) Process and apparatus for manufacturing resin sealed semiconductor device, and resin sealed semiconductor device
KR101296349B1 (en) Optoelectronic part producing method, optoelectronic part producing system, and optoelectronic part
KR19990023662A (en) Method and apparatus for forming panel of packaged integrated circuit
TWI414028B (en) Injection molding system and method of chip package
JPH10284525A (en) Method for producing semiconductor device
JP2001053094A (en) Resin sealing method and device
US6692988B2 (en) Method of fabricating a substrate-based semiconductor package without mold flash
KR101380385B1 (en) Method for manufacturing led package using batch encapsulation technology
KR101762174B1 (en) Light emitting device package and method of manufacturing the same
CN102593090B (en) There is the leadframe package of the tube core on the pedestal that is arranged on isolation lead-in wire
US20050082490A1 (en) Optical semiconductor housing with transparent chip and method for making same
KR100757825B1 (en) Manufacturing method of light emitting diode
US7358598B2 (en) Process for fabricating a semiconductor package and semiconductor package with leadframe
CN114783959A (en) Packaging structure and packaging method
JPS609131A (en) Method for resin sealing of semiconductor device and apparatus thereof
JP2010212628A (en) Method of manufacturing semiconductor device
JPH1044180A (en) Transfer resin sealing method and resin sealing with the method
JP2003174123A (en) Semiconductor device and method for manufacturing the same
JPH07302809A (en) Resin sealing type semiconductor device and its production process

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20161212

Year of fee payment: 4