KR20080109289A - Double pick up cylinder for element of semiconductor - Google Patents

Abstract

A double pick-up cylinder for the semiconductor device is provided to contain the minute position error in a process by transferring two devices at the same time. A double pick-up cylinder for the semiconductor device comprises 2 vacuum shafts(2,3), 2 piston rods(4,5), the fitting block(6), the holder(7) and the fitting block(8). The vacuum shaft is equipped in one cylinder body(1) comprising the body. The piston rod is equipped in one cylinder body in order to move up and down the vacuum shaft with pneumatic. The fitting block connects one piston rod and the vacuum shaft. The fitting block consists of one body in order to provide the suction air. The holder and fitting block connect the piston rod and the vacuum shaft. The holder and fitting block is laminated in order to control the pitch of the fitting plug in which the suction air is provided.

Description

Double pick up cylinder for element of semiconductor

1 is a perspective view showing the external appearance of the present invention,

2 is an exploded perspective view showing the configuration of the present invention,

3 is a front view showing the internal coupling structure of the present invention,

4 is a front view of a cylinder body constituting the present invention,

5 is a front view of the first fitting block constituting the present invention,

6 is an exemplary view of the front, side and bottom of the holder constituting the present invention,

7 is an exemplary view of the front, side and bottom of the holder of the second fitting block constituting the present invention,

8 is an exemplary view showing the lifting operation of the present invention,

9 is an exemplary view showing a pitch change of the fitting plug according to the present invention,

10 is an exemplary view showing a state in which a plurality of pickup cylinder of the present invention is mounted on the "X" axis.

<Description of the symbols for the main parts of the drawings>

(1): Cylinder body (2, 3): 1st, 2nd shaft

(4, 5): first and second piston rod (6): first fitting block

(7): Holder (8): Second fitting block

(9): 1st damper part 10: 2nd damper part

11: first spring 12: second spring

(13): Fitting plug (14): Plug bolt

15, 16: 1st, 2nd piston packing 17, 18: 1st, 2nd damper

19: first stopper pin 20: second stopper pin

21: first rod bushing 22: second rod bushing

The present invention relates to a double pick-up cylinder for a semiconductor device, and in detail has two pick-up cylinders and a small position error, so that two semiconductor chips can be precisely transferred in a semiconductor manufacturing line, and an apparatus capable of shifting the pitch of the pick-up cylinder It is about.

In general, a pickup cylinder is used in a semiconductor manufacturing process to pick up a semiconductor element such as a chip component and move it to an assembly process.

In order to move the precise semiconductor chip precisely according to each process and not to damage it, the pickup cylinder mainly uses a vacuum suction method, and mainly transfers the vacuum shaft by one vacuum device vacuum suction vacuum shaft and up and down by pneumatic pressure. It consists of a pickup cylinder consisting of a piston rod. Usually, the pick-up cylinders are arranged in a row with a plurality of neighboring pick-up cylinders and configured to simultaneously work on the corresponding semiconductor elements. These pickup cylinders are mounted and moved in a line on the X axis of the semiconductor transfer equipment moving in the x, y, z axis direction.

A suction cup is installed in the lower portion of the vacuum shaft constituting the pickup cylinder and protrudes to a predetermined stroke by a piston rod, and the suction cup is in contact with the surface of the semiconductor element by a negative pressure generating means such as an air inhaler. The semiconductor device is picked up by suction of the semiconductor device due to the generation of negative pressure and drawn in a predetermined stroke as the piston rod rises.

The pickup cylinder having the configuration and operation as described above may be applied to assembling semiconductor devices, such as precise semiconductor chips, when the lifting and lowering position is small.

However, in order to precisely move the semiconductor device up and down, a device having a complicated structure must be provided, so that the thickness of the pick-up cylinder device increases, and as a result, the distance between neighboring pick-up cylinders increases, so that the semiconductor chips arranged with precise intervals Difficulties will follow.

In addition, conventionally, when semiconductor chips having two semiconductor element lines are arranged, two lines of cylinder devices, not one cylinder device, should be provided in two rows on two x-axes, so the number of pickup cylinder devices must be increased and controlled. As the number of pickup cylinders to be increased, the apparatus for controlling them also becomes complicated.

In addition, the conventional pickup cylinder having two pickup cylinders has a thick thickness, so that the distance between neighboring pickup cylinders is at least 10 mm and the distance between the neighboring pickup cylinders is at least 10 mm. In this case, there is a problem that a precise assembly process is not achieved due to a large position error during transportation due to installation tolerances.

In addition, a conventional pickup cylinder having two pickup cylinders has a problem in that the pitch adjustment between the pickup cylinders is impossible and the user cannot adjust the pitch.

In addition, the conventional pickup cylinders are made of light aluminum body, so the physical and chemical properties are weak, so that when used as it is, they are easily deteriorated and corroded, thereby preventing their appearance and function from being damaged or lost. , Anodized to have strength, wear resistance, corrosion resistance and electrical insulation. Therefore, the surface is electrically insulated, and due to the characteristics of the semiconductor process, a separate ground line must be provided to protect the semiconductor chip from electrical sparks that may occur during chip transfer. For this purpose, a device for fixing the ground line to the pickup cylinder body is essential. In addition, there is a problem that the device is complicated by connecting the ground wire with a neighboring pickup cylinder.

An object of the present invention for solving the above problems is to provide a pickup cylinder device capable of simultaneously transferring two precision devices such as semiconductor chips.

Another object of the present invention is to provide a pickup cylinder device having a structure capable of simultaneously maintaining two precise elements such as semiconductor chips to maintain a precise position error during operation.

Another object of the present invention is to provide a pick-up cylinder device having a structure that can adjust the pitch between the pick-up cylinder as needed on the user side.

Another object of the present invention is to have a structure that can transfer a precise element such as a semiconductor chip having a precise spacing because the thickness of the pick-up cylinder device is smaller and the distance between the neighboring pickup cylinder device is smaller with two pickup cylinders It is to provide a pickup cylinder device.

Another object of the present invention is to provide an electrically conductive pickup cylinder device which does not need a separate ground wire for preventing electric sparks while performing surface plating to enhance the physical and chemical properties of aluminum constituting the pickup cylinder. There is.

The present invention, which achieves the above object and accomplishes the problem for eliminating the conventional drawback, in the cylinder for picking up a precision semiconductor element such as a semiconductor chip, comprising two burrs provided in one cylinder body constituting a body. A shaft; Two piston rods mounted on one cylinder body for raising and lowering the clutch shaft by pneumatic pressure; A one-piece fitting block for interlocking the one piston rod and the clutch shaft and providing intake air; It characterized in that it comprises a holder and the fitting block is stacked and stacked to adjust the pitch of the fitting plug provided with the suction air at the same time interlocking another piston rod and the brake shaft.

Hereinafter, the configuration and the operation of the embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a perspective view showing the external appearance of the present invention, Figure 2 is an exploded perspective view showing the configuration of the present invention, Figure 3 is a front view showing the internal coupling structure of the present invention, Figure 4 is a cylinder constituting the configuration of the present invention Figure 5 is a front view of the body, Figure 5 is a front view of the first fitting block constituting the configuration of the present invention, Figure 6 is a front, side and bottom view of the holder constituting the configuration of the present invention, Figure 7 Exemplary views of the front, side and bottom of the holder of the second fitting block constituting the invention, as shown in the configuration of the present invention,

A cylinder body 1 constituting the body;

First and second clutch shafts 2 and 3 inserted into the cylinder body and transported to and from the cylinder body;

First and second piston rods 4 and 5 inserted into the cylinder body to transfer the first and second clutch shafts 2 and 3 downward by pneumatic pressure;

A first fitting block 6 formed of a body in which suction air is provided in combination with a lower portion of the first clutch shaft, and a first piston rod 4 is inserted into and buffered;

A holder (7) through which the second clutch shaft (3) penetrates and the second piston rod (5) is inserted and buffered;

A second fitting block (8) for pitch adjustment to which the lower part of the holder (7) rests and engages with the second vacuum shaft (3) penetrating the lower part of the holder (7);

A first damper portion (9) accommodated in the first fitting block (6) and screwed with the first piston rod (4) and at the same time providing a cushioning force with the cylinder body (1);

A second damper portion (10) accommodated in the holder (7) and screwed with the second piston rod (5) and at the same time providing a cushioning force with the cylinder body (1);

A first spring 11 fitted around the first piston rod 4 to provide a restoring force of the first piston rod 4;

A second spring 12 fitted around the second piston rod 5 to provide a restoring force of the second piston rod 5;

It comprises a fitting plug 13 provided with intake air and a plug bolt 14 for preventing intake air provided, which are respectively coupled to one of the inner and outer fitting holes at the bottom of the second fitting block 8.

The first rod bush 21 is fitted around the first piston rod 4 and the first spring 11 so as to be protected.

The second rod bush 22 is fitted around the second piston rod 5 and the second spring 12 so as to be protected.

The lower portion of each bush is threaded to be screwed with the lower portion of the cylinder body.

First and second piston packings 15 and 16 are fitted to the upper portion of the first piston rod 4 and the second piston rod 5 to seal the pneumatics from leaking downward. First and second dampers 17 and 18 are provided at an upper portion, and a first stopper pin 19 and a second stopper pin 20 are disposed on an upper portion of the first and second dampers 17 and 18. Screwed to the body (1) to prevent the departure. The first stopper pin 19 and the second stopper pin 20 are formed hollow so that the pneumatic pressure is applied downward.

The first and second dampers 17 and 18 are installed between the first and second piston packings 15 and 16 and the first stopper pin 19 and the second stopper pin 20 so that It is to buffer the contact by the vertical movement.

The cylinder body (1) has four holes (1001) into which a first piston shaft (2) and a first piston rod (4) and a second cylinder shaft (3) and a second piston rod (5) are inserted. The first stopper pin 19 is formed at an upper portion of the hole 1002 and the hole 1003 into which the 1002, 1003, and 1004 are vertically penetrated, and the first piston rod 4 and the second piston rod 5 are inserted. And the second threaded stopper pin 20 are coupled to the female thread portions 1021 and 1031, and the x-axis fixing mounting holes 1005 and 1006 for transporting the pick-up cylinder and the fixing guide pin holes 1007 1008) is formed and fixed to the X-axis.

The first shaft shaft 2 has a male screw portion 201 inserted into the female screw portion 631 formed at an upper portion of the fitting hole 63 of the first fitting block 6.

The second shaft shaft 3 has a male screw portion 301 inserted into the female screw portion 831 formed in the upper portion of the outer fitting hole 82 of the second fitting block 8.

The first piston rod 4 has two insertion protrusions 41 protruding in the circumferential direction so that the first piston packing 15 is inserted in the upper portion thereof, and a nut 91 of the first damper portion 9 formed in the lower portion thereof. It is formed of a male screw portion 42 screwed to).

The second piston rod 5 has two insertion protrusions 51 protruding in the circumferential direction so that the second piston packing 16 is inserted in the upper portion thereof, and a nut 101 of the second damper portion 10 formed in the lower portion thereof. It is formed of a male screw portion 52 that is screwed into).

The first fitting block 6 is integrally formed with a fitting holder 61 and a fitting portion 62 protruding downward from one side of the fitting holder 61, and a fitting hole 63 inside the fitting portion 62. ) Is formed and the male screw portion (201) formed in the lower portion of the first shaft shaft 2 is inserted into the female screw portion (631) processed on the upper side to provide the suction air. In addition, a damper hole 64 into which the damper part 9 for buffering the first fitting block 6 is inserted is formed inside the other side of the fitting holder 61.

Through the fitting hole 63, the suction air is loaded or unloaded by applying or releasing suction force to a device such as a semiconductor chip.

The holder 7 is formed of the letter "a", the second fitting block 8 is formed of the letter "b" is configured to be in contact with each other to be seated.

The holder 7 has a key groove 71 and a through hole 73 formed at one side thereof, and the key groove 71 is formed so that the key 81 formed at one side of the second fitting block 8 at the lower side is inserted into and fixedly supported. The through hole 73 penetrates the male screw part 301 of the second shaft shaft, and a damper hole 72 into which the damper part 10 for buffering the holder 7 is inserted is formed at the other side.

The second fitting block 8 has a key 81 which is inserted into the key groove 71 of the holder 7 on the outer upper portion, and protrudes, and the male screw portion 301 of the second shaft shaft 3 is screwed therein. An outer fitting hole 82 having a female threaded portion 831 to be coupled thereto and an inner fitting hole 84 connected to the outer fitting hole 82 and an air passage 83 are formed.

Suction air is provided in the outer fitting hole 82 and the inner fitting hole 84 so that the suction air is applied to or released from the device such as a semiconductor chip through the fitting plug 13 coupled thereto. . The plug bolt 14 blocks the other air flow.

The air passage 83 is blocked by the metal ball 85 after assembly to prevent the leakage of air.

The first damper portion 9 is a nut 91 for screwing into the male screw portion 42 formed at the lower portion of the first piston rod 4 and a spring 92 positioned at the lower portion of the nut to provide a buffering force. Washer 93 located at the top of 91 and washer 94 located at the bottom of the spring.

The second damper portion 10 is a nut 101 for screwing into a male screw portion 52 formed at a lower portion of the second piston rod 5 and a spring 102 positioned at a lower portion of the nut to provide a cushioning force. A washer 103 located at the top of the 101 and a washer 104 located at the bottom of the spring.

All of the components of the present invention listed above are composed of aluminum as the base material, but the surface of the conductive material is formed by forming an electroless nickel plating layer having a certain thickness in order to reinforce the physical and chemical properties of aluminum and to prevent electrical sparks. It is configured not to need a separate ground wire.

Figure 8 is an exemplary view showing the lifting action of the present invention, looking at the lifting action of the present invention through this of the present invention as shown, the compressor (shown through the first stopper pin 19 and the second stopper pin) None and the first and second piston shafts interlocked with the first fitting block and the hole and the second fitting block at the same time when the first and second piston rods are lowered and positioned on the upper part of the semiconductor chip, etc. Is lowered, and the fitting part 62 and the suction plate (not shown) attached to the fitting plug 13 positioned below the first fitting block and the second fitting block come into close contact with an element such as a semiconductor chip. Then, when the suction air is provided from the air inhaler (not shown) through the first and second buffer shafts formed in the hollow, the device such as the semiconductor chip is lifted. On the contrary, when the suction air is released, the lifting force of the semiconductor chip is released.

In the above description, one double cylinder is used as an example, but in the actual process, a plurality of semiconductor chips having one or two rows are usually arranged so that an assembly process is performed. Used on the "X" axis.

9 is an exemplary view showing a pitch change of the fitting plug according to the present invention. When the arrangement of the semiconductor chip located below is changed while operating according to FIG. You work by exchanging positions.

In addition, although not shown in the embodiment, the double pick-up cylinder of the present invention can be applied to a device such as a semiconductor chip having a two-cylinder device but having a smaller thickness (8 mm or less) and a precise arrangement.

FIG. 10 is a diagram showing a state in which a plurality of pickup cylinders of the present invention are mounted on an "X" axis. FIG. 10 illustrates a state in which two semiconductor chips and the like are arranged in two rows. In addition, since the side thickness is small, it can be seen that the distance between the neighboring pickup cylinder is installed close, even if the distance between the semiconductor chips located in the lower portion is precisely performed.

The present invention is not limited to the above-described specific preferred embodiments, and various modifications can be made by any person having ordinary skill in the art without departing from the gist of the present invention claimed in the claims. Of course, such changes will fall within the scope of the claims.

The present invention as described above has the advantage that can simultaneously transfer two precise lifting target elements, such as semiconductor chips,

It has the advantage that it has the structure to maintain precise position error during work by transferring two elements such as semiconductor chip at the same time.

The advantage that the user can adjust the pitch between the pickup cylinders as needed,

Although it has two pickup cylinders and the thickness of the pickup cylinder device is smaller, the distance between neighboring pickup cylinder devices is narrower, and it is possible to transfer devices such as semiconductor chips with precise spacing.

It is a useful invention that has the advantage of being an electrically conductive pickup cylinder that does not need a separate ground wire to prevent electrical sparks while performing surface plating to enhance the physical and chemical properties of aluminum constituting the pickup cylinder. It is an invention which is expected to use greatly.

Claims (9)

In a cylinder for picking up precision semiconductor elements such as semiconductor chips, Two shaft shafts installed in one cylinder body constituting the body; Two piston rods mounted on one cylinder body for raising and lowering the clutch shaft by pneumatic pressure; A one-piece fitting block for interlocking the one piston rod and the clutch shaft and providing intake air; A double pick-up cylinder for a semiconductor device, comprising: a holder and a fitting block, which are stacked and stacked to adjust the pitch of a fitting plug provided with intake air while interlocking another piston rod and a pressure shaft. In a cylinder for picking up precision semiconductor elements such as semiconductor chips, A cylinder body 1 constituting the body; First and second clutch shafts 2 and 3 inserted into the cylinder body and transported to and from the cylinder body; First and second piston rods 4 and 5 inserted into the cylinder body to transfer the first and second clutch shafts 2 and 3 downward by pneumatic pressure; A first fitting block 6 formed of a body in which suction air is provided in combination with a lower portion of the first clutch shaft, and a first piston rod 4 is inserted into and buffered; A holder (7) through which the second piston shaft (3) penetrates and the second piston rod (5) is inserted and buffered; A second fitting block (8) for pitch adjustment to which the lower part of the holder (7) rests and engages with the second vacuum shaft (3) penetrating the lower part of the holder (7); A first damper portion (9) accommodated in the first fitting block (6) and screwed with the first piston rod (4) and at the same time providing a cushioning force with the cylinder body (1); A second damper portion (10) accommodated in the holder (7) and screwed with the second piston rod (5) and at the same time providing a cushioning force with the cylinder body (1); A first spring 11 fitted around the first piston rod 4 to provide a restoring force of the first piston rod 4; A second spring 12 fitted around the second piston rod 5 to provide a restoring force of the second piston rod 5; A fitting plug 13 for providing intake air and a plug bolt 14 for preventing intake air, which is coupled to one of the inner and outer fitting holes at the bottom of the second fitting block 8, respectively. Double pickup cylinder for semiconductor devices. The method of claim 2, A first rod bush 21 is fitted around the first piston rod 4 and the first spring 11 to protect the first piston rod 4 and the second spring 12. A double pick-up cylinder for a semiconductor device, characterized in that the two rod bush (22) is fitted to protect. The method of claim 2, First and second piston packings 15 and 16 are fitted to the upper portion of the first piston rod 4 and the second piston rod 5 to seal the pneumatics from leaking downward. First and second dampers 17 and 18 are provided at an upper portion, and a first stopper pin 19 and a second stopper pin 20 are disposed on an upper portion of the first and second dampers 17 and 18. Screwed to the body (1) to prevent separation, the first stopper pin 19 and the second stopper pin 20 is formed in a hollow so that the pneumatic pressure double pick-up, characterized in that configured to be applied downward cylinder. The method of claim 2, The cylinder body (1) has four holes (1001) into which a first piston shaft (2) and a first piston rod (4) and a second cylinder shaft (3) and a second piston rod (5) are inserted. The first stopper pin 19 is formed at an upper portion of the hole 1002 and the hole 1003 into which the 1002, 1003, and 1004 are vertically penetrated, and the first piston rod 4 and the second piston rod 5 are inserted. And the second threaded stopper pin 20 are coupled to the female thread portions 1021 and 1031, and the x-axis fixing mounting holes 1005 and 1006 for transporting the pick-up cylinder and the fixing guide pin holes 1007 1008), wherein the double pickup cylinder for a semiconductor device. The method of claim 2, The holder 7 has a key groove 71 and a through hole 73 formed at one side thereof, and the key groove 71 is formed so that the key 81 formed at one side of the second fitting block 8 at the lower side is inserted into and fixedly supported. The through-hole 73 has a male screw portion 301 of the second shaft shaft penetrated therein, and the other side has a damper hole 72 into which the damper portion 10 is inserted to cushion the holder 7. Double pickup cylinder for semiconductor devices. The method of claim 2, The second fitting block 8 has a key 81 which is inserted into the key groove 71 of the holder 7 on the outer upper portion, and protrudes, and the male screw portion 301 of the second shaft shaft 3 is screwed therein. An outer fitting hole 82 having a female threaded portion 831 to be coupled therein, and an inner fitting hole 84 connected to the outer fitting hole 82 and an air passage 83 are formed, and the outer fitting hole 82 or the inner side is formed. A double pick-up cylinder for a semiconductor device, characterized in that the fitting plug 13 or plug bolt 14 is coupled to the fitting hole 84. The method of claim 2, The first damper portion 9 is a nut 91 for screwing into the male screw portion 42 formed at the lower portion of the first piston rod 4 and a spring 92 positioned at the lower portion of the nut to provide a buffering force. A washer 93 located at the top of the 91 and a washer 94 located at the bottom of the spring, The second damper portion 10 is a nut 101 for screwing into a male screw portion 52 formed at a lower portion of the second piston rod 5 and a spring 102 positioned at a lower portion of the nut to provide a cushioning force. A double pick-up cylinder for a semiconductor device, characterized in that consisting of a washer 103 located at the top of the 101 and a washer 104 located at the bottom of the spring. The method according to any one of claims 1 to 8, The material of each component constituting the double pick-up cylinder is made of aluminum, the surface of the double pick-up cylinder for a semiconductor device, characterized in that the surface is formed by forming an electroless nickel plating layer of a certain thickness.

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