KR20080105746A - Photosensitive resin composition - Google Patents

Abstract

A photosensitive resin composition, a method for forming a display pattern by using the composition, and a display using the composition are provided to improve the productivity by reducing the processing time and toenhance impact resistanceby increasing the flexibility of film. A photosensitive resin composition comprises 0.1-10 wt% of at least one compound selected from dioctyl phthalate, diisononyl phthalate, dioctyl adipate, tricresyl phosphate, and 2,2,4-trimethyl-1,3-pentanediol monoisobutyrate as a sensitizer. Preferably the composition comprises 10-30 wt% of an acrylic copolymer; 1-20 wt% of 1,2-quinonediazide 5-sulfonic acid ester compound; 0.1-10 wt% of the sensitizer; and the balance of a solvent.

Description

Photosensitive Resin Composition {PHOTOSENSITIVE RESIN COMPOSITION}

The present invention relates to a photosensitive resin composition, and more particularly, it has excellent performances such as flatness, resolution, heat resistance, and transmittance after development, and in particular, it is possible to increase productivity by shortening the process time by enabling a highly sensitive organic insulating film. In addition, the present invention relates to a photosensitive resin composition capable of increasing the impact resistance by making the film flexible.

In the TFT type liquid crystal display device or integrated circuit device, an organic insulating film is used to insulate the wirings arranged between the layers.

Recently, due to the expansion of the display market, productivity and cost reduction are urgently required. The organic insulating film applied to the current display manufacturing process is advantageous in various aspects such as improvement of the aperture ratio, but the disadvantages of long process time and low sensitivity have been continuously questioned.

Therefore, the research to develop a high sensitivity organic insulating film in the display process is further required.

In order to solve the problems of the prior art as described above, the present invention is excellent in the performance after development, such as flatness, resolution, heat resistance, transmittance, etc. In particular, it is possible to increase the productivity by reducing the process time by enabling a high-sensitivity organic insulating film In addition, it is an object of the present invention to provide a photosensitive resin composition capable of increasing the impact resistance by making the film flexible.

In addition, the present invention is excellent in the performance after development, such as flatness, resolution, heat resistance, transmittance, etc. using the photosensitive resin composition, in particular, by enabling a high-sensitivity organic insulating film to form a display pattern that can increase the productivity by reducing the process time It is an object to provide a display comprising a method and a cured product of the photosensitive resin composition as an organic insulating film.

In order to achieve the above object, the present invention provides a photosensitive resin composition,

Compounds selected from the group consisting of dioctyl phthalate, diisononyl phthalate, dioctyl adipate, tricresyl phosphate, and 2,2,4-trimethyl-1,3-pentanediol monoisobutyrate as sensitivity enhancers It provides a photosensitive resin composition comprising 0.1 to 10% by weight.

In another aspect, the present invention provides a display pattern forming method using the photosensitive resin composition.

The present invention also provides a display comprising the cured product of the photosensitive resin composition as an organic insulating film.

Hereinafter, the present invention will be described in detail.

The present inventors have studied dioctylphthalate, diisononyl phthalate, dioctyl adipate, tricresyl phosphate, and 2,2,4-trimethyl-1,3-pentanediol monoisobutyrate while studying to improve the sensitivity of the organic insulating film. Including at least one compound selected from the group consisting of a photosensitive resin composition for an organic insulating film as a sensitivity enhancer, the sensitivity is significantly increased, and after development, it has excellent performances such as flatness, resolution, heat resistance, transmittance, and the like. It was confirmed that it can increase the impact resistance by flexibility to complete the present invention.

The photosensitive resin composition of this invention consists of a dioctyl phthalate, a diisononyl phthalate, a dioctyl adipate, a tricresyl phosphate, and a 2,2, 4- trimethyl- 1, 3- pentanediol monoisobutyrate as a sensitivity enhancer. It characterized in that it comprises 0.1 to 10% by weight of at least one compound selected from.

The dioctyl phthalate, diisononyl phthalate, dioctyl adipate, tricresyl phosphate, and 2,2,4-trimethyl-1,3-pentanediol monoisobutyrate are conventionally used as plasticizers or solvents, but the photosensitivity of the present invention In the resin composition, it acts as a sensitivity enhancer, and preferably 2,2,4-trimethyl-1,3-pentanediol monoisobutyrate is used. The sensitivity enhancer is included in the photosensitive resin composition of the present invention 0.1 to 10% by weight, if less than 0.1% by weight is difficult to expect the productivity increase through the reduction of the process time, if more than 10% by weight There may be a problem that the heat resistance is lowered and the unit price increases. Preferably, it is preferable to include 2 to 10% by weight, and if it is within the above range can satisfy not only the sensitivity but also flatness, resolution, heat resistance, transmittance, and impact resistance at the same time.

Preferably, the photosensitive resin composition of the present invention comprises a) 5 to 40% by weight of an acrylic copolymer; b) 1 to 20% by weight of 1,2-quinonediazide 5-sulfonic acid ester compound; c) 0.1 to 10% by weight of the sensitivity enhancer; And d) a residual amount of solvent.

The acryl-based copolymer of a) serves to easily form a predetermined pattern in which scum does not occur when developing. The content of the a) acrylic copolymer in the photosensitive resin composition of the present invention is preferably 5 to 40% by weight. Within the above range, not only the sensitivity but also flatness, resolution, heat resistance, transmittance, and impact resistance can be satisfied at the same time.

As a specific example, the a) acrylic copolymer is iii) unsaturated carboxylic acid or an anhydride thereof, ii) an epoxy group-containing unsaturated compound and iii) an olefinically unsaturated compound as monomers, after radical synthesis in the presence of a solvent and a polymerization initiator, followed by precipitation and filtration. It can be obtained by removing unreacted monomer through vacuum drying process .

A) i) Unsaturated carboxylic acid, unsaturated carboxylic anhydride or mixtures thereof used in the present invention include unsaturated monocarboxylic acids such as acrylic acid and methacrylic acid; Unsaturated dicarboxylic acids such as maleic acid, fumaric acid, citraconic acid, metaconic acid and itaconic acid; Or anhydrides of these unsaturated dicarboxylic acids, or the like, may be used alone or in combination of two or more thereof. Particularly, acrylic acid, methacrylic acid, or maleic anhydride may be used in terms of copolymerization reactivity and solubility in aqueous alkali solution. Do.

The unsaturated carboxylic acid, unsaturated carboxylic anhydride or a mixture thereof is preferably included in an amount of 15 to 45 parts by weight based on the total monomers. Solubility in aqueous alkali solution is most ideal when the content is within the above range.

The epoxy group-containing unsaturated compound of a) ii) used in the present invention is glycidyl acrylate, glycidyl methacrylate, glycidyl α-ethyl acrylate, glycidyl α-n-propyl acrylate, α-n- Butyl acrylate glycidyl, acrylic acid-beta -methyl glycidyl, methacrylic acid-beta -methyl glycidyl, acrylic acid-beta -ethyl glycidyl, methacrylic acid-beta -ethyl glycidyl, acrylic acid -3, 4-epoxybutyl, methacrylic acid-3,4-epoxybutyl, acrylic acid-6,7-epoxyheptyl, methacrylic acid-6,7-epoxyheptyl, α-ethylacrylic acid-6,7-epoxyheptyl, o- Vinyl benzyl glycidyl ether, m-vinyl benzyl glycidyl ether, or p-vinyl benzyl glycidyl ether, methacrylic acid 3,4-epoxy cyclohexyl, and the like can be used. It can be mixed and used.

In particular, the epoxy group-containing unsaturated compounds are methacrylic acid glycidyl, methacrylic acid-β-methylglycidyl, methacrylic acid-6,7-epoxyheptyl, o-vinylbenzyl glycidyl ether, m-vinylbenzyl It is more preferable to use glycidyl ether, p-vinylbenzyl glycidyl ether, methacrylic acid 3,4-epoxy cyclohexyl, etc. in improving copolymerization reactivity and heat resistance of the obtained pattern.

The epoxy group-containing unsaturated compound is preferably included in 15 to 45 parts by weight based on the total monomers. When the content is within the above range, the heat resistance of the organic insulating film and the storage stability of the photosensitive resin composition may be satisfied at the same time.

The olefinically unsaturated compounds of a) iii) used in the present invention are methyl methacrylate, ethyl methacrylate, n-butyl methacrylate, sec-butyl methacrylate, tert-butyl methacrylate, methyl acrylate. , Isopropyl acrylate, cyclohexyl methacrylate, 2-methylcyclohexyl methacrylate, dicyclopentenyl acrylate, dicyclopentanyl acrylate, dicyclopentenyl methacrylate, dicyclopentanyl methacrylate, 1 -Adamantyl acrylate, 1-adamantyl methacrylate, dicyclopentanyloxyethyl methacrylate, isoboroyl methacrylate, cyclohexyl acrylate, 2-methylcyclohexyl acrylate, dicyclopentanyloxy Ethyl acrylate, isoboroyl acrylate, phenyl methacrylate, phenyl acrylate, benzyl acrylate, 2-hydroxyethyl meth Acrylate, styrene, s-methyl styrene, m-methyl styrene, p-methyl styrene, vinyltoluene, p-methoxy styrene, 1,3-butadiene, isoprene, or 2,3-dimethyl 1,3-butadiene It can be used and the said compound can be used individually or in mixture of 2 or more types.

In particular, the olefinically unsaturated compound is more preferably in terms of solubility in alkaline water solution of copolymerization reactivity and developer, using styrene, dicyclopentanyl methacrylate, or p-methoxy styrene.

The olefinically unsaturated compound is preferably included in an amount of 25 to 70 parts by weight, more preferably 25 to 45 parts by weight based on the total monomers. When the content is within the above range, the swelling does not occur after development, and the solubility in the aqueous alkali solution may be ideally maintained.

As a solvent used for solution polymerization of such monomers, methanol, tetrahydroxyfuran, toluene, dioxane, or the like may be used.

The polymerization initiator used for solution polymerization of such monomers may use a radical polymerization initiator, specifically 2,2-azobisisobutyronitrile, 2,2-azobis (2,4-dimethylvaleronitrile ), 2,2-azobis (4-methoxy 2,4-dimethylvaleronitrile), 1,1-azobis (cyclohexane-1-carbonitrile), or dimethyl 2,2'-azobisisobutyl Rate and the like can be used.

The acrylic copolymer of a) obtained by radical reaction of the above monomers in the presence of a solvent and a polymerization initiator, and removing unreacted monomers through precipitation, filtration and vacuum drying processes has a polystyrene reduced weight average molecular weight (Mw) of 5,000 to 20,000. Is preferably. In the case of the organic insulating film having a polystyrene reduced weight average molecular weight of less than 5,000, there is a problem that developability, residual film ratio, etc. may be deteriorated, pattern development, heat resistance, etc. may be inferior, and in the case of an organic insulating film exceeding 20,000, sensitivity may be reduced or There is a problem that the pattern phenomenon may be inferior.

In addition, the 1,2-quinonediazide 5-sulfonic acid ester compound of b) used in the present invention may be prepared by reacting a naphthoquinonediazide sulfonic acid halogen compound and a phenol compound under a weak base.

Examples of the phenolic compounds include 2,3,4-trihydroxybenzophenone, 2,4,6-trihydroxybenzophenone, 2,2'-tetrahydroxybenzophenone, and 4,4'-tetrahydroxybenzophenone. , 2,3,4,3'-tetrahydroxybenzophenone, 2,3,4,4'-tetrahydroxybenzophenone, 2,3,4,2'-tetrahydroxy 4'-methylbenzophenone, 2,3,4,4'-tetrahydroxy 3'-methoxybenzophenone, 2,3,4,2'-pentahydroxybenzophenone, 2,3,4,6'-pentahydroxybenzophenone, 2,4,6,3'-hexahydroxybenzophenone, 2,4,6,4'-hexahydroxybenzophenone, 2,4,6,5'-hexahydroxybenzophenone, 3,4,5 , 3'-hexahydroxybenzophenone, 3,4,5,4'-hexahydroxybenzophenone, 3,4,5,5'-hexahydroxybenzophenone, bis (2,4-dihydroxyphenyl ) Methane, bis (p-hydroxyphenyl) methane, tri (p-hydroxyphenyl) methane, 1,1,1-tri (p-hydroxyphenyl) ethane, bis (2,3,4-trihydroxy Phenyl) methane, 2,2-bis (2,3,4-trihydroxyphenyl) propane, 1,1,3-tris (2,5-dimeth Methyl 4-hydroxyphenyl) -3-phenylpropane, 4,4 '-[1- [4- [1- [4-hydroxyphenyl] -1-methylethyl] phenyl] ethylidene] bisphenol, or bis ( 2,5-dimethyl 4-hydroxyphenyl) -2-hydroxyphenylmethane etc. can be used, The said compound can be used individually or in mixture of 2 or more types.

When the quinone diazide compound is synthesized with the phenol compound and the naphthoquinone diazide sulfonic acid halogen compound as described above, the esterification degree is preferably 50 to 85%. Within the above range, the residual film ratio and the correction stability are excellent at the same time.

The b) 1,2-quinonediazide 5-sulfonic acid ester compound is preferably contained in 1 to 20% by weight in the photosensitive resin composition of the present invention. When the content is in the above range, the pattern is easy to form, and the solubility in the aqueous alkali solution is a developer has an ideal advantage.

The sensitivity enhancer of c) used in the present invention is as described above.

In addition, the solvent of d) used in the present invention does not generate flatness and coating stain of the organic insulating film, thereby forming a uniform pattern profile.

The solvent may be alcohol such as methanol, ethanol, benzyl alcohol, hexyl alcohol; Ethylene glycol alkyl ether acetates such as ethylene glycol methyl ether acetate and ethylene glycol ethyl ether acetate; Ethylene glycol monoalkyl ethers such as ethylene glycol alkyl ether propionate such as ethylene glycol methyl ether propionate and ethylene glycol ethyl ether propionate, ethylene glycol methyl ether and ethylene glycol ethyl ether; Diethylene glycol alkyl ethers such as diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol dimethyl ether, diethylene glycol methyl ethyl ether; Propylene glycol alkyl ether acetates such as propylene glycol methyl ether acetate, propylene glycol ethyl ether acetate, and propylene glycol propyl ether acetate; Propylene glycol alkyl ether propionates such as propylene glycol methyl ether propionate, propylene glycol ethyl ether propionate and propylene glycol propyl ether propionate; Propylene glycol monoalkyl ethers such as propylene glycol methyl ether, propylene glycol ethyl ether, propylene glycol propyl ether, and propylene glycol butyl ether; Butylene glycol monomethyl ethers such as dipropylene glycol alkyl ethers such as dipropylene glycol dimethyl ether and diporopropylene glycol diethyl ether, butylene glycol monomethyl ether, butylene glycol monoethyl ether; Dibutylene glycol alkyl ethers such as dibutylene glycol dimethyl ether and dibutylene glycol diethyl ether.

The solvent is included as the remainder of the entire photosensitive resin composition, and preferably included to be 50 to 90% by weight. When it is in the said range, the coating property and correction stability of the photosensitive resin composition can be improved simultaneously.

The photosensitive resin composition of this invention which consists of such a component as needed may further contain e) epoxy resin, f) adhesive, g) acrylic compound, and h) surfactant.

The epoxy resin of the said e) functions to improve the heat resistance, sensitivity, etc. of the pattern obtained from the photosensitive resin composition.

The epoxy resin is bisphenol A epoxy resin, phenol novolac epoxy resin, cresol novolac epoxy resin, cycloaliphatic epoxy resin, glycidyl ester epoxy resin, glycidyl amine epoxy resin, heterocyclic epoxy resin, Or a resin obtained by co-polymerizing glycidyl methacrylate different from the acrylic copolymer of a), and in particular, a bisphenol A type epoxy resin, a cresol novolac type epoxy resin, or a glycidyl ester type. Preference is given to using epoxy resins.

The epoxy resin is preferably contained in 0.01 to 10% by weight relative to the photosensitive resin composition of the present invention, when the content is in the above range can improve the coating properties and adhesion.

In addition, the adhesive of f) serves to improve the adhesion to the substrate, it is preferably contained in 0.01 to 10% by weight relative to the photosensitive resin composition of the present invention.

As the adhesive, a silane coupling agent having a reactive substituent such as a carboxyl group, a methacryl group, an isocyanate group, or an epoxy group can be used. Specifically, γ-methacryloxypropyltrimethoxysilane, vinyltriacetoxysilane, vinyltrimethoxysilane, γ-isocyanatepropyltriethoxysilane, γ-glycidoxypropyltrimethoxysilane, or β- (3 , 4-epoxy cyclohexyl) ethyltrimethoxysilane and the like can be used.

Moreover, the said acrylic compound of g) functions to improve the transmittance | permeability, heat resistance, a sensitivity, etc. of the pattern obtained from the photosensitive resin composition.

Preferably, the acrylic compound is a compound represented by the following formula (1).

(Formula 1)

In the formula of Formula 1,

R is a hydrogen atom, an alkyl group of 1 to 5 carbon atoms, an alkoxy group of 1 to 5 carbon atoms, or an alkanoyl group of 1 to 5 carbon atoms,

1 <a <6 and a + b = 6.

The acrylic compound is preferably included in an amount of 0.01 to 10 parts by weight, more preferably 0.1 to 5% by weight based on the photosensitive resin composition of the present invention. When the content is in the above range, it is better in improving the transmittance, heat resistance, sensitivity, and the like of the pattern.

In addition, the surfactant of h) serves to improve the coatability and developability of the photosensitive composition.

The surfactant may be polyoxyethylene octylphenyl ether, polyoxyethylene nonylphenyl ether, F171, F172, F173 (trade name: Japan Nippon Ink Company), FC430, FC431 (trade name: Sumitomo Triem, Inc.), or KP341 (trade name: Shinwol) Chemical industry) and the like.

It is preferable that the said surfactant is contained in 0.0001 to 2 weight% with respect to the photosensitive resin composition of this invention, and when the content is in the said range, it is further more favorable in the coating property and developability of a photosensitive composition.

It is preferable that the solid content concentration of the photosensitive resin composition of this invention which consists of the above components is 10 to 50 weight%, and the composition which has a solid content of the said range is used after filtering by a 0.1-0.2 micrometer millipore filter etc. good.

The present invention also provides a display pattern forming method using the photosensitive resin composition and a display including a cured product of the photosensitive resin composition as an organic insulating film.

The pattern formation method in the display process of this invention uses the said photosensitive resin composition in the method of forming the pattern in a display process by forming the photosensitive resin composition into an organic insulating film.

Specifically, the method of forming a pattern in the display process using the photosensitive resin composition is as follows.

First, the photosensitive resin composition of this invention is apply | coated to the surface of a board | substrate by the spray method, the roll coater method, the rotary coating method, etc., A solvent is removed by prebaking, and a coating film is formed. At this time, the prebaking is preferably carried out for 1 to 15 minutes at a temperature of 80 ~ 115 ℃.

Then, a predetermined pattern is formed by irradiating visible light, ultraviolet rays, far ultraviolet rays, electron beams, X-rays, and the like on the formed coating film according to a previously prepared pattern, and developing with a developer to remove unnecessary portions.

The developer is preferably an aqueous alkali solution, specifically, inorganic alkalis such as sodium hydroxide, potassium hydroxide and sodium carbonate; Primary amines such as ethylamine and n-propylamine; Secondary amines such as diethylamine and n-propylamine; Tertiary amines such as trimethylamine, methyldiethylamine, dimethylethylamine and triethylamine; Alcohol amines such as dimethylethanolamine, methyl diethanolamine and triethanolamine; Or an aqueous solution of a quaternary ammonium salt such as tetramethylammonium hydroxide or tetraethylammonium hydroxide can be used. In this case, the developer is used by dissolving the alkaline compound at a concentration of 0.1 to 10% by weight, and may be added an appropriate amount of a water-soluble organic solvent and a surfactant such as methanol, ethanol and the like.

In addition, after developing with the developer as described above, it is washed with ultrapure water for 30 to 90 seconds to remove unnecessary parts and dried to form a pattern, and after irradiating the formed pattern with light such as ultraviolet rays, the pattern is applied to a heating apparatus such as an oven. By heating at a temperature of 150 to 250 ℃ for 30 to 90 minutes to obtain a final pattern.

The photosensitive resin composition according to the present invention has excellent performances such as flatness, resolution, heat resistance, and transmittance after development, and in particular, it is possible to increase productivity by shortening the process time by enabling a highly sensitive organic insulating film, and at the same time, softening the film. This can increase the impact resistance.

Hereinafter, preferred examples are provided to help understanding of the present invention, but the following examples are merely to illustrate the present invention, and the scope of the present invention is not limited to the following examples.

EXAMPLE

Example 1

(Acrylic copolymer production)

10 parts by weight of 2,2'-azobis (2,4-dimethylvaleronitrile), 400 parts by weight of tetrahydroxyfuran, 30 parts by weight of methacrylic acid, glycidyl methacryl in a flask equipped with a cooling tube and a stirrer. 45 parts by weight of raret and 25 parts by weight of styrene were added thereto, and the mixture was nitrogen-substituted and gently stirred. The reaction solution was heated to 62 ° C. and subjected to radical reaction while maintaining this temperature for 10 hours to prepare a polymer solution.

In order to remove the unreacted monomer of the polymer solution, 10 parts by weight of the polymer solution was precipitated with respect to 100 parts by weight of n-Hexane. After precipitation, the Poor solvent in which unreacted material was dissolved was removed through a filtering process using a mesh. Thereafter, in order to remove the solvents containing the unreacted monomer remaining after the filtering process, the acrylic copolymer was completely removed by vacuum drying at 30 ° C. or lower.

The weight average molecular weight of the acrylic copolymer was 10,000. At this time, the weight average molecular weight is the polystyrene reduced average molecular weight measured using GPC.

(1,2-quinonediazide compound preparation)

1 mole of 4,4 '-[1- [4- [1- [4-hydroxyphenyl] -1-methylethyl] phenyl] ethylidene] bisphenol and 1,2-naphthoquinonediazide-5-sulfonic acid [ Chloride] condensation reaction of 2 moles to give 4,4 '-[1- [4- [1- [4-hydroxyphenyl] -1-methylethyl] phenyl] ethylidene] bisphenol 1,2-naphthoquinonediazide -5-sulfonic acid ester was prepared.

(Photosensitive resin composition production)

15% by weight of the acrylic copolymer prepared above, 4,4 '-[1- [4- [1- [4-hydroxyphenyl] -1-methylethyl] phenyl] ethylidene] bisphenol 1,2-naphthoquinone 4 wt% of diazide-5-sulfonic acid ester, and 3 wt% of dioctylphthalate were mixed. The mixture was dissolved in diethylene glycol dimethyl ether so that the solid content of the mixture was 20% by weight, and then filtered through a 0.2 μm millipore filter to prepare a photosensitive resin composition.

Example 2

Except for using dioctyl adipate in place of dioctylphthalate when preparing the photosensitive resin composition in Example 1 was prepared in the same manner as in Example 1 to prepare a photosensitive resin composition.

Example 3

Except for using tricresyl phosphate in place of dioctyl phthalate when preparing the photosensitive resin composition in Example 1 was carried out in the same manner as in Example 1 to prepare a photosensitive resin composition.

Example 4

Photosensitive resins were prepared in the same manner as in Example 1, except that 2,2,4-trimethyl-1,3-pentanediol monoisobutyrate was used instead of dioctylphthalate in preparing the photosensitive resin composition in Example 1. A resin composition was prepared.

Comparative Example 1

A photosensitive resin composition was prepared in the same manner as in Example 1, except that dioctylphthalate was not used when preparing the photosensitive resin composition in Example 1.

Comparative Example 2

A photosensitive resin composition was prepared in the same manner as in Example 1, except that 15 wt% of dioctylphthalate was used to prepare the photosensitive resin composition in Example 1.

The physical properties of the photosensitive resin compositions of Examples 1 to 4 and Comparative Examples 1 and 2 were measured as shown in Table 1 below.

After applying the photosensitive resin composition prepared in Examples 1 to 4 and Comparative Examples 1 and 2 using a spin coater on a glass substrate, and prebaked on a hot plate for 2 minutes at 90 ℃ to a thickness of 3.0 ㎛ Phosphorus film was formed.

A) Flatness after development-Elipsometer was used to measure the uniformity after development of the film formed as above. At this time, (circle) and 90-95% of the cases where flatness exceeded 95% on the whole board | substrate basis, (triangle | delta) and the case of less than 90% were represented by x.

B) Sensitivity-Using a pattern mask on the film formed in (a) above, apply UV radiation with 20 ㎽ / ㎠ in intensity at 435nm to 10㎛ Line & Space 1: 1 CD Dose. After irradiation, the solution was developed at 23 DEG C for 1 minute in an aqueous solution of 2.38 wt% tetramethyl ammonium hydroxide, and then washed with ultrapure water for 1 minute.

Then, the developed pattern was irradiated with 500 mJ / cm 2 of ultraviolet light having an intensity of 20 mA / cm 2 at 435 nm, and cured at 230 ° C. for 60 minutes in an oven to obtain a pattern film.

C) Resolution-Measured with the minimum size of the pattern film formed during the measurement of the sensitivity of the b).

D) Heat resistance-The widths of the upper, lower, left and right sides of the pattern film formed during the measurement of the sensitivity of the above b) were measured. At this time, the case where the change rate of each angle was 0 to 20% based on the pre-midbak, and the case where 20 to 40% exceeded (triangle | delta) and the case exceeding 40% were represented by x.

E) Transmittance-Evaluation of the transmittance was measured by using a spectrophotometer, the transmittance of 400 nm of the pattern film.

division Flatness after development Sensitivity (mJ / ㎠) Resolution (μm) Heat resistance Transmittance Example 1 ○ 240 3 ○ 90 Example 2 ○ 240 3 ○ 90 Example 3 ○ 240 3 ○ 90 Example 4 ○ 220 3 ○ 90 Comparative Example 1 ○ 300 3 ○ 90 Comparative Example 2 ○ 240 3 × 90

Through Table 1, the photosensitive resin composition prepared in Examples 1 to 4 according to the present invention was excellent in flatness, resolution, heat resistance, and transmittance after development, and the sensitivity was superior to that of Comparative Example 1, thereby shortening the process time. Through it was confirmed that the productivity can be increased, particularly in Example 4 was confirmed that the sensitivity is very excellent. In addition, in the case of Comparative Example 2 in which too many sensitivity enhancers were used, the sensitivity was excellent, but it was found that it was difficult to be applied to the organic insulating film because of poor heat resistance.

The photosensitive resin composition according to the present invention has excellent performances such as flatness, resolution, heat resistance, and transmittance after development, and in particular, it is possible to increase productivity by shortening the process time by enabling a highly sensitive organic insulating film, and at the same time, softening the film. This can increase the impact resistance.

Claims (10)

In the photosensitive resin composition, Compounds selected from the group consisting of dioctyl phthalate, diisononyl phthalate, dioctyl adipate, tricresyl phosphate, and 2,2,4-trimethyl-1,3-pentanediol monoisobutyrate as sensitivity enhancers Photosensitive resin composition comprising 0.1 to 10% by weight. The method of claim 1, The sensitivity enhancer is 2,2,4-trimethyl-1,3-pentanediol monoisobutyrate. Photosensitive resin composition, characterized in that. The method of claim 1, The photosensitive resin composition a) 10 to 40% by weight of the acrylic copolymer; b) 1 to 20% by weight of 1,2-quinonediazide 5-sulfonic acid ester compound; c) a sensitivity enhancer selected from the group consisting of dioctylphthalate, diisononylphthalate, dioctyl adipate, tricresyl phosphate, and 2,2,4-trimethyl-1,3-pentanediol monoisobutyrate 0.1 to 10 weight percent; And d) residual solvent Photosensitive resin composition comprising a. The method of claim 1, The acrylic copolymer V) 15 to 45 parts by weight of unsaturated carboxylic acid or anhydride thereof; Ii) 15 to 45 parts by weight of an epoxy group-containing unsaturated compound; And V) 25 to 70 parts by weight of olefinically unsaturated compound Purifying the acrylic copolymer obtained by copolymerizing, the weight average molecular weight of polystyrene conversion is 5000-20000, The photosensitive resin composition characterized by the above-mentioned. The method of claim 1, 2,3,4-trihydroxybenzophenone, 2,4,6-trihydroxybenzophenone, 2, as the phenolic compound which forms the parent compound in the 1,2-quinonediazide 5-sulfonic acid ester compound of b) 2'-tetrahydroxybenzophenone, 4,4'-tetrahydroxybenzophenone, 2,3,4,3'-tetrahydroxybenzophenone, 2,3,4,4'-tetrahydroxybenzophenone, 2,3,4,2'-tetrahydroxy 4'-methylbenzophenone, 2,3,4,4'-tetrahydroxy 3'-methoxybenzophenone, 2,3,4,2'-pentahydrate Oxybenzophenone, 2,3,4,6'-pentahydroxybenzophenone, 2,4,6,3'-hexahydroxybenzophenone, 2,4,6,4'-hexahydroxybenzophenone, 2 , 4,6,5'-hexahydroxybenzophenone, 3,4,5,3'-hexahydroxybenzophenone, 3,4,5,4'-hexahydroxybenzophenone, 3,4,5, 5'-hexahydroxybenzophenone, bis (2,4-dihydroxyphenyl) methane, bis (p-hydroxyphenyl) methane, tri (p-hydroxy phenyl) methane, 1,1,1-tri ( p-hydroxyphenyl) ethane, bis (2,3,4-trihydroxype ) Methane, 2,2-bis (2,3,4-trihydroxyphenyl) propane, 1,1,3-tris (2,5-dimethyl 4-hydroxyphenyl) -3-phenylpropane, 4,4 '-[1- [4- [1- [4-hydroxyphenyl] -1-methylethyl] phenyl] ethylidene] bisphenol, and bis (2,5-dimethyl 4-hydroxyphenyl) -2-hydroxy Photosensitive resin composition, characterized in that at least one selected from the group consisting of oxyphenylmethane. The method of claim 1, Alcohols such as methanol, ethanol, benzyl alcohol and hexyl alcohol as the solvent of d); Ethylene glycol alkyl ether acetates such as ethylene glycol methyl ether acetate and ethylene glycol ethyl ether acetate; Ethylene glycol monoalkyl ethers such as ethylene glycol alkyl ether propionate such as ethylene glycol methyl ether propionate and ethylene glycol ethyl ether propionate, ethylene glycol methyl ether and ethylene glycol ethyl ether; Diethylene glycol alkyl ethers such as diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol dimethyl ether, diethylene glycol methyl ethyl ether; Propylene glycol alkyl ether acetates such as propylene glycol methyl ether acetate, propylene glycol ethyl ether acetate, and propylene glycol propyl ether acetate; Propylene glycol alkyl ether propionates such as propylene glycol methyl ether propionate, propylene glycol ethyl ether propionate and propylene glycol propyl ether propionate; Propylene glycol monoalkyl ethers such as propylene glycol methyl ether, propylene glycol ethyl ether, propylene glycol propyl ether, and propylene glycol butyl ether; Butylene glycol monomethyl ethers such as dipropylene glycol alkyl ethers such as dipropylene glycol dimethyl ether and diporopropylene glycol diethyl ether, butylene glycol monomethyl ether and butylene glycol monoethyl ether; At least 1 type is selected from the group which consists of dibutylene glycol alkyl ethers, such as dibutylene glycol dimethyl ether and dibutylene glycol diethyl ether, The photosensitive resin composition characterized by the above-mentioned. The method of claim 1, The photosensitive resin composition is at least one member selected from the group consisting of e) 0.1 to 30 parts by weight of epoxy resin, f) 0.1 to 20 parts by weight of adhesive, g) 0.1 to 30 parts by weight of acrylic compound, and h) 0.0001 to 2 parts by weight of surfactant. The photosensitive resin composition, characterized in that it further comprises an additive selected. The method of claim 1, The photosensitive resin composition is for forming an organic insulating film of a display. Display pattern formation method using the photosensitive resin of any one of Claims 1-8. A display comprising the cured product of the photosensitive resin according to any one of claims 1 to 8 as an organic insulating film.