KR20080103790A - Probe unit and probe card having the same - Google Patents

Abstract

A probe unit and a probe card having the same are provided to connect the probe tip by fixing the probe tip by the jig. A probe unit includes the tip connected with the test material; the probe tip having the extension part extended from the tip; the jig accommodating the extension part of the probe tip while performing the electrical inspection of the test sieve of the test material. The jip comprises the first jig(10) including the first receptor(15) which accommodates one side of the extension part when accommodating the extension part of the probe tip; the second jig(20) including the second receptor(25) accommodating the other side of the extension part.

Description

PROBE UNIT AND PROBE CARD HAVING THE SAME

1 is a schematic perspective view illustrating a jig of a probe unit according to an exemplary embodiment of the present invention.

2A and 2B are schematic views showing a member for machining a jig of the probe unit of FIG. 1.

3A and 3B are schematic views illustrating a state in which a jig of the probe unit of FIG. 1 is processed.

4 is a schematic perspective view illustrating a probe tip of the probe unit of FIG. 4.

5A-5C are schematic cross-sectional views illustrating the methods for obtaining the probe unit of FIG. 1.

6 is a schematic perspective view of a probe unit according to an exemplary embodiment of the present invention.

The present invention relates to a probe unit and a probe card including the same, and more particularly, to a probe unit and a probe card including the same for use in electrical inspection of an object under test.

In general, an inspection process in a semiconductor manufacturing process is a process of checking whether a normal or abnormal state is generated according to a response electric signal corresponding to an applied electric signal by applying an electrical signal by contacting an electrical contact such as a probe card. . Individual semiconductor elements or liquid crystal display panels may be formed on the wafer.

Recently, due to the high integration of semiconductor devices, the pitch spacing implemented on the substrate has become extremely small. To solve this problem, a micro electro mechanical system (MEMS) process similar to semiconductor etching technology is used to form a probe card. Attempts have been made to produce probe cards.

In the method of forming a probe card by the MEMS process, a bump is formed at a predetermined height on an upper portion of a wiring portion that transmits an electrical signal from a spacer transformer, and then a probe body formed to have a probe tip is attached to the bump through a junction. Is done.

However, the conventional probe card by the MEMS process has a problem in the coupling between the spacer transformer and the probe tip for semiconductor inspection. In the structure where the probe tip is simply coupled on the bump, the coupling between the spacer transformer and the probe tip is not very close to obtain electrical reliability, and the gap between the probe tips is maintained even when the probe tips are densely integrated. In the simple bump and probe tip coupling structure, it is difficult to secure the reliability of the gap between the probe tips.

In order to solve the above technical problem, the present invention is to provide a probe unit that allows the probe tip to be closely bonded by fixing the probe tip by a jig.

Another object of the present invention is to provide a probe card including the probe unit.

Probe unit according to an embodiment of the present invention for achieving the above object includes a probe tip and a jig. The probe tip includes a tip in contact with the subject and an extension extending from the tip when performing an electrical test of the subject. The jig includes an extension extending from the tip.

The jig may include a first jig and a second jig. The first jig may include a first accommodation part accommodating one side of the extension part when accommodating the extension part of the probe tip. The second jig may include a second accommodation part accommodating the other side of the extension part.

The first jig may include a first coupling part at both ends of the first jig, and the second jig may include a second coupling part coupled to the first coupling part at both ends of the second jig. The first jig and the second jig may be fixed by combining the first coupling part and the second coupling part.

An extension of the probe tip may have a taper shape in which a cross section is widened toward the lower portion.

The probe tip may be formed in a two-dimensional structure having a predetermined thickness by a micro electro mechanical system (MEMS) process.

A probe card according to another embodiment of the present invention includes a substrate, a probe tip, and a jig including wires capable of transmitting an electrical signal. The probe tip is electrically connected to the substrate and includes a tip contacting the object under test and an extension extending from the tip when performing an electrical test of the object under test. The jig receives an extension of the probe tip.

The jig may include a first jig and a second jig. The first jig may include a first accommodation part accommodating one side of the extension part when accommodating the extension part of the probe tip. The second jig may include a second accommodation part accommodating the other side of the extension part.

The first jig of the probe card includes a first coupling portion at both ends of the first jig, and the second jig includes a second coupling portion coupled to the first coupling portion at both ends of the second jig. can do. The first jig and the second jig may be fixed by combining the first coupling part and the second coupling part.

An extension of the probe tip of the probe card may have a taper shape in which a cross section is widened toward the lower portion.

Therefore, when fixing the probe tip by using a jig on the sacrificial substrate, the adhesion of the probe tip is improved. In addition, since the probe tip is formed in a two-dimensional structure, electrical connection is facilitated, and the yield of the probe tip is improved. In addition, the two-dimensional probe tip structure simplifies the manufacturing process and can be easily applied to large area probe cards.

DETAILED DESCRIPTION Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention.

Hereinafter, a method of manufacturing a probe unit according to an exemplary embodiment of the present invention will be described in detail with reference to the accompanying drawings.

1 is a schematic perspective view illustrating a jig of a probe unit according to an exemplary embodiment of the present invention.

Referring to FIG. 1, a jig of a probe unit according to an embodiment of the present invention includes a first jig 10 and a second jig 20. The first jig 10 and the second jig 15 are formed to be symmetrical with each other.

The first jig 10 includes a first accommodating part 15, and the second jig 20 includes a second accommodating part 25. A plurality of first grooves are formed in the first accommodating part 15, and a plurality of second grooves are formed in the second accommodating part 25.

The first groove and the second groove are formed at corresponding positions facing each other. A probe tip (not shown) to be described later is positioned between the first groove and the second groove. The first and second grooves prevent the probe tip (not shown) from moving back and forth.

In a coupling structure of a conventional probe tip, a bumper is formed on a substrate, and a probe tip is coupled to the bumper. In the present invention, since the first jig 10 and the second jig 20 fix the probe tip (not shown), the coupling and fixability of the probe tip is improved.

In addition, the first jig 10 may include first coupling parts at both ends of the first jig 10. In addition, the second jig 20 may include a second coupling part coupled to the first coupling part at both ends of the second jig. The first jig and the second jig may be fixed by combining the first coupling part and the second coupling part.

In the present embodiment, the first coupling portion and the second coupling portion are formed at both ends of each of the first jig and the second jig, but as long as the first jig and the second jig can be fixed, the first The first coupling part and the second coupling part may be formed on any part of the first jig and the second jig.

2A and 2B are schematic views showing a member for machining a jig of the probe unit of FIG. 1.

2A and 2B, as shown in FIGS. 2A and 2B, the first jig 110 and the second jig 120 extending in the longitudinal direction are prepared. The first jig 110 and the second jig 120 are manufactured in a symmetrical form with each other. Fixing steps 111 and 121 are formed at lower ends of the first jig 110 and the second jig 120. The fixing steps 111 and 121 are used to fix the probe tip to be described later in the vertical direction.

The first jig 110 and the second jig 120 is formed in a structure that is wider from the bottom to the top. Compared to the fixing steps 111 and 121 for fixing the first jig 110 and the second jig 120, the upper part 113 of the first jig 110 and the upper part 123 of the second jig 120 are formed. It is formed by protruding.

Preferably, the inclination of the side surfaces of the first jig 110 and the second jig 120 may be formed as the inclination of the lower portion (not shown) of the probe tip which will be described later. When the side slopes of the first jig 110 and the second jig 120 are equal to the bottom slope of the probe tip, the bottom of the probe tip may be even to select the first jig 110 and the second jig 120. You will encounter

Therefore, even if the probe tip is located at any position of the first jig 110 and the second jig 120, the probe tip receives a uniform force, thereby improving the supporting force of the probe tip itself.

3A and 3B are schematic views illustrating a state in which a jig of the probe unit of FIG. 1 is processed.

3A and 3B, the first jig 210 and the second jig 220 include fixing grooves 215 and 225. The fixing grooves 215 and 225 are formed in the first jig 110 and the second jig 120 of FIGS. 2A and 2B. The fixing grooves 215 and 225 are formed using general microfabrication techniques.

The fixing grooves 215 and 235 are formed in the upper portion 213 of the first jig 210 and the upper portion 223 of the second jig 220. The fixing groove 215 of the first jig 210 and the fixing groove 225 of the second jig 220 are formed at positions corresponding to each other. The side of the probe tip to be described later is inserted into the fixing groove 215 of the first jig 210 and the fixing groove 225 of the second jig 220.

Therefore, the fixing grooves 215 and 225 are formed where the probe tip is to be located. In addition, it is formed to be substantially similar to the thickness of the probe tip, and fixed so that there is no forward and backward movement of the probe tip. In addition, the depth from the side of the fixing grooves (215, 225) so as not to reach the fixing step (211, 221). When the depth from the sides of the fixing grooves 215 and 225 is deeper than the fixing steps 221 and 221, the probe tip may not be supported.

4 is a schematic perspective view illustrating a probe tip of the probe unit of FIG. 4.

Referring to FIG. 4, the probe tip 400 includes a lower portion 410, an upper portion 430, and a contact portion 450. The lower portion 410 of the probe tip 400 is coupled to the fixing step of the first jig and the second jig. For the coupling, the lower portion 410 of the probe tip 400 is formed in a taper structure that narrows toward the upper portion. Since the taper structure is formed, when the first jig and the second jig are coupled to each other, the probe tip 400 receives a force in close contact with the vertical direction. Therefore, the bondability of the probe tip 400 is further enhanced.

The upper portion 410 of the probe tip 400 is composed of two arms. The upper portion 410 of the probe tip 400 includes a first arm 431 and a second arm 433. The first arm 431 is formed in a 'b' shape, and the second arm 433 includes at least one bent surface. The first arm 431 and the second arm 433 respectively extend from both ends of the lower portion 410 to meet at the contact portion 450. The second arm 433 serves to provide an elastic force when the external pressure is applied to the probe tip 400 in a vertical direction, and to cushion the external force.

The contact tip 455 is formed at the contact portion 450 of the probe tip 400. The contact tip 455 substantially contacts the semiconductor terminal to be inspected. The contact tip 455 is manufactured to have a sharp end, so that the contact tip 455 can be easily contacted with the electrode pad through the oxide film formed on the electrode pad of the semiconductor device.

The probe tip 400 may be formed in a plate structure. When the probe tip 400 is manufactured in a two-dimensional plate structure, a predetermined distance is secured between one probe tip and the next probe tip. Therefore, when the semiconductor terminal is integrated at a high density, the probe tip 400 may be easily disposed. The probe tip 400 is to be manufactured in a separate process. The probe tip 400 may be manufactured by a MEMS process.

5A-5C are schematic cross-sectional views illustrating the methods for obtaining the probe unit of FIG. 1.

5A to 5C, first, the first jig 510 processed in a desired shape is fixed to the sacrificial substrate 540. Thereafter, a plurality of probe tips 530 are mounted in the fixing groove (not shown) of the first jig 510.

When the plurality of probe tips 530 are fixed to the fixing groove (not shown) of the first jig 510 and a predetermined step (not shown), the second jig 520 may be connected to the plurality of probe tips (not shown). In close contact with the 530, the sacrificial substrate 540 is fixed.

The probe tip 530 has a tapered structure in which a lower portion thereof is widened downward. In addition, the first jig 510 and the second jig 520 are formed in a tapered structure narrowing toward the upper side. Therefore, when the probe tip 530 is mounted to the first jig 510 and the second jig 520, and the first jig 510 and the second jig 520 apply a force in a direction facing each other. At the probe tip 530 is forced downward. Therefore, the probe tip 530 is more firmly coupled to the first jig 510, the second jig 520, and the sacrificial substrate 540.

The probe tip 530 may be fixed between the first jig 510 and the second jig 520 by another method. The first jig 510 and the second jig 520 are first fixed to the sacrificial substrate 540. The first jig 510 and the second jig 520 are fixed at positions corresponding to each other, and the probe tips 530 are spaced apart from each other by an accessible distance. A plurality of probe tips 510 may be inserted along the fixing grooves (not shown) of the first jig 510 and the second jig 520 corresponding to each other. After the plurality of probe tips 510 are sandwiched between the first jig 510 and the second jig 520, the second jig 520 is in close contact with the first jig 510.

In this case, in order to arrange the first jig 510 and the second jig 520, guide lines may be formed on the sacrificial substrate 540. Steps may be formed to coincide with both ends of the first jig 510 and the second jig 520 to be used as guide lines. In addition, the guide line may guide the second jig 520 to be in close contact with the first jig 510 after the probe tip 510 is fitted in the correct direction.

6 is a schematic perspective view of a probe unit according to an exemplary embodiment of the present invention.

Referring to FIG. 6, a plurality of probe tips 630 disposed between the first jig 610 and the second jig 620 are formed on the sacrificial substrate 640. As shown in FIG. 6, after the plurality of probe tips 630 are disposed between the first jig 610 and the second jig 620, the height of the probe tips 630 using a leveling bolt (not shown). Can be adjusted. The overall flatness can be adjusted by adjusting the height of each probe tip 630.

Although the preferred embodiments of the present invention have been described in detail above, the scope of the present invention is not limited thereto, and various modifications and improvements of those skilled in the art using the basic concepts of the present invention defined in the following claims are also provided. It belongs to the scope of rights.

Therefore, according to the present invention, when the probe tip is fixed by using a jig on the sacrificial substrate, the bondability of the probe tip is improved, and even in the fine pitch, the bonding of the probe tip is firmer and harder than the conventional surface contact structure. can do.

In addition, the probe tip is formed in a two-dimensional structure, thereby widening the contact area, and facilitates electrical connection. The two-dimensional probe tip improves the yield of the probe tip and simplifies the manufacturing process, thereby reducing the manufacturing cost and easily applying the large-area probe card.

Claims (8)

A probe tip having a tip in contact with the subject and an extension extending from the tip when performing an electrical inspection of the subject under test; And And a jig for receiving an extension of the probe tip. The method of claim 1, wherein the jig, A first jig including a first receptacle for receiving one side of the extension when receiving the extension of the probe tip; And And a second jig including a second accommodating part accommodating the other side of the extension part. According to claim 2, wherein each of the first jig and the second jig is formed with a first coupling portion and a second coupling portion for coupling and fixing the first jig and the second jig, the first coupling portion and the second coupling portion Probe unit is fixed to the first jig and the second jig by coupling. The probe unit of claim 1, wherein an extension of the probe tip has a taper shape in which a cross section is widened toward a lower portion thereof. A substrate including wires capable of transmitting electrical signals; A probe tip electrically connected to the substrate, the probe tip having a tip contacting the object under test and an extension extending from the tip when performing an electrical test of the object under test; And And a jig for receiving an extension of the probe tip. The method of claim 5, wherein the jig, A first jig including a first receptacle for receiving one side of the extension when receiving the extension of the probe tip; And And a second jig including a second accommodating part accommodating the other side of the extension part. The method of claim 6, wherein each of the first jig and the second jig is formed with a first coupling portion and a second coupling portion for coupling and fixing the first jig and the second jig, the first coupling portion and the second coupling portion Probe card, characterized in that for coupling and fixing the first jig and the second jig. The probe card of claim 5, wherein the extension portion of the probe tip has a taper shape in which a cross section is widened toward a lower portion thereof.

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