KR20080100594A - Apparatus of adjusting position of electric inspection apparatus contactor - Google Patents
Apparatus of adjusting position of electric inspection apparatus contactor Download PDFInfo
- Publication number
- KR20080100594A KR20080100594A KR1020070046481A KR20070046481A KR20080100594A KR 20080100594 A KR20080100594 A KR 20080100594A KR 1020070046481 A KR1020070046481 A KR 1020070046481A KR 20070046481 A KR20070046481 A KR 20070046481A KR 20080100594 A KR20080100594 A KR 20080100594A
- Authority
- KR
- South Korea
- Prior art keywords
- coordinate data
- contact
- camera
- processing unit
- contact portions
- Prior art date
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
Abstract
Description
1 is a schematic configuration diagram showing a position correcting device of a contact portion for an electrical inspection device according to Embodiment 1 of the present invention.
FIG. 2 is a schematic diagram illustrating an example of a method of using the position correction device of the contact portion for the electrical inspection device of FIG. 1.
3 is a schematic configuration diagram showing a position correcting device of a contact portion for an electrical inspection device according to Embodiment 2 of the present invention.
<Explanation of symbols for the main parts of the drawings>
10: arithmetic processing unit 12: camera
14
30: control signal processor 32: position adjustment unit
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a position correcting device for a contact portion for an electrical inspection device, and more particularly, to a position correcting device for a contact portion for an electrical inspection device, such as a needle, included in a probe card.
In general, the electrical inspection apparatus, which may be collectively referred to as a probe card, includes mainly a contact portion that directly contacts an object to be inspected, such as a semiconductor substrate on which a circuit pattern is formed, a substrate connected to the aforementioned contact portion, and the like. Here, the contact portion may be variously classified according to its shape, but mainly includes a needle capable of probing in the inspection region of the inspected object, and the substrate includes a printed circuit board (PCB) having wiring therein. do.
An example of a probe card including the printed circuit board and the needle mentioned is disclosed in Korean Patent Application No. 2005-22742.
In the manufacture of a probe card, which is an electrical inspection device including a needle and a printed circuit board, the needle is mainly fixed to the printed circuit board, and then the position of the needle is corrected. That is, the position of the needle is adjusted through correction so that the needle can be accurately positioned in the inspection region of the subject.
In the aforementioned position correction of the needle, a film mask, a glass mask, a microscope, and the like are mainly used. Here, the film mask, the glass mask, or the like is an auxiliary member in which the coordinates of the needles are marked so as to be accurately positioned in the inspection region of the inspected object. In addition, the microscope is a member that helps the operator visually confirm the position and correction of the needle. Thus, after the film mask or glass mask is interposed between the probe card having the needle and the microscope, the position correction of the needle is achieved by directly moving the position of the needle to the coordinates indicated on the film mask or the glass mask.
However, in the position correction of the needle mentioned above, since a separate member such as a film mask or a glass mask is used, the cost of manufacturing the separate member increases. In addition, since a film mask or a glass mask is interposed between the probe card and the microscope, and it must be up / down, there is a problem that productivity is lowered due to a separate operation. In addition, since a work for correcting the position of the needle must be performed in a state where a film mask or a glass mask is interposed between the probe card and the microscope, it is not easy to secure a working space.
An object of the present invention is to provide an apparatus that can easily correct the position of a contact portion for an electrical inspection device without using a film mask, a glass mask, or the like.
In order to achieve the above object, a position correcting device for an electrical test apparatus according to an exemplary embodiment of the present invention coordinates a position of each test region of an inspected object in which an electrical test is performed by contacting each of the contact parts capable of electrical input / output. An arithmetic processing unit for generating data, a camera for enlarging photographing the contact parts, and a display unit for visually identifying coordinate data of the arithmetic processing unit and an image of the contact parts photographed with the camera. Include. Accordingly, the coordinate data displayed on the display unit and the position of each of the contact portions are compared to match the position of each of the contact portions that do not coincide with the coordinate data.
Here, matching the position of each of the contact portions that do not coincide with the coordinate data with the coordinate data is accomplished by hand.
According to another embodiment of the present invention, an apparatus for correcting a position of a contact portion for an electrical inspection device may coordinate positions of inspection regions of an object under test by contact with each of the contacts that are capable of electrical input and output. An arithmetic processing unit for generating data, a camera for zooming-in photographing the contact portions, and a position of each of the coordinate data and the contact portions obtained as an image by the camera, and comparing the result of the control signal And a control signal processor for generating a control signal, and finely adjusting the position of each of the contact parts so that the position of each of the contact parts that do not coincide with the coordinate data matches the coordinate data. It includes a fine position adjusting portion.
According to the embodiments of the present invention mentioned above, it is preferable that the calculation processing unit generates the coordinate data in an Excel file, and the camera can adjust magnification of several to several hundred times.
In addition, it is preferable to further include a stage that is positioned above the electrical inspection device, and movable in the X-axis, Y-axis and Z-axis.
Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. As the inventive concept allows for various changes and numerous embodiments, particular embodiments will be illustrated in the drawings and described in detail in the text. However, this is not intended to limit the present invention to the specific disclosed form, it should be understood to include all modifications, equivalents, and substitutes included in the spirit and scope of the present invention. In describing the drawings, similar reference numerals are used for similar components. In the accompanying drawings, the dimensions of the structures are shown in an enlarged scale than actual for clarity of the invention.
Terms such as first and second may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as the second component, and similarly, the second component may also be referred to as the first component.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this application, the terms "comprise" or "having" are intended to indicate that there is a feature, number, step, action, component, part, or combination thereof described in the specification, and that one or more other features It should be understood that it does not exclude in advance the possibility of the presence or addition of numbers, steps, actions, components, parts or combinations thereof.
Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art. Terms such as those defined in the commonly used dictionaries should be construed as having meanings consistent with the meanings in the context of the related art and shall not be construed in ideal or excessively formal meanings unless expressly defined in this application. Do not.
Example 1
1 is a schematic configuration diagram showing a position correcting device of a contact portion for an electrical inspection device according to Embodiment 1 of the present invention.
First, the inspected object subjected to the electrical inspection by the contact portion for the electrical inspection device mainly includes a semiconductor memory element, a high density integrated circuit element, etc. as a semiconductor element, and may also include a display element or the like. Therefore, it is preferable that the inspection regions of the inspected object include pads through which input and output of an electrical signal of the semiconductor element are performed when the inspected object is a semiconductor element. Therefore, as an example of the coordinate data referred to in the present invention, it can be understood that the position of each of the pads of the semiconductor element, which is the inspection regions of the object under test, is represented.
In addition, an example of a contact portion for an electrical test apparatus for performing the electrical test of the test target may include a needle capable of probing to each of the pads of the semiconductor device. As such, an example of the electrical inspection apparatus mentioned as the contact part includes a needle may include a probe card including a printed circuit board. Therefore, it can be understood that the electrical inspection apparatus of the present invention includes a probe card, and the contact portion includes a needle. At this time, the electrical test apparatus of the present invention is in a state where the needle is soldered to the probe card. Therefore, the position correction of the contact portion for the electrical inspection device of the present invention corresponds to the subsequent process after the manufacture of the probe card.
As described above, the electrical inspection object using the electrical inspection device of the present invention mainly includes a semiconductor element and the like, and the electrical inspection device includes a probe card and the like.
Therefore, referring to FIG. 1, the
Specifically, the
The coordinate data generated by the
As described above, in the present invention, when the type of the inspected object is selected, the position of each of the inspected regions of the inspected object is generated as coordinate data by using the
The
In addition, the
In addition, the
In addition, the mentioned coordinate data can be displayed in various shapes. For example, it can be displayed in a circle, square, bar, or the like.
In addition, the
In addition, the movement of the
Thus, the position of the contact portion for the electrical inspection apparatus using the
As a result of the positional comparison of each of the aforementioned coordinate data and the contacts, the position of each of the contacts that do not coincide with the coordinate data is matched with the coordinate data. That is, as shown in FIG. 2, when the
Also, as mentioned, the
As mentioned, when using the
Therefore, application of the
Example 2
3 is a schematic configuration diagram showing a position correcting device of a contact portion for an electrical inspection device according to Embodiment 2 of the present invention.
Referring to FIG. 3, the
Accordingly, the control
The
Therefore, in the present invention, by including the control
In addition, in the present invention, the display of the coordinate data and the position of each of the contact parts may be omitted. This is because the
However, in the present invention, it is preferable to display the coordinate data and the positions of each of the contact portions overlapping each other on the
Therefore, in the case of the second embodiment of the present invention, similarly to the first embodiment of the present invention, the film mask, the glass mask, or the like can be omitted. In addition, in the second embodiment of the present invention, fine adjustment of the position of the contact portion for automatically correcting the position of the contact portion can be performed automatically, so that a process error due to manual labor and the like can be sufficiently reduced, and productivity improvement is also expected. Can be.
Therefore, according to this invention, the position correction of the contact part for electrical inspection devices can be easily performed, without using a film mask, a glass mask, etc. Therefore, when performing the position correction of the contact portion of the electrical inspection apparatus using the position correction apparatus of the present invention, it is possible to achieve cost reduction, productivity improvement, ease of operation, and the like.
While the above has been described with reference to preferred embodiments of the present invention, those skilled in the art can variously modify and change the present invention without departing from the spirit and scope of the present invention as set forth in the claims below. It will be appreciated.
Claims (12)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020070046481A KR20080100594A (en) | 2007-05-14 | 2007-05-14 | Apparatus of adjusting position of electric inspection apparatus contactor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020070046481A KR20080100594A (en) | 2007-05-14 | 2007-05-14 | Apparatus of adjusting position of electric inspection apparatus contactor |
Publications (1)
Publication Number | Publication Date |
---|---|
KR20080100594A true KR20080100594A (en) | 2008-11-19 |
Family
ID=40287046
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020070046481A KR20080100594A (en) | 2007-05-14 | 2007-05-14 | Apparatus of adjusting position of electric inspection apparatus contactor |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR20080100594A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101064553B1 (en) * | 2009-12-23 | 2011-09-14 | 양 전자시스템 주식회사 | Probe driving apparatus capable of automatically compensating location of probe pin |
-
2007
- 2007-05-14 KR KR1020070046481A patent/KR20080100594A/en not_active Application Discontinuation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101064553B1 (en) * | 2009-12-23 | 2011-09-14 | 양 전자시스템 주식회사 | Probe driving apparatus capable of automatically compensating location of probe pin |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4908138B2 (en) | Probe inspection device | |
KR100959703B1 (en) | Probe apparatus, probing method and stroage medium | |
JP2006339196A (en) | Method of computing/calibrating movement quantity of prober, program of computing/calibrating movement quantity and prober | |
JP2010245508A (en) | Wafer alignment device and wafer alignment method | |
KR20130109873A (en) | Method for inspecting and generating job data of pcb inspection system | |
JPWO2016117016A1 (en) | Inspection support device | |
JP2013205234A (en) | Defect detection apparatus | |
TWI542870B (en) | Contact type circuit pattern inspection apparatus and inspection method thereof | |
JP4652699B2 (en) | Substrate inspection device, position adjustment method | |
EP3330663B1 (en) | Substrate inspection apparatus and method | |
JP5875811B2 (en) | Substrate inspection apparatus and correction information acquisition method | |
JP5096852B2 (en) | Line width measuring apparatus and inspection method of line width measuring apparatus | |
JP2022068593A (en) | Specification method of substrate support area and device | |
KR20080100594A (en) | Apparatus of adjusting position of electric inspection apparatus contactor | |
JP2000346896A (en) | Board inspecting device | |
JP3509040B2 (en) | Probe movement control method in circuit board inspection device | |
CN111386469A (en) | Substrate inspection apparatus, inspection position correction method, position correction information generation method, and position correction information generation system | |
JP2009019907A (en) | Inspection apparatus | |
JP2003098216A (en) | Circuit board inspection device | |
KR101677001B1 (en) | Measuring apparatus | |
KR20080100592A (en) | Method of adjusting position of electric inspection apparatus contactor | |
KR100428510B1 (en) | Apparatus and method of precise positioning control using optical system | |
KR20090030429A (en) | Method of aligning probes and apparatus for aligning probes | |
JPH11185688A (en) | Observation device, and magnification regulating method therefor | |
KR101444258B1 (en) | Method for determining a validity of a compensation matrix during a circuit board inspection |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E601 | Decision to refuse application |