KR20080089251A - 패턴 결함 검사 방법, 포토마스크의 제조 방법, 및 패턴전사 방법 - Google Patents

패턴 결함 검사 방법, 포토마스크의 제조 방법, 및 패턴전사 방법 Download PDF

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Publication number
KR20080089251A
KR20080089251A KR1020080028923A KR20080028923A KR20080089251A KR 20080089251 A KR20080089251 A KR 20080089251A KR 1020080028923 A KR1020080028923 A KR 1020080028923A KR 20080028923 A KR20080028923 A KR 20080028923A KR 20080089251 A KR20080089251 A KR 20080089251A
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KR
South Korea
Prior art keywords
pattern
light
diffracted light
repeating pattern
defect
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KR1020080028923A
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English (en)
Korean (ko)
Inventor
노보루 야마구찌
Original Assignee
호야 가부시키가이샤
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Publication date
Application filed by 호야 가부시키가이샤 filed Critical 호야 가부시키가이샤
Publication of KR20080089251A publication Critical patent/KR20080089251A/ko

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/82—Auxiliary processes, e.g. cleaning or inspecting
    • G03F1/84—Inspecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N2021/95676—Masks, reticles, shadow masks

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
KR1020080028923A 2007-03-30 2008-03-28 패턴 결함 검사 방법, 포토마스크의 제조 방법, 및 패턴전사 방법 KR20080089251A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2007-00092818 2007-03-30
JP2007092818A JP4869129B2 (ja) 2007-03-30 2007-03-30 パターン欠陥検査方法

Publications (1)

Publication Number Publication Date
KR20080089251A true KR20080089251A (ko) 2008-10-06

Family

ID=39974692

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020080028923A KR20080089251A (ko) 2007-03-30 2008-03-28 패턴 결함 검사 방법, 포토마스크의 제조 방법, 및 패턴전사 방법

Country Status (4)

Country Link
JP (1) JP4869129B2 (ja)
KR (1) KR20080089251A (ja)
CN (1) CN101275920A (ja)
TW (1) TW200848694A (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008056659A1 (de) 2007-11-09 2009-06-25 Cheil Industries, Inc., Gumi Transparentes Thermoplastisches Harz und Verfahren zu dessen Herstellung
KR101511158B1 (ko) * 2008-12-16 2015-04-13 삼성전자주식회사 레티클 에러 검출 방법
US9100563B2 (en) 2010-03-15 2015-08-04 Samsung Electronics Co., Ltd. Apparatus, method and computer-readable medium imaging through at least one aperture of each pixel of display panel

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US7570796B2 (en) 2005-11-18 2009-08-04 Kla-Tencor Technologies Corp. Methods and systems for utilizing design data in combination with inspection data
US9659670B2 (en) 2008-07-28 2017-05-23 Kla-Tencor Corp. Computer-implemented methods, computer-readable media, and systems for classifying defects detected in a memory device area on a wafer
JP4596062B2 (ja) 2008-09-29 2010-12-08 ブラザー工業株式会社 帯電ワイヤの取付方法、プロセスカートリッジの製造方法およびプロセスカートリッジ
JP5178561B2 (ja) * 2009-02-06 2013-04-10 Ｈｏｙａ株式会社 パターン検査方法、パターン検査装置、フォトマスク製造方法、およびパターン転写方法
TW201100787A (en) * 2009-02-18 2011-01-01 Nikon Corp Surface examining device and surface examining method
CN105675496B (zh) * 2009-09-21 2019-07-05 阿科尼生物系统公司 一体化料筒
JP2012119512A (ja) * 2010-12-01 2012-06-21 Hitachi High-Technologies Corp 基板の品質評価方法及びその装置
US20120237858A1 (en) * 2011-03-18 2012-09-20 Nanya Technology Corporation Photomask and a method for determining a pattern of a photomask
US9170211B2 (en) 2011-03-25 2015-10-27 Kla-Tencor Corp. Design-based inspection using repeating structures
JP2013068551A (ja) * 2011-09-22 2013-04-18 Toshiba Corp パターン検査装置、およびパターン検査方法
CN103823329B (zh) * 2012-11-16 2016-09-07 中芯国际集成电路制造(上海)有限公司 掩膜版及对其进行缺陷检测的方法
US9865512B2 (en) 2013-04-08 2018-01-09 Kla-Tencor Corp. Dynamic design attributes for wafer inspection
US9310320B2 (en) 2013-04-15 2016-04-12 Kla-Tencor Corp. Based sampling and binning for yield critical defects
TWI512772B (zh) * 2014-03-19 2015-12-11 Darfon Electronics Corp 彈性體層及其檢驗方法
KR102341450B1 (ko) * 2015-07-17 2021-12-21 도판 인사츠 가부시키가이샤 메탈 마스크 기재, 메탈 마스크 기재의 관리 방법, 메탈 마스크, 및, 메탈 마스크의 제조 방법
CN106403808A (zh) * 2015-07-29 2017-02-15 上海微电子装备有限公司 一种测量通孔硅形貌的装置与方法
JP7292842B2 (ja) * 2018-09-21 2023-06-19 キヤノン株式会社 異物検査装置、露光装置、および物品製造方法
JP7454331B2 (ja) * 2018-10-26 2024-03-22 株式会社トクヤマ 固定用治具
JP7229138B2 (ja) * 2019-09-27 2023-02-27 Hoya株式会社 パターン検査方法、フォトマスクの検査装置、フォトマスクの製造方法、および表示装置の製造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008056659A1 (de) 2007-11-09 2009-06-25 Cheil Industries, Inc., Gumi Transparentes Thermoplastisches Harz und Verfahren zu dessen Herstellung
KR101511158B1 (ko) * 2008-12-16 2015-04-13 삼성전자주식회사 레티클 에러 검출 방법
US9100563B2 (en) 2010-03-15 2015-08-04 Samsung Electronics Co., Ltd. Apparatus, method and computer-readable medium imaging through at least one aperture of each pixel of display panel

Also Published As

Publication number Publication date
CN101275920A (zh) 2008-10-01
TW200848694A (en) 2008-12-16
JP4869129B2 (ja) 2012-02-08
JP2008249575A (ja) 2008-10-16

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