KR20080081545A - Liquid crystal display device - Google Patents
Liquid crystal display device Download PDFInfo
- Publication number
- KR20080081545A KR20080081545A KR20070021672A KR20070021672A KR20080081545A KR 20080081545 A KR20080081545 A KR 20080081545A KR 20070021672 A KR20070021672 A KR 20070021672A KR 20070021672 A KR20070021672 A KR 20070021672A KR 20080081545 A KR20080081545 A KR 20080081545A
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- liquid crystal
- metal substrate
- pcb
- crystal display
- metal
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Abstract
Description
1 is a cross-sectional view of a liquid crystal display device according to the related art.
2 is a plan view showing the metal PCB structure of FIG.
3 is a plan view showing another structure of the metal PCB of FIG.
4 is a cross-sectional view of a liquid crystal display according to an exemplary embodiment of the present invention.
5A and 5B are views illustrating a manufacturing process of the metal PCB of FIG. 4.
Figure 6a is a side view showing the state of the force acting when assembling the metal PCB of Figure 4
6B is a cross-sectional view illustrating a state of a force acting when assembling the metal PCB of FIG. 4.
7 and 8 illustrate a modified structure of the metal PCB of FIG.
9 is a cross-sectional view according to another embodiment of the metal PCB of FIG. 4.
10 is a cross-sectional view according to another embodiment of the metal PCB of FIG. 4.
※※ Explanation of symbols for main parts of drawing ※※
230: lower cover 232: first reflecting plate
234, 334, 434, 534, 634: metal substrate
236, 336, 436, 536, 636: light emitting element
237, 537, 637: conductive material 238: second reflector
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid crystal display device, and more particularly, to improve the warpage phenomenon of a metal printed circuit board (LED) fixed by arranging LEDs in an LED backlight structure.
In general, a direct type back-light used in a large-scale liquid crystal display reflects light from a cold cathode fluorescent lamp to a liquid crystal panel in front of a reflective plate. At this time, a milky white scattering plate such as a diffuser plate is additionally disposed in the reflection path, so that light having a locally uniform illuminance is illuminated on the liquid crystal display. However, such a method has a problem of bringing the liquid crystal display to a large and complicated model due to the thickness problem of the backlight constituting the display.
In recent years, as one of the surface light source devices, the backlight is thinned and the brightness is also improved by using a light emitting diode (LED) having characteristics such as fast response speed, low power consumption, and semi-permanent lifetime. Most of all, this is the next generation LCD that can replace the cold cathode tube backlight device by reproducing natural color and high quality images compared to the existing cold cathode tube, and recognizing that it is an eco-friendly product that solves the afterimage problem and does not use mercury. It is regarded as a core component of.
Next, the direct type liquid crystal display device having the LED backlight device will be described in detail with reference to the accompanying drawings. As shown in FIG. 1, the LCD includes a backlight including a
More specifically, first, a plurality of printed circuit boards (PCBs) 34 formed by forming at least one line of LEDs emitting light are arranged and fixed on the
Of course, the entire reflecting plate for reflecting light from the
In addition, there is another reflecting
However, the above two
Subsequently, a diffuser plate 42 for mitigating non-uniformity of light emitted from the
After the configuration of the backlight is completed as described above, the
Thereafter, the
An
2 is a view showing the LED backlight structure of Figure 1, Figure 3 is a view showing another structure of the LED backlight of FIG.
First, the PCB 34 shown in FIG. 2 is substantially a metal PCB. That is, an insulating layer is formed on a metal substrate made of aluminum (Al) or the like, and a plating layer is formed of copper (Cu) or the like on the insulating layer by electroplating, and then the copper forming the plating layer is precipitated again ( Outwardly to form a circuit pattern. The
On the other hand, the PCB 44 shown in FIG. 3 is a tile type substrate that can be separated between a metal substrate such as aluminum and a substrate on which a circuit pattern is formed, and then attaches at least one LED substrate to each metal substrate. The
This can be seen as a way to prevent overproduction of products and solve cost problems by flexibly coping with LED backlight devices used in liquid crystal display devices of various sizes such as 32 inches and 42 inches.
However, such a conventional metal PCB has a circuit pattern formed on a plated layer on a metal substrate having a long bar shape of a rectangular shape having a height of about 1.6 mm, so that the LED backlight is substantially constructed using the metal PCB. In this case, an external force acts on the bar-shaped metal substrate during assembly by an operator or equipment, and an impact test of a liquid crystal display device, which causes bending of the metal PCB.
This results in cracking of the circuit pattern of the plating layer formed on the metal substrate, or the disconnection of the conductive wire to assist the electrical connection between the tile-type substrates attached on the metal substrate. It is a major cause.
Accordingly, the present invention forms a reinforcing structure of various shapes such as irregularities or hollows on a metal substrate made of aluminum or the like to improve such a problem, and in addition, the intaglio and hollow portions of the irregularities are formed. It is an object of the present invention to provide an LED backlight device and a liquid crystal display device for facilitating heat dissipation by forming a thermal conductive material such as grease in a pad.
And the achievement of this object can be further embodied by the present invention. That is, the liquid crystal display according to the exemplary embodiment of the present invention includes a lower cover; At least one comprising a metal substrate arranged and fixed on the lower cover and having at least one of upper and lower surfaces unbalanced to distribute the load, and a light emitting device mounted on the upper surface of the metal substrate to emit light. Printed Circuit Board (PCB); And it characterized in that it comprises a liquid crystal panel is fastened to be spaced apart (離 隔) to the front of the PCB.
In addition, the liquid crystal display according to another embodiment of the present invention and the lower cover; At least one PCB comprising a metal substrate arranged on the lower cover and having at least one hollow formed therein to distribute the load, and a light emitting element mounted on an upper surface of the metal substrate to emit light; Circuit board); And it characterized in that it comprises a liquid crystal panel is fastened to be spaced apart (離 隔) to the front of the PCB.
Then, the above configuration will be described in detail with reference to the accompanying drawings. 4 is a cross-sectional view illustrating a liquid crystal display device according to an exemplary embodiment of the present invention.
First, the
In addition, the metal PCB 230 may be formed on the lower surface of the
Of course, prior to arranging and fixing the plurality of
In addition, there is another reflecting
However, the two reflecting
Next, a
Next, the
Thereafter, the
An
5A and 5B illustrate the manufacturing process of the
For example, the reinforcing structure is at least one along the long axis direction of the upper half thickness (8 mm) on the lower surface of the
In addition, the above-mentioned aluminum may be classified into various types in consideration of its material, tensile strength, and durability, and in the present invention, the thermal conductivity of the 50 series is 1.5 to 2 times better than that of the 50 series for cost reduction and thermal conductivity efficiency. Inexpensive 60 series materials are available.
The insulating
Anodizing is a method of artificially producing an oxide film having a uniform thickness by accelerating the oxidation of a metal surface by allowing a metal to act as an anode in a solution such as sulfuric acid. The aluminum is oxidized by oxygen generated at the anode to produce a film of aluminum oxide (Al 2 O 3 ). Since this film is very hard, highly corrosion resistant and extremely small porosity layer, it can be dyed in various colors, so anodizing is often performed on the metal surface not only for practical reasons such as corrosion resistance and abrasion resistance but also for aesthetic reasons. .
As described above, the
Electroplating using an alternating current power source is a kind of pulse plating, in which copper is deposited in pores of the oxide film layer, which is the insulating
Accordingly, when the electroplating is performed by applying AC power to the
In addition, a circuit pattern is formed on the
As described above, the
The
However, the same effect can be obtained by using grease prepared by mixing in a colloidal state by adding a metal soap and a small amount of water to the liquid mineral oil lubricant instead of the pad material. will be.
6A is a view showing an action state of the force viewed in the long axis direction when assembling the
FIG. 6B is a view showing an action state of a force in a short axis direction when assembling the
Therefore, as described above, the distributed load F2 becomes equal to the external force F1 by the external worker of the
Based on this, the distributed structure of the force formed on the lower surface of the
In addition, such a concave-convex shape may be deformed into a semicircular arcuate structure or triangular shape so as to non-equilibrate at least one of the upper and lower surfaces as shown in FIGS. 7 and 8. Of course, the number will not be particularly limited as above.
Such a structure can be further modified to a shape as shown in FIG. 9. In other words, by forming the concave-convex shape on the upper and lower surfaces of the
For example, assuming that the
In addition, as shown in FIG. 10, a method of forming a hollow in the center region of the
In addition to the shape of the hollow in addition to the square shown in the drawings it will be possible to change to a variety of shapes, such as round, oval, or triangle.
Of course, even in the above two cases, the dispersion structure of the various forces on the
In other words, in order to efficiently discharge heat from the
As a result of the configuration up to now, the liquid crystal display device according to the present invention protects the metal conductive pattern of the metal substrate by forming a reinforcing structure having various shapes such as irregularities or hollows on the metal substrate made of aluminum or the like. It is possible to secure reliability of lighting of LED.
In addition, heat dissipation from the metal substrate may be facilitated by forming pads with a thermally conductive material such as grease on the intaglio and hollow portions formed on the metal substrate.
In addition, in the case where the metal substrate is made of
Claims (19)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR20070021672A KR20080081545A (en) | 2007-03-05 | 2007-03-05 | Liquid crystal display device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR20070021672A KR20080081545A (en) | 2007-03-05 | 2007-03-05 | Liquid crystal display device |
Publications (1)
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KR20080081545A true KR20080081545A (en) | 2008-09-10 |
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KR20070021672A KR20080081545A (en) | 2007-03-05 | 2007-03-05 | Liquid crystal display device |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9347621B2 (en) | 2012-10-04 | 2016-05-24 | Samsung Electronics Co., Ltd. | Light emitting module and lighting device using the same |
-
2007
- 2007-03-05 KR KR20070021672A patent/KR20080081545A/en not_active Application Discontinuation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9347621B2 (en) | 2012-10-04 | 2016-05-24 | Samsung Electronics Co., Ltd. | Light emitting module and lighting device using the same |
US9759405B2 (en) | 2012-10-04 | 2017-09-12 | Samsung Electronics Co., Ltd. | Light emitting module and lighting device using the same |
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