KR20080081495A - Manufacturing method of display device - Google Patents

Abstract

A display device manufacturing method is provided to fix a substrate stably during an etch process by attaching a magnet jig to an edge of a pixel array formed on the substrate, thereby stably reducing a thickness of the substrate. A magnet jig(100) is attached to each edge of one or more pixel arrays(20,60) formed on a substrate(21a,61a). The rear of the substrate corresponding to the pixel array is etched. After that, the magnet jig is separated from the substrate. The pixel array is formed on the substrate as including one of a color filter array and a TFT(Thin Film Transistor) array. The magnet jig is coated with plastic.

Description

Manufacturing Method of Display Device

1 and 2 are diagrams for explaining an example of a display device.

3A to 3E are cross-sectional views illustrating a method of manufacturing a display device according to a first embodiment of the present invention.

4 and 5 are views for explaining the magnet jig according to the present invention.

6A to 6D are cross-sectional views illustrating a method of manufacturing a display device according to a second embodiment of the present invention.

7A to 7E are cross-sectional views illustrating a method of manufacturing a display device according to a third embodiment of the present invention.

8A to 8E are cross-sectional views illustrating a method of manufacturing a display device according to a fourth embodiment of the present invention.

9 is a view for explaining a method of etching by dipping the substrate in the etching liquid.

<Explanation of symbols for the main parts of the drawings>

21, 61, 21a, 21b, 61a, 61b, 121b, 161b, 221b, 261b: substrate

20, 60: pixel array

Magnet jig: 100, 100a, 100b, 200, 300

101: plastic protective film 107: etching solution

The present invention relates to a method of manufacturing a display device. In particular, the present invention relates to a method of manufacturing a display device capable of making the substrate of the display device thin.

Display devices are evolving from heavy, space-consuming CRTs (Cathode-Ray Tubes) to light and thin flat panel displays. The flat panel display includes a liquid crystal display (LCD), a plasma display panel (PDP), an organic electroluminescent display (OLED), and the like.

Although flat panel displays are thinner than CRTs, due to the rapid development of portable devices such as mobile phones and laptops, a flat panel display is required to develop a technology that can make a flat panel display even thinner in recent years. As part of this, various attempts have been made on a method for thinning a substrate of a display device.

SUMMARY OF THE INVENTION An object of the present invention is to provide a method for manufacturing a display device which can thin a substrate of the display device.

In order to achieve the above object, a method of manufacturing a display device according to the present invention comprises the steps of attaching a magnet jig to the edge of each of the at least one pixel array formed on the substrate; Etching the back surface of the substrate corresponding to the pixel array; And separating the magnet jig from the substrate.

The substrate is a metal substrate of magnetic material.

The metal substrate of the magnetic material includes any one of iron, cobalt, nickel, martensitic stainless steel, and ferritic stainless steel.

In the attaching of the magnet jig in the first embodiment of the present invention, the magnet jig is attached to the rear surface of the substrate.

In addition, the first embodiment of the present invention comprises the steps of attaching a plastic protective film on the pixel array; And separating the plastic protective film from the pixel array after etching the back side of the substrate.

In addition, the first embodiment of the present invention further includes cutting the edge of the substrate to which the magnet jig is attached.

In the attaching of the magnet jig in the second embodiment of the present invention, the magnet jig is attached to an upper surface of the substrate.

In a second embodiment of the present invention, the method may further include disposing a plastic protective film to cover the pixel array; The plastic protective film is fixed to the substrate at the same time as attaching the magnet jig, and at the same time as the magnetic jig is separated.

In the attaching of the magnet jig in the third embodiment of the present invention, the first magnet jig is attached to the upper surface of the substrate, and the second magnet jig is attached to the rear surface of the substrate.

And further comprising disposing a plastic protective film to cover the pixel array in the third embodiment of the present invention; The plastic protective film is fixed to the substrate while attaching the first magnet jig, and is separated from the substrate at the same time as the first magnet jig is separated.

And cutting the edges of the substrate to which the first and second magnet jigs are attached in the third embodiment of the present invention.

A method of manufacturing a display device according to a fourth exemplary embodiment of the present invention includes: arranging a first substrate and a second substrate having at least one pixel array on an upper surface thereof so that the pixel arrays face each other; Attaching the first magnet jig to a rear surface of the first substrate and attaching the second magnet jig to a rear surface of the second substrate; Etching back surfaces of the first substrate and the second substrate corresponding to the pixel array; And separating the first and second magnet jigs from the first and second substrates.

The fourth embodiment further includes disposing a plastic protective film on edges of the first substrate and the second substrate so as to cover side surfaces of the pixel array; The plastic protective film is fixed to the substrate at the same time as the first and second magnet jig is attached, and the first and second magnet jig is separated from the substrate at the same time.

The fourth embodiment of the present invention further includes cutting edges of the first and second substrates to which the first and second magnet jigs are attached.

In the third and fourth embodiments of the present invention, the first magnet jig and the second magnet jig are disposed to face opposite polarities to each other.

In embodiments of the present invention, the pixel array includes any one of a color filter array and a thin film transistor array.

In embodiments of the invention the magnet jig is coated with plastic.

In addition, in embodiments of the present invention, the magnet jig includes one or more grooves to correspond to each of the one or more pixel arrays.

In the embodiments of the present invention, the plastic coating the magnetic substrate and the plastic protecting the pixel array include polyethylene (PES), polyethylene terephthalate (PET), polyimide (PI), and Teflon. It includes any one of.

Other objects and advantages of the present invention other than the above object will be apparent from the description of the preferred embodiment of the present invention with reference to the accompanying drawings.

Hereinafter, preferred embodiments of the present invention will be described with reference to FIGS. 1 to 8E.

In the following embodiments, the display device includes a pixel array composed of a plurality of thin film patterns on a substrate, and the pixel array may be a thin film transistor array according to a type of display device. And color filter arrays.

1 and 2 show examples of display devices. FIG. 1 is a diagram illustrating an electrophoresis display, and FIG. 2 is a diagram illustrating a liquid crystal display.

Referring to FIG. 1, an electrophoretic display device according to an exemplary embodiment of the present invention includes a lower array portion and an upper array portion.

The upper array portion includes a flexible film. The upper array portion includes an upper electrode 34 formed on the base film 32, capsules 35 positioned on the upper electrode 34 and including charge pigment particles, and an adhesive layer. 36 is provided. The base film 32 is mainly made of plastic having flexibility. The capsule 35 includes black dye particles 35a in response to a positive voltage, white dye particles 35b in response to a negative voltage, and a transparent fluid 35c.

The lower array portion includes a TFT array 20 formed on the lower substrate 21. The TFT array 20 includes a gate line (not shown) and TFTs connected to a data line (not shown) intersecting with the gate insulating film 23 interposed therebetween, and a pixel electrode 17 connected to each TFT. . The TFT causes the data signal of the data line to be charged and held in the pixel electrode 17 in response to the gate signal of the gate line. For this purpose, the TFT includes a gate electrode 8 extending from the gate line, a semiconductor pattern 18 overlapping the gate electrode 8, a source electrode 10 in ohmic contact with the semiconductor pattern 18 and extending from the data line; And a drain electrode 12 in ohmic contact with the semiconductor pattern 18 and connected to the pixel electrode 17. The semiconductor pattern 18 is exposed between the source electrode 10 and the drain electrode 12 to form an active channel 14, and the electrodes 10 and 12 connected to the active layer 14 include the active layer 14. ) And an ohmic contact layer 16 to make ohmic contact. The pixel electrode 17 is in contact with the drain electrode 12 through the contact hole 15 that exposes the drain electrode 12 through the protective film 25 protecting the TFT 6.

The electrophoretic display electrically controls the arrangement of the white dye particles 35b and the black dye particles 35a in the capsule 35 by an electric field formed between the pixel electrode 17 and the upper electrode 34. To achieve black, white or gray between black and white.

The electrophoretic display includes forming a TFT array 20 on a lower substrate 21 and attaching an upper array portion thereon.

Referring to FIG. 2, the liquid crystal display according to the present invention includes a lower array portion and an upper array portion that face each other with the liquid crystal molecules 71 interposed therebetween.

The upper array unit includes a color filter array 60 formed on the upper substrate 61. The color filter array 60 includes a black matrix 63, a color filter 65, and a common electrode 67. The black matrix 63 partitions an area where the color filter 65 is to be formed and absorbs light incident from the adjacent color filter 65 to prevent optical interference between adjacent color filters 65. The color filter 65 displays a corresponding color by transmitting light of a specific wavelength band including red (R), green (G), and blue (B). The common electrode 67 forms an electric field with the pixel electrode 17 of the lower array unit. The color filter array 60 may further include an alignment layer that determines the alignment direction of the liquid crystal molecules 71.

The lower array portion includes a TFT array 20 formed on the lower substrate 21 as described above in FIG. The description of the TFT array 20 is the same as described above in FIG. The TFT array 20 of the liquid crystal display device may further include an alignment layer that determines the alignment direction of the liquid crystal molecules 71.

The LCD may implement an image by adjusting a light transmittance passing through the liquid crystal molecules 71 using a vertical electric field formed between the pixel electrode 17 and the common electrode 67. In FIG. 2, the common electrode 67 is included in the upper array unit to form a vertical electric field with the pixel electrode 17. Alternatively, the common electrode 67 is arranged in parallel with the pixel electrode 17. It may be included in the portion to form a horizontal electric field with the pixel electrode 17.

Such a liquid crystal display includes a process of forming the color filter array 60 on the upper substrate 61 and forming the TFT array 20 on the lower substrate 21, and the color filter array 60 and the TFT array 20. ) Is a step of bonding the two substrates 21 and 61 so as to face each other.

The pixel array of the display device is not limited to the above-described color filter array 60 and the TFT array 20, and may further include an organic light emitting diode or the like.

When the substrates 21 and 61 are made of metal, an insulating film may be further formed between the pixel arrays 20 and 60 and the substrates 21 and 61.

A method of manufacturing a display device according to the present invention includes a process of thinning the substrates 21 and 61 on which the pixel arrays 60 and 20 are formed. In the process of thinning the substrates 21 and 61 according to the present invention, the back surfaces of the substrates 21 and 61 are etched so that the pixel arrays 20 and 60 formed on the substrates 21 and 61 are not damaged, and during the etching process. A magnet jig capable of stably fixing the substrates 21 and 61 is used. Hereinafter, a method of manufacturing a display device according to the present invention using a magnet jig will be described in detail by embodiments.

3A to 3E are cross-sectional views illustrating a method of manufacturing a display device according to a first embodiment of the present invention. In the method of manufacturing the display device according to the first embodiment of the present invention, the magnet jig 100 is attached to the substrates 21a and 61a having the first thickness d1 on which the pixel arrays 20 and 60 are formed. And etching the exposed surfaces of 21a and 61a and separating the magnet jig 100 from the substrate.

Before attaching the magnet jig 100 as shown in FIG. 3A, pixel arrays 20 and 60 are formed on the substrates 21a and 61a. In this case, the substrates 21a and 61a have a first thickness d1 that enables the process of forming the pixel arrays 20 and 60 to proceed stably. In addition, the substrates 21a and 61a should be made of a magnetic metal so that the substrates 21a and 61a may be attached to the magnet jig 100 in consideration of a process of attaching the magnet jig 100. The magnetic material is characterized in that the ferromagnetic material (ferromagnetic substance) that can be attached to the magnet. Ferromagnetic materials include iron (Fe), cobalt (Co), nickel (Ni) and stainless steel (stainless steel). Stainless steel is a type that does not adhere to the magnet depending on its composition. Accordingly, in the first embodiment of the present invention, a ferrite type and a martensite type stainless steel having a property that can be attached to a magnet are used.

The process of attaching the magnet jig 100 to the substrates 21a and 61a on which the pixel arrays 20 and 60 are formed is performed on the substrates 21a and 61a, which are edges of the pixel arrays 20 and 60, as shown in FIG. 3B. By attaching the magnet jig 100 to the back. In this case, the method may further include attaching the plastic protective film 101 to cover the pixel arrays 20 and 60 in order to more stably protect the pixel arrays 20 and 60 from the subsequent etching process. The plastic protective film 101 is attached to the upper portions of the substrates 21a and 61a through an adhesive 103 or the like.

In the process of etching the exposed surfaces of the substrates 21a and 61a, a nozzle 105 for injecting the etching liquid 107 is disposed on the rear surface of the substrates 21a and 61a, as shown in FIG. The etching solution 107 is sprayed through to etch the substrates 21a and 61a. The exposed surfaces of the substrates 21a and 61a are etched until the exposed thicknesses of the substrates 21a and 61a become the second thickness d2. The second thickness d2 is thinner than the first thickness d1 and ultimately allows the substrates 21a and 61a to have flexible characteristics. The etching solution 107 for etching the substrates 21 and 21b made of metal includes halogen elements such as chlorine (Cl), bromine (Br), and iodine (I). Especially when stainless steel is used, the etchant contains iron chloride. The plastic protective film 101 has little or no reactivity with the etchant 107 for etching the metal. Examples of such plastic protective film 101 include polyethylene (Poly Ethylene; hereinafter referred to as "PE"), polyethylene terephthalate (hereinafter referred to as "PET"), polyimide; Hereinafter referred to as " PI ") and Teflon. In addition, like the plastic protective film 101, the magnet jig 100 may be coated by the above-described plastic so as not to be etched from the etching solution 107.

After the etching process, the plastic protective film 101 is separated from the adhesive 103 and the substrates 21a and 61a, and the magnet jig 100 is also separated from the substrates 21a and 61a as shown in FIG. 3D. The substrates 21a and 61a are etched by the etchant 107 and are covered by the first region A1 and the magnet jig 100 having the second thickness d2, and thus are not exposed to the etchant 107 so that the substrates 21a and 61a are not exposed to the etchant 107. It is divided into a second region A2 having a thicker thickness. The first area A1 is an area where the pixel arrays 20 and 60 are formed, and the second area A2 is an edge of the substrates 21a and 61a where the pixel arrays 20 and 60 are not formed.

As described above, the second region A2 is cut to obtain the pixel arrays 20 and 60 formed on the substrates 21a and 61a having the second thickness d2.

As described above, the substrates 21a and 61a are stably fixed to the magnet jig 100 during the etching process in the first embodiment of the present invention. In addition, in the first embodiment of the present invention, by further attaching the plastic protective film 101 on the pixel arrays 20 and 60, the pixel arrays 20 and 60 may be prevented from being damaged from the etching solution.

The magnet jig 100a according to the present invention may be formed to have one groove so as to be attached to the edge of the pixel array as shown in FIG. 4. In addition, when the pixel array is formed in multiple units for mass production, the magnet jig 100b may be formed to have a plurality of grooves to correspond to the edges of each pixel array as shown in FIG. 5. The shape of the magnet jig is applied not only to the first embodiment of the present invention but also to the following embodiments.

6A through 6D are cross-sectional views illustrating a method of manufacturing a display device according to a second embodiment of the present invention. In the method of manufacturing the display device according to the second embodiment of the present invention, the process of attaching the magnet jig 100 to the substrates 21a and 61a of the first thickness d1 on which the pixel arrays 20 and 60 are formed is performed. And etching the exposed surfaces of 21a and 61a and separating the magnet jig 100 from the substrate.

Before attaching the magnet jig 100 as shown in FIG. 6A, pixel arrays 20 and 60 are formed on the substrates 21a and 61a. At this time, the substrates 21a and 61a have a first thickness d1 for stably proceeding the process of forming the pixel arrays 20 and 60 as described above with reference to FIG. 3A, and are attached to the magnet jig 100. It should be made of metal of magnetic material that can be made. In addition, in the second embodiment of the present invention, before attaching the magnet jig 100, the plastic protective film may be covered to cover the pixel arrays 20 and 60 in order to more stably protect the pixel arrays 20 and 60 from the etching process. 101) may be further included.

The process of attaching the magnet jig 100 to the substrates 21a and 61a on which the pixel arrays 20 and 60 are formed is performed on the substrates 21a and 61a which are edges of the pixel arrays 20 and 60, as shown in FIG. 6B. It is made by attaching the magnet jig 100 to the upper surface. The plastic protective film 101 is fixed to the substrates 21a and 61a through a process of attaching the magnet jig 100.

In the process of etching the exposed surfaces of the substrates 21a and 61a, as shown in FIG. 6C, a nozzle 105 for spraying the etching liquid 107 is disposed on the back surface of the substrates 21a and 61a, and the nozzle 105 is disposed. The etching solution 107 is sprayed through to etch the entire back surface of the substrates 21a and 61a. Back surfaces of the substrates 21a and 61a are etched until the thicknesses of the substrates 21a and 61a become the second thickness d2 as described above with reference to FIG. 3C.

After the etching process, as shown in FIG. 6D, the magnet jig 100 is separated from the substrates 21a and 61a. When the magnet jig 100 is separated from the substrates 21a and 61a, the plastic protective film 101 which is fixed to the substrates 21a and 61a through the magnet jig 100 is also separated from the substrates 21a and 61a. In the second embodiment of the present invention, the pixel arrays 20 and 60 formed on the substrates 21a and 61a of the second thickness d2 by separating the magnet jig 100 from the substrates 21a and 61a without a separate cutting process. ) Can be obtained.

As described above, the substrates 21a and 61a are stably fixed by the magnet jig 100 during the etching process in the second embodiment of the present invention. In addition, according to the second embodiment of the present invention, the plastic protective film 101 is further attached to the pixel arrays 20 and 60, and the plastic protective film 101 is fixed without an adhesive by fixing the plastic protective film 101 with the magnet jig 100. This can prevent the pixel arrays 20 and 60 from being damaged.

7A to 7E are cross-sectional views illustrating a method of manufacturing a display device according to a third embodiment of the present invention. In the method of manufacturing the display device according to the third exemplary embodiment, the first magnet jig 200 and the second magnet are formed on the substrates 21b and 61b of the first thickness d1 on which the pixel arrays 20 and 60 are formed. A process of attaching the jig 300, a process of etching the exposed surfaces of the substrates 21b and 61b, and a process of separating the first magnet jig 200 and the second magnet jig 300 from the substrate.

As illustrated in FIG. 7A, the pixel arrays 20 and 60 are formed on the substrates 21b and 61b before attaching the first magnet jig 200 and the second magnet jig 300. At this time, the substrates 21b and 61b have a first thickness d1 that enables the process of forming the pixel arrays 20 and 60 to proceed stably. In addition, in the third embodiment of the present invention, before the first magnet jig 200 and the second magnet jig 300 are attached, the pixel array 20, 60 may be more stably protected from the etching process. The method may further include disposing the plastic protective film 101 to cover 60.

Attaching the first magnet jig 200 and the second magnet jig 300 to the substrates 21b and 61b on which the pixel arrays 20 and 60 are formed is illustrated in FIG. 7B. The first magnet jig 200 is attached to the top surface of the substrates 21b and 61b, which are edges of the substrate, and the second magnet jig 300 is attached to the back surface of the substrates 21b and 61b, which is the edge of the pixel arrays 20 and 60. By attaching. In the third embodiment of the present invention, the substrates 21b and 61b are fixed between the first magnet jig 200 and the second magnet jig 300. To this end, since the attraction force must act between the first magnet jig 200 and the second magnet jig 300, the first magnet jig 200 and the second magnet jig 300 should be disposed to face opposite polarities. do. That is, when the first magnet jig 200 is disposed so that the N pole faces the substrates 21b and 61b, the second magnet jig 300 should be disposed so that the S pole faces the substrates 21b and 61b. On the contrary, if the S pole of the first magnet jig 200 is disposed to face the substrates 21b and 61b, the second magnet jig 300 is disposed so that the N pole thereof faces the substrates 21b and 61b. In the third embodiment of the present invention, the substrates 21b and 61b are fixed by the attraction force between the first magnet jig 200 and the second magnet jig 300 even if they are not ferromagnetic bodies such as glass. The plastic protective film 101 may also be fixed to the substrates 21b and 61b by the attraction force of the first magnet jig 200 and the second magnet jig 300.

In the process of etching the exposed surfaces of the substrates 21b and 61b, as shown in FIG. 7C, the nozzles 105 for spraying the etching liquid 107 are disposed on the rear surfaces of the substrates 21b and 61b, and the nozzles 105 are disposed. The etching solution 107 is sprayed through to etch the substrates 21b and 61b. The exposed surfaces of the substrates 21b and 61b are etched until the thicknesses of the exposed substrates 21b and 61b become the second thickness d2 as described above with reference to FIG. 3C. Since the plastic protective film 101 has little or no reactivity with an etchant that etches metal, and does not react with an etchant that etches glass, such as hydrofluoric acid (HF), as described above with reference to FIG. , 60).

After the etching process, as illustrated in FIG. 7D, the first magnet jig 200 and the second magnet jig 300 are separated from the substrates 21b and 61b. When the first magnet jig 200 and the second magnet jig 300 are separated from the substrates 21b and 61b, the first magnet jig 200 and the second magnet jig 300 may be connected to the substrates 21b and 61b through the first magnet jig 200 and the second magnet jig 300. The plastic protective film 101 which has been fixed is also separated from the substrates 21b and 61b.

After the etching process, the substrates 21b and 61b are etched in the etchant 107 and covered by the first region A1 and the second magnet jig 100 (2) having the second thickness d2, thereby etching the etchant 107. It is divided into a second region A2 that is not exposed to and has a thickness thicker than the second thickness d2. The first area A1 is an area in which the pixel arrays 20 and 60 are formed, and the second area A2 is an edge of the substrates 21b and 61b in which the pixel arrays 20 and 60 are not formed.

Subsequently, in the third embodiment of the present invention, the pixel formed on the substrates 21b and 61b having the second thickness d2 as shown in FIG. 7E by cutting the second region A2 as described above with reference to FIG. 3D. Arrays 20 and 60 can be obtained.

As described above, in the third embodiment of the present invention, although the substrates 21b and 61b are not metals of the magnetic material, the first magnet jig 200 and the second magnet jig 300 having different polarities during the etching process are performed. It can be fixed stably by. In addition, in the third embodiment of the present invention, by further forming the plastic protective film 101 on the pixel arrays 20 and 60, it is possible to prevent the pixel arrays 20 and 60 from being damaged from the etching solution.

8A to 8E are cross-sectional views illustrating a method of manufacturing a display device according to a fourth embodiment of the present invention. In the method of manufacturing the display device according to the fourth exemplary embodiment of the present invention, the first and second substrates 121b and 161b and the second substrates 221b and 261b of the first thickness d1 having the pixel arrays 20 and 60 are formed. Attaching the first magnet jig 200 and the second magnet jig 300, etching the exposed surfaces of the first and second substrates 121b and 161b and 221b and 261b, and a first magnet jig ( And separating the 200 and the second magnet jig 300 from the first substrate 121b and 161b and the second substrate 221b and 261b.

Before attaching the first magnet jig 200 and the second magnet jig 300, pixel arrays 20 and 60 are formed on the first substrate 121b and 161b and the second substrate 221b and 261b, respectively. do. At this time, each of the first substrate 121b and 161b and the second substrate 221b and 261b may have a first thickness (1) for stably proceeding the process of forming the pixel arrays 20 and 60 as described above with reference to FIG. 3A. d1).

The process of attaching the first magnet jig 200 and the second magnet jig 300 to the first substrates 121b and 161b and the second substrates 221b and 261b on which the pixel arrays 20 and 60 are formed may be performed by using a pixel array ( Arranging the first substrate 121b and 161b and the second substrate 221b and 261b on which the 20 and 60 are formed so that the pixel arrays 20 and 60 face each other, and the back surface of the first substrate 121b and 161b. Attaching the first magnet jig 200 to the second magnet jig 300 and attaching the second magnet jig 300 to the second substrates 221b and 261b.

As shown in FIG. 8A, the first and second substrates 121b and 161b and the second and second substrates 221b and 261b having the pixel arrays 20 and 60 are disposed so that the pixel arrays 20 and 60 face each other. Back surfaces of the first and second substrates 121b and 161b and 221b and 261b are exposed to the outside. In addition, in the fourth exemplary embodiment of the present invention, the pixel arrays 20 and 60 may be more stably protected from the etching process before the first magnet jig 200 and the second magnet jig 300 are attached. The method may further include disposing the plastic protective film 101 to cover the side surface of the substrate 60. In order to cover side surfaces of the pixel arrays 20 and 60, the plastic protective film 101 is disposed on side surfaces and edges of the first and second substrates 121b and 161b and 221b and 261b.

As shown in FIG. 8B, the process of attaching the first magnet jig 200 to the rear surfaces of the first substrates 121b and 161b and attaching the second magnet jig 300 to the second substrates 221b and 261b may be performed. The first magnet jig 200 and the second magnet jig 300 are attached to edges of the pixel arrays 20 and 60. In the fourth embodiment of the present invention, the first substrate 121b and 161b and the second substrate 221b and 261b are fixed between the first magnet jig 200 and the second magnet jig 300. To this end, since the attraction force must act between the first magnet jig 200 and the second magnet jig 300 as described above with reference to FIG. 7B, the first magnet jig 200 and the second magnet jig 300 are mutually opposite. It should be arranged with the polarity facing. In addition, in the fourth embodiment of the present invention, the first and second substrates 121b and 161b and the second and second substrates 221b and 261b may be formed of the first magnet jig 200 and the second, even if they are not ferromagnetic such as glass, as described above with reference to FIG. 7B. It is fixed by the attraction force between the magnet jig (300). The plastic protective film 101 may also be fixed to the first substrates 121b and 161b and the second substrates 221b and 261b by the attraction force of the first magnet jig 200 and the second magnet jig 300.

The process of etching the exposed surfaces of the first and second substrates 121b and 161b and the second and second substrates 221b and 261b is performed as shown in FIG. 8C, respectively, for the first and second substrates 121b and 161b and 221b and 261b, respectively. A nozzle 105 for injecting the etching liquid 107 is disposed on the back surface of the substrate, and the etching liquid 107 is sprayed through the nozzle 105 to form the first substrate 121b, 161b and the second substrate 221b, 261b. By etching. The exposed surfaces of the first and second substrates 121b and 161b and the second and second substrates 221b and 261b have the thicknesses of the exposed first and second substrates 121b and 161b and 221b and 261b as described above with reference to FIG. 3C. Etching is performed until the second thickness d2 is reached. Since the plastic protective film 101 has little or no reactivity with the etchant that etches the metal, and does not react with the etchant that etches the glass, such as hydrofluoric acid (HF), as described above with reference to FIG. 20, 60) can be protected.

After the etching process, as shown in FIG. 8D, the first magnet jig 200 and the second magnet jig 300 are separated from the first substrate 121b and 161b and the second substrate 221b and 261b. When the first magnet jig 200 and the second magnet jig 300 are separated from the first substrate 121b and 161b and the second substrate 221b and 261b, the first magnet jig 200 and the second magnet jig ( The first substrate 121b and 161b and the second substrate 221b and 261b which are fixed to face each other through the 300 are separated. In addition, when the first magnet jig 200 and the second magnet jig 300 are separated from the first substrate 121b and 161b and the second substrates 221b and 261b, the first magnet jig 200 and the second magnet jig are separated. The plastic protective film 101, which was fixed to the first substrate 121b and 161b and the second substrate 221b and 261b through the 300, may also be formed from the first substrate 121b and 161b and the second substrate 221b and 261b. Are separated.

After the etching process, each of the substrates 121b, 161b, 221b, and 261b is etched in the etchant 107 to have a first area A1, a first magnet jig 200, and a second magnet having a second thickness d2. Covered by the jig 300 is not exposed to the etchant 107 is divided into a second area (A2) having a thickness thicker than the second thickness (d2). The first area A1 is an area where the pixel arrays 20 and 60 are formed, and the second area A2 is an edge of the substrates 121b, 161b, 221b and 261b in which the pixel arrays 20 and 60 are not formed. .

Subsequently, in the fourth embodiment of the present invention, the substrates 121b, 161b, 221b, and 261b of the second thickness d2 are cut by cutting the second region A2 as described above with reference to FIG. 3D. The pixel arrays 20 and 60 formed on it can be obtained.

As described above, in the fourth embodiment of the present invention, the first substrate 121b and 161b and the second substrate 221b and 261b are not magnetic metals, but the first magnet jig having different polarities during the etching process. It can be stably fixed by the 200 and the second magnet jig 300. In addition, in the fourth exemplary embodiment of the present invention, the plastic protection film 101 is further formed to protect the side surfaces of the pixel arrays 20 and 60, thereby preventing the pixel arrays 20 and 60 from being damaged from the etchant. . In addition, in the fourth exemplary embodiment of the present invention, the first substrate 121b and 161b and the second substrate 221b and 261b on which the pixel arrays 20 and 60 are formed to be opposed to each other are etched so as to improve the yield of the display device. have.

In the first to fourth embodiments of the present invention, a method of etching the exposed surface of the substrate through the etchant injected through the nozzle has been described above. In addition to the above-described method, the exposed surface of the substrate may be etched by a simple method of dipping the substrate into the etchant while the pixel array is protected by the plastic protective film.

FIG. 9 illustrates a method of etching an exposed surface of a substrate by dipping in an etchant. The substrates 121b, 161b, 221b, and 261b shown in FIG. 9 are the substrates 121b, 161b, 221b, and 261b according to the fourth embodiment of the present invention.

Referring to FIG. 9, as described above with reference to FIG. 8B, the first and second substrates 121b and 161b and the second and second substrates 221b and 261b fixed by the first and second magnetic jigs 200 and 300 may be disposed on their upper surfaces. The formed pixel arrays 20 and 60 are dipped and etched in the water tank 90 containing the etchant 107 in a state where the formed pixel arrays 20 and 60 are protected by the plastic protective film 101.

According to the present invention, the etching process may be stably performed by fixing the substrate on which the pixel array is formed with a magnet jig. Furthermore, in the present invention, even if the substrate on which the pixel array is formed before the etching process has a flexible characteristic, the substrate can be etched to be thinner by stably fixing the substrate with a magnet jig.

As described above, the present invention stably fixes the substrate during the etching process by stably attaching the magnet jig to the edge of the pixel array formed on the substrate, thereby stably reducing the thickness of the substrate.

In addition, even if the substrate on which the pixel array is formed before the etching process has a flexible characteristic, the substrate can be etched to be thinner by stably fixing the substrate with a magnet jig, thereby providing a thinner display device.

Those skilled in the art will appreciate that various changes and modifications can be made without departing from the technical spirit of the present invention. Therefore, the technical scope of the present invention should not be limited to the contents described in the detailed description of the specification but should be defined by the claims.

Claims (24)

Attaching a magnet jig to an edge of each of the one or more pixel arrays formed on the substrate; Etching the back surface of the substrate corresponding to the pixel array; And And separating the magnet jig from the substrate. The method of claim 1, And the pixel array is formed on an upper surface of the substrate including any one of a color filter array and a thin film transistor array. The method of claim 1, And the magnet jig is coated with plastic. The method of claim 1, And the substrate is a metal substrate of a magnetic material. The method of claim 4, wherein The metal substrate of the magnetic material includes any one of iron, cobalt, nickel, martensitic stainless steel and ferritic stainless steel. The method of claim 1, Attaching the magnet jig, And attaching the magnet jig to the rear surface of the substrate. The method of claim 6, Attaching a plastic protective film on the pixel array; And And separating the plastic protective film from the pixel array after etching the back surface of the substrate. The method of claim 6, And cutting an edge of the substrate to which the magnet jig is attached. The method of claim 1, Attaching the magnet jig, And attaching the magnet jig to an upper surface of the substrate. The method of claim 9, Disposing a plastic protective film to cover the pixel array; And the plastic protective film is fixed to the substrate at the same time as the magnet jig is attached, and is separated from the substrate at the same time as the magnetic jig is separated. The method of claim 1, Attaching the magnet jig, And attaching the first magnet jig to an upper surface of the substrate, and attaching the second magnet jig to a rear surface of the substrate. The method of claim 11, And the first magnet jig and the second magnet jig are disposed to face opposite polarities to each other. The method of claim 11, Disposing a plastic protective film to cover the pixel array; And the plastic protective film is fixed to the substrate at the same time as the first magnet jig is attached, and the plastic protection film is separated from the substrate at the same time as the first magnet jig is separated. The method of claim 11, And cutting edges of the substrate to which the first and second magnet jigs are attached. The method of claim 1 The magnet jig includes at least one groove to correspond to each of the at least one pixel array. The method according to any one of claims 3, 7, 10, and 13, The plastic is made of a display device, characterized in that any one of polyethylene (PES), polyethylene terephthalate (PET), polyimide (PI) and Teflon (Teflon). Arranging a first substrate and a second substrate having one or more pixel arrays disposed on an upper surface thereof so that the pixel arrays face each other; Attaching the first magnet jig to a rear surface of the first substrate and attaching the second magnet jig to a rear surface of the second substrate;  Etching back surfaces of the first substrate and the second substrate corresponding to the pixel array; And And separating the first and second magnet jigs from the first and second substrates. The method of claim 17, And the pixel array is formed on an upper surface of each of the first and second substrates including one of a color filter array and a thin film transistor array. The method of claim 17, And the first and second magnetic jigs are coated with plastic. The method of claim 17, Disposing a plastic protective film on edges of the first substrate and the second substrate to cover side surfaces of the pixel array; The plastic protective film is fixed to the substrate at the same time as the first and second magnet jig is attached, the first and second magnet jig is separated from the substrate at the same time as the manufacturing of the display device Way. The method of claim 17, And cutting edges of the first and second substrates to which the first and second magnet jigs are attached. The method of claim 17, And the first magnet jig and the second magnet jig are disposed to face opposite polarities to each other. The method of claim 17, The first and second magnet jig includes at least one groove to correspond to each of the at least one pixel array. The method according to any one of claims 17 and 20, The plastic is made of a display device, characterized in that any one of polyethylene (PES), polyethylene terephthalate (PET), polyimide (PI) and Teflon (Teflon).

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