KR20080079509A - Flexible substrate module and a method for manufacturing the same - Google Patents

Abstract

A flexible substrate module and a manufacturing method thereof are provided to reduce production unit cost by reusing a conveyance substrate. A flexible substrate(110) faces one side of a supporting substrate(100). A first adhesive member(131) is interposed between the supporting substrate and the flexible substrate. A dummy flexible substrate(120) faces the other side of the supporting substrate. A second adhesive member(132) is interposed between the supporting substrate and the dummy flexible substrate, and has adhesive force bigger than the first adhesive member. A protecting member(150) covers the second adhesive member.

Description

Flexible substrate module and a method for manufacturing the same

1 is a flow chart showing a process of forming a flexible display substrate using the flexible substrate module according to the present invention.

2A to 2C are cross-sectional views illustrating a process of manufacturing a flexible display substrate using the flexible substrate module according to the first embodiment of the present invention.

3A to 3C are cross-sectional views illustrating a process of manufacturing a flexible display substrate using the flexible substrate module according to the second embodiment of the present invention.

<Description of Signs of Major Parts of Drawings>

100, 200: support substrate 110, 210: flexible substrate

120, 220: dummy flexible substrate 131, 231: first adhesive member

132: second adhesive member 150: protective member

160: substrate for transport 233: adhesive member

The present invention relates to a flexible substrate module and a method of manufacturing the same for manufacturing a flexible display device.

With the development of the information society, in recent years, there have been various liquid crystal display devices (LCDs), plasma display panels (PDPs), electroluminescent displays (VFDs), and vacuum fluorescent displays (VFDs). Flat panel display devices have been studied.

Among them, the liquid crystal display is the most widely used as a substitute for the CRT (Cathode Ray Tube) for the use of the mobile image display device because of the excellent image quality, light weight, thinness, and low power consumption. In addition to the use of the present invention, a variety of applications such as a television, a computer monitor, and the like for receiving and displaying broadcast signals have been developed.

Recently, in accordance with the demand for adopting a flat panel display device for portable products such as electronic sheets, arm bands, wallets, notebook computers, and the like, development of a display device having flexibility has been in progress. .

Such display devices mounted on portable products, such as electronic paper, arm bands, wallets, notebook computers, and e-books, must have flexible characteristics to bend in response to external forces.

Therefore, the display device should be made of a flexible substrate that can be bent.

The flexible substrate has a characteristic of having a thickness of typically 0.3 mm or less, flexible, light, unbreakable, and flexible, and thus flexible, and flexible, so that the flexible substrate can be freely deformed.

Therefore, in the next generation, it is expected that the technology of applying such a flexible substrate to various types of display devices such as a liquid crystal display device and an organic light emitting display device will be in the spotlight.

For example, the liquid crystal display may form a thin film transistor and a pixel electrode on a lower substrate, and a light blocking film, a color filter layer, and a common electrode on an upper substrate. In addition, the upper and lower substrates are bonded to each other and a liquid crystal layer is formed between the two substrates.

As such, since the liquid crystal display goes through a number of process steps, it is necessary to transport the substrate to each process step.

However, since the upper and lower substrates are flexible substrates, the substrate is bent downward at the time of conveyance, so that the transfer is not easy.

In addition, since the manufacturing process of the liquid crystal display device is performed at a high temperature, the substrate may deteriorate or cause defects in the device characteristics formed while repeatedly expanding and contracting.

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flexible substrate module and a method of manufacturing the same that can easily convey a flexible substrate at the time of manufacturing the flexible display device.

In order to achieve the above object, a first embodiment of a flexible substrate module according to the present invention, a support substrate; A flexible substrate facing one surface of the support substrate; A first adhesive member interposed between the support substrate and the flexible substrate; A dummy flexible substrate facing the other surface of the support substrate; And a second adhesive member interposed between the support substrate and the dummy flexible substrate and having a greater adhesive force than the first adhesive member.

In order to achieve the above object, a method of manufacturing a flexible substrate module according to a first embodiment of the present invention includes a support substrate, a dummy flexible substrate, and a second adhesive member interposed between the support substrate and the dummy flexible substrate. Preparing a transfer substrate; Preparing a flexible substrate; And attaching the support substrate and the flexible substrate between the support substrate and the flexible substrate through a first adhesive member having a lower adhesive force than the second adhesive member.

In addition, a second embodiment of the flexible substrate module according to the present invention in order to achieve the above object, a dummy flexible substrate facing one surface of the support substrate; A second adhesive member interposed between the support substrate and the dummy flexible substrate; And a protective member covering the second adhesive member exposed between the support substrate and the dummy flexible substrate.

In addition, in order to achieve the above object, a third embodiment of the flexible substrate module according to the present invention, a dummy flexible substrate facing one surface of the support substrate; And an adhesive member interposed between the support substrate and the dummy flexible substrate.

In addition, to achieve the above object, a method of manufacturing a flexible substrate module according to a third embodiment of the present invention, preparing a dummy flexible substrate facing the second surface of the support substrate; And attaching the support substrate and the dummy flexible substrate through an adhesive member between the support substrate and the dummy flexible substrate.

The present invention can reduce the production cost because the transfer substrate for transporting the flexible substrate in the process of manufacturing the flexible display device can be recycled.

In addition, the present invention by recycling the previously used transport substrate to adhere the flexible substrate to the transport substrate to proceed with the manufacturing process, there is no need to produce a transport substrate newly, it is possible to shorten the process time to improve productivity .

Hereinafter, a flexible substrate module and a method of manufacturing the same according to the present invention will be described in detail with reference to the accompanying drawings.

Terms used repeatedly in describing the embodiments of the present invention will be defined as follows.

The flexible display device refers to a display device in which a substrate is made of a flexible material and can display a screen while flexibly bending by an external force.

The flexible display substrate refers to a first substrate or a second substrate constituting the flexible display device. An array element including a thin film transistor may be formed on the first substrate. An array element including a color filter pattern may be formed on the second substrate.

The flexible substrate is made of a flexible substrate such as plastic, metal foil, stainless steel substrate.

Although the flexible substrate has a flexible characteristic, the manufacturing process is performed while being mounted on a rigid substrate, thereby preventing defects generated during the process.

In addition, the substrate for transporting the flexible substrate according to the present invention is not only adhered to the flexible substrate on which the display element is formed, but also to the surface opposite to the surface to which the flexible substrate is adhered to, the dummy flexible substrate is adhered to or adhered to.

The dummy flexible substrate is not directly produced by the manufacturing process like the flexible substrate on which the display element is formed, but the dummy flexible substrate is transported together with the flexible substrate to perform a manufacturing process, so that the process chamber or the chemical It can be processed by medicine.

However, the conveying substrate according to the present invention is more robust than the cohesive force or chemical resistance between the flexible substrate and the conveying substrate, so that the cohesion or chemical resistance between the dummy flexible substrate and the conveying substrate is more robust. Damage to the adhesive or adhesive between the dummy flexible substrate and the transfer substrate may be minimized by a chemical or the like.

Therefore, if one cycle is performed by adhering one flexible substrate to a substrate for transport and then detaching the flexible substrate from the substrate for transport after performing a series of manufacturing steps for forming a display element, the substrate for transport of the present invention The advantage is that it can be used repeatedly in several cycles of the process.

Hereinafter, in describing embodiments according to the present invention, the transport substrate according to the present invention includes a support substrate that is not bent and a dummy flexible substrate attached to the support substrate, and the transport substrate and the dummy flexible substrate. The adhesive material in between is called a 2nd adhesive member, and the adhesive material between the said board | substrate for conveyance and the flexible substrate in which a display element is formed is called a 1st adhesive member.

In addition, one surface of the support substrate adhered to the flexible substrate is referred to as a first surface, and the other surface of the support substrate adhered to the dummy flexible substrate is referred to as a second surface.

Each thickness of the flexible substrate and the dummy flexible substrate may be the same as or different from each other.

The degree of bending of the flexible substrate and the dummy flexible substrate in the same high temperature process is preferably similar to each other.

Even if the flexible substrate and the dummy flexible substrate are different materials, the thicknesses of the flexible substrate and the dummy flexible substrate may be different from each other so that the flexible substrate and the dummy flexible substrate may be bent in the same high temperature process.

In addition, the thicknesses of the first adhesive member and the second adhesive member may be the same or may be different from each other.

That is, the separation distance between the flexible substrate and the support substrate by the first adhesive member and the separation distance between the dummy flexible substrate and the support substrate by the second adhesive member may be the same as or different from each other.

The display element may be applied to a process of forming a thin film transistor array including the thin film transistor, but the display element may be a process of forming a color filter array including at least one of a color filter layer, a light blocking layer, and a common electrode layer.

In addition, terms such as 'first' and 'second' used in the present invention may be used selectively or interchangeably, respectively, and do not necessarily mean being formed in that order.

In the present invention, in terms of the relationship between the structure and the substrate as a reference, the terms indicating the positional relationship such as 'on', 'upper', 'lower', and 'lower' mean that the structure is directly It may be formed in contact, and even if not integrated contact can be sufficiently applied in a range that satisfies the positional relationship.

1 is a flowchart illustrating a process of manufacturing a flexible display substrate using the flexible substrate module according to the present invention.

First, a transport substrate is produced (S110).

The transport substrate includes a support substrate, a dummy flexible substrate bonded to the second surface of the support substrate, an adhesive member or a second adhesive member interposed between the support substrate and the dummy flexible substrate.

The support substrate is made of a hard material such as a glass substrate.

The substrate of the same material may be used as the flexible substrate and the dummy flexible substrate which are mounted on the transport substrate to form a display element.

The flexible substrate and the dummy flexible substrate may be substrates of different materials, but both substrates are made of a flexible material.

Preferably, the degree to which the dummy flexible substrate is bent at high temperature may be about the same as the degree to which the flexible substrate is bent at high temperature.

The flexible substrate and the dummy flexible substrate may be bent in opposite directions in a high temperature process, and the dummy flexible substrate may be bent in a direction opposite to the direction in which the flexible substrate is bent to prevent the flexible substrate from bending in one direction. Since the dummy flexible substrate and the flexible substrate are attached to both surfaces of the support substrate, the dummy flexible substrate and the flexible substrate may increase in the surface where the dummy flexible substrate and the flexible substrate are not attached to the support substrate in a high temperature process. Are bent in opposite directions.

Thereafter, the flexible substrate is adhered to the other surface of the transport substrate (S120).

A device may be formed on the flexible substrate, and a thin film transistor array device or a color filter pattern may be formed.

A first adhesive member is interposed between the flexible substrate and the transfer substrate.

It is assumed that the second adhesive member is superior in adhesive force and chemical resistance than the first adhesive member.

The first adhesive member includes one of silicon and acryl.

The second adhesive member includes one of silicone and acrylic.

The adhesive force of the first adhesive member is 20 gf / in (= gram force / inch) or more.

The adhesive force of the said 2nd adhesive member is 100 gf / in or more.

The second adhesive member is larger than the adhesive force of the first adhesive member.

The first adhesive member and the second adhesive member may be made of a single adhesive.

In contrast, the first adhesive member and the second adhesive member may be formed of a double-sided adhesive. The double-sided pressure-sensitive adhesive is a first and second adhesive layer is formed on both sides of the intermediate substrate.

When the first adhesive member is made of a double-sided adhesive, the adhesive force of the first adhesive layer between the flexible substrate and the intermediate substrate is 20 gf / in (= gram force / inch) or more. The adhesive force of the second adhesive layer between the intermediate substrate and the supporting substrate is 20 gf / in (= gram force / inch) or more. On the contrary, the adhesive force of the second adhesive layer may be 100 gf / in or more.

When the second adhesive member is made of a double-sided adhesive, the second adhesive member may include a third adhesive layer, an intermediate substrate, and a fourth adhesive layer.

At least one of the third adhesive layer and the fourth adhesive layer has an adhesive force of 100 gf / in or more.

Here, in the first and second adhesive members, a large adhesive force means that the adhesive member and the adhesive member (here, the support substrate) are firmly attached to each other, and that the adhesive members are firmly attached to each other between the adhesive member and the adhesive member. There is no gap in it, making it difficult for chemical solutions to penetrate. Therefore, it can be judged that a large adhesive force is excellent in chemical resistance.

Therefore, the second adhesive member is superior in chemical resistance to the first adhesive member.

Preferably, the flexible substrate and the dummy flexible substrate are made of the same material. However, if the thermal expansion coefficients of the flexible substrate and the dummy flexible substrate are similar so that the transfer substrate and the flexible substrate are not bent at a high temperature, the materials of the two substrates are similar. It may be different.

 In the process of manufacturing the flexible display device, a plurality of photolithography processes are repeated, and not only the flexible substrate but also the transfer substrate are exposed and contacted with a developer, strip liquid, and etching solution used in the photolithography process.

In the conveying substrate according to the present invention, a second adhesive member having better adhesive force and chemical resistance than the first adhesive member is interposed between the support substrate and the dummy flexible substrate, thereby manufacturing a display element on the flexible substrate. The second adhesive member may be prevented from being eroded or etched by the chemicals such as the developer, strip solution, and etchant.

In addition, according to the present invention, the flexible substrate adhered to the first surface of the support substrate may be attached to the first adhesive member to detach the flexible substrate from the support substrate when the manufacturing process of the display device is completed. Inject the solution to remove the member.

At this time, even if the solution for removing the first adhesive member is in contact with the second adhesive member, since the second adhesive member has better adhesive force and chemical resistance than the first adhesive member, the second adhesive member is lost. Can be prevented.

Therefore, the transport substrate can be recycled and used even when manufacturing display elements on other flexible substrates, thereby reducing the production cost. Since the transport substrate does not need to be newly manufactured, the transport time can be shortened to improve productivity. Can be.

A display element including a thin film transistor (TFT) is formed on the transfer substrate and the flexible substrate adhered to the flexible substrate.

The process of forming the display element will be described briefly as follows.

The display element may be applied to a thin film transistor array forming process including the thin film transistor, but the display element may be a color filter array forming process including at least one of a color filter layer, a light blocking layer, and a common electrode layer.

In the thin film transistor, a gate wiring is formed on the flexible substrate 110, and the gate wiring includes a gate electrode.

A gate insulating film is formed on the entire surface of the first substrate on which the gate wiring is formed.

The gate insulating film is formed of, for example, a silicon nitride film (SiNx) or a silicon oxide film (SiOx).

A semiconductor layer is formed on the gate insulating layer corresponding to the gate electrode.

The semiconductor layer includes a first semiconductor layer and a second semiconductor layer formed on one side and the other side of the first semiconductor layer and spaced apart from each other.

The first semiconductor layer is made of amorphous silicon (a-Si), and the second semiconductor layer is made of amorphous silicon (hereinafter, n + a-Si) doped with a high concentration of n-type impurities.

A data line defining a pixel area is formed on the flexible substrate 110 to cross the gate line.

The data line includes a source electrode and a drain electrode formed on the second semiconductor layer.

The data line and the source and drain electrodes are made of the same metal material and are simultaneously formed through one process.

The source electrode and the drain electrode are spaced apart from each other by a predetermined interval to expose the first semiconductor layer between the source electrode and the drain electrode to form a channel.

The gate electrode, the gate insulating layer, the semiconductor layer, the source electrode, and the drain electrode constitute a thin film transistor (TFT) and are disposed in at least one pixel area.

A passivation layer is formed on the flexible substrate 110 on which the thin film transistor is formed.

The passivation layer includes a drain contact hole exposing a portion of the drain electrode.

A pixel electrode is formed in the pixel area on the passivation layer, and the pixel electrode is connected to the drain electrode through the drain contact hole.

The display element may be a color filter array forming process including at least one of a color filter layer, a light blocking layer, and a common electrode layer.

In this case, a light blocking layer is formed on the flexible substrate in a region corresponding to the pixel region boundary and the thin film transistor region.

The light blocking layer may be, for example, a black matrix that absorbs or blocks light.

A color filter layer is formed on an area corresponding to the pixel area on the flexible substrate on which the light blocking layer is formed.

An overcoat layer may be further formed on the entire surface of the flexible substrate 110 on which the color filter layer and the light blocking layer are formed.

A common electrode layer may be further formed on the front surface of the flexible substrate 110.

The common electrode layer is made of a transparent conductive electrode material, and includes at least one selected from the group consisting of indium tin oxide and indium zinc oxide.

The display element forming process as described above is formed by several photolithography processes.

At this time, the transfer substrate for transferring the flexible substrate is also exposed to contact with the developer, strip liquid, etching liquid, etc. used in the photolithography process.

However, in the conveying substrate according to the present invention, since the second adhesive member having better adhesion and chemical resistance than the first adhesive member is interposed between the support substrate and the dummy flexible substrate, a display element is manufactured on the flexible substrate. In the process, the second adhesive member may be prevented from being eroded or etched by a chemical such as a developing solution, a stripping solution, or an etching solution.

Thereafter, the flexible substrate on which the display element is formed is detached from the transport substrate (S130).

The detachable process of the flexible substrate is performed by injecting a solution for removing the adhesive into the first adhesive member between the flexible substrate and the support substrate.

2A to 2C are cross-sectional views illustrating a process of manufacturing a flexible display substrate using the flexible substrate module according to the first embodiment of the present invention.

As shown in FIG. 2A, the flexible substrate 110 is adhered to the substrate 160 for transport. A first adhesive member 131 is interposed between the transport substrate 160 and the flexible substrate 110.

The first adhesive member 131 is formed on the conveying substrate 160 facing the flexible substrate 110, and the flexible substrate 110 is the conveying substrate on which the first adhesive member 131 is formed. And may be adhered to 160.

The first adhesive member 131 is formed on the flexible substrate 110 facing the substrate 110 for conveyance, and then the surface on which the first adhesive member 131 is formed is adhered to the substrate 160 for conveyance. May be

The transport substrate 160 includes a support substrate 100 and a dummy flexible substrate 120, and the second adhesive member 132 interposed between the support substrate 100 and the dummy flexible substrate 120. Include.

The second adhesive member 132 has the same or greater adhesive force and chemical resistance than the first adhesive member 131.

The dummy flexible substrate 120 is preferably made of the same material as the flexible substrate 110, but the dummy flexible substrate 120 and the flexible substrate 110 are not necessarily the same material.

However, even if the dummy flexible substrate 120 and the flexible substrate 110 are made of different materials, the dummy flexible substrate 120 and the flexible substrate 110 are both flexible and have a similar degree of bending in a high temperature process. Do.

A protective member may be disposed on side surfaces of the support substrate 100 and the dummy flexible substrate 120 to cover the second adhesive member 132 exposed between the support substrate 100 and the dummy flexible substrate 120. 150 is formed.

For example, the protection member 150 may be a sealant.

Preferably, the protection member 150 is formed around the side surface of the transfer substrate 160.

The protection member 150 may cover part or all of the side surfaces of the support substrate 100.

In addition, the protection member 150 may cover part or all of the side surfaces of the dummy flexible substrate 120.

The second adhesive member 132 is a developer, strip, developer while the protective member 150 is in the process of forming a display element on the flexible substrate 110 adhered on the transport substrate 160. By preventing contact with chemicals such as the like, the loss of the second adhesive member 132 may be prevented and protected.

The flexible substrate 110 adhered to the transport substrate 160 configured as described above undergoes various processes to form a display element on the flexible substrate 110.

As shown in FIG. 2B, the flexible substrate 110 adhered to the transport substrate 160 according to the present invention is formed on the flexible substrate 110 through various processes.

Several photolithography processes are repeated to form the display device on the flexible substrate 110.

For example, a process of forming a gate wiring on the flexible substrate 110 will be described.

The flexible substrate 110 is transferred into the sputtering chamber in a state in which the flexible substrate 110 is adhered to the transfer substrate 160.

A metal film is deposited on the flexible substrate 110 conveyed into the sputtering chamber.

Thereafter, the flexible substrate 110 is subjected to a photolithography process.

A photoresist film is formed on the metal film on the flexible substrate 110.

After being selectively exposed on the photoresist film, the photoresist film is dipped in a developer so that only the photoresist pattern remains on the metal film.

The metal film on which the photoresist pattern is formed is dipped in an etchant to remove only the metal film on the location where the photoresist pattern is formed and the metal film on the location exposed by the photoresist pattern.

As a result, a metal pattern is formed on the flexible substrate 110, and a photoresist pattern is formed on the metal pattern.

Thereafter, the flexible substrate 110 is immersed in a strip liquid to remove the photoresist pattern remaining on the flexible substrate 110.

A metal pattern remains on the flexible substrate 110, and the metal pattern forms a gate wiring and a gate electrode.

In this case, not only the flexible substrate 110 but also the transport substrate 160 may be exposed and contacted with a developer, strip solution, etching solution, and the like used in the photolithography process.

However, since the second adhesive member 132 is covered by the protective member 150, the second adhesive member 132 is not in contact with the developer, the strip solution, the etchant, and the like, so that the second adhesive member 132 may not be lost by the chemicals such as the developer, the strip solution, and the etchant. .

On the other hand, the first adhesive member 131 may be damaged by penetration of the chemical into the side surface between the flexible substrate 110 and the support substrate 100, but after the manufacturing process of the display element Since the first adhesive member 131 is removed in order to detach and detach the flexible substrate 110 from the transport substrate 160, the damage of the first adhesive member 131 is an inhibitory factor in achieving the object of the present invention. It doesn't work.

The substrate 160 for transport according to the first embodiment of the present invention is made of the same or superior adhesive strength and chemical resistance than the first adhesive member 131 between the support substrate 100 and the dummy flexible substrate 120. 2 the adhesive member 132 is interposed, the protective member 150 for protecting the second adhesive member 132 is covered on the side of the support substrate 100 and the dummy flexible substrate 120, In the process of manufacturing the display device on the flexible substrate 110, the second adhesive member 132 may be prevented from being eroded or etched by chemicals such as the developer, strip solution, and etchant.

Therefore, since the transport substrate 160 may be recycled and used even when manufacturing the display element on the other flexible substrate 110, the cost of production may be reduced, and the transport substrate 110 may not be newly manufactured. Productivity can be improved by shortening the process time.

As illustrated in FIG. 2C, after the display element is formed on the flexible substrate 110, the adhesive is adhered to the first adhesive member 131 interposed between the flexible substrate 110 and the support substrate 100. The flexible substrate 110 may be detached from the transport substrate 160 by injecting a solution for removing the member.

3A to 3C are cross-sectional views illustrating a process of manufacturing a flexible display substrate using the flexible substrate module according to the second embodiment of the present invention.

As shown in FIG. 3A, the flexible substrate 210 is adhered on the substrate 260 for transport. A first adhesive member 231 is interposed between the transfer substrate 260 and the flexible substrate 210.

The first adhesive member 231 is formed on the transport substrate 260 facing the flexible substrate 210, and then the flexible substrate 210 is formed on the transport substrate on which the first adhesive member 231 is formed. And may be adhered to 260.

The first adhesive member 231 is formed on the flexible substrate 210 facing the transport substrate 260, and then a surface on which the first adhesive member 231 is formed is adhered to the transport substrate 260. May be

The transport substrate 260 includes a support substrate 200 and a dummy flexible substrate 220, and includes an adhesive member 233 interposed between the support substrate 200 and the dummy flexible substrate 220. .

The adhesive member 233 has a greater adhesive force and chemical resistance than the first adhesive member 210.

Two surfaces of the support substrate and the dummy flexible substrate do not come into contact with each other by the adhesive member.

The dummy flexible substrate 220 is preferably made of the same material as the flexible substrate 210, but the dummy flexible substrate 220 and the flexible substrate 210 are not necessarily made of the same material.

However, even if the dummy flexible substrate 220 and the flexible substrate 210 are made of different materials, the dummy flexible substrate 220 and the flexible substrate 210 are both flexible and have a similar degree of bending in a high temperature process. Do.

The flexible substrate 210 adhered on the transport substrate 260 configured as described above undergoes various processes to form a display element on the flexible substrate 210.

As shown in FIG. 3B, the flexible substrate 210 adhered to the substrate 260 for transport according to the present invention has a display device formed on the flexible substrate 210 through various processes.

Several photolithography processes are repeated to form the display device on the flexible substrate 210.

In this case, not only the flexible substrate 210 but also the transport substrate 260 is exposed to and contacted with a developer, a strip solution, an etchant, and the like used in the photolithography process.

However, since the adhesive member 233 has stronger characteristics than the first adhesive member 231 in the developer, strip solution, and etching solution, damage caused by chemicals such as the developer, strip solution, and etchant is minimized.

On the other hand, the first adhesive member 231 may be damaged by penetration of the chemical into the side surface between the flexible substrate 210 and the support substrate 200, but after the manufacturing process of the display element Since the first adhesive member 231 is removed in order to detach and detach the flexible substrate 210 from the transport substrate 260, the damage of the first adhesive member 231 is an inhibitory factor in achieving the object of the present invention. It doesn't work.

The transfer substrate 260 according to the first embodiment of the present invention has the same adhesive strength and chemical resistance or superior to that of the first adhesive member 231 between the support substrate 200 and the dummy flexible substrate 220. Since the member 233 is interposed, the adhesive member 233 is prevented from being eroded or etched by chemicals such as a developer, a strip solution, and an etchant in the process of manufacturing the display element on the flexible substrate 210. can do.

Therefore, the transport substrate 260 can be used to recycle even when manufacturing the display element on the other flexible substrate 210, so that the production cost can be reduced, and the transport substrate 260 does not need to be newly manufactured. Productivity can be improved by shortening the process time.

As shown in FIG. 3C, after the display element is formed on the flexible substrate 210, the adhesive is adhered to the first adhesive member 231 interposed between the flexible substrate 210 and the support substrate 200. The flexible substrate 210 may be detached from the transport substrate 260 by injecting a solution for removing the member.

Although the present invention has been described with reference to the embodiments illustrated in the drawings, this is merely exemplary, and it will be understood by those skilled in the art that various modifications and equivalent other embodiments are possible. Therefore, the true technical protection scope of the present invention will be defined by the technical spirit of the appended claims.

The present invention has a first effect of reducing production cost since the transfer substrate for transferring the flexible substrate may be recycled and used in the process of manufacturing the flexible display device.

In addition, the present invention is to recycle the previously used transport substrate to adhere the flexible substrate to the transport substrate to proceed with the manufacturing process, there is no need to produce a new transport substrate, shorten the process time to improve the productivity of the second Has the effect of.

Claims (42)

Support substrates; A flexible substrate facing one surface of the support substrate; A first adhesive member interposed between the support substrate and the flexible substrate; A dummy flexible substrate facing the other surface of the support substrate; And And a second adhesive member interposed between the support substrate and the dummy flexible substrate and having a greater adhesive force than the first adhesive member. The method of claim 1, The flexible substrate module further comprises a protective member covering the second adhesive member. The method of claim 2, The protective member is a flexible substrate module, characterized in that the sealant (sealant). The method of claim 1, The first adhesive member is a flexible substrate module comprising one of silicon (silicon) and acrylic (acryl). The method of claim 1, The second adhesive member is a flexible substrate module, characterized in that it comprises one of silicon (silicon) and acrylic (acryl). The method of claim 1, A flexible substrate module, characterized in that a display element is formed on the flexible substrate. The method of claim 6, The display element is an array element including a thin film transistor. The method of claim 1, Flexible substrate module, characterized in that the adhesive force of the first adhesive member is 20gf / in (= gram force / inch) or more. The method of claim 1, Flexible substrate module, characterized in that the adhesive force of the second adhesive member is 100gf / in or more. The method of claim 1, The first adhesive member includes a first adhesive layer, an intermediate substrate, and a second adhesive layer. The method of claim 10, The adhesive force of at least one of the first adhesive layer and the second adhesive layer is 20 gf / in (= gram force / inch) or more flexible substrate module. The method of claim 1, The second adhesive member includes a third adhesive layer, an intermediate substrate, and a fourth adhesive layer. The method of claim 12, Flexible substrate module, characterized in that the adhesive force of at least one of the third adhesive layer and the fourth adhesive layer is 100gf / in or more. Preparing a transport substrate including a support substrate, a dummy flexible substrate, and a second adhesive member interposed between the support substrate and the dummy flexible substrate; Preparing a flexible substrate; And And attaching the support substrate and the flexible substrate between the support substrate and the flexible substrate via a first adhesive member having a lower adhesive force than the second adhesive member. The method of claim 14, In the step of preparing the transfer substrate, Forming a protective member covering the second adhesive member, characterized in that it comprises a. The method of claim 14, The method of manufacturing a flexible substrate module, further comprising the step of forming a display element on the flexible substrate adhered to the transfer substrate. The method of claim 15, The protective member is a sealant (sealant), characterized in that the manufacturing method of the flexible substrate module. A dummy flexible substrate facing one surface of the support substrate; A second adhesive member interposed between the support substrate and the dummy flexible substrate; And And a protective member covering the second adhesive member exposed between the support substrate and the dummy flexible substrate. The method of claim 18, A flexible substrate facing the other surface of the support substrate; And The flexible substrate module further comprises a first adhesive member interposed between the support substrate and the flexible substrate. The method of claim 19, A flexible substrate module, characterized in that a display element is formed on the flexible substrate. The method of claim 18, The protective member covers at least a portion of the side surface of the support substrate and at least a portion of the side of the dummy flexible substrate. The method of claim 18, The protective member is a flexible substrate module, characterized in that the sealant (sealant). The method of claim 19, The second adhesive member has a greater adhesive force than the first adhesive member. The method of claim 19, Flexible substrate module, characterized in that the adhesive force of the first adhesive member is 20gf / in (= gram force / inch) or more. The method of claim 18, Flexible substrate module, characterized in that the adhesive force of the second adhesive member is 100gf / in or more. The method of claim 19, The flexible substrate module, wherein the second adhesive member and the first adhesive member have the same adhesive force. The method of claim 19, The first adhesive member includes a first adhesive layer, an intermediate substrate, and a second adhesive layer. The method of claim 27, The adhesive force of at least one of the first adhesive layer and the second adhesive layer is 20 gf / in (= gram force / inch) or more flexible substrate module. The method of claim 18, The second adhesive member includes a third adhesive layer, an intermediate substrate, and a fourth adhesive layer. The method of claim 29, Flexible substrate module, characterized in that the adhesive force of at least one of the third adhesive layer and the fourth adhesive layer is 100gf / in or more. A dummy flexible substrate facing one surface of the support substrate; And The flexible substrate module, characterized in that it comprises an adhesive member interposed between the support substrate and the dummy flexible substrate. The method of claim 31, wherein A flexible substrate facing the other surface of the support substrate; And The flexible substrate module further comprises an adhesive member interposed between the support substrate and the flexible substrate. The method of claim 31, wherein And a protective member covering the adhesive member exposed between the support substrate and the dummy flexible substrate. The method of claim 33, The protective member covers at least a portion of the side surface of the support substrate and at least a portion of the side of the dummy flexible substrate. The method of claim 33, The protective member is a flexible substrate module, characterized in that the sealant (sealant). The method of claim 32, The adhesive member includes one of silicon and acryl. The method of claim 31, wherein The adhesive member includes one of silicon (silicon) and acryl (acryl). The method of claim 32, The adhesive member includes a first adhesive layer, an intermediate substrate, and a second adhesive layer. The method of claim 32, Flexible substrate module, characterized in that the adhesive force of at least one of the first adhesive layer and the second adhesive layer is 20gf / in (= gram force / inch) or more.  Preparing a dummy flexible substrate facing the second side of the support substrate; And And attaching the support substrate and the dummy flexible substrate through an adhesive member between the support substrate and the dummy flexible substrate. The method of claim 40, Preparing a flexible substrate facing the first surface of the support substrate; And And attaching the support substrate and the flexible substrate between the support substrate and the flexible substrate via an adhesive member having a lower adhesive force than the adhesive member. The method of claim 40, The flexible substrate attached to the support substrate further comprises the step of bringing into the process chamber for forming a display element on the flexible substrate.

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