KR20080079194A - Imaging element package, imaging element module and lens barrel, and image capturing apparatus - Google Patents

Abstract

An imaging element package, an imaging element module, a lens barrel, and an imaging device are provided to seal an image element chip without a seal glass and seal rubber and eliminate a space between the seal glass and an optical member to achieve a compact imaging element package. An imaging element package(60) includes an imaging element chip(62) having an imaging plane, a board(64) on which the imaging element chip is mounted, an optical member(66) transmitting light, and a support(68). The support includes a body(70) having a hole(7002) functioning as an optical path used for capturing an image and a mounting part(72) attached to the body. The board is attached to the body of the support to cover one end of the hole while the imaging plane faces from one end of the hole toward the other end thereof. The optical member is attached to the body to close the other end of the hole.

Description

Imaging device package, imaging device module and lens barrel and imaging device {IMAGING ELEMENT PACKAGE, IMAGING ELEMENT MODULE AND LENS BARREL, AND IMAGE CAPTURING APPARATUS}

The present invention relates to an imaging device package, an imaging device module and a lens barrel and an imaging device.

Conventionally, an imaging device chip and an imaging device unit into which the imaging chip is inserted have been provided.

This imaging device unit has the following structure. The imaging device chip is accommodated in the housing recess of the package, and the housing recess is sealed with a seal glass to form the imaging device portion. The imaging element portion is provided on a flexible substrate which is a wiring member. Thereafter, the imaging device portion is assembled to the holder, the seal rubber and the optical member are placed in this order on the seal glass, and the space between the seal glass and the optical element is sealed by further fixing the holder with the compression member. See Patent Publication No. 2005-124099).

Thus, in the conventional imaging element unit, the imaging element chip was sealed with the seal glass and the package, and the space between the seal glass and the optical element was sealed with the optical member, the seal rubber, and the seal glass. This structure has room for improvement. This makes it difficult to reduce the number of parts, which makes it difficult to improve the assembly work. It is also disadvantageous in miniaturization.

Therefore, it is desirable to provide an imaging device package, an imaging device module, a lens barrel, and an imaging device that can reduce costs and are advantageous for miniaturization. This invention was made | formed in view of the above situation.

According to an embodiment of the present invention, an imaging device package includes an imaging device chip having an imaging surface, a substrate on which the imaging device chip is installed, an optical member for allowing light to pass through, and a hole serving as an imaging optical path. The support body which has this penetrating-formed body part and a mounting part provided in the said main-body part and attached to a mounting position is provided. The substrate is attached to the main body so as to close one end in the penetrating direction of the hole while the imaging surface is directed from one end in the penetrating direction of the hole to the other end. The optical member is attached to the main body so as to close the other end in the penetrating direction of the hole.

In addition, according to another embodiment of the present invention, an imaging device module including an imaging device package and a wiring member is provided. The imaging device package includes an imaging device chip having an imaging surface, a substrate on which the imaging device chip is installed, an optical member for allowing light to pass therethrough, a body portion through which a hole serving as an optical path for imaging is penetrated, and It is provided with the support body which is provided in a main-body part, and has a mounting part attached to a mounting position. The substrate is attached to the main body so as to close one end in the penetrating direction of the hole while the imaging surface is directed from one end in the penetrating direction of the hole to the other end. The optical member is attached to the main body so as to close the other end in the penetrating direction of the hole. The substrate is electrically connected to the wiring member.

According to yet another embodiment of the present invention, a lens barrel including a barrel and an image pickup device module is provided, and the image pickup device module includes an image pickup device package and a wiring member. The image pickup device package includes an image pickup device chip having an image pickup surface, a substrate on which the image pickup device chip is installed, an optical member for allowing light to pass through, a main body portion through which a hole serving as an optical path for image pickup is formed, and The support body which has a mounting part provided in the main-body part is provided. The substrate is attached to the main body so as to close one end in the penetrating direction of the hole while the imaging surface is directed from one end in the penetrating direction of the hole to the other end. The optical member is attached to the main body so as to close the other end in the penetrating direction of the hole. The substrate is electrically connected to the wiring member. The mounting portion is attached to the barrel such that the optical member faces the inside of the barrel.

According to yet another embodiment of the present invention, there is provided an imaging device having a lens barrel, wherein the lens barrel includes a barrel and an image pickup device module, wherein the image pickup device module includes an image pickup device package and a wiring member. Include. The imaging device package includes: an imaging device chip having an imaging surface, a substrate on which the imaging device chip is installed, an optical member for allowing light to pass therethrough, and a body portion through which a hole serving as an imaging optical path penetrates; The support body which has a mounting part provided in the said main body part is provided. The substrate is attached to the main body so as to close one end in the penetrating direction of the hole while the imaging surface is directed from one end in the penetrating direction of the hole to the other end. The optical member is attached to the main body so as to close the other end in the penetrating direction of the hole. The substrate is electrically connected to the wiring member. The mounting portion is attached to the barrel such that the optical member faces the inside of the barrel.

According to the present invention, since the conventional seal glass and the seal rubber for sealing the imaging device chip are no longer needed, the space between the seal glass and the optical member can be omitted, thereby reducing component cost and assembly cost. In addition to this, it is possible to provide an advantageous structure for miniaturization.

Embodiments of the present invention will be described below with reference to the drawings.

(First embodiment)

In this embodiment, the case where the imaging device package, imaging device module and lens barrel according to the present invention are inserted into the imaging device will be described.

1 is a perspective view of the image pickup device 100 of the present embodiment from the front, FIG. 2 is a perspective view of the image pickup device 100 of the present embodiment from the back, and FIG. 3 is a perspective view of the image pickup device 100 of the present embodiment from the bottom. 4 is an explanatory diagram for explaining a state of receiving the memory card 132 and the battery 138, and FIG. 5 is a block diagram showing a control system of the imaging apparatus 100. FIG.

As shown in Figs. 1 and 2, the imaging device 100 is a digital still camera.

The imaging device 100 has a rectangular plate-shaped case 102 constituting the exterior, and the case 102 is configured by matching the front case 102A and the rear case 102B.

The front face of the case 102 is formed by the front case 102A, and the back face of the case 102 is comprised by the rear case 102B.

In the present specification, the front side refers to the subject side, the rear side refers to the opposite side, and the left and right sides refer to the state in which the imaging device 100 is viewed from the front side.

The lens barrel 10 is inserted in the right part of the case 102 as shown by the dashed-dotted line in the figure, and the objective lens 14 and the imaging device package according to the present invention are inserted in the lens barrel 10. 60 (see FIG. 6), and an optical system 104 or the like for guiding the object image captured by the objective lens 14 to the imaging device package 60. The imaging device package 60 includes an imaging device chip 62 (refer to FIG. 5) which will be described later.

The objective lens 14 is disposed to face the front of the case 102 through the lens window 103 provided in the front case 102A.

On the right side of the front surface of the case 102, a flash 108, a self-timer lamp 110, and the like, which provide an image pickup auxiliary light, are provided.

The cover 112 is slidably installed in the vertical direction on the front surface of the case 102. The cover 112 has a lower limit position for exposing the lens window 103, the flash 108, and the self-timer lamp 110 to the front surface, and the lens window 103, the flash 108, and the self-timer lamp 110. Slide between the upper limit positions.

In the left part of the upper surface of the case 102, a shutter button 114, a power button 116, and the like are provided.

On the back of the case 102, a display 118 (liquid crystal display) on which images such as still images and moving images, characters and symbols are displayed, a zoom switch 120 for causing zooming operation of the imaging optical system 104, A cross switch 122 and a plurality of operation buttons 124 for performing various operations are provided.

On the left side of the case 102, a mode switch 126 is provided for switching the imaging device 100 to a still image imaging mode, a moving image imaging mode, a reproduction / editing mode, and the like.

As shown in Fig. 3 and Fig. 4, on the bottom of the case 102, a memory accommodating chamber 102A for detachably accommodating a memory card 132 for recording a still image or a moving image or the like, and imaging The battery accommodating chamber 102B which removably accommodates the battery 138 which comprises the power supply of the apparatus 100 is installed side by side in the front-back direction (thickness direction) of the case 102. As shown in FIG. These memory housing chambers 102A and the battery housing chamber 102B are opened and closed by an opening / closing cover 102C connected to the bottom of the case 102 via a hinge.

As shown in FIG. 5, the imaging device chip 62 is constituted by a CD, a CMOS sensor, or the like for imaging an object image formed by the optical system 104.

The image picked up by the image pickup device chip 62 is output to the image processing unit 130 as an image pickup signal. The image processing unit 130 generates image data of a still image or a moving picture based on the image pickup signal, and generates a memory card (memory). Medium). The image data is also displayed on the display 118 by the display processor 134.

In addition, the imaging device 100 controls the image processing unit 130 and the display processing unit 134 in accordance with the operation of the shutter button 114, the cross switch 122, the operation button 124, and the mode switch 126. The control unit 136 including a CPU and the like is provided.

6 is a perspective view of the lens barrel 10 as viewed obliquely from the front, FIG. 7 is a perspective view of the lens barrel 10 as viewed obliquely from the back, FIG. 8 is an exploded perspective view showing a partial configuration of the lens barrel 10, and FIG. 9 is a lens An exploded perspective view showing the remaining configuration of the barrel 10, FIG. 10 is an X-ray cross-sectional view of FIG. 6, and FIG. 11 is an X-ray cross-sectional view of FIG.

6 to 9, the lens barrel 10 includes a barrel 12, an objective lens 14, an image pickup device package 60, and an optical system 104.

In the present embodiment, the optical system 104 includes a prism 16, a zoom movable lens group 18, a focus movable lens group 20, a first fixed lens group 22, and a second fixed lens. A group 24, a third fixed lens group 26, a guide mechanism 28 for the zoom movable lens group 18, and a guide mechanism 30 for the focus movable lens group 20, have.

In addition, a driving means 32 (actuator or the like) for moving the zoom movable lens group 18 and a driving means 34 (actuator or the like) for moving the focus movable lens group 20 are provided.

As shown in FIG. 6 and FIG. 7, the barrel 12 has a flat plate shape having a predetermined width, length and thickness as a whole. The objective lens 14, the image pickup device package 60, and the optical system 104 are arranged side by side along the longitudinal direction of the barrel 12 at the center portion in the width direction of the barrel 12.

The barrel 12 is interposed between the first barrel splitter 1202 and the second barrel splitter 1204 for dividing the barrel 12 in the longitudinal direction, and the two barrel splitters 1202 and 1204. It consists of the 3rd barrel part 1206 which becomes. The 1st barrel part 1202 is located in the one half of the longitudinal direction of the barrel 12, and the 2nd barrel part 1204 is located in the other half of the longitudinal direction of the barrel 12, These 1st A third barrel barrel partition 1206 is interposed between the barrel barrel barrel 1202 and the second barrel barrel barrel 1204.

As shown in FIG. 8, FIG. 10, and FIG. 11, the inside of the 1st cylindrical part 1202 is provided with the open type | mold component accommodating space 1202A at the bottom surface. The objective lens 14 is attached above the front surface of the first barrel segment 1202. In the state in which the lens compression member 1402 is positioned on the front side, the light shielding frame 1404 is located on the rear side.

The prism 16 reflects the image captured by the objective lens 14 downward (on the image pickup device package 60 side). In this embodiment, a prism is used for this purpose. The prism 16 is disposed at the position facing the objective lens 14 in the part accommodating space 1202A.

The first fixed lens group 22 and the zooming movable lens group 18 are disposed below the prism 16 in the part accommodating space 1202A.

The first fixed lens group 22 combines a lens 2202 inserted into a mounting portion of the first barrel segment 1202 and a compression member 2204 (shielding frame) which fixes the lens 2202 to the mounting portion. It is composed of

As shown in FIG. 8, the zoom movable lens group 18 includes a first zoom lens 1802, second and third zoom lenses 1804 and 1805 adhered to each other, and first, second and third zoom lenses. A zoom lens frame 1806 which supports the outer circumferential portions of 1802, 1804, and 1805 by caulking is provided.

The zoom lens frame 1806 is positioned around the first, second, and third zoom lenses 1802, 1804, and 1805 and supports the first, second, and third zoom lenses 1802, 1804, and 1805. 1810 and the extension part 1812 which extends from the support part 1810 in the width direction in the component accommodation space 1202A.

The extension portion 1812 includes a rod insertion hole 1814, flanges 1816 facing each other in the longitudinal direction of the barrel 12, and shafts 3602 and 3602 through the flanges 1816. A female screw member 36 having a female screw 3604 is formed while being immovably coupled in the longitudinal direction of (12).

In addition, the engaging groove 1818 is formed at the position of the support portion 1810 which is located opposite to the extension portion 1812.

In the rod insertion hole 1814, a metal main guide shaft 38 extending in the longitudinal direction of the first barrel segment 1202 is slidably inserted.

The main guide shaft 38 is supported by a wall portion whose both ends in the longitudinal direction constitute an upper surface of the first barrel segment 1202 and a wall portion of the third barrel segment 1206.

The main guide axis 38 extends in parallel with the optical axes of the first, second, and third zoom lenses 1802, 1804, and 1805. Thus, the main guide shaft 38 leads the zoom movable lens group 18 in the optical axis direction of the zoom movable lens group 18.

In the engaging groove 1818, a sub guide shaft 40 (see FIG. 10) extending in parallel with the main guide shaft 38 is slidably inserted. Accordingly, the sub guide shaft prevents the zoom movable lens group 18 from rotating around the main guide shaft 38.

The guide mechanism 28 for the zoom movable lens group 18 is comprised by the main guide shaft 38 and the sub guide shaft 40. As shown in FIG.

As shown in FIG. 8, the driving means 32 for moving the zoom movable lens group 18 includes a holder 3202 extending in the longitudinal direction of the barrel 12 and a motor provided on an upper portion of the holder 3202. 3204 and a male screw member 3206 extending along the holder 3202 and driven to rotate by the motor 3204.

The holder 3202 is attached to the groove portion of the right side surface of the first barrel segment 1202, whereby the male screw member 3206 is located in the part accommodating space 1202A, and the motor 3204 is connected to the first barrel segment ( 1202) on the top.

The male screw member 3206 is screwed into the female screw 3604 of the female screw member 36. Accordingly, the zoom movable lens group 18 is guided by the main guide shaft 38 and the sub guide shaft 40 by the forward and backward rotation of the motor 3204, and reciprocates along their optical axis directions, thereby performing a zoom operation. .

As shown in FIG. 8, the third barrel barrel 1206 includes an internal powder 1206A facing the inside of the component storage space 1202A and an external powder 1206B located outside the component storage space 1202A. Have

The second fixed lens group 24 is attached to the internal powder 1206A in a state in which its optical axis coincides with the optical axis of the movable lens group 18 for zoom, and the iris (2) is attached to the rear surface of the second fixed lens 24. Aperture 42 is disposed. This iris 42 is opened and closed by the drive part 44 attached to the outer part 1206B of the 3rd cylindrical part 1206. As shown in FIG.

As shown to FIG. 9, FIG. 11, the inside of the 2nd barrel division body 1204 is provided with the component accommodation space 1204A which opened up and down in this Example, and the 2nd barrel division body 1204 is provided. By attaching the imaging device package 60 to the lower portion of the lower portion, the lower end of the component accommodation space 1204A is closed.

The focus movable lens group 20 and the third fixed lens group 26 are disposed at positions positioned in the width direction center of the second barrel dividing body 1204 in the component accommodation space 1204A.

As shown in FIG. 9, the focus movable lens group 20 supports the first and second focus lenses 2002 and 2004 adhered to each other and the first and second focus lenses 2002 and 2004. It has a focus lens frame 2006.

The focus lens frame 2006 is positioned around the first and second focus lenses 2002 and 2004 and supports the first and second focus lenses 2002 and 2004, and the support portion 2010. It has the extension part 2012 extended in the width direction in the component accommodation space 1204A from 2010.

The extension portion 2012 includes a rod insertion hole 2014, flanges 2016 that face each other in the longitudinal direction of the barrel 12, and barrels 482 and 4802 to the flanges 2016. A female screw member 48 having a female screw 4804 is formed while being immovably engaged in the longitudinal direction of (12).

In addition, the engaging groove 2018 is formed at the position of the support portion 2010 located on the opposite side to the extension portion 2012.

In the rod insertion hole 2014, a main guide shaft 50 made of metal extending in the longitudinal direction of the second barrel dividing body 1204 is slidably inserted. Both ends of the main guide shaft 50 are supported by the wall portion of the third barrel portion 1206 and the wall portion provided below the second barrel portion 1204.

The main guide shaft 50 extends in parallel with the optical axes of the first and second focus lenses 2002 and 2004. Therefore, the main guide shaft 50 guides the focus movable lens group 20 in the optical axis direction of the focus movable lens 28.

In the engaging groove 2018, a subguide shaft 52 (see Fig. 10) extending in parallel with the main guide shaft 50 is slidably inserted. Thus, the sub guide shaft 52 prevents the focusing lens 20 from rotating around the main guide shaft 50.

The guide mechanism 30 for the focusing movable lens group 20 is constituted by these main guide shafts 50 and the sub guide shafts 52.

As shown in FIG. 9, the driving means 34 for moving the focusing lens group 20 includes a holder 3402 extending in the longitudinal direction of the barrel 12 and a motor provided below the holder 3402. 3404 and a male screw member 3406 extending along the holder 3402 and driven to rotate by the motor 3404.

The holder 3402 is attached to the groove portion on the right side of the second barrel segment 1204, whereby the male screw member 3406 is located in the part accommodating space 1204A, and the motor 3404 is the second barrel segment ( 1204).

The male screw member 3406 is screwed to the female screw 4804 of the female screw member 48. Accordingly, the focusing lens group 20 is guided to the main guide shaft 50 and the sub guide shaft 52 by the front and rear rotation of the motor 3404, and reciprocates along their optical axis directions, thereby performing the focusing operation.

The 3rd fixed lens group 26 is arrange | positioned in the position of the component accommodation space 1204A below the focusing movable lens group 20, and is inserted into the mounting part of the 2nd barrel division body 1204. It consists of a group 2602 and the compression member 2604 which fixes this 3rd fixed lens group 2602 to the said mounting part.

As shown in FIG. 11, the unevenness | corrugation is provided between the upper end of the 2nd barrel part 1204, and the 2nd fixed lens group 24 on the back surface of the 2nd part of the barrel part 1204 facing the component accommodation space 1204A. Part 1204C is installed.

In addition, an uneven portion 1204D is installed at a position between the third fixed lens group 26 and the image pickup device package 60 at the rear position of the second barrel split body 1204 facing the component accommodation space 1204A. .

These uneven parts 1204C and 1204D are formed to prevent the following disadvantages. Light incident through the objective lens 14, the prism 16, the first fixed lens group 22, the zoom movable lens group 18, the second fixed lens group 24, and the focus movable lens group 20. Among them, light reaching the rear position of the second barrel barrel 1204 facing the component housing space 1204A is reflected. As a result, so-called flare or ghost reflection light is generated, and the reflected light reaches the imaging surface of the imaging device chip 62 of the imaging device package 60 and adversely affects the imaging signal of the imaging device chip 62.

As shown in FIG. 9, a barrel side mounting portion 1205 for installing the image pickup device package 60 is provided at the lower portion of the barrel 12 (lower portion of the second barrel barrel split body 1204).

As shown in FIG. 15, the barrel side mounting portion 1205 is provided with an opening 1204B for directing the imaging device chip 62 toward the component accommodation space 1204A. Around this opening 1204B, two female screws 1210, two positioning pins 1212, two positions around two female screws 1210, and a total of three positions away from the female screws 1210 The positioning surface (reference surface) 1214 provided in several places is formed. The positioning surface 1214 extends on the plane perpendicular to the penetrating direction of the opening 1204B.

Next, the image pickup device package 60 which is the subject of this invention is demonstrated in detail.

12 is an exploded perspective view of the image pickup device package 60, FIG. 13 is a sectional view of the image pickup device package 60, FIG. 14 is a plan view of the image pickup device package 60, and FIG. 15 is a barrel 12 of the image pickup device package 60. Fig. 16 is an explanatory diagram for assembling the imaging device package 60. Figs.

12 and 13, the imaging device package 60 includes an imaging device chip 62, a substrate 64, an optical member 66, and a support 68.

The imaging device chip 62 is a so-called bare chip and has a rectangular plate shape.

As illustrated in FIG. 14, a rectangular imaging surface 62A is formed at one center of the imaging device chip 62 in the thickness direction. In the rectangular area around the imaging surface 62A, a plurality of electrode pads 6202 and positioning alignment marks 6204 (reference points) for positioning described later are provided.

The substrate 64 is electrically connected to the imaging device chip 62.

As shown in Figs. 12 and 13, the substrate 64 has a rectangular plate shape having a contour larger in circumference than the image pickup device chip 62, and is located at the center of the surface located on one side in the thickness direction of the substrate 64. The back surface positioned opposite to the imaging surface 62A of the imaging device chip 62 is bonded and fixed with an adhesive such as a die bond adhesive.

On the front surface of the substrate 64, an electrode pad (not shown) for connecting an imaging device chip is provided at a position corresponding to the electrode pad 6202 of the imaging device chip 62. As shown in FIG. 13, the electrode pad 6202 (see FIG. 14) of the image pickup device chip 62 and the electrode pad for connecting the image pickup device chip are electrically connected through a gold wire 65.

In addition, an external terminal for wiring (not shown) is provided on the back surface of the substrate 64. The external terminal is electrically connected to the image pickup device chip connection electrode pad through the internal wiring of the substrate 64.

The wiring electrode pad is electrically connected to a flexible substrate 74 serving as a wiring member for exchanging signals with the imaging device chip 62. As the wiring member, not only the flexible substrate 74 but also various wiring substrates such as a multilayer substrate such as an organic substrate can be adopted.

In this embodiment, the imaging device chip connection electrode pad and the wiring external terminal are formed by performing nickel plating or gold plating on the tungsten wiring.

In the present embodiment, as will be described later, the substrate 64 and the flexible substrate 74 are electrically connected by reflow soldering. The board | substrate 64 is formed with the material which has the heat resistance which can be reflow soldered.

As a material which has such heat resistance, various materials, such as a multilayer high temperature baking ceramic substrate and an organic substrate, can be employ | adopted, for example.

The optical member 66 enables the transmission of light. Examples of the optical member 66 include a cover glass, an optical filter, a lens, and the like.

In this embodiment, the optical member 66 is constituted by forming a coating film (coat layer) having an optical filter function on the surface of a rectangular plate-shaped cover glass formed of a transparent glass material.

The support body 68 is equipped with the main body part 70 and the mounting part 72. As shown in FIG.

The support body 68 is formed of a material having heat resistance that can be reflow soldered and excellent in workability (which can be processed with high precision).

In other words, as the support body 68, a material having a small dimensional variation even during heating processing such as an assembly process and reflow soldering is preferable, and a material having high processing accuracy and good formability is preferable.

In addition, the support body 68 needs to maintain the positional relationship with the imaging device chip 62 and the support body 68 positioned with respect to the alignment mark 6204 of the imaging device chip 62, as mentioned later.

In the present embodiment, the support 68 is formed of an epoxy resin for injection molding.

The epoxy resin for injection molding can be molded with high precision, and can be processed with the precision of several micrometers which are optically required.

In addition, the epoxy resin for injection molding is excellent in heat resistance. Therefore, even in the reflow soldering temperature of 200 degreeC vicinity, initial processing precision can be maintained without causing a shape change. Thereby, in the assembly process and the reflow soldering process, the positional relationship of the support body 68 positioned with respect to the alignment mark 6204 of the imaging device chip 62 can be maintained.

In this embodiment, although the high-precision injection molding epoxy material was used as the support body 68, the same effect can be expected even when using heat-resistant plastic materials, such as a liquid crystal polymer, as long as it meets optical performance, such as processing precision and a deformation | transformation. .

In the main body portion 70, a through hole 7002 (hereinafter, simply referred to as a hole 7002) serving as an optical path for imaging is formed.

The hole 7002 has a rectangular cross section, and therefore, the main body portion 70 has a rectangular frame shape.

The inner part of the main body part 70 which forms the hole 7002 is formed with the inclined surface 7004 in which the cross section of the hole 7002 becomes small gradually toward the other end from the one end of a penetrating direction.

Further, at the other end of the inner portion of the main body portion 70, that is, at the end near the other end of the inclined surface 7004, it is widened in the direction orthogonal to the direction of penetration of the hole 7002, and the A recess 7010 is formed to hold the excess adhesive that does not contribute to adhesion.

The attaching portion 72 is a portion where the image pickup device package 60 is attached to the mounted position. In the present embodiment, the mounting position is the barrel 12 inserted into the imaging device 100.

As shown in FIG. 13, the mounting part 72 is provided in the position of the main-body part 70 of the vicinity of the end of the hole 7002 in the penetrating direction.

As shown in FIG. 14, the mounting portion 72 has a contour having a larger circumference than the main body portion 70, and has a rectangular plate shape that widens in a direction orthogonal to the through direction of the hole 7002.

In the mounting portion 72, two screw insertion holes 7202 and two positioning holes 7204 are formed. Those holes 7202 and 7204 extend in a direction parallel to the direction of penetration of the holes 7002.

Positioning surfaces (reference surfaces) 7206 for positioning are formed in three directions along the optical axis for imaging. That is, in the surface of the mounting part 72 located in the other end vicinity of the said penetrating direction, it is formed in the two positions around two screw insertion holes 7202, and the position separated from those screw insertion holes 7202. As shown in FIG. The positioning surface 7206 extends to a surface orthogonal to the through direction of the hole 7002.

The board | substrate 64 is attached to the main-body part 70 so that the imaging surface 62A may close the one end of the penetration direction of the hole 7002 in the state which directed the other end from the one end of the penetration direction of the hole 7002.

In the present embodiment, the substrate 64 is bonded to the main body portion 70 by the thermosetting adhesive.

The optical member 66 is attached to the main body 70 so as to close the other end in the penetrating direction of the hole 7002.

In this embodiment, the optical member 66 is adhered to the main body portion 70 by a thermosetting adhesive.

In this way, the substrate 64 and the optical member 66 are attached to both ends of the main body portion 70, whereby the space in which the image pickup device chip 62 is accommodated is sealed.

The central axis passing through the center of the imaging surface 62A and orthogonal to the imaging surface 62A and the central axis of the hole 7002 coincide with each other, and the inner portion of the main body portion 70 forming the hole 7002 is the image pickup device chip 62. It is formed as an inclined surface 7004 gradually spaced apart from the central axis as it approaches.

In this embodiment, the imaging device package includes a fixed aperture 80.

The fixed aperture 80 limits the area of light transmitted through the optical member 66.

By the fixed aperture 80, stray light inside the barrel 12 is prevented from entering the imaging surface 62A of the imaging device chip 62, thereby preventing ghost.

The fixed stop 80 is integrally formed with the inner part at a position near the other end in the penetrating direction of the hole 7002 in the inner part of the main body part 70 through which the hole 7002 is formed.

In the present embodiment, the fixed diaphragm 80 is formed at the end of the inclined surface 7004 facing the concave portion 7010, and has a rectangular frame shape when viewed in plan view.

A part of the light transmitted through the optical member 66 is reflected from the inner circumferential surface of the hole 7002 of the main body portion 70 or the imaging surface 62A, so that stray light may occur.

In particular, as in the present embodiment, when the optical member 66 is formed by forming a coating film (coat layer) having an optical filter function on the surface of the cover glass, the coating film is an IR coat having a function of cutting infrared rays When the stray light is reflected at the interface between the coating film and the cover glass and is incident on the imaging surface 62A, red ghost may be generated.

In this case, the smaller the angle of incidence of stray light incident on the optical member 66 (the interface) (the angle of stray light with respect to a normal perpendicular to the surface of the optical member 66), the more components of the stray light are at the interface. The amount of stray light reflected by the light reflected on the interface and incident on the imaging surface 62A decreases.

On the other hand, as in the present embodiment, the larger the angle between the inclined plane 7004, which is the inner circumferential surface of the hole 7002, and the imaginary line orthogonal to the imaging plane 62A, the more the angle reflected by the inclined plane 7004 is reflected by the imaging plane 62A. It has been found that the incident angle at which stray light enters the interface becomes small.

In the present embodiment, the red ghost can be suppressed by setting the angle of the inclined surface 7004 to the virtual line orthogonal to the imaging surface 62A to 5 degrees or more.

Alternatively, the fixed stop 80 may be configured as follows.

17 is a cross-sectional view of the image pickup device package 66 which shows a modification of the fixed stop 80, and FIG. 18 is a perspective view of the image pickup device package 66 which shows a modified example of the fixed stop 80.

As shown in FIG. 17, FIG. 18, the inner part of the main-body part 70 is a wall surface extended in the direction parallel to the penetrating direction of the hole 7002 so that the cross section of the hole 7002 may be uniform along a penetrating direction ( 7020).

At the position near the other end of the wall surface 7020, the wall portion 7702 protrudes in an annular shape to the inside of the hole 7002 over the entire circumference of the hole 7002.

The inner part of the wall part 7202 is formed as the projection 7024 which becomes small in cross section as it approaches the front-end | tip.

The fixed stop 80 is formed by the wall portion 7202 and the protrusion 7024.

In this case, since the inner part of the wall part 7202 is formed as the projection 7024 which becomes small in cross section as it approaches the tip, the light which touched the surface of the projection 7024 is with respect to the penetration direction of the hole 7002. Guided in inclined direction. In other words, stray light incident on the imaging surface 62A can be suppressed in the direction inclined with respect to the imaginary line orthogonal to the imaging surface 62A, which is advantageous for preventing the generation of ghost.

Next, the assembly of the image pickup device package 60 will be described.

First, the image pickup device chip 62 is bonded to the substrate 64 by a die bond adhesive, and the image pickup device chip 62 and the substrate 64 are electrically connected by the gold wire 65. An imaging device chip 62 is provided at 64.

Next, with reference to FIG. 16, the attachment of the board | substrate 64 with the imaging element chip 62 to the support body 68 is demonstrated.

First, the adjustment jig used for this attachment is demonstrated.

The adjusting jig includes an upper head 200, a surface plate or level block 202, a fixing pin 204, a CCD camera 210, an image recognition device (not shown), a mounting device not shown, and the like. do.

The upper head 200 supports the substrate 64 on which the imaging device chip 62 is installed, in a state where the top and bottom thereof are inverted, that is, in a state where the imaging surface 62A of the imaging device chip 62 faces downward. .

The upper head 200 is comprised so that the said mounting apparatus may move along X-axis, Y-axis, and Z-axis orthogonal to each other, and may rotate around the three axes.

The surface plate 202 is fixed to the lower side of the upper head 200, is secured in plan view, and extends in parallel along the plane including the X axis and the Y axis.

Two fixing pins 204 protrude upward from the surface plate 202 (in the Z-axis direction), and insert the support bodies 68 into the two positioning holes 7204 of the support body 68. It supports in an unmovable direction with respect to each extension direction of an axis, a Y axis, and a Z axis.

The CCD camera 210 is provided so that the imaging surface 62A of the imaging device chip 62 can be picked up through the hole 7002 of the support body 68 supported by the fixing pin 204.

Next, the attachment of the substrate 64 to the support 68 will be described.

The substrate 64 provided with the image pickup device chip 62 is fixed to the upper head 200.

Next, the fixing pin 204 is fitted into the positioning hole 7204 of the support body 68 to fix the support body 68 to the surface plate 202.

At this time, the inclination of the support body 68 is defined by the positioning surface 7206 of the support body 68, and the rotation direction (rotation angle θ direction) around each axis of the X-axis, Y-axis, and Z-axis is determined by the positioning hole ( 7204).

Next, the thermosetting adhesive material 2 is applied to one end of the main body portion 70 of the support body 68, and the alignment mark 6204 (see FIG. 14) and the positioning hole 7204 of the imaging surface 62A are attached to the CCD. Imaging with the camera 210 is performed. The captured image is recognized by the image recognition device. Based on the recognition result, the upper head 200 is moved in the X-axis direction, the Y-axis direction, and the rotational direction around the Z-axis, respectively, so as to be within the flat plane of the image pickup device chip 62 and the support body 68. Positioning is performed.

As a result, positioning within the planar surface of the positioning hole 7204 of the image pickup device chip 62 and the support body 68 is performed.

Once the positioning in the ＸＹ plane is made, by using the image recognition device and the mounting apparatus, the Rx adjustment in the plane formed between the X and Z axes, that is, the positioning in the rotational direction about the Y axis and , Ry adjustment in the plane formed by the Y axis and the Z axis, that is, positioning in the rotational direction about the X axis is performed.

Positioning is performed so that the imaging surface 62A of the imaging device chip 62 and the positioning surface 7206 of the support body 68 are parallel.

That is, the central axis passing through the center of the imaging surface 62A and orthogonal to the imaging surface 62A coincides with the central axis of the hole 7002.

Next, the substrate 64 is moved in the Z-axis direction while maintaining the relative positional relationship between the image pickup device chip 62 and the support body 68. The surface of the board | substrate 64 and the one end of the main-body part 70 of the support body 68 are made to contact, and the thermosetting adhesive 2 is heated and hardened using a heater (not shown).

Thereby, the support of the board | substrate 64 with which the imaging device chip 62 was provided in the state in which positioning with the positioning hole 7204 and the positioning surface 7206 of the imaging device chip 62 and the support body 68 was performed. Assembly to one end of the body portion 70 of 68 is completed.

In this embodiment, the support body 68 is formed of the above-mentioned injection molding epoxy resin, so that ± 30 μm in the X axis direction, ± 30 μm in the Y axis direction, ± 0.5 ° in the rotational direction θ around the Z axis, and the X axis It was confirmed that the Rx adjustment in the plane formed by the Z axis and the Z axis made it possible to adjust the high ability exceeding the capability capability index 1.5 with the precision of 6 ′ by the Ry adjustment in the plane formed by the Y axis and the Z axis. .

Next, attaching the support body 68 to the optical member 66 is demonstrated.

First, the thermosetting adhesive 2 is apply | coated to the other end of the hole 7002 of the main-body part 70 of the support body 68 in the axial direction.

Subsequently, the optical member 66 is mounted on the other end of the main body part 70, and the thermosetting adhesive 2 is heated and hardened using a heater (not shown).

Accordingly, the assembly of the optical member 66 to the other end of the main body 70 is completed, thereby completing the assembly of the imaging device package 60.

In the present embodiment, the case where the thermosetting adhesive 2 is used for adhesion of the substrate 64 and the optical member 66 to the support 68 is explained, but of course, the ultraviolet curing adhesive may be used.

However, when using an ultraviolet curable adhesive, it requires some time to irradiate an ultraviolet curable adhesive uniformly. On the other hand, when using the thermosetting adhesive 2, by using a heater, the thermosetting adhesive 2 interposed between the board | substrate 64 and the support body 68 can be heated evenly and simply by a reliable method. Therefore, it is advantageous at the point that hardening of the thermosetting adhesive 2 can be performed reliably in a short time.

Next, the assembly of the image pickup device package 60 and the flexible substrate 74 will be described.

The assembly of the imaging device package 60 and the flexible board 74 is performed by electrically connecting the external terminal for wiring on the back of the board 64 and the wiring terminal provided on the flexible board 74 by reflow soldering. .

By assembling the flexible substrate 74 on the imaging device package 60 in this manner, the imaging device module 76 is configured.

Next, the assembling of the image pickup device module 76 to the barrel 12 will be described.

As shown in FIG. 15, the main body part 70 of the support body 68 is inserted in the opening 1204B of the barrel 12, and each positioning pin 1212 of the barrel side mounting part 1205 is attached to the mounting part 72. As shown in FIG. Are inserted into the respective positioning holes 7204. Positioning of the imaging device module 76 relative to the barrel 12 by bringing each positioning surface (reference surface) 1214 of the barrel side mounting portion 1205 into contact with each positioning surface (reference surface) 7206 of the mounting portion 72. This is done.

During the positioning, the screw N is fastened to each female screw 1210 through each screw insertion hole 7202 of the mounting portion 72.

Accordingly, the optical member 66 is directed toward the inside of the barrel 12, that is, the imaging surface 62A is positioned on the optical axis of the optical path in the barrel 12, so that the image pickup device package 60 is placed on the barrel 12. By attaching to, the assembly of the imaging device module 76 to the barrel 12 is completed.

As described above, in the present embodiment, the imaging device package 60 includes the imaging device chip 62, the substrate 64 on which the imaging device chip 62 is installed, the optical member 66, and the support ( 78).

Therefore, the number of components can be reduced and the configuration can be simplified as compared with the conventional imaging device unit. This configuration is advantageous for component cost, assembly cost reduction, and miniaturization.

That is, the conventional image pickup device unit has a structure in which the image pickup device portion is provided on a flexible substrate which is a wiring member. In the imaging device portion, the imaging device chip is accommodated in the housing recess of the package, and the housing recess is sealed with a seal glass. In addition, the imaging device portion is assembled to a holder, and the seal rubber and the optical member are placed on the seal glass in this order. Then, the space between the seal glass and the optical element is sealed by fixing the optical member to the holder with a compression member. Therefore, the number of parts increases and the assembly cost also increases.

In contrast, in the present embodiment, the main body portion 70 has the substrate 64 closed so that one end of the through direction of the hole 7002 is closed while the imaging surface 62A faces the other end from one end of the through direction of the hole 7002. Attach to. The image pickup device chip 62 is sealed by attaching the optical member 66 to the main body portion 70 so as to close the other end in the through direction of the hole 7002. Therefore, not only the seal glass and the seal rubber for sealing the imaging device chip are required, but also the space between the seal glass and the optical member can be omitted. This configuration is advantageous for component cost, assembly cost reduction, and miniaturization.

Moreover, conventionally, it has become the double sealing structure which seals the accommodating recessed part in which the imaging element chip was accommodated with the seal glass, and seals the edge part of the seal rubber put on the seal glass with an optical member. Therefore, the structure of a package was complicated, and occupied space was required in both the direction parallel to the optical axis for imaging, and the direction orthogonal to the optical axis for imaging. As a result, the parts cost increases, which is disadvantageous for miniaturization.

In the above-described configuration of the present embodiment, since the substrate 64 is used instead of the package having a complicated shape having a receiving recess, and the seal glass for sealing the imaging device chip can also be used as the optical member 66, the component It is advantageous in reducing the cost and miniaturization in both the direction parallel to the optical axis for imaging and the direction orthogonal to the optical axis for imaging.

In the above-described configuration of the present embodiment, since the support body 68 is formed of a material having heat resistance capable of reflow soldering, both the substrate 64 and the optical member 66 on which the imaging device chip 62 is installed are supported by the support body ( In the state bonded to 68, the substrate 64 can be attached to the flexible substrate 74 as the wiring member by reflow soldering.

Therefore, even if a high temperature is used during reflow soldering, the support body 68 is not deformed or damaged, so that the positional accuracy of the imaging device chip 62 (the imaging surface 62A) with respect to the support body 68, or the barrel 12 The positional accuracy of the image pickup device chip 62 with respect to the image pickup device chip 62 or the positional accuracy of the image pickup device chip 62 with respect to the optical axis for image pickup can be ensured, as well as the image pickup device package 60 and the image pickup device module 76. It is advantageous to simplify the assembling work.

In the above configuration, the imaging device package 60 includes an imaging device chip 62, a substrate 64 provided with the imaging device chip 62, an optical member 66, and a support body 68. The fixed diaphragm 80 is integrally installed in the inner part of the support body 68.

Therefore, the number of components can be reduced and the configuration can be simplified as compared with the conventional imaging device unit. This configuration is advantageous for component cost, assembly cost reduction, and miniaturization.

That is, in the conventional imaging device unit, the imaging device portion is provided on the flexible substrate which is the wiring member. In the imaging device unit, the imaging device chip is accommodated in the housing recess of the package, and the housing recess is sealed with a seal glass. Subsequently, the imaging device portion is assembled to a holder, a seal rubber is placed on the seal glass, and a light shielding sheet for forming a fixed aperture is placed on the seal rubber. Further, the optical member is placed on the light shielding sheet, and the space between the seal glass and the optical element is sealed by fixing the optical member to the holder with a compression member. Therefore, the number of parts is high and the assembly cost is higher.

On the other hand, if it is comprised like this embodiment mentioned above, the board | substrate 64 may be closed so that the imaging surface 62A may close the one end of the through direction of the hole 7002 in the state which directed from one end of the through direction of the hole 7002 to the other end. The image pickup device chip 62 is sealed by attaching to the main body 70 and attaching the optical member 66 to the main body 70 so as to close the other end in the through direction of the hole 7002. The fixed stop 80 is integrally installed in the inner portion of the support body 68. Therefore, not only the seal glass and the seal rubber for sealing the imaging device chip are required, but also the space between the seal glass and the optical member can be omitted. The light shielding sheet conventionally required is not required. This configuration is advantageous for component cost, assembly cost reduction, and miniaturization.

In addition, since the conventional structure has a double sealing structure in which the accommodating recess in which the imaging device chip is accommodated is sealed with a seal glass and the end of the seal rubber placed on the seal glass is sealed with an optical member, the structure of the package is complicated, The occupied space in both the direction parallel to the optical axis for imaging, and the direction orthogonal to the optical axis for imaging was required. As a result, the parts cost increases, which is disadvantageous for miniaturization.

In the above-described configuration of the present embodiment, since the substrate 64 is used instead of the package having a complicated shape having a receiving recess, and the seal glass for sealing the imaging device chip can also be used as the optical member 66, the component It is advantageous in reducing the cost and miniaturization in both the direction parallel to the optical axis for imaging and the direction orthogonal to the optical axis for imaging.

In the above-described configuration of the present embodiment, since the support body 68 is formed of a material having heat resistance capable of reflow soldering, both the substrate 64 and the optical member 66 on which the imaging device chip 62 is installed are supported by the support body ( In the state bonded to 68, the substrate 64 can be attached to the flexible substrate 74 as the wiring member by reflow soldering.

Therefore, even if a high temperature is used during reflow soldering, the support body 68 is not deformed or damaged, so that the positional accuracy of the imaging device chip 62 (the imaging surface 62A) with respect to the support body 68, or the barrel 12 The positional accuracy of the image pickup device chip 62 with respect to the image pickup device chip 62 or the positional accuracy of the image pickup device chip 62 with respect to the optical axis for image pickup can be ensured, as well as the image pickup device package 60 and the image pickup device module 76. It is advantageous to simplify the assembling work.

(2nd Example)

Next, a second embodiment of the present invention will be described.

19 is an exploded perspective view of the support body 68 in the second embodiment. 20 is an explanatory view of the assembly of the support body 68 in the second embodiment. Fig. 21 is an explanatory view of the assembly of the support body 68 in the second embodiment. Fig. 22 is a perspective view of the main body portion 70 in the second embodiment. Fig. 23 is a sectional view of the image pickup device package 60 in the second embodiment. 24 is a plan view of the image pickup device package 60 in the second embodiment.

The second embodiment differs from the first embodiment in that the main body portion 70 and the mounting portion 72 of the support body 68 are each composed of different members. That is, as shown in Figs. 19, 20, and 21, the main body portion 70 of the support body 68 is formed of the main body member member 82 made of a ceramic material, and the mounting portion 72 is mounted made of a metal material. It is formed of the bouillon member 84, and the support body 68 is completed by assembling them.

A ceramic fired material can be used as the ceramic material constituting the body member 82.

The ceramic material (ceramic plastic material) has insulation and is suitable for accommodating the image pickup device chip 62. The material has low moisture permeability and is excellent in preventing moisture from penetrating, and has excellent airtightness. In addition, the thermal conductivity of the ceramic material (ceramic plastic material) is about 20-30 W / mK, and has excellent heat dissipation properties as compared with the plastic molding material (0.5 to 0.8 W / mK).

As shown to FIG. 22, FIG. 23, the member 82 for main-body parts becomes a rectangular cylindrical shape, and the inner space serves as the hole 7002. As shown to FIG.

The outer circumferential surface of the body member 82 has four side surfaces. Among these sides, the positioning portion 86 is formed on two sides facing each other. The positioning unit 86 is formed to protrude convexly.

On each of two sides, two positioning units 86 are provided. In each of the positioning portions 86, a positioning surface 8602 orthogonal to these side surfaces is formed at a position located at an intermediate portion in the longitudinal direction of the body member.

Kovar may be used as the metal material constituting the mounting member 84.

Cobar is an alloy in which nickel and cobalt are mixed with iron, and is known as a material suitable for glass welding (glass welding).

COVA has a thermal conductivity of 19.7 W / mK and has high heat dissipation as with ceramic materials (ceramic plastics).

COVA is suitable as the mounting part 72 because it is excellent in mechanical properties and workability and a high precision component can be obtained.

As shown in FIG.20, FIG.23, the attaching member 84 is set to the rectangular plate shape of the outline larger than the member 82 for main body parts. In the mounting member 84, a rectangular insertion hole 8402 is formed at the center thereof, and the main body member 82 is inserted therein. An insertion hole 8402 is formed to penetrate the mounting member 84 in a direction perpendicular to the thickness direction of the mounting member 84.

The mounting part member 84 is comprised of the 1st surface 8410 and the 2nd surface 8212 located in the both ends of the thickness direction. The first surface 8410 is located at the side of the main body 70 where the substrate 64 is disposed. The second surface 8212 is located at the main body 70 side where the optical member is disposed.

The positioning portion 86 is configured such that the body portion member 82 comes into contact with the second surface 8212 of the mounting portion member 84 when the body portion member 82 is inserted into the insertion hole 8402, Thereby, positioning in the penetrating direction of the insertion hole 8402 with respect to the mounting part member 84 of the main-body member 82 is performed.

The support body 68 is comprised by integrating the main-body member 82 and the mounting-member member 84 in a state where the main-body member 82 is inserted into the insertion hole 8402.

The integration of the main body member 82 and the mounting member 84 can be performed by adopting various joining methods known in the art, such as adhesives. In this embodiment, as shown in FIG. 21, in a state where the main body member 82 is inserted into the insertion hole 8402, the outer peripheral surface of the main body member 82 is of the mounting part member 84 facing the outer peripheral surface. Glass is welded to the part.

In glass welding, the weld glass 88 melted by high temperature is used for welding (welding and sealing) between the outer circumferential surface of the main body portion member 82 and the portion of the mounting portion member 84 facing the outer circumferential surface.

When the metal material and the ceramic material are joined by glass welding, sufficient bonding strength can be obtained even in a high temperature environment by reflow soldering or the like, which is advantageous over the prior art.

Coba's linear expansion coefficient is 5 × 10 ⁻⁶ / ° C., which is quite close to the linear expansion coefficient of 7 × 10 ⁻⁶ / ° C. of the ceramic material (ceramic plastic). Therefore, when the cobar and the ceramic fired material are bonded together, high bonding reliability can be obtained, which is advantageous.

According to the second embodiment, in addition to the advantages in the first embodiment, the following advantages are provided.

When the main body portion 70 is composed of the main body portion member 82 made of ceramic material, the moisture permeability of the main body portion 70 can be considerably lowered, so that the imaging device chip 62 vulnerable to a humidity environment can be protected. It is advantageous to secure durability and reliability of the device package 60.

Moreover, since the mounting part 72 is comprised from the mounting part member 84 which consists of metal materials, it is advantageous to ensure durability against the impact applied to the mounting part 72 from the exterior by a fall or vibration.

The heat generated by the imaging device chip 62 is radiated to the barrel 12 via the substrate 64, the main body portion 70, and the mounting portion 72. In the present embodiment, since the substrate 64 and the main body portion 70 are formed of a ceramic material, and the mounting member 72 is formed of a metal material, the heat dissipation of the imaging device chip 62 is improved. It is advantageous. Therefore, the present embodiment is advantageous in increasing the stability of the operation of the imaging device chip 62 and extending the lifespan by suppressing the temperature rise of the imaging device chip 62.

In the present embodiment, the digital still camera is exemplified as the imaging device, but the present invention can of course also be applied to various imaging devices such as a video camera and a television camera.

This application is a Japanese patent No. 1 filed with a Japanese Patent Office on February 26, 2007. Japanese Patent No. 2007-045533, filed with the Japan Patent Office on December 5, 2007 It includes topics related to 2007-314724, all of which are hereby incorporated by reference.

1 is a perspective view of the image pickup device 100 of the first embodiment as seen from the front.

2 is a perspective view of the image pickup device 100 of the first embodiment as seen from the back.

3 is a perspective view of the imaging device 100 of the first embodiment as seen from below.

4 is an explanatory diagram for explaining an accommodation state of the memory card 132 and the battery 138.

5 is a block diagram showing a control system of the imaging apparatus 100.

6 is a perspective view of the lens barrel 10 viewed obliquely from the front.

7 is a perspective view of the lens barrel 10 viewed obliquely from the rear.

8 is an exploded perspective view showing a part of the lens barrel 10.

9 is an exploded perspective view showing the remaining configuration of the lens barrel 10.

10 is a cross-sectional view taken along line X-ray of FIG. 6.

FIG. 11 is a cross-sectional view taken along line X in FIG. 6. FIG.

12 is an exploded perspective view of the image pickup device package 60.

13 is a cross-sectional view of the image pickup device package 60.

14 is a plan view of the image pickup device package 60.

15 is an explanatory diagram for attaching the image pickup device package 60 to the barrel 12.

16 is an explanatory diagram for assembling the image pickup device package 60.

17 is a cross-sectional view of the image pickup device package 66 which discloses a modification of the fixed stop 80.

18 is a perspective view of an image pickup device package 66 which discloses a modification of the fixed stop 80.

19 is an exploded perspective view of the support body 68 in the second embodiment.

20 is an explanatory view of the assembly of the support body 68 in the second embodiment.

Fig. 21 is an explanatory view of the assembly of the support body 68 in the second embodiment.

Fig. 22 is a perspective view of the main body portion 70 in the second embodiment.

Fig. 23 is a sectional view of the image pickup device package 60 in the second embodiment.

24 is a plan view of the image pickup device package 60 in the second embodiment.

Claims (21)

An imaging device chip having an imaging surface, A substrate provided with the imaging device chip; An optical member for allowing light to pass through, A support having a main body through which a hole serving as an optical path for imaging is penetrated, and a mounting part provided on the main body and attached to a mounted position; The substrate is attached to the main body so as to close one end of the through direction of the hole while the imaging surface faces the other end from one end of the through direction of the hole, And the optical member is attached to the main body so as to close the other end in the penetrating direction of the hole. The method of claim 1, Attaching the main body portion and the substrate is an image pickup device package, characterized in that the adhesion by the adhesive. The method of claim 1, Attaching the main body portion and the optical member is an image pickup device package, characterized in that made by the adhesive. The method of claim 1, And an inner portion of the main body portion forming the hole is formed as an inclined surface whose cross section of the hole gradually decreases from one end in the through direction to the other end. The method of claim 1, The central axis passing through the center of the imaging plane and orthogonal to the imaging plane coincides with the central axis of the hole, And an inner portion of the main body portion forming a hole is formed as an inclined surface that is gradually spaced apart from the central axis of the image pickup device as it approaches the image pickup device chip. The method of claim 1, And the substrate is formed of a material having heat resistance capable of reflow soldering. The method of claim 1, And the substrate is a ceramic substrate. The method of claim 1, And the optical member is a cover glass, an optical filter, or a lens. The method of claim 1, And the optical member comprises a cover glass and a coat layer having an optical filter function provided on a surface of the cover glass. The method of claim 1, The support is an image pickup device package, characterized in that formed of a material having excellent heat resistance and reflow soldering processability. The method of claim 1, The support is an image pickup device package, characterized in that formed of epoxy resin for injection molding. The method of claim 1, The body portion is composed of a member for body portion made of ceramic material, The mounting portion is composed of a mounting member made of a metal material, The support is an image pickup device package, characterized in that the main body member and the mounting member is assembled and integrated. The method of claim 12, The main body member has a rectangular cylindrical shape, and the inner space of the main body member becomes the hole. The mounting portion member has a rectangular plate shape having a larger contour than the main body portion member, and the main body portion member is inserted in the center of the main body portion member so as to be orthogonal to the through direction of the hole in the thickness direction of the mounting portion member. An insertion hole is formed through, In the integration of the main body member and the mounting member, the outer peripheral surface of the main body member and the part of the mounting member facing the outer peripheral surface are joined by glass welding while the main body member is inserted into the insertion hole. An imaging device package, characterized in that is achieved by. The method of claim 13, The mounting part member includes a first surface and a second surface located at both ends in the thickness direction, and the first surface is located at the side of the main body part member on which the substrate is disposed, and the second surface is an optical member. Is located on the side for the body portion member is disposed, A positioning portion is formed on an outer circumferential surface of the member for main body portion, The positioning portion is in contact with the second surface of the mounting portion member when the body portion member is inserted into the insertion hole, whereby the position in the penetration direction of the insertion hole with respect to the mounting portion member of the body portion member. And an imaging device package configured to make a decision. The method of claim 1, The mounting portion has a plate shape that widens in a direction orthogonal to the through direction of the hole, And the screw insertion hole is formed in the mounting portion and extends in a direction parallel to the through direction of the hole. The method of claim 1, The mounting portion has a plate shape that is widened in a direction orthogonal to a through direction of the hole, The mounting portion is formed with a screw insertion hole extending in a direction parallel to the through direction of the hole, The mounting portion is provided with a positioning hole extending in a direction parallel to the through direction of the hole, And a positioning surface extending on a plane orthogonal to the through direction of the hole at a position of the mounting portion near the other end in the through direction of the hole. The method of claim 1, The inner part of the main body portion forming the hole is formed as an inclined surface that gradually decreases as the cross section of the hole faces the other end from one end in the penetrating direction of the hole, Attachment of the main body portion and the optical member is made by adhesion with an adhesive, And a concave portion formed at an end portion of the inclined surface near the other end to hold an extra adhesive which is widened in a direction orthogonal to a through direction of the hole and does not contribute to adhesion of the optical member. The method of claim 1, The central axis passing through the center of the imaging plane and orthogonal to the imaging plane coincides with the central axis of the hole, The inner part of the main body portion forming the hole is formed with an inclined surface that is gradually spaced apart from the central axis of the imaging device as it approaches the imaging device, Attachment of the main body portion and the optical member is made by adhesion with an adhesive, And a concave portion formed at an end portion of the inclined surface near the other end to hold an extra adhesive which is widened in a direction orthogonal to a through direction of the hole and does not contribute to adhesion of the optical member. An imaging device module comprising an imaging device package and a wiring member, The imaging device package, An imaging device chip having an imaging surface, A substrate provided with the imaging device chip; An optical member for allowing light to pass through, A support having a main body through which a hole serving as an optical path for imaging is penetrated, and a mounting part provided on the main body and attached to a mounted position; The substrate is attached to the main body so as to close one end of the through direction of the hole while the imaging surface faces the other end from one end of the through direction of the hole, The optical member is attached to the main body so as to close the other end in the through direction of the hole, And the substrate is electrically connected to the wiring member. A lens barrel including a barrel and an imaging device module, The imaging device module includes an imaging device package and a wiring member, The imaging device package, An imaging device chip having an imaging surface, A substrate provided with the imaging device chip; An optical member for allowing light to pass through, And a support having a main body portion formed therethrough with a hole serving as an optical path for imaging, and a mounting portion provided in the main body portion. The substrate is attached to the main body so as to close one end of the through direction of the hole while the imaging surface faces the other end from one end of the through direction of the hole, The optical member is attached to the main body so as to close the other end in the through direction of the hole, The substrate is electrically connected to the wiring member, And the mounting portion is attached to the barrel such that the optical member faces the inside of the barrel. An imaging device having a lens barrel, The lens barrel includes a barrel and an imaging device module, The imaging device module includes an imaging device package and a wiring member, The imaging device package, An imaging device chip having an imaging surface, A substrate provided with the imaging device chip; An optical member for allowing light to pass through, A support having a main body through which a hole serving as an optical path for imaging is penetrated, and a mounting part installed in the main body; The substrate is attached to the main body so as to close one end of the through direction of the hole while the imaging surface faces the other end from one end of the through direction of the hole, The optical member is attached to the main body so as to close the other end in the through direction of the hole, The substrate is electrically connected to the wiring member, And the mounting portion is attached to the barrel such that the optical member faces the inside of the barrel.

Images