JP2006067147A - Solid-state imaging device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a solid-state imaging device capable of very easily adjusting the focusing of a lens unit and an imaging device, when assembling. <P>SOLUTION: Positioning members 23a and 23b are brought into contact with two adjacent side faces 11a and 11b of a CCD 11, to position the CCD to a reference position in the X-Y direction orthogonal with respect to an optical axis. In this case, two side faces 11c and 11d of the CCD facing two side faces 11a and 11b of the CCD are pressed by pressing members 26a and 26b. Furthermore, the CCD is positioned in the Z-axis direction being the direction of the optical axis, by a flat surface 22, and the CCD is pressed against the flat surface in the Z-axis direction by projecting parts 25a and 25b provided on a CCD plate 24. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a solid-state imaging device used in an electronic camera (digital still camera) or the like, and more particularly to a solid-state imaging device capable of accurately positioning a solid-state imaging element.

  In general, in a digital still camera (hereinafter simply referred to as a camera), a solid-state image pickup device including a solid-state image pickup device such as a charge coupled device (CCD) is used. In this solid-state image pickup device, an incident is made through an optical lens system. The obtained light is imaged on the light receiving surface of the solid-state imaging device, and an image is obtained by photoelectric conversion.

  By the way, in assembling the solid-state imaging device, it is necessary to perform focus adjustment between the lens unit including the optical lens system and the solid-state imaging device, and in the focus adjustment, the lens unit is parallel to the optical axis direction of the lens unit. It is necessary to perform focus adjustment with respect to the Z axis and the XY axis direction orthogonal to the Z axis and adjust the angle (θ) between the optical axis and the light receiving surface of the solid-state imaging device. That is, it is necessary to accurately position the solid-state imaging device.

  By the way, in the conventional image pickup apparatus, the solid-state image pickup device is incorporated in the lens barrel without being displaced with respect to the optical axis of the optical system. The solid-state image sensor inserted in the frame body is pressed and held by the pressing pieces, and these pressing pieces are formed along the side opposite to the reference side of the solid-state image sensor. There is one that performs positioning. In other words, here, a pressing piece for pressing the solid-state imaging device is formed along the reference piece of the solid-state imaging device so as to securely hold the solid-state imaging device (hereinafter referred to as Conventional Example 1).

  Furthermore, in order to position a plurality of lens groups with respect to the solid-state imaging device with high accuracy, a part of the cemented lens that is joined to the solid-state imaging device and fixed with the plurality of lens groups in contact with the guide member Then, the position of the cemented lens with respect to the solid-state image sensor is adjusted, and this guide member is fixed to the solid-state image sensor together with the cemented lens. Here, after the cemented lens is positioned by the guide member, And fixed together with the solid-state imaging device (refer to Patent Document 1: hereinafter referred to as Conventional Example 2).

JP-A-2004-87718 (paragraph (0040) to paragraph (0050), FIGS. 1 to 2)

  By the way, in the above-mentioned conventional example 1, although the pressing piece for pressing the solid-state image sensor is formed along the reference piece of the solid-state image sensor, in the conventional example 1, the solid-state image sensor is positioned and fixed in the XY axis direction. However, there is a problem that it is difficult to position the optical axis (Z-axis direction) and to adjust the angle (θ) between the optical axis and the light receiving surface of the solid-state imaging device.

  In Conventional Example 2, the cemented lens and the solid-state imaging element are positioned by the guide member that contacts a part of the cemented lens. However, in Conventional Example 2, the cemented lens is positioned. As a result, there is a problem that it is very difficult to adjust not only the XY axis direction but also the Z axis direction and the angle (θ). That is, both the conventional examples 1 and 2 have a problem that it is difficult to finely adjust the focus in the XY axis direction, the Z axis direction, and the angle (θ).

  SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a solid-state imaging device that can adjust the focus between a lens unit and an imaging device very easily during assembly in view of the problems of the related art.

  Therefore, in order to solve such a problem, the present invention provides a solid-state imaging device in contact with two adjacent side surfaces of the imaging element, a base member on which the imaging element is mounted, and the base member. A positioning member that positions the image sensor at a reference position in the XY direction orthogonal to the optical axis, and a side surface of the image sensor that is disposed on the base member and is in contact with the positioning member. A pressing member that presses a side surface to adjust the positioning in the XY direction, a flat surface that is provided on the base member and positions the imaging device in the Z-axis direction, which is the optical axis direction, and the imaging device And an attachment member that is pressed and fixed in the axial direction.

  In the present invention, the base member is formed with a substantially rectangular concave portion, and two adjacent side surfaces of the concave portion that are adjacent to the inner peripheral surface serve as the positioning member, and are adjacent to the inner peripheral surface. The pressing member is disposed on the two side surfaces facing the two side surfaces.

  In the present invention, a lens unit disposed on the subject side of the image sensor, a glass plate disposed between the lens unit and the image sensor, and facing the image sensor, the glass plate and the image sensor The glass plate is pressed in the Z-axis direction via the rubber member by the imaging device.

  In the present invention, a cutout portion is formed in the flat surface, and the imaging element is fixed to the flat surface by an adhesive filled in the cutout portion.

  As described above, according to the present invention, when an image sensor is incorporated into a solid-state image sensor, not only can the image sensor be positioned in the XY and Z axis directions, but also the tilt with respect to the optical axis can be adjusted. As a result, there is an effect that the focusing between the lens unit and the image sensor can be easily performed.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. However, the dimensions, materials, shapes, relative arrangements, and the like of the component parts described in this embodiment are not intended to limit the scope of the present invention only to the description unless otherwise specified. It is just an example.

  FIG. 1 is a perspective view showing a main part of an example of a solid-state imaging device according to Embodiment 1 of the present invention. As shown in FIG. 1, a solid-state imaging device 10 includes an imaging element (for example, CCD) 11 and a cover glass. (Having a glass plate, for example, an infrared blocking filter) 12, a cylindrical lens holder 13 made of a light shielding resin, and a lens unit 14, and the CCD 11 is arranged to face the cover glass 12. The lens unit 14 is held by a lens holder 13. In the illustrated example, the lens holder 13 is attached to an apparatus housing 15. The apparatus housing 15 is formed with a motor mounting flange portion 15a, and a driving motor 16 is supported on the flange portion 15a. The lens unit 14 is driven in the optical axis direction by the driving motor 16.

  A flat surface 21 is formed on the surface opposite to the side (subject side) to which the lens unit 14 is attached of the apparatus housing 15, and an opening is formed on the flat surface. Communicating with As shown in the figure, a cover glass 12 is fitted into the opening, and a rectangular rubber member (hereinafter referred to as a CCD rubber) 22 is disposed in association with the four sides of the cover glass 12. As shown in the figure, a fixed frame 23 is disposed so as to surround the flat surface 21, and a substantially rectangular recess is defined by the fixed frame 23. Then, the adjacent two side surfaces 11a and 11b of the substantially rectangular CCD 11 are brought into contact with the XY positioning members disposed on the adjacent two side surfaces 23a and 23b of the inner peripheral surface of the recess as will be described later. The

  As shown in FIG. 1, the CCD 11 is attached to a CCD plate 24. The CCD plate 24 has an attachment surface portion 24a and attachment portions 24b and 24c formed at both ends of the attachment surface portion 24a. The CCD 11 is attached to the attachment surface portion 24a.

  As shown in FIG. 2, projecting portions 25a and 25b extending in the longitudinal direction are formed on the mounting surface portion 24a at a predetermined interval, and the surfaces of these projecting portions 25a and 25b are flat. . The protrusions 25a and 25b are increased in strength by the half blank, and the CCD 11 is pressed in the direction indicated by the solid line arrow by the flat surface. The connecting portion between the attachment surface portion 24a and the attachment portion 24b has a spring property, which makes it easy to attach the CCD plate 24 to the apparatus housing 15. As shown in FIG. 3, two positioning portions 231 are formed on the side surface 23a with a predetermined interval, and similarly, two positioning portions 232 are formed on the side surface 23b with a predetermined interval. . And the surface of these positioning parts 231 and 232 is shape | molded by the cylindrical peripheral surface. Further, as shown in FIG. 1, leaf spring members 26a and 26b, which are pressing members, are disposed on the two side surfaces facing the two adjacent side surfaces 23a and 23b of the fixed frame 23, respectively. And 26b are fixed at one end to the device casing 15, and the leaf spring members 26a and 26b press the CCD 11 toward the side surfaces 23a and 23b, respectively. These leaf spring members 26a and 26b are devised so as to be in contact with the CCD 11 on a wide surface, and are devised so that a pressing force is applied in a direction substantially perpendicular to the side of the CCD 11.

  Further, a notch 27 is formed at a predetermined position of the opening continuously from the above-described opening. As will be described later, the adhesive is filled from the notch 27, and the CCD 11 is formed. Bonded to the device casing 15.

  Next, an operation when the CCD 11 is attached to the apparatus housing 15 will be described. 1 to 4, the CCD 11 is disposed on the mounting surface portion 24 a of the CCD plate 24 with an adhesive or the like. At this time, one surface of the CCD 11 (the surface opposite to the light receiving surface) comes into contact with the protrusions 25a and 25b, and the CCD 11 is pressed in the direction indicated by the solid line arrow in FIG. Further, an adhesive is injected into the notch 27 described above.

  In this state, the CCD 11 is inserted into the concave portion from the light receiving surface side. When the CCD 11 is inserted into the concave portion, the two adjacent side surfaces 11c and 11d of the CCD 11 are pressed by the leaf spring members 26a and 26b, respectively, and the two adjacent side surfaces 11a and 11b of the CCD 11 facing this are respectively two concave side surfaces 23a and 23b. Will be pressed to the side. That is, the CCD 11 is pressed by the leaf spring members 26a and 26b toward the two side surfaces 23a and 23b of the recess in the XY plane orthogonal to the optical axis. As described above, since the positioning portions 231 and 232 are formed on the side surfaces 23a and 23b, the two side surfaces 11a and 11b of the CCD 11 come into contact with the positioning portions 231 and 232, respectively.

  In this way, the two side surfaces 11a and 11b of the CCDs 11a and 11b are pressed against the positioning portions 231 and 232, respectively, and the two side surfaces 11a and 11b of the CCD 11 are in contact with the positioning portions 231 and 232, respectively. If it is set as the reference position, the CCD 11 is positioned at the reference position simply by inserting the CCD 11 into the recess from the light receiving surface side. In addition, you may make it utilize these side surfaces 23a and 23b itself as a positioning member, without forming the positioning parts 231 and 232. FIG. At this time, the two side surfaces 11a and 11b of the CCD 11 are pressed against the two side surfaces 23a and 23b of the recess by the spring members 26a and 26b, respectively, and the two side surfaces 11a and 11b of the CCD 11 are respectively pressed to the two side surfaces 23a of the recess. And 23b are in perfect contact. Then, if the state where the two side surfaces 11a and 11b of the CCD 11 are in contact with the two side surfaces 23a and 23b of the recess is set as the reference position, the CCD 11 can be positioned at the reference position only by inserting the CCD 11 into the recess from the light receiving surface side. It will be.

  When the CCD 11 is inserted into the recess and the light receiving surface abuts against the flat surface 21, if the CCD plate 24 is supported on the apparatus housing 15 by the mounting portions 24a and 24c, the CCD 11 is moved to the optical axis by the protrusions 25a and 25b. As a result of pressing in the (Z-axis) direction, the light receiving surface of the CCD 11 is pressed against the flat surface 21, and the light receiving surface of the CCD 11 is in perfect contact with the flat surface 21. That is, the positioning of the CCD 11 in the Z-axis direction is performed. In a state where the light receiving surface of the CCD 11 is in perfect contact with the flat surface 21, the inclination (θ) with respect to the light receiving surface of the CCD 11 is adjusted (that is, the inclination (θ) is defined by the flat surface 21. Will be.)

  As described above, only by inserting the CCD 11 into the concave portion from the light receiving surface side, positioning in the XY direction, positioning in the Z-axis direction, and adjustment of the inclination (θ) with respect to the optical axis can be performed. Further, the CCD 11 is fixed to the apparatus housing 15 in a state where the positioning is performed by the adhesive previously filled in the notch 27. That is, as shown in FIG. 5, the CCD 11 is fixed to the apparatus housing 15 with the focus adjustment between the CCD 11 and the lens unit 14 (in FIG. 5, the components shown in FIG. The same constituent elements are given the same reference numerals, and the description thereof is omitted here). At this time, as a result of the CCD rubber 22 being pressed in the optical axis direction by the light receiving surface side of the CCD 11, the cover glass 12 is fixed in the optical axis direction via the CCD rubber 22.

  As is clear from the above description, the base member is constituted by the device casing 15 and the fixed frame 23, and the positioning is formed on the two side surfaces 23a and 23b of the fixed frame 23 with which the two adjacent side surfaces 11a and 11b of the CCD 11 abut. The parts 231 and 232 function as a positioning member that positions the CCD 11 at a reference position in the XY direction orthogonal to the optical axis. When the positioning portions 231 and 232 are not formed, the side surfaces 23a and 23b themselves function as positioning members that position the CCD 11 at a reference position in the XY direction orthogonal to the optical axis.

  Further, the leaf spring members 26a and 26b function as a pressing member that presses the two side surfaces 11c and 11d of the CCD 11 opposed to the side surfaces 11a and 11b of the CCD 11 abutted by the positioning member to adjust the positioning in the XY direction. . The CCD plate 24 and the protruding portions 25a and 25b function as an attachment member that presses and fixes the CCD 11 in the Z-axis direction.

  Thus, in the solid-state imaging device 10 described above, when the CCD 11 is arranged on the CCD plate 24 and the CCD 11 is inserted into the concave portion from the light receiving surface side to face the cover glass 12, the CCD 11 is moved in the XY direction. As a result of positioning in the Z-axis direction and adjusting the inclination (θ) with respect to the optical axis, the focus between the lens unit 14 and the CCD 11 can be adjusted very easily during assembly. The cover glass 12 is also fixed in the Z-axis direction via the CCD rubber 22, and there is an effect that the CCD 11 can be positioned with high accuracy during assembly.

  The solid-state imaging device of the present invention can be applied not only to a digital still camera but also to a camera module for a mobile device such as a mobile phone.

It is a perspective view which decomposes | disassembles and shows the principal part of an example of the solid-state imaging device by Example 1 of this invention. It is a perspective view which shows an example of the CCD plate shown in FIG. FIG. 5 is a perspective view for explaining a positioning unit that positions the CCD in the XY direction in the solid-state imaging device according to the first embodiment of the present invention. It is a perspective view which shows the effect | action of the leaf | plate spring member which presses 2 side surfaces of CCD arrange | positioned at a CCD plate. In the solid-state imaging device according to Embodiment 1 of the present invention, FIG.

Explanation of symbols

10 Solid-state imaging device 11 Image sensor (CCD)
12 Cover glass 13 Lens holder 14 Lens unit 15 Device housing 16 Driving motor 21 Flat surface 22 Rubber member (CCD rubber)
23 Fixed frame 24 CCD plate 25a, 25b Projection part 26a, 26b Leaf spring member 27 Notch part 231, 232 Positioning part

Claims (4)

An image sensor;
A base member on which the image sensor is mounted;
A positioning member that is provided on the base member and contacts the two adjacent side surfaces of the imaging element to position the imaging element at a reference position in the XY direction orthogonal to the optical axis;
A pressing member that adjusts positioning in the XY direction by pressing two side surfaces of the imaging element that are disposed on the base member and that are opposed to the two side surfaces of the imaging element that are in contact with the positioning member;
A flat surface provided on the base member for positioning the image sensor in the Z-axis direction, which is the optical axis direction;
A solid-state imaging device, comprising: an attachment member that presses and fixes the imaging element in the Z-axis direction. A concave portion having a substantially rectangular shape is formed in the base member, and two side surfaces adjacent to the inner peripheral surface of the concave portion are used as the positioning member,
The solid-state imaging device according to claim 1, wherein the pressing member is disposed on two side surfaces facing two adjacent side surfaces of the inner peripheral surface. A lens unit disposed on the subject side of the image sensor;
A glass plate disposed between the lens unit and the image sensor and facing the image sensor;
A rubber member disposed between the glass plate and the imaging element;
The solid-state imaging device according to claim 1, wherein the glass plate is pressed in the Z-axis direction by the imaging element via the rubber member. The flat surface has a notch,
The solid-state imaging device according to claim 1, wherein the imaging element is fixed to the flat surface by an adhesive filled in the notch.

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