KR20080072910A - Soldering device with computer-based sensor system - Google Patents

Abstract

The invention relates to a soldering device (01) for soldering workpieces, wherein the soldering device (01) has a least one heating element (06), at least two heating current leads (07, 08) and at least one sensor (05, 06, 07, 08, 09, 10, 11, 13), and wherein the heating element can be supplied with a heating current via the heating current leads (07, 08), and wherein the soldering device (01) has a computer unit (12), and wherein the sensor (05, 06, 07, 08, 09, 10, 11, 13) is connected to the computer unit (12).

Description

Soldering machine with computer-based sensor system {SOLDERING DEVICE WITH COMPUTER-BASED SENSOR SYSTEM}

The present invention relates to a soldering machine for soldering work pieces according to the preamble of the independent claim.

Common types of soldering machines are often difficult to control over their heating power. One problem is in determining all ambient conditions by sensors, which is that simple choices that determine all ambient conditions are often not available. Even if these options are available, one often encounters the problem of finding only simple solutions that lead to the connection from the soldering device and to the control unit.

The present invention is based on the object of providing a new soldering machine.

According to the invention, this object is achieved by the features of the independent claims.

Advantageous embodiments of the invention form the object of the dependent claims.

It is an object of the invention that a soldering device for soldering workpieces comprises at least one heating element, at least two heating current supply lines and at least one sensor, the heating element being supplied with heating current through the heating current supply lines. The soldering device has a computer unit, and the sensor is achieved by being connected to the computer unit.

The soldering device can be implemented essentially arbitrarily. It may consist of a soldering iron designed to be connected to the control unit or, for example, an autarkic handheld soldering iron.

In addition, the heating element can be implemented essentially freely. The heating element serves to heat the soldering tip, and current is supplied through the two heating current supply lines.

In addition, the soldering apparatus may be provided with one or more sensors. The sensor can measure any physical parameters, in particular temperature. This is particularly beneficial for controlling the heating current of the heating element based on these measurements.

However, it is often not sufficient to control the heating current based on the measurement of a single sensor. For example, it would be beneficial to measure the temperature at different locations within the soldering machine. For example, it may be possible to measure the temperature at the soldering tip, the temperature of the heating element or the temperature in the processing area of the soldering appliance. It would also be envisaged to provide a sensor in the form of an identification sensor, which provides a soldering device with a distinct identification feature.

Reading of the sensors is typically performed by a control device that can be located inside or outside the soldering machine. If the sensors are locally spaced apart from the control device by a significant distance, a plurality of connecting lines are required between the sensors and the control device if multiple sensors are provided.

It is also known to assign a transducer component to each sensor and to tie the supply lines introduced into the sensors according to the One Wire principle. However, this requires not only a number of transducer components, but also individual special sensors or actuators. These special sensors or actuators have the disadvantage of being very inflexible in terms of their functionality and expensive in terms of their manufacture and availability.

The soldering machine of the present invention has a computer unit, and the sensor or sensors are connected to the computer unit. This means that the supply lines of the sensors can be implemented relatively short. An additional connection to the control unit is made between the computer unit and the control unit. This connection is typically implemented with only a few manageable supply lines.

The sensors are read indirectly by the computer unit. This may prompt the computer unit to create a connection to a given sensor, if necessary. The measurement can then be carried out by the computer unit, and the determined measured value can be supplied to the control unit, for example, and for example to connect the sensor to a connection line introduced from the computer unit to the control unit. .

This means that a plurality of measured values are available with a minimum number of connecting lines. This provides maximum flexibility and also requires minimal wiring expenditure.

It is also possible to extend the sensor configuration of the soldering machine, for example by adding another sensor at a minimal installation cost. In this case, only the additional sensor needs to be connected to the computer unit.

In addition, the digital connection of several soldering devices can be easily implemented, for example in a bus system.

Furthermore, the combined forwarding of the sensor information, for example from the computer unit to the control unit, has a positive effect on the weight and diameter of this connection line, for example between the computer unit and the control unit. In addition, the size of the plug-type connectors and the processing area of the soldering device can be realized smaller. In addition, data transmission is less susceptible to errors, as electromagnetic interactions between sensor connection lines are reduced.

The computer unit can be implemented essentially freely. In one particular embodiment, the computer unit is implemented in the form of a microcontroller. In this case, this offers the special advantage that a computational unit capable of performing the computation is flexibly adapted.

This embodiment also provides the advantage that most of the separate transducer components that bind the sensor can be eliminated. The system is more cost-effective and more flexible in its design, implementation and expandability.

The type of communication with the computer unit can be implemented essentially freely. However, this is particularly advantageous when the computer unit is connected to two computer unit supply lines, where at least one computer unit supply line is the same as at least one heating current supply line and communication with the computer unit is Can be implemented via In this case, it is possible to access the computer unit in the soldering machine externally, for example. In this case, for example, the connection of the soldering appliance to the control unit is realized only through one of the heating current supply lines and the other. In this case no additional supply lines are required. For example, the connection line connecting the soldering appliance to the control device can have a very small diameter. In addition, the flexibility of these lines has a beneficial effect. Furthermore, the connectors of the connecting lines can be embodied in smaller dimensions. Moreover, the potentials of the computer unit and the heating element can be decoupled due to the additional computer unit supply line.

It may also prove beneficial to connect the computer unit to two separate computer unit supply lines that are not identical to one of the respective heating current supply lines. In this case, for example, other interferences between the heating element and the computer unit can be avoided.

However, the computer unit supply lines and the heating current lines may be identical in pairs. In this case, only heating current supply lines are required to implement external connections of the heating element and the computer unit.

Communication with the computer unit via the computer unit supply lines can be implemented essentially freely. In particular, communication with digital transmission protocols is beneficial. This transmission is typically done in a series of ways. In this case, an inquiry about a given sensor is first sent to a computer unit, which then answers the interrogation of the desired sensor.

The question can be implemented, for example, in a way that the computer unit supplies the measured value to the external unit or simply answers that the desired sensor can be accessed via the computer unit supply lines.

In another advantageous embodiment, the computer unit is connected to the computer unit supply lines according to the one wire principle. In this case, the computer unit supply lines not only serve for voltage supply of the computer unit, but also for bidirectional communication with the computer unit. In this embodiment, the supply lines and the communication lines introduced into the computer unit are combined with each other.

In another advantageous embodiment, the computer unit supply lines of the soldering machine can be connected to a control unit, which can communicate with the computer unit of the soldering machine via the computer unit supply lines.

In this embodiment, the control unit, for example, must not only supply the heating current to the soldering device, but also control the heating current to protect the components of the soldering device. In order to ensure reliable control using the control unit, the control unit relies on the data of the sensors in the soldering machine.

In the proposed connection using computer unit supply lines, the control unit sends a query command to the computer unit in the soldering machine and instructs the computer unit to, for example, address the corresponding sensor accordingly. The control unit receives the measured value of the sensor in response or is allowed access to the sensor.

In another advantageous embodiment, at least one thermal element is formed between the heating element and the heating current supply lines, and at least one thermal voltage can be tapped on the thermal element.

However, combinations of these features are more effective in conjunction with the present invention. The implementation of a heating element based on a combination of these properties has the same advantages on its own. The combination of these characteristics need not be implemented in conjunction with the soldering machine. It also proves that heating elements having these properties are beneficial. Heating elements of this type can be used, for example, in coffee machines and plastic injection-molding tools.

Such heating elements can also be beneficial for soldering devices. A soldering device consists of, for example, a soldering device for soldering workpieces, the soldering device having at least one heating element and at least two heating current supply lines, wherein the heating element is provided with a heating current through the heating current supply lines. One or more thermal elements, which may be supplied and from which one or more thermal voltages can be derived, are formed between the heating element and the heating current supply lines.

The temperature of the elements forming the thermal element can be determined based on the influence of the thermal temperature. The thermal element is formed of a heating element and heating current supply lines as proposed herein. Heating elements and heating current supply lines in particular require protection. For example, the heating elements of state of the art soldering machines become smaller and more powerful. For example, if the soldering machine is operating incorrectly or if the mass to be heated is coming out even though the soldering tip has been removed, the heating element may overload and then be destroyed. Therefore, it is particularly important to monitor the temperature of the heating element. However, since the temperature of the heating element does not necessarily correspond to the temperature of the soldering tip, the temperature of the heating element must be determined directly on the heating element, or better itself. One particularly suitable choice to implement this is the thermal effect.

For example, if the soldering tip of the soldering device is removed during operation of the soldering device, the energy of the heating element can no longer radiate out. In this case, there is a risk that the heating element may burn out and be destroyed. The temperature of the heating element rises. However, the thermal voltage on the thermal element formed by the heating element and the heating current supply lines increases with rising temperature. Thus, for example, by control of the heating current using the control device, it is possible to determine the temperature of the heating element, and if the temperature of the heating element rises, the heating current can be reduced accordingly.

However, this temperature measurement initially serves only to determine the temperature of the heating element. The actual solder tip temperature is typically determined by a separate temperature sensor.

Another advantage of forming a thermal temperature between the heating element and the heating current supply lines can be found in that no costly additional installations are required. In this case, only the manufacture of the elements which form part of the thermal element of suitable metal materials is required.

The heating element and heating current supply lines can be implemented essentially freely. In one particularly advantageous embodiment, the heating element is composed of a first metallic material, the first heating supply line is composed of a second metallic material, and the second heating current supply line is composed of a third metallic material. This in particular allows for flexible manufacturing and also allows simple improvement of the thermal element.

If only the ends of the heating thread forming the heating element are provided with a metallic material forming part of the thermal element, the same effects can be achieved in a simpler way.

The heating element itself or the ends of the heating thread forming the heating element may for example consist of a NiCr-alloy. The first heating current supply line may, for example, consist of nickel wire, and the second heating current supply line may in this case consist of iron wire.

For example, it would be possible to use platinum, platinum-rhodium, constantan and / or copper and / or other alloys or combinations of metal materials suitable for forming thermal elements.

This thermal element, functioning as a temperature sensor, can be operated in an essentially similar manner. This would require that voltage measurements be made between heating wires. This voltage measurement can be made, for example, in a soldering device, but can also be implemented by a control circuit, for example, in which the soldering device is connected with its heating current supply lines.

In another advantageous embodiment, the thermal element can be connected to the computer unit in the form of a sensor. This provides a simple choice of measuring the temperature of the heating element without a significant increase in installation costs. In this case, the computer unit can, for example, determine the voltage between the heating current supply lines or for example the control device can measure the voltage between the heating current supply lines.

In another advantageous embodiment, the soldering device includes a sensor that detects the use and / or movement of the soldering device.

However, this property is not only efficient in connection with the present invention, but also produces its effect in the autonomous invention.

This type of sensor can detect the use and / or movement of the soldering device or can detect whether the soldering device is at rest. This sensor output can be used to detect the use of soldering equipment, for example. This is typically possible because the fluctuations during the soldering process, in particular when the soldering devices are moved towards or away from the soldering point. During the down time, the soldering device is not moved, but for example the heating current supply can be cut off. After that, the soldering device is switched to the standby mode.

In particular, this not only protects the associated components such as heating elements and soldering tips, but also reduces energy consumption. In addition, these types of detecting the use or movement of soldering machines are maintenance free and contactless types. The solutions so far known have relied on, for example, additional mechanical and / or electrical or electromechanical attachment. This has been implemented, for example, in the form of electrical connections between the soldering machine and the holding stand. In addition, these solutions have required high costs for the path of electrical lines, mechanical devices that accommodate sensors and actuators, and their control and evaluation. Also, due to this system configuration, the reliability of the function is often limited in these types of solutions.

Sensors that detect the use and / or movement of the soldering device can be implemented essentially freely. However, in one particularly preferred embodiment, the sensor is implemented in the form of an acceleration sensor. This allows simple and cost effective detection in the use or movement of the soldering machine. Sensors of this type can be purchased inexpensively in the form of accessory components and can also be easily evaluated.

In another advantageous embodiment, the sensor is implemented in the form of a proximity sensor. For example, if a worker's hand approaches the soldering machine, this can typically assume that its use will begin soon, indicating that if the worker's hand is not detected, the soldering iron has probably been put down.

The proposed motion detection does not depend on the connection to the new computer-based sensor system and can be implemented in the soldering machine in the form of a similar independent solution. In this case, the motion sensor is approached directly.

However, it is also conceivable to connect the motion sensor to the computer unit. In this case, the above-mentioned beneficial effects are achieved.

The measurement data of the sensors that detect the use and / or movement of the soldering machine can be freely evaluated in nature. It is most beneficial to record the movement of the soldering machine in the coordinate system. This can be implemented based on the data of the sensors that detect the use and / or movement of the soldering machine.

In addition, soldering devices of this type are used in robotic systems. In this case, two- or three-dimensional motion curves can be recorded to reproduce the solder path of travel.

In another advantageous embodiment, the operating curve is recorded with respective solder tip temperatures and times correlated to them determined at separate points of the operating curve for archiving and control.

Soldering tips to be attached to the soldering device should be optimally adapted to the heating element geometry for their shape and mass to protect the soldering device and ensure its trouble-free operation. In particular, an optimum thermal coupling between the heating element and the soldering tip should be achieved to protect the heating element.

The inner diameter and inner geometry of the solder tips, as well as their outer diameter, outer geometry and overall length, should ideally be adapted to the geometry and length of the heating element.

Hereinafter, one embodiment of the present invention is illustrated in the drawings and described by way of example.

In this drawing,

1 is a schematic diagram of a soldering device implemented in the form of a portable soldering iron.

1 shows a portable soldering iron having a functional portion 02 and a treatment portion 03. The solder tip 04 is positioned positionally over the functional portion 02. This positional setting leads to an optimal thermal coupling between the functional part 02 and the soldering tip 04.

The functional portion 02 also has a soldering tip temperature sensor 05. The solder tip temperature sensor 05 determines the temperature of the solder tip.

The functional part 02 also has a heating element 06. The heating element 06 may be embodied in the form of a two-pronged heating wire composed of NiCr-alloy.

The two respective connections of the soldering tip temperature sensor 05 and the heating element 06 extend into the processing portion 03.

Two heating current supply lines 07, 08 located in the processing portion 03 are connected to each one end of the heating element 06. The first heating current supply line 07 is made of nickel wire, and the second heating current supply line 08 is made of iron wire. The second ends of the heating current supply lines each extend from the portable soldering iron 01. Due to the three different metallic materials of the heating element 06 of the first heating current supply line 07 and the second heating current supply line 08, the thermal element consists of the heating element and two heating current supply lines. do. This can determine the heating wire temperature on its own based on the thermal effect.

The processing portion 03 also includes an identification sensor 09. The identification sensor 09 exhibits a distinct identification shape that makes it possible to identify the portable soldering iron 01.

The processing portion 03 also comprises an IO transducer component 13 to which additional sensors and / or actuators can be connected according to conventional principles.

The processing portion 03 also includes a use sensor 10. The use sensor 10 makes it possible to detect the operation of the portable soldering iron 01. When the soldering iron is not used, the heating current supply can be interrupted through the heating current supply lines 07 and 08.

The treatment portion 03 also includes a treatment portion temperature sensor 11. The treatment part temperature sensor 11 makes it possible to determine the temperature in the treatment part 03. This can, for example, prevent an operator from getting hurt.

The connecting lines of the sensors 05, 06, 07, 08, 09, 10, 11 and 13 are connected to the input side of the computer unit 12 integrated into the portable soldering iron 01 along the shortest possible path. In this case, the computer unit 12 is implemented in the form of a microcontroller. Thus, the output side of the computer unit 12 is connected to the computer unit supply lines 14 and 15. This allows, for example, the external control unit to communicate with the computer unit 12.

In this embodiment, the heating current supply line 08 and the computer unit supply line 15 are identical. As a result, the wiring costs from the portable soldering iron 01 are limited to two heating current supply lines 07 and 08 and an additional computer unit supply line 14.

However, the computer unit supply lines can each extend from the soldering machine separately, for example not equal to one of the heating current supply lines. This leads to the advantages already described above.

The complete connection between the portable soldering iron 01 and another device is implemented in a particularly simple and uncomplicated manner.

Claims (12)

In the soldering apparatus (01) for soldering the workpieces, The soldering device 01 has at least one heating element 06, at least two heating current supply lines 07, 08, and at least one sensor 05, 06, 07, 08, 09, 10, 11, 13. The heating element may be supplied with a heating current through the heating current supply lines 07 and 08, The soldering device 01 has a computer unit 12 and the sensors 05, 06, 07, 08, 09, 10, 11, 13 are connected to the computer unit 12. Appliance (01). The method of claim 1, Soldering device (01), characterized in that the computer unit (12) is implemented in the form of a microcontroller. The method according to claim 1 or 2, The computer unit 12 is connected to two computer unit supply lines 14, 15, wherein the at least one computer unit supply line 15 is identical to the at least one heating current supply line 08, and the computer Soldering device (01), characterized in that it can communicate with the computer unit (12) via unit supply lines (14, 15). The method according to any one of claims 1 to 3, The computer unit 12 is connected to the computer unit supply lines 14, 15 according to the One Wire principle, and the computer unit supply lines 14, 15 are connected to the computer unit 12. Soldering device (01), wherein the computer unit supply lines (14, 15) provide bidirectional communication with the computer unit (12). The method according to any one of claims 1 to 4, The computer unit supply lines 14, 15 of the soldering device 01 can be connected to a control unit, which is connected to the control unit via the computer unit supply lines 14, 15. A soldering device (01) characterized in that it can communicate with a computer unit (12). The method according to any one of claims 1 to 5, At least one thermal element from which at least one thermal voltage can be derived is formed between the heating element (06) and the heating current supply lines (07, 08). The method according to any one of claims 1 to 6, The heating element 06 is made of a first metal material, the first heating current supply line 07 is made of a second metal material, and the second heating current supply line 08 is made of a third metal material. Soldering apparatus (01) characterized in that it is configured. The method according to claim 6 or 7, The soldering device (01) characterized in that the thermal element can be connected to the computer unit (12) in the form of a sensor. The method according to any one of claims 1 to 8, The soldering device (01) is characterized in that it comprises a sensor (10) for detecting the use and / or movement of the soldering device (01). The method of claim 9, Soldering device (01), characterized in that the sensor (10) for detecting the use and / or movement of the soldering device (01) is implemented in the form of an acceleration sensor. The method according to claim 9 or 10, A soldering device (01) characterized in that at least a multidimensional operating curve is defined by the sensor (10) which detects the use and / or movement of the soldering device (01). The method according to any one of claims 9 to 11, The operating curve is recorded together with a correlating temperature and a correlated time.

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