KR20080064794A - Packing buffer for stacked body in which semiconductor package trays are receivable - Google Patents

Packing buffer for stacked body in which semiconductor package trays are receivable Download PDF

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Publication number
KR20080064794A
KR20080064794A KR1020080060478A KR20080060478A KR20080064794A KR 20080064794 A KR20080064794 A KR 20080064794A KR 1020080060478 A KR1020080060478 A KR 1020080060478A KR 20080060478 A KR20080060478 A KR 20080060478A KR 20080064794 A KR20080064794 A KR 20080064794A
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South Korea
Prior art keywords
buffer
semiconductor package
tray
box
concave
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KR1020080060478A
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Korean (ko)
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원용권
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원용권
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Priority to KR1020080060478A priority Critical patent/KR20080064794A/en
Publication of KR20080064794A publication Critical patent/KR20080064794A/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D81/00—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents
    • B65D81/02—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage
    • B65D81/05—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage maintaining contents at spaced relation from package walls, or from other contents
    • B65D81/107—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage maintaining contents at spaced relation from package walls, or from other contents using blocks of shock-absorbing material
    • B65D81/113—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage maintaining contents at spaced relation from package walls, or from other contents using blocks of shock-absorbing material of a shape specially adapted to accommodate contents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
    • B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D2581/00—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents
    • B65D2581/02—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage
    • B65D2581/05—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage maintaining contents at spaced relation from package walls, or from other contents
    • B65D2581/051—Details of packaging elements for maintaining contents at spaced relation from package walls, or from other contents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D2585/00—Containers, packaging elements or packages specially adapted for particular articles or materials
    • B65D2585/68—Containers, packaging elements or packages specially adapted for particular articles or materials for machines, engines, or vehicles in assembled or dismantled form
    • B65D2585/86—Containers, packaging elements or packages specially adapted for particular articles or materials for machines, engines, or vehicles in assembled or dismantled form for electrical components

Abstract

A packing buffer for stacked bodies for receiving semiconductor package trays is provided to achieve buffering when plural trays for receiving semiconductor package are stacked and packed in a box. Packing buffers for stacked bodies for receiving semiconductor package trays are disposed on the upper and lower surfaces of a stacked body(50). The circumference of the packing buffer(60) is formed in the shape of a flange and the center portion of the packing buffer is formed in the shape of a recess. A separation concave and convex portion(62) is formed on the center of the packed buffer in both directions. Plural buffering concave and convex portions(64,66) are formed on both sides of the separation concave and convex portion. The packing buffer is manufactured in a dry pulp mold type.

Description

반도체 패키지 트레이가 수납될 수 있는 적층체 포장용 완충재 {PACKING BUFFER FOR STACKED BODY IN WHICH SEMICONDUCTOR PACKAGE TRAYS ARE RECEIVABLE}PACKING BUFFER FOR STACKED BODY IN WHICH SEMICONDUCTOR PACKAGE TRAYS ARE RECEIVABLE}

본 발명은 복수개의 반도체 패키지를 수납하는 트레이를 적층시킨 다음, 박스에 포장할 때, 완충시키기 위하여 사용되는 반도체 패키지가 수납될 수 있는 트레이의 적층체 포장용 완충재에 관한 것으로서, 특히 완충재가 적층되더라도 쉽게 분리할 수 있도록 하는 반도체 패키지가 수납될 수 있는 트레이의 적층체 포장용 완충재에 관한 것이다.The present invention relates to a buffer packaging material for stack packaging of a tray in which a semiconductor package used to buffer a semiconductor package used for cushioning a stack of a plurality of semiconductor packages, and then packed in a box. The present invention relates to a laminate packaging buffer of a tray in which a semiconductor package that can be detached can be stored.

일반적으로 반도체 패키지용 트레이는 공정간에 이동시키기 위하여 사용되거나, 조립 및 전기적 검사가 완전히 완료된 다음, 사용자에게 전달되기 전에 포장시키기 위하여 사용된다.Generally, trays for semiconductor packages are used to move between processes, or to be packaged before delivery to the user after assembly and electrical inspection have been completed.

이때, 반도체 패키지용 트레이를 포장할 때, 복수개의 반도체 패키지용 트레이를 적층시킨 다음, 포장재로 감싸고, 박스에 넣어 포장을 하게 되는데, 외부 충격으로부터 반도체 패키지를 보호하기 위하여 박스의 상/하면에 완충재가 삽입된다.At this time, when packaging the semiconductor package tray, a plurality of semiconductor package trays are stacked, then wrapped with a packaging material, and put in a box to be packed, a cushioning material on the upper and lower surfaces of the box to protect the semiconductor package from external impact Is inserted.

도 1은 종래 기술의 반도체 패키지용 트레이 포장용 완충재가 도시된 평면도이고, 도 2는 도 1의 완충재 일부가 도시된 측면도이다.1 is a plan view showing a tray packaging buffer material for a semiconductor package of the prior art, Figure 2 is a side view showing a portion of the buffer member of FIG.

종래 기술에 따른 반도체 패키지용 트레이 포장용 완충재는 실용신안공고 204639호 에 기재된 것으로써, 도 1 및 도 2에 도시된 바와 같이 중앙에 길게 상향 돌출된 분리 요철부(12)를 기준으로 양측에 복수개의 중앙 요철부(14)가 형성되고, 둘레부분(16a)에 복수개의 외곽 요홈부(16b)가 구비된다.The buffer packaging material for tray packaging for semiconductor packages according to the prior art is described in Utility Model Publication No. 204639, and has a plurality of openings on both sides based on the separation convex portion 12 protruding upwardly in the center as shown in FIGS. 1 and 2. A central concave-convex portion 14 is formed, and a plurality of outer concave grooves 16b are provided in the circumferential portion 16a.

이때, 상기 완충재(10)는 펄프를 물에 풀어서 반죽상태에서 틀에 넣어서 성형하도록 하되, 이와 같은 펄프는 일종의 폐지를 사용하더라도 무방하다.At this time, the buffer material 10 is to release the pulp in water to put in the mold in the dough state to be molded, such a pulp may be used a kind of waste paper.

특히, 상기 중앙 요철부(14) 및 외곽 요홈부(16b)는 일정간격으로 형성되되, 상기 중앙 요철부(14)는 그 둘레부분(16a) 평면을 기준으로 더 낮게 형성되는 반면, 상기 외곽 요홈부(16b)는 그 둘레부분(16a) 평면으로부터 홈이 형성된다.In particular, the central concave-convex portion 14 and the outer concave portion 16b are formed at regular intervals, while the central concave-convex portion 14 is formed lower with respect to the circumference portion 16a plane thereof, while the outer concave portion The groove 16b is formed with a groove from the plane of the peripheral portion 16a thereof.

따라서, 반도체 패키지용 트레이를 적층시켜 두 묶음을 형성시킨 다음, 그 상하면에 상기 완충재(10)를 설치하여 박스에 삽입하여 포장하게 되되, 외부 충격이 가해지더라도 상기 분리 요철부(12)가 좌우방향의 충격을 완충시키는 동시에 상기 중앙 요철부(14) 및 외곽 요홈부(16b)가 상하방향의 충격을 완충시키도록 한다.Accordingly, the stack for the semiconductor package is stacked to form two bundles, and then the cushioning material 10 is installed on the upper and lower surfaces of the semiconductor package tray and inserted into the box. At the same time to cushion the impact of the central concave-convex portion 14 and the outer groove 16b to buffer the impact in the vertical direction.

그러나, 종래 기술에 따른 반도체 패키지용 트레이 포장용 완충재는 적층된 상태로 납품됨에 따라 완충재들(10) 사이에 분리 요철부(12), 중앙 요철부(14), 외곽 요홈부(16b)가 서로 맞물리기 때문에 분리하기가 어려울 뿐 아니라 시간이 많이 걸려 생산성이 떨어지는 문제점이 있다.However, as the buffer packaging material for a semiconductor package tray according to the prior art is delivered in a stacked state, the separating uneven parts 12, the central uneven parts 14, and the outer uneven parts 16b fit between the buffer materials 10. Not only is it difficult to separate because of the bite, it takes a lot of time, there is a problem that productivity is reduced.

또한, 종래 기술에 따른 반도체 패키지용 트레이 포장용 완충재는 자동화 시스템에서 완충재(10)를 박스에 삽입하는 경우, 완충재(10)가 박스에 삽입되는 방향과 완충재 내부에 공기가 빠져나오는 방향이 반대로 형성됨에 따라 공기 저항으로 인하 여 완충재(10)를 박스에 투입하기 역시 어렵고, 나아가 완충재(10)의 무게 중심이 상측에 있기 때문에 자동화 시스템에서 완충재가 박스 내부로 투입되면서 뒤집힐 수 있어 포장하기가 번거로운 문제점이 있다.In addition, in the tray packaging buffer for a semiconductor package according to the prior art, when the buffer 10 is inserted into a box in an automated system, the direction in which the buffer 10 is inserted into the box and the direction in which air escapes inside the buffer are formed oppositely. Therefore, due to air resistance, it is also difficult to put the buffer 10 into the box, and furthermore, since the center of gravity of the buffer 10 is on the upper side, the buffer can be flipped as it is thrown into the box in an automated system, which makes it difficult to pack. have.

또한, 종래 기술에 따른 반도체 패키지용 트레이 포장용 완충재는 습식 방식으로 제작됨에 따라 건조과정에서 수축이 심할 뿐 아니라 뒤틀림 현상이 발생되고, 그 결과 외형상 매끈하게 제작하기 어려울 뿐 아니라 정확한 치수대로 제작하기 어려워 제품의 불량률이 높은 문제점이 있다.In addition, the buffer packaging material for a semiconductor package tray according to the prior art is produced in a wet manner not only severe shrinkage during the drying process, but also warp occurs, and as a result it is not only difficult to produce smooth appearance, but also difficult to produce accurate dimensions There is a problem that the defective rate of the product is high.

본 발명은 상기한 종래 기술의 문제점을 해결하기 위하여 안출된 것으로서, 적층되더라도 분리가 용이한 반도체 패키지가 수납될 수 있는 트레이의 적층체 포장용 완충재를 제공하는데 그 목적이 있다.SUMMARY OF THE INVENTION The present invention has been made to solve the problems of the prior art, and an object thereof is to provide a buffer for stack packaging of a tray in which a semiconductor package that can be easily separated even if stacked can be accommodated.

본 발명은 박스에 삽입하기 용이한 반도체 패키지가 수납될 수 있는 트레이의 적층체 포장용 완충재를 제공하는데 그 목적이 있다.SUMMARY OF THE INVENTION An object of the present invention is to provide a buffer packaging material for stacking a tray in which a semiconductor package that can be easily inserted into a box can be stored.

본 발명은 정확한 치수대로 제작이 가능한 반도체 패키지가 수납될 수 있는 트레이의 적층체 포장용 완충재를 제공하는데 그 목적이 있다.SUMMARY OF THE INVENTION An object of the present invention is to provide a shock absorbing material for stack packaging of a tray in which a semiconductor package which can be manufactured to precise dimensions can be accommodated.

상기한 과제를 해결하기 위한 본 발명에 따른 반도체 패키지가 수납될 수 있는 트레이의 적층체 포장용 완충재는 복수개의 반도체 패키지가 수납된 트레이의 적층체를 박스에 포장할 때 상기 적층체의 상/하면에 설치되어 상기 적층체에 가해지는 충격을 완충시키는 반도체 패키지 트레이의 적층체 포장용 완충재로, 상기 완충재의 중앙 부분에 형성된 하나 이상의 통공을 포함하는 것을 특징으로 한다.In order to solve the above problems, a buffer packaging material for stacking a tray in which a semiconductor package according to the present invention may be stored may be disposed on the upper and lower surfaces of the stack when a stack of trays containing a plurality of semiconductor packages is packed in a box. A buffer packaging material for stack packaging of a semiconductor package tray provided to cushion a shock applied to the stack, characterized in that it comprises at least one through hole formed in the central portion of the buffer.

이하, 본 발명의 실시 예를 첨부된 도면을 참조하여 상세히 설명한다.Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

도 3은 본 발명에 따른 완충재가 적용된 반도체 패키지용 트레이의 포장상태가 도시된 분해사시도이고, 도 4는 본 발명에 따른 반도체 패키지용 트레이 포장용 완충재가 도시된 평면도이며, 도 5는 도 4의 완충재 일부가 도시된 측면도이다.3 is an exploded perspective view illustrating a packaging state of a tray for a semiconductor package to which a buffer according to the present invention is applied, and FIG. 4 is a plan view showing a buffer packaging for a semiconductor package according to the present invention, and FIG. 5 is a buffer of FIG. 4. Some are side views.

본 발명에 따른 반도체 패키지용 트레이 포장용 완충재는 도 3에 도시된 바와 같이 복수개의 반도체 패키지용 트레이가 적층된 적층체(50)의 상하면에 위치되도록 한 다음, 박스(70)에 포장되도록 한다.As shown in FIG. 3, the buffer packaging material for a semiconductor package tray according to the present invention is positioned on the upper and lower surfaces of a stacked stack 50 in which a plurality of semiconductor package trays are stacked, and then packaged in a box 70.

여기서, 상기 적층체(50)는 복수개의 반도체 패키지가 수납된 트레이가 상하방향으로 수십 개 내지 백여 개가 적층된 다음, 별도의 포장재로 감싸지도록 하여 구성된다.Here, the stack 50 is configured such that a tray containing a plurality of semiconductor packages is stacked in a dozen or hundred pieces in the vertical direction, and then wrapped in a separate packaging material.

이때, 상기 트레이는 평판형상으로 상기 반도체 패키지가 수납될 수 있는 복수개의 포켓이 구비되고, 상기 트레이를 적층시키면, 상기 트레이의 둘레부분이 서로 맞닿 으면서 적층된다.In this case, the tray is provided with a plurality of pockets in which the semiconductor package can be accommodated in a flat plate shape, and when the trays are stacked, the peripheral portions of the trays are stacked while contacting each other.

다음, 상기 완충재(60)는 도 4 및 도 5에 도시된 바와 같이 그 둘레부분이 플랜지 형태로 형성되는 동시에 그 중앙부분이 홈 형태로 형성되되, 중앙에 양측방향으로 가로지르도록 분리 요철부(62)가 형성되고, 상기 분리 요철부(62) 양측에 복수개의 완충 요철부(64,66)가 형성된다.Next, the shock absorbing material 60, as shown in Figures 4 and 5, the circumferential portion is formed in the form of a flange at the same time the center portion is formed in the groove shape, separated uneven portion so as to cross in both directions in the center ( 62 is formed, and a plurality of buffered concave-convex portions 64 and 66 are formed on both sides of the separation concave-convex portion 62.

물론, 상기 완충재(60)는 건식 펄프 몰드 타입으로 제작하여 외관을 매끈하게 형성하고, 정확한 치수로 제작되도록 하는 것이 바람직하다.Of course, the shock absorbing material 60 is preferably made of a dry pulp mold type to form a smooth appearance, and to be manufactured with accurate dimensions.

이때, 상기 완충 요철부(64,66)는 상기 완충재(60) 중앙 부분의 바닥면으로부터 ‘ㄷ’, ‘+’, ‘-’ 등의 다양한 돌출부를 형성하는 동시에 이와 대비되는 홈부가 형성되도록 구성되되, 다양한 형태의 돌출부 및 홈부를 구비함에 따라 뒤틀림 현상을 방지하도록 제작할 수 있다.At this time, the buffer concave-convex portions 64 and 66 form various protrusions such as 'c', '+', and '-' from the bottom surface of the central portion of the cushioning material 60, and at the same time, the grooves are formed to be formed. However, it can be produced to prevent the warping phenomenon by having a variety of protrusions and grooves.

보다 상세하게, 상기 완충 요철부(64,66)는 상기 완충재(60) 둘레부분의 내측에 격자형의 돌출부 형태로 형성된 복수개의 외곽 요철부(64)와, 상기 외곽 요철부(64)와 연결되도록 상기 완충재(60) 둘레부분보다 상향 돌출된 형태로 형성된 복수개의 가이드 돌출부(66)도 포함된다.In more detail, the buffer concave and convex portions 64 and 66 are connected to a plurality of outer concave and convex portions 64 formed in the form of a lattice-shaped protrusion inside the periphery of the buffer material 60 and the outer concave and convex portions 64. Also included are a plurality of guide protrusions 66 formed to protrude upward from the periphery of the cushioning material 60.

이때, 상기 가이드 돌출부(66)는 상기 완충재(60) 둘레부분에 일정간격을 두고 모두 형성되어 상기 적층체(50)가 상기 완충재(60)에 안착되도록 안내하고, 상기 적층체(50)의 상/하측면과 맞물리도록 하여 보다 접촉면적을 늘림으로 완충 효과를 높일 수 있도록 한다.At this time, the guide protrusions 66 are all formed at predetermined intervals around the buffer member 60 to guide the laminate 50 to be seated on the buffer member 60, and the image of the laminate 50 Engage the lower / lower side to increase the cushioning effect by increasing the contact area.

또한, 상기 완충 요철부(64,66)에는 복수개의 통공(60h)이 형성되되, 상기 완충 재(60)가 상기 박스(70)에 삽입됨에 따라 상기 박스(70)의 내부 공기를 가압하더라도 상기 박스(70)로부터 공기가 상기 통공(60h)을 통하여 빠져나갈 수 있으므로, 상기 완충재(60)를 상기 박스(70)에 손쉽게 삽입할 수 있다.In addition, a plurality of through holes 60h are formed in the buffered convex and concave portions 64 and 66, even though the buffer member 60 is inserted into the box 70, even if the internal air of the box 70 is pressurized. Since air may escape from the box 70 through the through hole 60h, the shock absorbing material 60 may be easily inserted into the box 70.

특히, 상기 완충재(60)는 상기 분리 요철부(62), 완충 요철부(64,66)가 많이 형성됨에 따라 그 접촉면적이 늘어나 다수의 완충재(60)가 서로 적층되면, 분리하기가 어려운데, 이를 방지하기 위하여 상기 완충재(60)가 적어도 두 개 이상 적층되더라도 그 둘레부분에 상하방향으로 분리공간을 형성하도록 하기 위하여 이형부재의 일종으로 분리턱(68)이 형성되도록 한다.In particular, the buffering material 60 is difficult to separate when a plurality of the buffering material 60 is laminated with each other as the contact area increases as the separation concave-convex portion 62, the buffer concave-convex portion 64, 66 is formed, In order to prevent this, even if at least two shock absorbers 60 are stacked, the separation jaw 68 is formed as a kind of a release member in order to form a separation space in the vertical direction at the periphery thereof.

이때, 상기 분리턱(68)은 상기 완충재(60)의 둘레부분 상면으로부터 격자모양으로 하향 돌출되면서 단차지게 형성되되, 상기 완충재(60)의 둘레부분을 따라 일정간격을 두고 적어도 두 개 이상이 형성되도록 하고, 그 단차진 높이가 작업자의 손가락이 손쉽게 들어갈 수 있도록 적어도 1cm 이상은 되도록 형성한다.At this time, the separating jaw 68 is formed stepped while projecting downward from the upper surface of the peripheral portion of the buffer member 60 in a lattice shape, at least two or more are formed at predetermined intervals along the peripheral portion of the buffer member (60). The stepped height is formed to be at least 1 cm or more so that the operator's fingers can easily enter.

물론, 상기 완충재(60)의 둘레부분을 기준으로 상기 가이드 돌출부(66)만 상측에 형성되고, 상기 외곽 요철부(64) 및 분리턱(68)을 비롯한 부분들이 하측에 형성되기 때문에 상기 가이드 돌출부(66) 및 분리턱(68)은 상기 완충재(60)의 무게 중심을 하측에 형성하도록 할 수 있어 자동화 시스템에서 보다 안정적으로 상기 완충재(60)가 상기 박스(70)에 삽입될 수 있도록 한다.Of course, only the guide protrusion 66 is formed on the upper side with respect to the circumferential portion of the shock absorbing material 60, and the guide protrusion because the parts including the outer concave-convex portion 64 and the separating jaw 68 are formed on the lower side. The 66 and the separating jaw 68 may allow the center of gravity of the shock absorbing material 60 to be formed on the lower side so that the shock absorbing material 60 may be inserted into the box 70 more stably in an automated system.

상기와 같이 구성된 완충재(60)를 사용하여 자동화 시스템으로 반도체 패키지용 트레이를 박스(70)에 포장하는 과정을 살펴보면, 다음과 같다.Looking at the process of packaging the tray for a semiconductor package in the box 70 by an automated system using the buffer material 60 configured as described above, as follows.

먼저, 상기 반도체 패키지가 수납된 트레이를 적층시킨 다음, 포장재로 감싸서 적 층체(50)를 두 개 만들어 놓고, 상기 상자(70)에 하나의 완충재(60)를 삽입하되, 전과정이 자동화 시스템에 의해 이루어지거나, 작업자에 의해 직접 이루어질 수도 있다.First, stacking the tray containing the semiconductor package, and then wrapped with a packaging material to make two laminated bodies 50, inserting one buffer 60 in the box 70, the whole process by the automation system It may be made or may be made directly by an operator.

이때, 상기 완충재(60)가 상기 박스(70)에 삽입될수록 그 내부 공기를 가압하되, 상기 완충재의 통공(60h)을 통하여 빠져나감에 따라 손쉽게 삽입할 수 있고, 나아가 상기 완충재(60)가 하측에 무게 중심이 형성됨에 따라 자동화 시스템에 의해 움직여지더라도 뒤짚어지는 것을 방지할 수 있다.At this time, as the buffer 60 is inserted into the box 70, the internal air is pressurized, but can be easily inserted as it passes through the through hole 60h of the buffer, and further, the buffer 60 is lowered. As the center of gravity is formed in the center of gravity, it can be prevented from being flipped even if it is moved by the automation system.

다음, 상기 박스(70) 내측에 한 쌍의 적층체(50)를 삽입하되, 각각의 적층체(50)가 상기 박스(70)에 삽입된 완충재(60) 위에 나란하게 올려지되, 각각의 적층체(50)는 그 하부가 상기 완충재(60) 측의 분리 요철부(62) 및 완충 요철부(64,66)에 의해 둘러싸여지게 된다.Next, a pair of laminates 50 are inserted into the box 70, and each laminate 50 is placed side by side on the cushioning material 60 inserted into the box 70. The lower part of the sieve 50 is surrounded by the separation concave-convex portion 62 and the buffer concave-convex portions 64 and 66 on the cushioning material 60 side.

이와 같이, 상기 박스(70)에 한 쌍의 적층체(50)를 삽입한 다음, 다른 하나의 완충재(60)를 한 쌍의 적층체(50) 상면을 덮어주도록 씌우고, 상기 박스(70)를 닫아 포장을 완료한다.As described above, the pair of laminates 50 are inserted into the box 70, and then the other cushioning material 60 is covered to cover the upper surface of the pair of laminates 50, and the box 70 is covered. Close to complete packaging.

이상에서, 본 발명은 본 발명의 실시예 및 첨부도면에 기초하여 반도체 패키지용 트레이를 포장하기 위하여 사용되는 완충재를 예로 들어 상세하게 설명하였다. 그러나, 이상의 실시예들 및 도면에 의해 본 발명의 범위가 제한되지는 않으며, 본 발명의 범위는 후술한 특허청구범위에 기재된 내용에 의해서만 제한될 것이다.In the above, the present invention has been described in detail by taking an example of the cushioning material used to package the tray for a semiconductor package based on the embodiment of the present invention and the accompanying drawings. However, the scope of the present invention is not limited by the above embodiments and drawings, and the scope of the present invention will be limited only by the contents described in the claims below.

상기와 같이 구성되는 본 발명에 따른 반도체 패키지가 수납될 수 있는 트레이의 적층체 포장용 완충재는 그 둘레부분에 하향 돌출되도록 분리턱이 일체로 형성되기 때문에 상하방향으로 적층되더라도 상하방향으로 소정의 분리공간을 확보하여 작업자가 손쉽게 분리할 수 있어 생산성을 높일 수 있는 이점이 있다.The buffer packaging material for stacking the stacked body of the tray in which the semiconductor package according to the present invention configured as described above is accommodated is formed so that the separation jaw is integrally formed so as to protrude downward in the circumferential part thereof, so that the predetermined separation space in the vertical direction is predetermined even in the vertical direction. There is an advantage to increase the productivity can be easily separated by the operator.

또한, 본 발명에 따른 반도체 패키지가 수납될 수 있는 트레이의 적층체 포장용 완충재는 복수개의 통공이 형성되기 때문에 박스에 삽입됨에 따라 공기를 가압하더라도 통공을 통하여 빠져나감으로 작업이 용이하며, 나아가 플랜지 형태의 둘레부분을 기준으로 가이드 돌출부가 상향 돌출되도록 형성되는 반면, 다양한 요철부 및 분리턱이 하향 돌출되도록 형성되기 때문에 전체적인 무게중심이 하측에 형성되기 때문에 자동화 시스템에 의해 완충재가 박스에 삽입되더라도 뒤집어지지 않고 안정적으로 작업이 이루어지는 이점이 있다.In addition, since the buffer packaging material for stacking the stack in which the semiconductor package according to the present invention can be accommodated is formed with a plurality of through holes, it is easy to work by exiting through the through holes even if pressurized air as inserted into the box. Guide protrusions are formed to protrude upwardly based on the periphery of the, while various uneven parts and separation jaws are formed to protrude downward, so that the overall center of gravity is formed at the lower side, so that the cushioning material is not flipped over by the automation system. There is an advantage that the work is performed stably without.

또한, 본 발명에 따른 반도체 패키지가 수납될 수 있는 트레이의 적층체 포장용 완충재는 펄프를 건식 방식으로 몰드 제작하기 때문에 외형상 매끈하게 제작할 수 있을 뿐 아니라 정확한 치수대로 제작할 수 있어 제품의 불량률이 낮출 수 있는 문제점이 있다.In addition, the buffer packaging material for stack packaging of the tray that can accommodate the semiconductor package according to the present invention can be produced in a smooth shape as well as accurate dimensions because the pulp is molded in a dry manner can lower the defect rate of the product. There is a problem.

이상에서, 본 발명은 본 발명의 실시예 및 첨부도면에 기초하여 반도체 패키지용 트레이를 포장하기 위하여 사용되는 완충재를 예로 들어 상세하게 설명하였다. 그러나, 이상의 실시예들 및 도면에 의해 본 발명의 범위가 제한되지는 않으 며, 본 발명의 범위는 후술한 특허청구범위에 기재된 내용에 의해서만 제한될 것이다.In the above, the present invention has been described in detail by taking an example of the cushioning material used to package the tray for a semiconductor package based on the embodiment of the present invention and the accompanying drawings. However, the scope of the present invention is not limited by the above embodiments and drawings, and the scope of the present invention will be limited only by the contents described in the claims below.

도 1은 종래 기술의 반도체 패키지용 트레이 포장용 완충재가 도시된 평면도,1 is a plan view showing a buffer packaging material for tray packaging for semiconductor packages of the prior art,

도 2는 도 1의 완충재 일부가 도시된 측면도,FIG. 2 is a side view of a portion of the cushioning material of FIG. 1;

도 3은 본 발명에 따른 완충재가 적용된 반도체 패키지용 트레이의 포장상태가 도시된 분해사시도,3 is an exploded perspective view illustrating a packaging state of a tray for a semiconductor package to which a buffer member according to the present invention is applied;

도 4는 본 발명에 따른 반도체 패키지용 트레이 포장용 완충재가 도시된 평면도,4 is a plan view showing a buffer packaging material for a semiconductor package tray according to the present invention,

도 5는 도 4의 완충재 일부가 도시된 측면도이다.FIG. 5 is a side view of a portion of the cushioning material of FIG. 4.

<도면의 주요 부분에 관한 부호의 설명><Explanation of symbols on main parts of the drawings>

50 : 적층체 60 : 완충재50 laminated body 60 buffer material

60h : 통공 62 : 분리 요철부60h: through hole 62: separation uneven portion

64 : 외곽 요철부 66 : 가이드 돌출부64: outer uneven portion 66: guide protrusion

68 : 분리턱68: separation jaw

Claims (1)

상세한 설명 및 도면에 기재된 반도체 패키지가 수납될 수 있는 트레이의 적층체 포장용 완충재.A cushioning material for stack packaging of a tray in which a semiconductor package described in the detailed description and drawings can be stored.
KR1020080060478A 2008-06-25 2008-06-25 Packing buffer for stacked body in which semiconductor package trays are receivable KR20080064794A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013169672A1 (en) * 2012-05-06 2013-11-14 Entegris, Inc. Large diameter wafer packaging system

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013169672A1 (en) * 2012-05-06 2013-11-14 Entegris, Inc. Large diameter wafer packaging system

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