WO2013169672A1

WO2013169672A1 - Large diameter wafer packaging system

Info

Publication number: WO2013169672A1
Application number: PCT/US2013/039766
Authority: WO
Inventors: Barry Gregerson; Matthew B. NICHOLAS
Original assignee: Entegris, Inc.
Priority date: 2012-05-06
Filing date: 2013-05-06
Publication date: 2013-11-14
Also published as: TW201408562A

Abstract

A packaging system for transporting a wafer container that includes a first conformal spacer cushion and a second conformal spacer cushion. The first cushion includes a body portion defining a substantially contiguous contoured inner surface that includes a central, generally planar projecting portion configured to be received by a central recess of a front wall of a wafer container, and generally planar non-central surfaces configured to receive complementary surfaces of the front wall of the wafer container. The second conformal spacer cushion includes a body defining a substantially contiguous contoured inner surface, the contoured inner surface including a central planar surface, first projecting portions configured to be received by first recesses of a rear wall of the wafer container, and second projecting portions configured to be received by second recesses of a rear wall of the wafer container.

Description

LARGE DIAMETER WAFER PACKAGING SYSTEM

RELATED APPLICATION

The present application claims priority to U.S. Provisional Application No. 61/643,324, filed May 6, 2012, and entitled LARGE DIAMETER WAFER PACKAGING SYSTEM, which is herein incorporated by reference in its entirety.

FIELD OF THE INVENTION

The present invention is generally directed to packaging systems for large diameter wafers and wafer containers. More specifically, the present invention is directed to efficient packaging systems for wafer containers that provide improved contact between the wafer container and the packaging so as to better distribute shock forces and dampen vibration.

BACKGROUND OF THE INVENTION

Standard semiconductor wafer sizes have grown steadily over time from a mere 25mm to the new standard 450mm. As wafer sizes have grown larger, manufacturing and material handling equipment, containers, packaging and so on have also changed. In particular, wafer containers used to transport wafers to, from, and within, a fabrication facility, have generally been scaled up in size to accommodate the new, larger wafer sizes. Packaging systems for wafer containers, meant to protect wafer containers and their contents during shipping, have also been scaled up in size. However, with the advent of even larger wafer sizes, in particular the latest 450mm wafer size, wafer containers when filled with large wafers weigh significantly more than prior, smaller loaded wafer containers. The additional size and weight of the packaging contents presents challenges to large wafer packaging systems. Some known packaging solutions simply increase the size of the packaging, and possibly strengthen know materials to accommodate the larger size and weight of larger wafers and larger wafer containers.

However, simply scaling up previously-used designs may not be sufficient to protect large wafer containers and their contents, nor may such techniques be particularly efficient. Further, as fabricators impose ever-tightening requirements on wafer containment, standard, known packaging systems often provide insufficient security for large wafer-based transport and container systems.

SUMMARY OF THE INVENTION An embodiment of the invention provides a shipping system for transporting a plurality of large-wafer containers in a bulk environment packaging system. The bulk environment packaging system provides multiple advantages including ease of assembly and a reduction of bulk materials over individually boxed systems, while providing a structural core through the center of the bulk environment packaging system. The structural core enables the use of a non-rigid pallet cap component such as corrugated paper, thus enabling the product to be recycled and sourced globally while reducing the mass of the packaging system while lowering overall packaging costs. The low cost of the shipper further enables one-time use for high quality appearance.

Structurally, a plurality of rectangular sleeves is clustered together within a common base cap and covered by a common top cap. Each sleeve is fitted with a plurality of spacer cushions that are configured to engage at least the corners of the wafer container. The spacers can be dimensioned to provide a friction fit with an interior surface of the rectangular sleeves so that, despite the sleeves being "bottomless," the wafer containers are retained within the rectangular sleeve when the module is lifted away from the base cap.

In one embodiment, the sleeves are sized to accommodate 450 mm Multiple Application Carriers (MACs) in a cluster of four sleeves. The capped assemblies can be stacked for shipping of eight MACs. In one embodiment, the eight unit arrangement has a footprint of approximately 59 inches by 45 inches for loading onto a pallet and is approximately 51 inches high.

In another embodiment, the claimed invention comprises a packaging system for transporting a plurality of wafer containers, the packaging system comprising: a first assembly including: a plurality of rectangular sleeves, each rectangular sleeve being of substantially similar dimensions, the plurality of sleeves being configured for arrangement on a plane in an assembly footprint, the assembly footprint having an overall length dimension and an overall width dimension; a plurality of spacer cushions for insertion in one of said plurality of rectangular sleeves, each of the plurality of spacer cushions being configured for engagement with at least one corner of one of the plurality of wafer containers, the plurality of spacer cushions being dimensioned to define an annular space between the wafer container and the rectangular sleeve; and a base cap and a top cap, each including a planar portion and a side portion, the side portion extending from the planar portion and dimensioned to surround the assembly footprint, the base cap being dimensioned to surround and secure a bottom portion of the plurality of rectangular sleeves when arranged in the assembly footprint, and the top cap being dimensioned to surround and secure an upper portion of the plurality of rectangular sleeves when arranged in the assembly footprint.

In yet another embodiment, the claimed invention comprises a shipping system for 450 mm wafers. The system includes: a first layer of four 450 mm wafer containment modules positioned in a two by two arrangement. Each wafer containment module comprises: a 450 mm wafer container loaded with 450mm wafers therein, the wafer containers positioned such that the wafers in each wafer container is in an upright vertical orientation; lower cushioning for each individual wafer container, the lower cushioning engaging at least four lower corners of each individual wafer container; upper cushioning for each individual wafer container, the upper cushioning engaging at least four upper corners of each individual wafer container; four-sided sleeves, each open on the top and bottom of the sleeve, each having one of the wafer containers nested therein with the respective upper cushioning and lower cushioning, the first layer further comprising: an upper corrugated cardboard cap with a central piece sized to cover tops of the four wafer containment modules, the upper corrugated cardboard cap having four sides extending downwardly from the central piece to partially cover exposed exterior sleeves of each wafer containment module, a lower corrugated cardboard cap with a central piece sized to cover bottoms of the four wafer containment modules, the lower corrugated cardboard cap having four sides extending upwardly from the central piece to partially cover the exposed exterior sleeves of each wafer shipper package. In another embodiment, the claimed invention comprises a packaging system for transporting a wafer container. The packaging system includes: a first conformal spacer cushion comprising a body portion and a plurality of edge portions, the body portion defining a substantially contiguous inner surface configured to contact a front wall of a wafer container; and a second conformal spacer cushion. The second cushion comprises a body portion and a plurality of edge portions, the body portion defining a substantially contiguous contoured inner surface, the contoured inner surface including a central planar surface, a first plurality of projecting portions adjacent a first side of the central planar surface and configured to be received by a first plurality of recesses of a rear wall of the wafer container, and a second plurality of projecting portions adjacent a second side of the central planar surface and configured to be received by a second plurality of recesses of a rear wall of the wafer container. In another embodiment, the claimed invention comprises a wafer transport packaging system, that includes: a wafer container configured to carry 450mm semiconductor wafers, including a front wall, rear wall and four side walls, the front wall defining a front contoured surface, the rear wall defining a rear contoured surface; a first conformal spacer cushion defining a substantially contiguous inner surface, the inner surface being generally complementary to the front contoured surface of the front wall of the wafer container, the first conformal spacer cushion adjacent the front wall of the wafer container such that the inner surface of the first conformal spacer cushion is adjacent to the front contoured surface of the wafer container; and a second conformal spacer cushion defining a substantially contiguous contoured inner surface, the contoured inner surface being generally complementary to the rear contoured surface of the rear wall of the wafer container, the second conformal spacer cushion adjacent the rear wall of the wafer container such that the contoured inner surface of the second conformal spacer cushion is adjacent to, and conformal to, the rear contoured surface of the wafer container.

The claimed invention also includes a method of packaging a wafer container containing a plurality of wafers for transport. In an embodiment, the method includes: inserting a plurality of wafers into the wafer container, the wafer container including a removable door defining a front wall; orienting the wafer container to be in a transport position, such that the front wall is in a horizontal orientation and the wafers are in a vertical orientation; placing a first conformal spacer cushion having a surface adjacent the front wall of the wafer carrier, thereby causing the surface of the first conformal spacer cushion to cover substantially all of an outer surface of the front wall; and placing a second conformal spacer cushion having a contoured surface adjacent a rear wall of the wafer carrier, thereby causing the contoured surface of the second conformal spacer cushion to cover substantially all of an outer surface of the rear wall.

BRIEF DESCRIPTION OF THE DRAWINGS

The invention may be more completely understood in consideration of the following detailed description of various embodiments of the invention in connection with the accompanying drawings, in which:

FIG. 1 is an exploded view of a containment module with wafer container according to an embodiment of the invention;

FIG. 2 is an exploded view of an assembly of containment modules according to an embodiment of the invention;

FIG. 3 is an exploded view of stacked assemblies of containment modules according to an embodiment of the invention;

FIG. 4 is a perspective view of the stacked assemblies of FIG. 3 in a fully-packed state according to an embodiment of the invention; FIG. 5 is a rear perspective view of a wafer container;

FIG. 6 is a front perspective view of the wafer container of FIG. 5;

FIG. 7 is a cross-sectional view of the wafer container of FIG. 5 with attached spacer cushions;

FIG. 8 is a cross-sectional view of the wafer container of FIGS. 5 and 6 with attached spacer cushions, according to an embodiment of the invention;

FIG. 9 is a top perspective view of a first conformal spacer cushion, according to an embodiment of the invention;

FIG. 10 is a bottom perspective view of the first conformal spacer cushion of FIG.

9; FIG. 1 1 is a top perspective view of a second conformal spacer cushion, according to an embodiment of the invention;

FIG. 12 is a bottom perspective view of the second conformal spacer cushion of FIG. 1 1; FIG. 13 is an exploded view of a large wafer packaging system, according to an embodiment of the invention;

FIG. 14 is an exploded view of the packaging system of FIG. 13 with a wafer container;

FIG. 15 is a perspective view of the wafer container of FIG. 13 packed in the large wafer packaging system of FIGS. 13 and 14;

FIG. 16 is an exploded view of another embodiment of a large wafer packaging system; and

FIG. 17 is a perspective view of an embodiment of a large wafer shipping system, according to an embodiment of the present inventon. While the invention is amenable to various modifications and alternative forms, specifics thereof have been shown by way of example in the drawings and will be described in detail. It should be understood, however, that the intention is not to limit the invention to the particular embodiments described. On the contrary, the intention is to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the invention as defined by the appended claims.

DETAILED DESCRIPTION

Referring to FIG. 1, a shipping package or containment module 100 for wafer container 102 is depicted in an embodiment of the invention. Containment module 100 includes sleeve 104, top or first spacer cushion 106 and bottom or second spacer cushion 108. In an embodiment, wafer container 102 comprises a Multiple Application Carrier (MAC) for carrying 450mm semiconductor wafers. Wafer container 102 protects 450mm wafers during shipment when integrated into containment module 100, then is also used to transport 450mm wafers during various manufacturing processes, as will be understood by those of ordinary skill in the art. Wafer container 102 may comprise containers for other wafer sizes, including 300mm wafers, and other types of shipping and manufacturing containers including wafer shippers, front-opening shipping boxes (FOSBs), front-opening unified pods (FOUPs), and other such containers.

In an embodiment, and as depicted, wafer container 102 includes front wall 1 10, which includes front-opening removable door 112, rear wall 114, left side wall 116, right side wall 1 18, top wall 120 (see also FIG. 5), and bottom wall 122. Bottom wall 122, in an embodiment, and as depicted, includes kinematic coupler mechanism 124 for coupling to wafer container handling devices during the manufacturing process.

As depicted, wafer container 102 is oriented in a transport position with door 1 12 facing upward, such that wafers (not shown), are vertically oriented.

In an embodiment, sleeve 104 is fabricated from low cost, disposable and/or recyclable materials such as corrugated cardboard or corrugated plastic. In other embodiments, reusable rectangular sleeve 104 may comprise a reusable material. In an embodiment, the materials can be treated for water resistance and high humidity environments, for example, using wax impregnation. As depicted, in an embodiment, sleeve 104 defines a generally rectangular shape having an open top and bottom, though in other embodiments sleeve 104 may define other shapes to receive spacer cushions 106 and 108. Sleeve 104 defines interior cavity 130 and inner surface 132.

Spacer cushions 106 and 108 may be fabricated from, for example, plastic, polystyrene foam, foam rubber, and other materials known in the art.

First and second spacer cushions 106 and 108 are configured for capturing a wafer or substrate carrier therebetween. In the depicted embodiment, the first and second spacer cushions each define a frame having that surrounds and captures at least four corners of wafer container 102. In an embodiment, the frame shape of spacer cushions 106 and 108 include multiple outside surfaces 134, and define openings 136 and 138, respectively (see also FIG. 2). Alternatively, individual corner spacer cushions (not depicted) can be provided, one for coupling with each of the eight corners of the wafer container. "Cushioning" as used herein can be either the single piece or the four pieces as described above. First and second spacer cushions 106 and 108, in an embodiment, have outer dimensions that facilitate sliding engagement of outer surfaces 134 with an interior surface 132 of rectangular sleeve 104. In an embodiment, the interference between spacer cushions 106 and 108 and rectangular sleeve 104, provides sufficient friction to support the wafer container within the rectangular sleeve when the sleeve is lifted away for transport.

Referring to FIG. 2, large wafer packaging system 150 is depicted. In an embodiment, large wafer packaging system 150 includes a plurality of modular packaging systems or containment modules 100, top cap 152, bottom cap 154, and pallet 156. In the depicted embodiment, system 150 comprises four containment modules 100, and therefore includes four of each of sleeves 104, first spacer cushions 106, and bottom spacer cushions 108.

Top cap 152 fits over the multiple sleeves 104 at a top end, while bottom cap 154 fits over the multiple sleeves 104 at a bottom end. Top and bottom caps 152 and 154 may be configured to fit onto pallet 156 without overhanging the edges of pallet 156. The plurality of rectangular sleeves are assembled in a closely clustered arrangement that defines an assembly footprint that is generally rectangular and having an overall length and an overall width that corresponds approximately to pallet 156.

Each of common base cap 154 and common top cap 152 can include a horizontal planar portion 158 and a plurality, four as depicted, vertical side portions 160 that extend outwardly and away from planar horizontal portion 158. In one embodiment, the base and top caps are dimensioned to surround and secure the lower and upper portions of the assembled plurality of sleeves 104, respectively.

Referring to FIGS. 3 and 4, a stacked arrangement including first assembly 170 and second assembly 172 of shipping packages or containment modules 100 is depicted in an embodiment of the invention. First assembly 170 includes a 2x2 arrangement of four containment modules 100. Second assembly 172 also includes a 2x2 arrangement of four containment modules 100. The first and second assemblies 170, 172, in an embodiment are substantially identical to each other. For shipping, the first and second assemblies 170, 172 can be secured together using techniques available to the artisan, such as banding or shrink wrapping, to form a large wafer shipping system.

Functionally, the use of "topless" and "bottomless" rectangular sleeves 104 substantially reduces the bulk of a module 100 in comparison with standard box enclosures, which typically have doubled material thickness on the top and bottom because of an overlapping flap arrangement. Elimination of the top and bottom flaps can cut the mass of a cube-shaped module by approximately 50%. At the same time, the sleeves provide through the center portion or "core" of the assembly by virtue of the corners of the rectangular sleeves that meet at the center of the assembly.

The use of individual sleeves also enables containment modules 100 to retain the favorable characteristic of being able to move relative to, or slide against, each other without binding. Consider a scenario where the assembly of containment modules experiences a side load (static or impact), for example, on top cap 152, causing the top of containment modules 100 to lean away from the side load and rotate relative to the bottom of the containment modules 100. If instead of rectangular sleeves 104, the microenvironments shared common walls or were otherwise bound together or between microenvironments, the leaning of the structure could cause the friction fit between spacer cushions 106/108 and the common walls to slide relative to each other, which could cause wafer container 102 to become partially dislodged from its spacer cushions 106 and 108. Such dislodgement could cause undue stresses on wafer containers 102 when the side load is removed. With the individual rectangular sleeve arrangement of the present invention, system 1 0, the external surfaces of sleeves 104 will slide relative each other, leaving the arrangement between the rectangular sleeve, the spacer cushions and the wafer container intact and advantageously absorbing shock.

Referring to FIGS. 5, 6, and 8-14, another large wafer packaging system, system 180 is depicted. System 180, in an embodiment, supports a single wafer container 102 with its multiple wafers, much as containment module 100 contains a single wafer container 102. In large wafer packaging system 180, however, each spacer cushion contacts a substantial portion of both the front (top during transport) and rear (bottom during transport) contoured surfaces of wafer container 102, as is described in more detail below with respect to FIGS. 8-12. Referring to FIGS. 5 and 6, a wafer container 102 is depicted in further detail, including front wall 1 10 and rear wall 1 14. Wafer container 102 as depicted in FIGS. 5 and 6 is shown in its operational position, i.e., in the position that the wafer container is used during manufacturing, rather than in a transport position, as depicted above in FIGS. 1 and 4. Referring specifically to FIG. 5, a rear perspective view of wafer container 102 is depicted. Rear wall 1 14 defines a generally contoured surface 182 comprising a plurality of outer surfaces 184, angled surfaces 186, inner surfaces, 188 and defining a plurality of rear-wall recesses 190. Rear wall 1 14 may also define a number of other various surfaces and recesses forming the contour of surface 182. The specific shape of contoured surface 182 results from the desired structural characteristics of rear wall 1 14, which at an interior portion, provides support to the plurality of large wafers, 450mm wafers in an embodiment, carried by wafer container 102.

Referring to FIG. 6, a front perspective view of wafer container 102 is depicted. Front wall 110, comprising door 1 12, defines contoured surface 192, which includes a plurality of outer surfaces 194, angled surfaces 196, and inner surfaces 198. Surface 192 also defines a plurality of front-wall recesses 200, including a center recess and corner recesses.

Referring to FIG. 7, a cross sectional view taken through the center of wafer container 102 as depicted in FIG. 5, and as supported by spacer cushions 106 and 108, also depicted in cross section, is depicted. Spacer cushion 106 is adjacent front wall 1 10, while spacer cushion 108 is adjacent rear wall 1 14. Some interior structures of wafer container 102 used to support wafers, and the wafers themselves, are not depicted. Referring also to FIGS. 1 and 2, spacer cushions 106 and 108 as described above each define central open areas, openings 136, and 138, respectively. Consequently, spacer cushions 106 and 108 form a frame, and only contact wafer container 102 at the container corners, and in some embodiments, along its outer edges. As such, when attached to wafer container 102, large portions of front wall 110 and rear wall 1 14 are not in contact with their respective spacer cushions 106 and 108, and hence are unsupported when enclosed within containment module 100 and during shipment.

Still referring to FIG. 7, a majority of contoured surface 192 of front wall 1 10, including most of surfaces 194, and all of inner surface 198, remains unsupported by spacer cushion 106. Similarly, a majority of contoured surface 182 of rear wall 1 14, including surfaces 184, 186, and 188, remain unsupported by spacer cushion 108.

In such a configuration, the weight of wafer container 102 and certain packaging elements is borne by corners and edges of spacer cushion 108. When external vertical forces are applied to containment modules 100, such forces are transferred to wafer carrier 102 corners and edges, rather than being distributed about the entire area of rear wall 114 and front wall 1 12. Arrows FE illustrate the idea that vertical forces are concentrated along the outside edges of wafer container 102 and its spacer cushion 108.

Such a configuration may be sufficient and appropriate for some applications. However, the lack of support across most of front wall 1 10, and particularly rear wall 1 14, when wafer container 102 is in a transport position, may allow flexure of front wall 110 and rear wall 1 14, particularly for large, heavy wafers, such as 450mm wafers. This flexure and lack of support may result in a concentration of external shock forces at only those areas of wafer container 102 supported by spacer cushions 106 and 108. Further, vibration dampening is may be limited, with vibration being transferred to wafers inside wafer container 102 during transport. Such flexing and vibration may result in movement, particularly rotation, or wafers inside wafer container 102.

In addition to increasing the possibility of particle creation caused by frictional forces between the wafers and the internal structure of wafer container 102, the rotation of the wafers results in a rotational misalignment of the wafers within wafer container 102. If too much rotation occurs during shipment, guide notches or indicators on the wafers may not be appropriately aligned, and automated wafer-handling equipment may not be able to properly retrieve the wafers from wafer container 102, or may otherwise retrieve the wafers in a misaligned orientation, causing problems in the highly-automated and sensitive fabrication process.

Referring to FIGS. 8-12, an embodiment of a large wafer packaging system, system 180, includes spacer cushions that contact a substantial portion of contoured surfaces 182 and 192 of front and rear walls 110 and 1 14, respectively, thereby reducing wall flexure, vibration, and movement of wafers within wafer container 102.

Referring specifically to FIG. 8, a cross section of large wafer packaging system 180 supporting wafer container 102 is depicted. Wafer 181 is shown in dashed lines to demonstrate the vertical orientation of the wafers within wafer container 102. Similar to FIG. 7, some internal structural details of wafer container 102 are not depicted in FIG. 8.

In an embodiment, system 180 includes first conformal spacer cushion 206 and second conformal spacer cushion 208. In an embodiment, system 180 also includes strap system 210, inner bag 212, and outer bag 214. Large wafer packaging system 180 may also include wafer container 102 with a plurality of vertical-oriented wafers 181.

Referring to FIGS. 9 and 10 a pair of perspective views of first conformal spacer cushion 206 are depicted. First conformal spacer cushion 206 is configured to fit onto an adjacent front wall 110 of wafer container 102 (see also FIG. 8). Spacer cushion 206 is "conformal" in that its shape is complementary to the shape of front wall 1 10. First conformal spacer cushion 206 may be constructed from a variety of materials, both rigid and non-rigid, and including materials such as corrugated cardboard, corrugated plastic, foam with or without a plastic sheeting overlay, blowmolded plastic, sytrofoam, and so on. The term "cushion" is not intended to be limited to a non-rigid material, but rather is meant to convey the idea of absorbing or distributing a force directed to the wafer container.

In an embodiment, first conformal spacer cushion 206 includes central portion 220 defining recess 222, and edge portions 224. Central portion 220 defines surface 226, which in an embodiment defines a contoured surface 226. In an embodiment, surface 226 is a generally uniform, planar surface. In another embodiment, surface 226 defines a contoured surface including central projection 228 configured to fit into a recess of a front wall of wafer container 102. As the front wall is generally positioned upward in the transport position, and front wall 1 10 includes relatively few contours, first conformal spacer cushion 206 may comprise either a contoured or substantially flat surface 226. Surface 226 is substantially contiguous so that it can contact and support most portions of top wall 1 10 to aid in force distribution and vibration dampening during shipping.

Referring to FIGS. 1 1 and 12 a pair of perspective views of second conformal spacer cushion 208 are depicted. Second conformal spacer cushion 208 is generally configured to fit onto an adjacent rear wall 1 14 of wafer container 102 (see also FIG. 8). Spacer cushion 208 is "conformal" in that its shape is complementary to the shape of rear wall 1 10. Second conformal spacer cushion 206 may be constructed from a variety of materials similar to the materials of first conformal spacer cushion 206.

In an embodiment, second conformal spacer cushion 208 includes central portion 240 defining recess 242, and edge portions 244. Referring also to FIG. 8, edge portions 244 may include optional extension portions 244a that extend edge portions 244 along the side walls of wafer container 102 when attached to the container. Central portion 240 defines surface 246, which in an embodiment defines a contoured surface 246. In an embodiment, surface 246 is substantially contiguous so that it can contact and support most portions of rear wall 1 14 to aid in force distribution and vibration dampening during shipping. In an embodiment, contoured surface 246 includes central surface 248, which in an embodiment comprises a generally flat, planar surface, a first plurality of projections 250 adjacent a first side of central surface 248, and a second plurality of projections 252 located adjacent a second side of central surface 248.

In an embodiment, first projections 250 are substantially the same as one another and are equidistantly spaced apart, and second projections 252 are also substantially the same as one another and are also equidistantly spaced apart. Each projection may include multiple outer, inner, and angled planar surfaces complementary to recesses 190 of rear wall 1 14.

Referring also to FIG. 8, central surface 248 is configured to fit adjacent surface of rear wall 1 14. Further, first projections 250 and second projections 252 are generally configured to be received by recesses 190 defined in rear wall 140. As such, contour surface 246 is complementary to rear wall contoured surface 182, such that surface 246 conforms to surface 182 when second conformal spacer cushion 208 is located adjacent rear wall 1 14. An advantage of packaging system 180 is that substantially all portions of rear wall

114 are in contact with, and supported by, second conformal spacer cushion 206. In this way, the weight of wafer container 102 with its contents are distributed about the entire portion of rear wall 1 14 and spacer cushion 206, rather than concentrating that weight, or force, onto only the corners and edges of rear wall 114, which as described above, allows rear wall 1 14 to potentially flex, and allow vibrations to penetrate wafer container 102. With contact across virtually all of rear wall 114, external forces or shocks transmitted during shipping will also be distributed about most of rear wall 114, and not just at its corners and edges.

Referring to FIGS. 13-15, large wafer packaging system 180 may also include a sleeve or box 260 enclosing first and second spacer cushions 206 and 208, as well as wafer container 102. Box 260 may include individual lid 262, and may be closed at its bottom. In other embodiments, box 260 comprises a sleeve, open at the top and bottom, and similar to sleeve 104.

In addition to box 260, or rather than box 260, system 180 may include connector or strap 210, first bag 212, and/or second bag 214 (see FIG. 8 for bags).

As depicted in FIG. 15, in an embodiment, spacer cushions 206, 208, and wafer container 102 may be fully enclosed by box 260. Referring also to FIG. 8, packaging system 180 may not include box 260, but rather relies on strap 210 to secure conformal spacer cushions 106 and 108 to wafer carrier 102. In another embodiment providing further stability and protection, additional materials may be added to large wafer packaging system 180. Additional materials may include outer box 264, which in an embodiment includes bottom cap 266 and top cap 268. Outer box 264 may comprise materials similar to those described above with respect to sleeve 104. Corner supports 270 may be added to each corner of box 260, and box 260 may be placed into outer box 264. Corner supports 270 may comprise material similar to the material of spacer cushions 206 and 208.

The result is that wafer container 102 is double-boxed, with system 180 provided two sources of cushioning: first and second conformal spacer cushions 206/208 and corner supports 270. As such, the resultant system includes an inner cushioning system and an outer cushioning system, providing significantly improved shock and vibration protection for wafer container 102 and its contents.

Further, multiple large wafer packaging systems 180 may be placed together in a multi-container arrangement, such as the 4x2 arrangement described above with respect to FIGS. 1-4 to form a large wafer shipping system 300. In such an embodiment, eight wafer carriers 102, packaged as indicated in FIGS. 13-16 are assembled to form the shipping system depicted in FIG. 17.

As described above, embodiments of the claimed invention include large wafer packaging and shipping systems. However, embodiments of the claimed invention also include processes of packaging and shipping wafer containers 102 as described above, and as also described further below.

Referring again to FIGS. 13-17, an embodiment of the claimed invention includes a process of packaging wafer container 102. Although the below description suggests a particular order of the process steps, it will be understood that the steps may be performed in a number of orders, and not all steps may need to be performed.

In an embodiment, and in an optional step, a first bag 212 is wrapped about wafer container 102, and a second electrostatic discharge bag 214 is wrapped about wafer container 102 and bag 212. Wafer container 102 is positioned such that its front wall is facing in an upwardly direction, and such that its rear wall is facing in a downwardly direction (see also FIG. 8). Second conformal spacer cushion 208 having contoured surface 242 (see also FIG. 12) is placed against contoured surface 182 of rear wall 1 14; first conformal spacer cushion 206 is placed adjacent front wall 1 10 of wafer container 102. In an embodiment, strap 210 is wrapped about first and second conformal spacer cushions 206 and 208, further securing the spacer cushions to wafer container 102 and to one another.

Next, cushions and wafer container 102 are placed box 260, followed by corner supports 270 being added to the corners of box 260. Box 260, an inner box, is inserted with its corner supports into an outer box 264, and enclosed with top and bottom caps 266 and 268. Due to the addition of corner supports, an additional air cushion is created between walls of boxes 260 and 264.

In another embodiment, bottom cap 154 is placed onto a pallet 156; multiple packaging systems 180 are placed onto bottom cap 154, and top cap 156 is placed onto packaging systems 180. Another layer may be added to form an overall shipping system capable of safely transporting multiple wafer containers.

The foregoing descriptions present numerous specific details that provide a thorough understanding of various embodiments of the invention. It will be apparent to one skilled in the art that various embodiments, having been disclosed herein, may be practiced without some or all of these specific details. In other instances, components as are known to those of ordinary skill in the art have not been described in detail herein in order to avoid unnecessarily obscuring the present invention. It is to be understood that even though numerous characteristics and advantages of various embodiments are set forth in the foregoing description, together with details of the structure and function of various embodiments, this disclosure is illustrative only. Other embodiments may be constructed that nevertheless employ the principles and spirit of the present invention. Accordingly, this application is intended to cover any adaptations or variations of the invention.

For purposes of interpreting the claims for the present invention, it is expressly intended that the provisions of Section 1 12, sixth paragraph of 35 U.S.C. are not to be invoked unless the specific terms "means for" or "step for" are recited in a claim.

Claims

CLAIMS What is claimed is:

1. A packaging system for transporting a plurality of wafer containers, said packaging system comprising: a first assembly including: a plurality of rectangular sleeves, each rectangular sleeve being of substantially similar dimensions, said plurality of sleeves being configured for arrangement on a plane in an assembly footprint, said assembly footprint having an overall length dimension and an overall width dimension; a plurality of spacer cushions for insertion in one of said plurality of rectangular sleeves, each of said plurality of spacer cushions being configured for engagement with at least one corner of one of said plurality of wafer containers, said plurality of spacer cushions being dimensioned to define an annular space between said wafer container and said rectangular sleeve; and a base cap and a top cap, each including a planar portion and a side portion, said side portion extending from said planar portion and dimensioned to surround said assembly footprint, said base cap being dimensioned to surround and secure a bottom portion of said plurality of rectangular sleeves when arranged in said assembly footprint, said top cap being dimensioned to surround and secure an upper portion of said plurality of rectangular sleeves when arranged in said assembly footprint.

2. The packaging system of claim 1 further comprising a second assembly for mounting atop said first assembly, said second assembly being substantially identical to said assembly.

3. The packaging system of claim 1 , further comprising a first inner bag and a second outer bag enclosing each wafer container.

4. The packaging system of claim 1, wherein said plurality of sleeves number four.

5. The packaging system of claim 1, wherein each of said spacer cushions defines a rectangular frame.

6. A shipping system for 450 mm wafers, the system comprising: a first layer of four 450 mm wafer containment modules positioned in a two by two arrangement, each wafer containment module comprising: a 450 mm wafer container loaded with wafers therein, the wafer continers positioned such that the wafers in each wafer container is in an upright vertical orientation; lower cushioning for each individual wafer container, the lower cushioning engaging at least four lower corners of each individual wafer container; upper cushioning for each individual wafer container, the upper cushioning engaging at least four upper corners of each individual wafer container; four-sided sleeves, each open on the top and bottom of the sleeve, each having one of the wafer containers nested therein with the respective upper cushioning and lower cushioning, the first layer further comprising: an upper corrugated cardboard cap with a central piece sized to cover tops of the four wafer containment modules, the upper corrugated cardboard cap having four sides extending downwardly from the central piece to partially cover exposed exterior sleeves of each wafer containment module, a lower corrugated cardboard cap with a central piece sized to cover bottoms of the four wafer containment modules, the lower corrugated cardboard cap having four sides extending upwardly from the central piece to partially cover the exposed exterior sleeves of eacH wafer shipper package.

7. The system of claim 6 wherein the system further comprises a pallet below the lower corrugated cardboard cap.

8. The system of claim 6 or 7 further comprising a second layer of 450 mm wafer containment modules laying on top of the first layer, the second layer configured like the first layer.

9. A packaging system for transporting a wafer container, said packaging system comprising: a first conformal spacer cushion comprising a body portion and a plurality of edge portions, the body portion defining a substantially contiguous inner surface configured to contact a front wall of a wafer container; and a second conformal spacer cushion comprising a body portion and a plurality of edge portions, the body portion defining a substantially contiguous contoured inner surface, the contoured inner surface including a central planar surface, a first plurality of projecting portions adjacent a first side of the central planar surface and configured to be received by a first plurality of recesses of a rear wall of the wafer container, and a second plurality of projecting portions adjacent a second side of the central planar surface and configured to be received by a second plurality of recesses of a rear wall of the wafer container.

10. The packaging system of claim 9, wherein the inner surface of the first conformal spacer cushion comprises a contoured surface including a central, generally planar projecting portion configured to be received by a central recess of a front wall of a wafer container, and a plurality of generally planar, non-central surfaces configured to receive a plurality of complementary surfaces of the front wall of the wafer container.

1 1. The packaging system of claim 9, wherein each of the plurality of first and second projecting portions includes a planar surface parallel to, but not coplanar with, the central planar surface.

12. The packaging system of claim 9, wherein the first plurality of projecting portions includes three equidistantly spaced projecting portions.

13. The packaging system of claim 9, further comprising a connecting device connecting the first conformal spacer cushion to the second conformal spacer cushion.

14. The packaging system of claim 13, wherein the connecting device comprises one or more straps.

15. The packaging system of claim 9, further comprising a first bag for wrapping about the wafer container, the first bag conforming to the contoured inner surfaces of both the first conformal spacer cushion and the second conformal spacer cushion.

16. The packaging system of claim 15, wherein the bag comprises a polyethylene material.

17. The packaging system of claim 15, further comprising a second bag for wrapping about the wafer container and the first bag, the second bag generally conforming to the contoured inner surfaces of both the first conformal spacer cushion and the second conformal spacer cushion.

18. The packaging system of claim 17, wherein the second bag comprises an electrostatic discharge bag.

19. The packaging system of claim 9 further comprising a sleeve having four sides, the sleeve receiving the first conformal spacer cushion and the second conformal spacer cushion.

20. The packaging system of claim 19, wherein outer portions of the edge portions of the first and second conformal spacer cushions are positioned adjacent to, and in contact with, inner surfaces of the four sides of the sleeve.

21. The packaging system of claim 19, wherein the sleeve comprises a box having a top portion and a bottom portion.

22. The packaging system of claim 19, further comprising an outer box enclosing the first and second spacer cushions and the sleeve.

23. The packaging system of claim 9, wherein the edge portions of the first and second conformal spacer cushions are configured to contact side walls of the wafer container.

24. The packaging system of claim 9, further comprising the wafer container, the wafer container adapted to carry a plurality of 450mm wafers.

25. The packaging system of claim 9, wherein the first conformal spacer cushion comprises a material selected from the group consisting of corrugated cardboard, corrugated plastic, polystyrene foam, and plastic.

26. A wafer transport packaging system, comprising: a wafer container configured to carry 450mm semiconductor wafers, including a front wall, rear wall and four side walls, the front wall defining a front contoured surface, the rear wall defining a rear contoured surface; a first conformal spacer cushion defining a substantially contiguous inner surface, the inner surface being generally complementary to the front contoured surface of the front wall of the wafer container, the first conformal spacer cushion adjacent the front wall of the wafer container such that the inner surface of the first conformal spacer cushion is adjacent to the front contoured surface of the wafer container; and a second conformal spacer cushion defining a substantially contiguous contoured inner surface, the contoured inner surface being generally complementary to the rear contoured surface of the rear wall of the wafer container, the second conformal spacer cushion adjacent the rear wall of the wafer container such that the contoured inner surface of the second conformal spacer cushion is adjacent to, and conformal to, the rear contoured surface of the wafer container.

27. The wafer transport packaging system of claim 26, wherein the inner surface of the first conformal spacer cushion defines a contoured surface.

28. The packaging system of claim 26 further comprising a connecting device extending from the first conformal spacer cushion to the second conformal spacer cushion and coupling first conformal spacer cushion to the second spacer cushion and the wafer container.

29. The packaging system of claim 27, further comprising a first bag enclosing the wafer container and a second bag enclosing the first bag and the wafer container, such that the wafer container is not in direct contact with the first and second conformal spacer cushions.

30. The packaging system of claim 26, further comprising an inner box enclosing the first and second conformal spacer cushions, and the wafer container.

31. The packaging system of claim 30, further comprising secondary cushions adjacent corners of the inner box, and an outer box enclosing the inner box and the secondary cushions.

32. A method of packaging a wafer container containing a plurality of wafers for transport: inserting a plurality of wafers into the wafer container, the wafer container including a removable door defining a front wall; orienting the wafer container to be in a transport position, such that the front wall is in a horizontal orientation and the wafers are in a vertical orientation; placing a first conformal spacer cushion having a surface adjacent the front wall of the wafer carrier, thereby causing the surface of the first conformal spacer cushion to cover substantially all of an outer surface of the front wall; and placing a second conformal spacer cushion having a contoured surface adjacent a rear wall of the wafer carrier, thereby causing the contoured surface of the second conformal spacer cushion to cover substantially all of an outer surface of the rear wall.

33. The method of claim 32, further comprising inserting the wafer container, first conformal spacer cushion and second conformal spacer cushion into a first box.

34. The method of claim 33, further comprising adding corner supports to the first box, and inserting the first box with corner supports into a second box.