KR20080060524A - Organic light emitting diodes display device and method of manufacturing the same - Google Patents

Abstract

An organic light emitting diode display device and a method of manufacturing the same are provided to prevent pollution of a display region due to a dummy sealing member by positioning the dummy sealing member on a groove formed on a dummy seal forming region. An organic light emitting diode display device includes a first substrate(100), an organic light emitting diode, a sealing member, a second substrate(200), and a dummy sealing member(350). The first substrate includes a display region for displaying an image. The organic light emitting diode is provided on the display region. The sealing member is positioned on a periphery of the display region. The second substrate is bonded to the first substrate through the sealing member and includes a thin film transistor electrically connected to the organic light emitting diode. The dummy sealing member maintains the bonding of the first and the second substrates by being interposed between the first and second substrates in the display region.

Description

Organic light emitting diode display and manufacturing method thereof {ORGANIC LIGHT EMITTING DIODES DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME}

1 is a photograph showing that a toast failure occurs in a conventional dual panel type organic light emitting diode display.

2 is a plan view of an organic light emitting diode display according to a first exemplary embodiment of the present invention.

3 is an enlarged plan view of a portion of FIG. 2;

4 is a cross-sectional view taken along line II ′ of FIG. 1 and line II-II ′ of FIG. 3.

5 is a cross-sectional view of an organic light emitting diode display according to a second exemplary embodiment of the present invention.

6A through 6E are cross-sectional views illustrating a method of manufacturing an organic light emitting diode display according to a third exemplary embodiment of the present invention.

7A and 7B are cross-sectional views illustrating a method of manufacturing an organic light emitting diode display according to a fourth exemplary embodiment of the present invention.

 (Explanation of symbols for the main parts of the drawing)

100: first substrate 110: first electrode

115: buffy layer 120: organic light emitting layer

125: partition 130: second electrode

135: first contact spacer 137: second contact spacer

145: protrusion 200: second substrate

203: thin film transistor 204: common voltage pad portion

210: protective film 300: sealing member

350: dummy sealing member

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an organic light emitting diode display and a manufacturing method thereof, and more particularly, to a dual panel type organic light emitting display device and a manufacturing method thereof.

The organic light emitting diode display is self-luminous and does not require a backlight such as a liquid crystal display, so it is not only lightweight and thin, but also can be manufactured through a simple process, thereby increasing price competitiveness. In addition, organic light emitting diode display devices are rapidly rising as next generation displays due to low voltage driving, high luminous efficiency, and wide viewing angle.

The organic light emitting diode display includes an organic light emitting diode for generating light and a thin film transistor for controlling the driving of the organic light emitting diode. Here, the thin film transistors individually drive the organic light emitting diodes, so that the organic light emitting diodes may display the same luminance even when a low current is applied to the organic light emitting diodes. As a result, the organic light emitting diode display device includes a thin film transistor, which is advantageous for low power consumption, high definition, and large size, and can improve the life of the device.

In the organic light emitting diode display device as described above, the aperture ratio of the organic light emitting diode display is reduced by the thin film transistor as the image is transmitted to the user through the substrate.

In addition, as the organic light emitting diode display device forms a thin film transistor and an organic light emitting diode on one substrate, the manufacturing process time of the organic light emitting diode display device is increased and the process yield is lowered.

Accordingly, a technology for an organic light emitting diode display device of a dual panel type has emerged. The dual panel type organic light emitting diode display includes first and second substrates spaced apart from each other. The thin film transistor is formed on the first substrate, and the organic light emitting diode is formed on the second substrate. In this case, the spaced apart thin film transistor and the organic light emitting diode are electrically connected to each other by a contact spacer.

Such a dual panel organic light emitting diode display device may be manufactured by forming a thin film transistor and an organic light emitting diode on the first and second substrates, respectively, and then bonding the first and second substrates together in a vacuum state. . Thereby, process yield can be improved.

However, the dual panel type organic light emitting diode display has a problem in that a toast defect occurs.

1 is a photograph showing that a toast failure occurs in a conventional dual panel type organic light emitting diode display.

As shown in FIG. 1, the toast failure starts from the outside of the dual panel type organic light emitting diode display device and does not gradually light up as time passes. As a result, the organic light emitting diode display of the dual panel type is not driven entirely. At this time, it was confirmed that when the pressure is applied to the region where the drive is not turned on again.

This is because the separation space between the completed first and second substrates exists in a vacuum state, as the vacuum of the separation space decreases with time, and the cell gap between the first and second substrates increases. As a result, electrical contact between the thin film transistor and the organic light emitting diode is dropped, and the thin film transistor does not apply an electrical signal to the organic light emitting diode so that the organic light emitting diode is not driven.

It is an object of the present invention to provide an organic light emitting diode display device capable of preventing toast defects.

In addition, another object of the present invention is to provide a method of manufacturing the organic light emitting diode display.

In order to achieve the above technical problem, an aspect of the present invention provides an organic light emitting diode display. The organic light emitting diode display device includes a first substrate including a display area for displaying an image, an organic light emitting diode provided in the display area, a sealing member disposed along the periphery of the display area, and the first sealing member by the sealing member. A dummy sealing member bonded to a substrate and interposed between the first and second substrates of the display area and the second substrate having a thin film transistor electrically connected to the organic light emitting diode to maintain the bonding between the first and second substrates. It includes.

In order to achieve the above technical problem, there is provided a method of manufacturing an organic light emitting diode display device according to another aspect of the present invention. The manufacturing method includes providing a first substrate in which a display area in which an image is displayed is defined, forming an organic light emitting diode in the display area, and providing a second substrate in which a display area corresponding to the display area is defined. Forming a thin film transistor in the facing display area, forming a dummy sealing member disposed on the facing display area on the second substrate, and forming a sealing member along an outer edge of the facing display area. And the organic light emitting diode and the thin film transistor are electrically connected to each other, and bonding the first and second substrates to each other by the sealing member and the dummy sealing member.

Hereinafter, an organic light emitting diode display according to the present invention will be described in detail with reference to the accompanying drawings. The following embodiments are provided as examples to sufficiently convey the spirit of the present invention to those skilled in the art. Accordingly, the invention is not limited to the embodiments described below and may be embodied in other forms. In the drawings, the size and thickness of the device may be exaggerated for convenience. Like numbers refer to like elements throughout.

Example  One

2 is a plan view of an organic light emitting diode display according to a first exemplary embodiment of the present invention.

Referring to FIG. 2, the organic light emitting diode display includes a display area D for displaying an image. Here, the display area D includes a plurality of pixels. Each of the pixels emits light, and the lights display an image.

The sealing member 300 is disposed along the outside of the display area D to bond the first and second substrates 100 and 200 spaced apart from each other. At this time, the space between the first and second substrates 100 and 200 is in a vacuum state.

In addition, a dummy sealing member 350 is disposed in a predetermined region of the display area D to bond the first and second substrates 100 and 200 in the display area D to each other. As a result, the degree of vacuum is released between the first and second substrates 100 and 200 to prevent the gap between the first and second substrates 100 and 200 from increasing. As a result, as the gap increases, it is possible to prevent toast defects generated as electrical contact between the organic light emitting diode and the thin film transistor, which will be described later, drops.

Here, a plurality of dummy sealing members 350 may be disposed in the display area D. In this case, the dummy sealing member 350 may be disposed at each pixel area or at the periphery of each pixel area.

3 is an enlarged plan view of a portion of FIG. 2;

4 is a cross-sectional view taken along line II ′ of FIG. 1 and line II-II ′ of FIG. 3.

Referring to FIGS. 3 and 4, the organic light emitting diode display device includes a display area D, and includes first and second adhesive parts bonded to each other by a sealing member 300 disposed along an outer side of the display area D. Referring to FIGS. 2 substrates (100, 200). Here, the first substrate 100 is provided with an organic light emitting diode (E). In addition, the second substrate 200 is provided with a thin film transistor Tr electrically connected to the organic light emitting diode E.

In the first substrate 100, a display area D including a plurality of pixels P is defined. The first electrode 110 is provided in the display area D of the first substrate 100. That is, the first electrode 110 is integrally provided in all the pixels P, and all the pixels P share the first electrode 110 in common.

A buffer layer 115 is disposed on the first electrode 110 to expose a light emitting region in which light is generated. Here, the buffer layer 115 prevents a short failure between the first electrode 130 and the second electrode 130 to be described later. In addition, the buffer layer 115 is formed by extending the organic light emitting layer 130 to be described later in the neighboring pixels due to a process error, thereby preventing the neighboring pixels from affecting each other and deteriorating the image quality. Here, the buffer layer 115 may be made of silicon oxide, silicon nitride, or the like.

The partition wall 125 is provided on the buffer layer 115. The partition wall 125 is disposed along the periphery of each pixel P. That is, the partition wall 125 is disposed in a boundary area between the plurality of pixels P to separate each pixel P. Here, the partition wall 125 serves to naturally pattern the second electrode 130, which will be described later, for each pixel P without a shadow mask. As a result, the cross section of the partition wall 125 has a trapezoidal shape.

At this time, the opening C exposing the buffer layer 115 is formed in a predetermined region of the partition wall 125. In the opening C, a protrusion 145 to be described later is formed.

Here, the protrusion 145 may be disposed in another area that does not affect the opening ratio. For example, the protrusion 145 may be disposed on the buffer layer 115 corresponding to the periphery of the emission area of the pixel P. That is, the protrusion 145 may be disposed in the non-light emitting area of the pixel P.

The protrusion 145 protrudes toward the second substrate 200 to be described later. Here, the protrusion 135 is bonded to the dummy sealing member 350 disposed on the second substrate 200. As a result, the first and second substrates 100 and 200 in the display area D are bonded to each other.

In this case, the protrusion 145 may be designed to correspond to the separation interval between the first and second substrates 100 and 200. As a result, the gap between the first and second substrates 100 and 200 may be kept constant.

In addition, the first contact spacer 135 is provided on the buffer layer 115. The first contact spacer 135 is disposed in the pixel P. As shown in FIG. The first contact spacer 135 may be made of the same material as the protrusion 125. This is because the protrusion 145 and the first contact spacer 135 may be formed through the same process.

Here, the first contact spacer 135 serves to electrically connect the organic light emitting diode E and the thin film transistor 202 spaced apart from each other.

That is, as the second electrode 130 of the organic light emitting diode E is formed on the surface of the first contact spacer 135, a part of the second electrode 130 is formed by the first contact spacer 135. It protrudes toward the second substrate 200. As a result, the second electrode 130 on the first contact spacer 135 may be in electrical contact with the thin film transistor 202.

In addition, a second contact spacer 137 is further disposed on the buffer layer 115 corresponding to the edge portion of the display area D. FIG. The second contact spacer 137 electrically connects the common electrode pad 204 disposed on the first electrode 130 and the second substrate 200 to each other. That is, the conductive member 138 covering the second contact spacer 137 is electrically connected to the first electrode 130. Here, the conductive member 138 on the second contact spacer 137 is in contact with the common voltage pad part 203. As a result, the first electrode 130 and the common voltage pad part spaced apart from each other are electrically connected to each other, and a common voltage is applied to the first electrode 130 from the common voltage pad part 204.

The organic light emitting layer 120 is disposed on at least the first electrode 110 of the light emitting region.

The second electrode 130 is disposed on the organic light emitting layer 120. The second electrode 130 is separated for each pixel P by the partition wall 125. In this case, as described above, a part of the second electrode 130 is formed to cover the contact spacer 135, and the second electrode on the contact spacer 135 contacts the thin film transistor 102.

Thus, the organic light emitting diode E and the second substrate 200 including the first electrode 110, the organic light emitting layer 120, and the second electrode 130 are disposed in the display area D of the first substrate 100. Protruding portion 145 for adhering to the dummy sealing member 350 is provided.

On the other hand, in the second substrate 200, a facing display area corresponding to the display area D is defined. In the facing display area, the plurality of gate lines 202 and the data lines 201 are disposed to cross each other. Here, the gate lines 202 and the data lines 201 cross each other to form a plurality of cells 210, each cell 210 corresponding to each pixel P of the first substrate 100. In this case, the cell 210 and the pixel P are disposed at least partially overlapping each other. This is because the thin film transistor 203 provided in each cell 210 and the organic light emitting diode E disposed in the pixel P must be electrically connected to each other.

Each cell 210 includes a thin film transistor 203 connected to the gate line 202 and the data line 201. The thin film transistor 203 may include at least a switching thin film transistor S-Tr and a driving thin film transistor D-Tr. Here, the switching thin film transistor S-Tr switches the driving thin film transistor D-Tr. At this time, when the switching thin film transistor S-Tr turns on the driving thin film transistor D-Tr according to the gate signal, the driving thin film transistor D-Tr drives the organic light emitting diode E, It will light up. That is, the organic light emitting diode E is directly connected to the driving thin film transistor D-Tr. In addition, a capacitor Cp for charging an electrical signal may be further disposed in each cell 210.

The common voltage pad part 204 is disposed at the edge of the facing display area to apply a common voltage to the organic light emitting diode E. At this time, as described above, the common voltage pad part 204 is electrically connected to the first electrode 110 of the organic light emitting diode E by the second contact spacer 137.

The passivation layer 210 is disposed on the first substrate 100 including the thin film transistor 203 and the common voltage pad unit 204. Here, the passivation layer 210 includes a contact hole exposing the output terminal of the thin film transistor 203 and the common voltage pad unit 204. The output terminal may be a drain electrode of a driving thin film transistor. In this case, the second electrode 130 and the conductive member 137 disposed on the first and second contact spacers 135 and 137, respectively, are electrically contacted through the contact hole.

The dummy sealing member 350 corresponding to the protrusion 145 disposed on the first substrate 100 is disposed on the passivation layer 210. In this case, as the protrusion 145 and the dummy sealing member 350 are bonded to each other, the first and second substrates 100 and 200 in the display area D are partially bonded to each other. As a result, the second substrate 200 is separated from the first substrate 100 due to the pressure difference between the first and second substrates 100 and 200, thereby preventing toast failure. Here, the dummy sealing member 350 may be made of the same material as the sealing member 300. That is, the dummy sealing member 350 may be a thermosetting resin or a photocurable resin.

In the exemplary embodiment of the present invention, the protrusion 145 is provided on the first substrate 100 and the dummy sealing member 350 is provided on the second substrate 200. However, the present invention is not limited thereto, and the dummy sealing member 350 may be provided on the first substrate 100, and the protrusion 145 may be provided on the second substrate 200.

Accordingly, the organic light emitting diode display according to the exemplary embodiment of the present invention partially adheres the first and second substrates to each other in the display area, thereby preventing toast failures according to the degree of vacuum between the first and second substrates. can do.

Example  2

5 is a cross-sectional view of an organic light emitting diode display according to a second exemplary embodiment of the present invention. The second embodiment of the present invention has the same structure as the organic light emitting diode display device of the first embodiment described above except for the protective film. Therefore, duplicate descriptions of the same components will be omitted, and the same names and reference numerals will be given to the same components.

Referring to FIG. 5, the organic light emitting diode display device includes a display area D, and includes first and second substrates bonded to each other by a sealing member 300 disposed along an outer side of the display area D. 100, 200). Here, the first substrate 100 is provided with an organic light emitting diode (E). In addition, the second substrate 200 is provided with a thin film transistor Tr electrically connected to the organic light emitting diode E.

In the display area D of the first substrate 100, an organic light emitting diode including a first electrode 110, an organic light emitting layer 120, and a second electrode 130, and a dummy sealing member 350 of a second substrate, Protruding portion 145 is provided for bonding.

The second substrate 200 includes a thin film transistor 203 electrically connected to the second electrode 130 and a common voltage pad part 204 connected to the first electrode 110.

The passivation layer 220 is disposed on the first substrate 100 including the thin film transistor 203 and the common voltage pad unit 204. The passivation layer 220 includes a contact hole exposing the output terminal of the thin film transistor 203 and the common voltage pad part 204.

In addition, the passivation layer 220 includes a groove 225 having a predetermined depth. Here, the groove 225 corresponds to the protrusion 145 provided in the first substrate 100. In this case, the groove 225 may expose the second substrate 200.

The dummy sealing member 350 is disposed in the groove 225 to prevent the dummy sealing member 350 from flowing to another area. As a result, the dummy sealing member 350 disposed in the display area D may be prevented from contaminating the organic light emitting diode E or the thin film transistor and the common voltage pad part exposed through the contact hole.

Therefore, the organic light emitting diode display according to the second exemplary embodiment of the present invention forms the groove 225 in the passivation layer 220 and arranges the dummy sealing member 350 in the groove 225, thereby providing the dummy sealing member 350. ) Can be prevented from contaminating the inside of the panel, that is, the display area D.

Example  3

6A through 6E are cross-sectional views illustrating a method of manufacturing an organic light emitting diode display according to a third exemplary embodiment of the present invention. Here, the fifth embodiment is a manufacturing method for manufacturing the organic light emitting diode display according to the first embodiment of the present invention. Accordingly, a third embodiment of the present invention will be described with reference to FIGS. 6A to 6E and FIGS. 2 to 4.

6A, 2, and 3, a first substrate 100 is provided to manufacture an organic light emitting diode display. The first substrate 100 may be made of a material that can transmit light. For example, the first substrate 100 may be a plastic substrate, a glass substrate, a film, or the like.

The display area D is defined in the first substrate 100.

The first electrode 130 is formed on the first substrate 100 in the display area D. The first electrode 110 may be formed by etching the conductive film after forming the conductive film by sputtering or vacuum deposition. Here, the first electrode 110 is formed of a transparent conductive material so as to transmit light. For example, the first electrode 110 may be formed of ITO or IZO. Here, the first electrode 110 is used as a common electrode for all pixels.

After the first electrode 110 is formed, the buffer layer 115 is formed on the first electrode 110. The buffer layer 115 exposes the light emitting area of the pixel P. Here, the buffer layer 115 is formed by patterning an inorganic film. The inorganic layer may be formed of silicon oxide or silicon nitride. In this case, the inorganic film may be formed through chemical vapor deposition or sputtering.

6B, 2, and 3, after the buffer layer 115 is formed, the partition wall 125 is formed on the buffer layer 115. The partition wall 125 is formed to surround the periphery of the pixel P. Thus, the partition wall 125 is disposed in the boundary region between the pixels P to separate each pixel P. As shown in FIG.

In this case, the partition 125 has an opening C exposing the buffer layer 115. Here, the opening C is a region where the protrusion 145 to be described later is formed.

Here, the partition wall 125 serves to naturally pattern the second electrode 130, which will be described later, and the partition wall 125 has an inverse taper shape. For example, the cross-sectional shape of the partition wall 125 has an inverted trapezoidal shape.

In order to form the partition wall 125, an organic layer is formed on the first substrate 100 including the buffer layer 115. The organic film can be formed of acrylic resin, urethane resin, benzocyclobutene (BCB), polyimide (PI), or the like. The partition wall 125 may be formed through the exposure and development processes in the organic film.

6C, 2, and 3, after the partition wall 125 is formed, the first contact spacer 135 disposed in the pixel P and the second contact disposed at the edge portion of the display area D are formed. The protrusion 145 disposed in the opening C of the spacer 137 and the partition wall 125 is formed.

In order to form the first and second contact spacers 135 and 137 and the protrusion 145, an organic layer is formed on the first substrate 100 including the buffer layer 115. Thereafter, the organic layer may be formed through exposure and development processes. The organic layer may be formed of acrylic resin, urethane resin, benzocyclobutene (BCB), polyimide (PI), or the like.

In the exemplary embodiment of the present invention, the order of forming the partition wall 125 and the first contact spacer 135 is not limited. That is, after forming the first contact spacer 135, the partition wall 125 may be formed.

6D, 2, and 3, after forming the first and second contact spacers 135 and 137 and the protrusion 145, the organic light emitting layer 120 is formed on the first electrode 110. .

Here, the organic light emitting layer 120 may be formed of a high molecular material or a low molecular material. In this case, when the organic light emitting layer 120 is formed of a low molecular weight material, the organic light emitting layer 120 may be formed by a vacuum deposition method. In this case, the organic light emitting layer 120 may be formed to cover the outer skin of the first contact spacer 135 disposed in the pixel P.

After the organic light emitting layer 120 is formed, the second electrode 130 is formed on the organic light emitting layer 120. The second electrode 130 may be formed through a vacuum deposition method. In this case, the second electrode 130 is naturally patterned for each pixel P by the partition wall 125. As a result, the second electrode 130 may be formed without undergoing a separate shadow mask and an etching process.

In this case, the second electrode 130 is formed to cover the first contact spacer 135 disposed in the pixel P. As a result, a part of the second electrode 130 protrudes upward.

Here, the conductive member 138 covering the second contact spacer 137 is further formed in the process of forming the second electrode 130. In this case, the conductive member 138 is electrically connected to the first electrode 110, and a part of the conductive member 138 protrudes upward by the second contact spacer 137.

Meanwhile, a thin film transistor is formed on the second substrate 200 in addition to forming the organic light emitting diode on the first substrate 100.

6E, 2, and 3, the thin film transistor 203 is formed in the display area of the second substrate corresponding to the display area of the first substrate 100. At the same time, the common voltage pad part 204 is formed in the edge part of a facing display area.

After the thin film transistor 203 and the common voltage pad part 204 are formed, the passivation layer 210 is formed on the second substrate 200 to cover the thin film transistor 203 and the common voltage pad part 204.

The passivation layer 210 may be formed of silicon oxide or silicon nitride. In this case, the passivation layer 210 may be formed through chemical vapor deposition or sputtering. In this case, the protective layer 210 has a contact hole that exposes the output terminal of the thin film transistor 203 and the common voltage pad unit 204. An example of the output terminal may be a drain electrode of the thin film transistor 203. The contact hole may be formed by forming a photoresist pattern with a portion of the protective layer 210 opened therein and then etching the protective layer 210 using the photoresist pattern as an etching mask.

Subsequently, the dummy sealing member 350 is formed by dotting a sealing resin on the surface of the passivation layer 210 using an ink jet on the display area. In this case, the dummy sealing member 350 is formed to correspond to the protrusion 125 formed on the first substrate 100.

Thereafter, the sealing member 300 is formed along the periphery of the facing display area using the dispenser.

Thereafter, the first substrate 100 may be bonded together using the second substrate 200, the sealing member 300, and the dummy sealing member 350 to manufacture an organic light emitting diode display device as shown in FIG. 4. In this case, as an example of the bonding process, after aligning the first and second substrates 100 and 200 with each other in a vacuum chamber, the first and second substrates 100 and 200 are bonded by reducing the degree of vacuum in the chamber. You can.

At this time, the protrusion 145 and the dummy sealing member 350 are bonded to each other, so that the first and second substrates 100 and 200 in the display area D are partially bonded to each other.

Here, the dummy sealing member 350 and the sealing member 300 may be made of a thermosetting resin or a photocurable resin. At this time, when the dummy sealing member 350 and the sealing member 300 is made of a photo-curing resin, the dummy sealing member 350 and the sealing member 300 is performed using a mask in the process of curing. This is because the organic light emitting layer 120 may be degraded by reacting with light.

The organic light emitting diode and the thin film transistor may be electrically connected to each other by the first contact spacer 135. In addition, the organic light emitting diode and the common voltage pad part may be electrically connected to each other by the second contact spacer 137.

Example  4

7A and 7B are cross-sectional views illustrating a method of manufacturing an organic light emitting diode display according to a fourth exemplary embodiment of the present invention. The fourth embodiment of the present invention is the same as the manufacturing method of the organic light emitting diode display of the third embodiment described above except for forming the protective film. Therefore, duplicate description of the same manufacturing method will be omitted, and the same components and the same reference numerals will be given. In addition, the manufacturing method according to the fourth embodiment is for manufacturing the organic light emitting diode display according to the third embodiment described above. Therefore, a fourth embodiment of the present invention will be described with reference to FIGS. 7A, 7B and 5.

Referring to FIG. 7A, a second substrate 200 having a thin film transistor 203 and a common voltage pad part 204 is provided.

After forming the thin film transistor 203 and the common voltage pad part 204, the passivation layer 220 is formed on the second substrate 200 to cover the thin film transistor 203 and the common voltage pad part 204.

In this case, the passivation layer 220 forms a groove 225 having a predetermined depth in the contact hole and the dummy sealing member forming region 225 that expose the output terminal of the thin film transistor 203 and the common voltage pad unit 204, respectively. The groove 225 may expose the second substrate 200.

Referring to FIG. 7B, a dummy sealing member 350 is formed by dotting the sealing resin into the groove 225 using an inkjet. As a result, the sealing resin can be prevented from flowing to other areas to contaminate the organic light emitting diode and the thin film transistor. In this case, the dummy sealing member 350 is formed to correspond to the protrusion 125 formed on the first substrate 100.

Thereafter, the sealing member 300 is formed along the periphery of the facing display area using the dispenser.

Thereafter, the first substrate 100 is bonded using the second substrate 200, the sealing member 300, and the dummy sealing member 350 to manufacture the organic light emitting diode display device as shown in FIG. 5A.

Although described above with reference to embodiments of the present invention, those skilled in the art can variously modify and change the present invention without departing from the spirit and scope of the invention described in the claims below. I can understand that.

As described above, the organic light emitting diode display device according to the present invention forms a thin film transistor and an organic light emitting diode element on the first and second substrates, respectively, and then attaches the first and second substrates to each other to the organic light emitting display device. By manufacturing, it is possible to expect an improvement in production yield with a decrease in defective rate.

In addition, the organic light emitting diode display device partially adheres the first and second substrates to each other by a dummy sealing member provided in the display area, thereby preventing toast defects from occurring according to the degree of vacuum between the first and second substrates. Can be.

In addition, the organic light emitting diode display device can prevent the dummy sealing member from contaminating the inside of the panel, that is, the display area, by forming a groove in the dummy sealing formation region and disposing the dummy sealing member in the groove.

Claims (17)

A first substrate including a display area for displaying an image; An organic light emitting diode in the display area; A sealing member disposed along a periphery of the display area; A second substrate bonded to the first substrate by the sealing member and having a thin film transistor electrically connected to the organic light emitting diode; And And a dummy sealing member interposed between the first and second substrates in the display area to maintain adhesion between the first and second substrates. The method of claim 1, And a protrusion interposed between the first substrate and the dummy sealing member. The method of claim 2, And a contact spacer made of the same material as the protrusion and electrically connecting the organic light emitting diode and the thin film transistor to each other. The method of claim 1, The display area includes a plurality of pixels for displaying the image. And the dummy sealing member is disposed at a boundary area of the pixels. The method of claim 1, The display area includes a plurality of pixels for displaying the image. And the dummy sealing member is disposed in the pixel. The method of claim 1, The dummy sealing member is made of the same material as the sealing member. The method of claim 1, The display area includes a plurality of pixels for displaying the image. And a partition wall disposed along a boundary area of each of the pixels and exposing a formation area of the dummy sealing member. The method of claim 1, And a passivation layer covering the thin film transistor on the second substrate and having a groove corresponding to the dummy sealing member. Providing a first substrate on which a display area in which an image is displayed is defined; Forming an organic light emitting diode in the display area; Providing a second substrate on which a display area corresponding to the display area is defined; Forming a thin film transistor in the facing display area; Forming a dummy sealing member on the second substrate, the dummy sealing member disposed in the facing display area; Forming a sealing member along an outside of the facing display area; And The organic light emitting diode and the thin film transistor are electrically connected to each other, and bonding the first and the second substrate by the sealing member and the dummy sealing member comprising the step of manufacturing an organic light emitting diode display device. . The method of claim 9, The forming of the organic light emitting diode may include forming a protrusion on a first substrate corresponding to a contact area of the dummy sealing member. The method of claim 10, In the forming of the protrusion, a contact spacer for electrically connecting the organic light emitting diode and the thin film transistor to each other is further formed on the first substrate. The method of claim 10, And wherein the protrusion is formed at a boundary area of the pixels in the display area. The method of claim 10, And wherein the protrusion is formed in a pixel provided in the display area. The method of claim 9, The dummy sealing member and the sealing member are formed at the same time manufacturing method of the organic light emitting diode display device. The method of claim 9, In the step of forming the organic light emitting diode And forming a partition along the boundary area of each pixel while exposing the formation area of the dummy sealing member. The method of claim 9, In the step of forming the thin film transistor And forming a passivation layer on the second substrate, wherein the passivation layer covers the thin film transistor and has a groove in a region where the dummy sealing member is formed. The method of claim 9, And the dummy sealing member is formed by doping the sealing resin on the passivation layer by an inkjet method.

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