KR20080052902A - Display device - Google Patents

Abstract

A display apparatus is provided to radiate heat of a light emitting diode easily by changing a structure of a radiating member so as to improve an operation property of the light emitting diode. A display apparatus includes a display panel and at least one light source unit(50). The light source unit is applied to supply the light to the display panel. The light source unit includes a light emitting diode(52) and a printed circuit board(54). The light emitting diode radiates the light. The printed circuit board has a pattern(154) to transmit a driving signal to the light emitting diode. The light emitting diode includes a radiating member and the radiating member is coupled with the printed circuit board integrally. The light emitting diode has a light emitting diode chip, a lens(58), a frame(60), a first lead member(62), a second lead member(64), and the radiating member.

Description

Display device {DISPLAY DEVICE}

1 is a schematic exploded perspective view of a display device according to a first exemplary embodiment of the present invention.

FIG. 2 is an exploded perspective view showing an enlarged portion II of FIG. 1.

3A and 3B are cross-sectional views illustrating a coupling process of light emitting diodes.

4 is a cross-sectional view of a light source unit included in a display device according to a second exemplary embodiment of the present invention.

The present invention relates to a display device capable of efficiently dissipating heat generated from a light emitting diode.

Various types of display devices have been developed. Among various display devices, liquid crystal display devices (LCDs), which have improved performances due to rapidly developing semiconductor technologies, are widely used.

The liquid crystal display device can be miniaturized, lightweight, and low power, and thus can replace a conventional cathode ray tube (CRT). Therefore, the liquid crystal display device is used as a small product such as a mobile phone, a personal digital assistant (PDA), a portable multimedia player (PMP), and the like as well as a monitor and a TV which are medium and large products. On the other hand, since the liquid crystal display device is not a self-luminous device, a light source for supplying light is required.

An object of the present invention is to provide a display device capable of efficiently emitting heat generated from a light emitting diode.

A display device according to an embodiment of the present invention includes a display panel and one or more light source units adapted to provide light to the display panel. The light source unit includes a light emitting diode emitting light and a printed circuit board having a pattern applied to transmit a driving signal to the light emitting diode. The light emitting diode includes a heat dissipation member, and the heat dissipation member is three-dimensionally coupled with the printed circuit board.

The heat dissipation member may include a heat dissipation main body and a protrusion protruding from the heat dissipation main body toward the printed circuit board, and the protrusion may be inserted into and coupled to an opening formed in the printed circuit board. The printed circuit board may include a heat dissipation layer formed on the surface of the opening.

The display device according to an exemplary embodiment of the present invention may further include a solder member electrically connecting the heat dissipation member and the printed circuit board, and the protrusion may be coupled to the printed circuit board by the solder member. The heat dissipation layer may extend to the top and bottom surfaces of the printed circuit board. The heat dissipation layer may be electrically insulated from the pattern. The heat dissipation layer may be made of a conductive material, and the conductive material may include copper.

The light emitting diode may include a first lead member and a second lead member to which a driving voltage is applied, and the heat dissipation member may be integrally formed with any one of the first lead member and the second lead member. The light emitting diode may further include a light emitting diode chip, wherein the heat dissipation member may contact the light emitting diode chip and the light emitting diode chip may emit heat through the heat dissipation member.

The display panel may be a liquid crystal display panel.

With reference to the accompanying drawings, it will be described embodiments of the present invention to be easily implemented by those skilled in the art. As can be easily understood by those skilled in the art, the following embodiments are only intended to illustrate the present invention, and various forms without departing from the spirit and scope of the present invention. It can be modified. Where possible the same or similar parts are represented with the same reference numerals in the drawings.

When a section is said to be "on top" of another section, it may be just above the other section or may be accompanied by another section in between. In contrast, if a part is mentioned as "directly above" another part, no other part is intervened.

It is to be understood that the terms first, second and third are used to describe various parts, components, regions, layers and / or sections, but are not limited to these. These terms are only used to distinguish one part, component, region, layer or section from another part, component, region, layer or section. Accordingly, the first portion, component, region, layer or section described below may be referred to as the second portion, component, region, layer or section without departing from the scope of the invention.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the singular forms “a,” “an,” and “the” include plural forms as well, unless the phrases clearly indicate the opposite. As used herein, the meaning of “comprising” embodies a particular characteristic, region, integer, step, operation, element, and / or component, and other specific characteristics, region, integer, step, operation, element, component, and / or group. It does not exclude the presence or addition of.

Terms indicating relative space, such as "below" and "above", may be used to more easily explain the relationship of one part to another part shown in the drawings. These terms are intended to include other meanings or operations of the device in use with the meanings intended in the figures. For example, turning the device in the figure upside down, some parts described as being "below" of other parts are described as being "above" other parts. Thus, the “down” exemplary term encompasses both up and down directions. The device can be rotated 90 degrees or at other angles, the terms representing relative space being interpreted accordingly.

Unless defined otherwise, all terms including technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art. Commonly defined terms used are additionally interpreted to have a meaning consistent with the related technical literature and the presently disclosed contents, and are not interpreted in an ideal or very formal sense unless defined.

Embodiments of the invention described with reference to perspective and cross-sectional views specifically illustrate ideal embodiments of the invention. As a result, various modifications of the drawings, for example, manufacturing methods and / or specifications, are expected. Thus, the embodiment is not limited to the specific form of the illustrated region, but includes, for example, modification of the form by manufacture. For example, regions shown or described as flat may have properties that are generally rough and / or rough. Also, portions shown to have sharp angles may be rounded. Accordingly, the regions shown in the figures are only approximate in nature, and their forms are not intended to depict the exact form of the regions and are not intended to narrow the scope of the invention.

1 is an exploded schematic view of a display device 100 according to an embodiment of the present invention.

As shown in FIG. 1, the display device 100 includes a light source unit 50 that largely provides light to the display panel 40, and a display panel 40 that displays an image. In addition, the first fixing member 30, the second fixing member 32, and the third fixing member 34 are coupled to each other to fix and support them.

The display panel 40 is connected to the driver IC packages 22 and 24 and receives a driving signal from the printed circuit boards 26 and 28. The driving integrated circuit packages 22 and 24 may use a tape carrier package (TCP) or a chip on film (COF). Here, the display panel 40 is injected between a TFT substrate 42 composed of a plurality of TFTs (thin film transistors), a color filter substrate 44 positioned on the TFT substrate 42, and the substrates. It includes a liquid crystal layer (not shown).

The TFT substrate 42 is a transparent glass substrate on which a matrix thin film transistor is formed. A data line is connected to a source terminal, and a gate line is connected to a gate terminal. In the drain terminal, a pixel electrode made of transparent indium tin oxide (ITO) as a conductive material is formed.

When electrical signals are input from the printed circuit boards 26 and 28 to the data lines and the gate lines of the display panel 40 described above, electrical signals are input to the source terminal and the gate terminal of the TFT, and these electrical signals are input. Accordingly, the TFT is turned on or turned off so that an electrical signal necessary for pixel formation is output to the drain terminal.

On the other hand, a color filter substrate 44 is disposed thereon opposite the TFT substrate 42. The color filter substrate 44 is a substrate in which RGB pixels, which are color pixels in which a predetermined color is expressed while light passes, are formed by a thin film process, and a common electrode made of ITO is coated on the entire surface. When power is applied to the gate terminal and the source terminal of the TFT and the thin film transistor is turned on, an electric field is formed between the pixel electrode and the common electrode of the color filter substrate 44. By this electric field, the arrangement angle of the liquid crystal injected between the TFT substrate 42 and the color filter substrate 44 is changed, and the light transmittance is changed according to the changed arrangement angle to obtain a desired pixel.

A driving signal and a timing signal are applied to the gate line and the data line of the TFT in order to control the alignment angle of the liquid crystals of the display panel 40 and the timing when the liquid crystals are arranged. The timing of the application of the data driving signal to the source side of the display panel 40 is determined. A data driving integrated circuit package 22 for determining is attached, and a gate driving integrated circuit package 24 is attached to the gate side to determine the application timing of the gate driving signal.

The data printed circuit board 26 and the gate printed circuit board 28 each include a data driving signal, a gate driving signal, which are signals for driving the display device 100, and a plurality of timing signals for applying these signals at an appropriate time. Are generated, the data signal is applied to the data line of the display panel 40, and the gate driving signal is applied to the gate line of the display panel 40.

The light source unit 50, the reflective sheet 12, the optical sheet 14, and the diffusion plate 16 are provided under the display panel 40. The reflective sheet 12 reflects the light emitted to the lower portion of the light source unit 50 toward the display panel 40. The diffusion plate 16 diffuses the emitted light to make it uniform, and the optical sheet 14 improves the linearity of the light to provide the light to the display panel 40. The structure of the light source unit 50 will be described later in detail with reference to FIGS. 2 to 4.

Although not shown in FIG. 1, an inverter board and a control board are provided on the rear surface of the third fixing member 34. The inverter board transforms an external power supply to a constant voltage level to provide the light source unit 50, and the control board is connected to the printed circuit boards 26 and 28 to convert analog data signals into digital data signals, and then the display panel 40. To provide.

FIG. 2 is an enlarged view of part II of FIG. 1 and illustrates a state in which the light source unit 50 is disassembled.

As shown in FIG. 2, the light source unit 50 includes a light emitting diode 52 that emits light and a printed circuit board 54 having patterns 154 applied to transmit driving signals to the light emitting diode 52. ).

The light emitting diode 52 includes a light emitting diode chip 56 (shown in FIG. 3A), a lens 58 and frame 60, a first lead member 62 and a second lead member 64, and a heat dissipation member 66. ) (Illustrated in FIG. 3A, hereinafter the same).

The lens 58 and the frame 60 form an appearance of the light emitting diode 52, and the first lead member 62 and the second lead member 64 contact the patterns 154 of the printed circuit board 54. To receive the driving signal. The heat dissipation member 66 includes a protrusion 266.

The printed circuit board 54 has conductive patterns 154 and an opening 254. A heat dissipation layer 68 is formed on the surface of the opening 254, and the heat dissipation layer 68 may be made of a conductive material, for example, a material including copper. Therefore, heat transmitted from the heat dissipation member 66 can be quickly released through the printed circuit board 54. The patterns 154 are electrically insulated from the heat dissipation layer 68 such that the patterns 154 contact the heat dissipation layer 68 so that a short circuit does not occur. 2 shows the patterns 154 and the heat dissipation layer 68 spaced apart from each other as an example.

3A and 3B sequentially illustrate a process in which the light emitting diode 52 is coupled to the printed circuit board 54. 3A is a cross-sectional view taken along line III-III of FIG. 2.

The LED chip 56 is connected to the first lead member 62 and the second lead member 64 through the conductive wire 156 to receive a driving signal. The heat dissipation member 66 is formed in contact with the light emitting diode chip 56 to emit heat generated from the light emitting diode chip 56 to the outside. The heat dissipation member 66 includes a heat dissipation body 166 and a protrusion 266. The protrusion 266 protrudes toward the printed circuit board 54 under the heat dissipation main body 166.

The solder member 70 is provided between the heat dissipation member 66 and the printed circuit board 54 to be fusion soldered. Therefore, the solder member 70 may firmly couple the heat dissipation member 66 to the printed circuit board 54. This will be described in more detail as follows.

First, the solder member 70 is positioned on the opening 254 of the printed circuit board 54, and the light emitting diode 52 is positioned on the solder member 70. After the heat is applied to the printed circuit board 54 to melt the solder member 70, the protrusion 266 of the heat dissipation member 66 is inserted into the opening 254 of the printed circuit board 54. Then, the solder member 70 is cured and the light emitting diode 52 is firmly attached to the printed circuit board 54.

That is, as shown in FIG. 3B, the light emitting diode 52 is three-dimensionally coupled with the printed circuit board 54. In other words, since the light emitting diode 52 contacts the printed circuit board 54 through the top surface and the opening 254 of the printed circuit board 54, the heat dissipation area is large.

Conventionally, since the lower part of the heat dissipation member is formed flat and attached to the printed circuit board, the heat dissipation member has a problem in that the area of the heat dissipation member is not only in contact with the printed circuit board, but also the surface is uneven so that the heat dissipation member cannot be stably contacted with the printed circuit board. . Therefore, the heat radiating effect of the heat radiating member was not good.

However, in the present exemplary embodiment, since the heat dissipation member 66 is three-dimensionally coupled to the printed circuit board 54 by using the protrusion 266 and the opening 254, the light emitting diode 52 contacts the printed circuit board 54. The area becomes wider. Therefore, the heat radiating effect of the heat radiating member 66 can be improved.

In addition, the heat radiation layer 68 extending from the surface of the opening 254 to the top and bottom surfaces of the printed circuit board 54 further secures the heat radiation area of the heat radiation member 66. Accordingly, as indicated by the arrows in FIG. 3B, the heat dissipation member 66 may easily release heat through the upper and lower surfaces of the printed circuit board 54. As a result, the heat dissipation efficiency of the light emitting diode 52 is improved, so that its operating life can be increased.

4 shows a light source unit 51 included in the display device according to the second embodiment of the present invention. The light source unit 51 shown in FIG. 4 is the same as the light source unit 50 of FIG. 3B except for the heat radiating member 67 of the light emitting diode 53. Therefore, the same reference numerals are used for the same parts, and detailed description thereof will be omitted.

Referring to FIG. 4, the heat dissipation member 67 may include a heat dissipation body 167 and a protrusion 266. The heat dissipation main body 167 is integrally formed with any one of the first lead member 62 and the second lead member 64. 4 illustrates a state in which the heat dissipation member 67 is connected to the second lead member 64 as an example.

The second lead member 64 is energized with the heat dissipation layer 68 through the heat dissipation member 67. Since the heat dissipation layer 68 is electrically insulated from the pattern 154, the heat dissipation layer 68 is not electrically connected to the first lead member 62, so that a short circuit does not occur between the lead members 62 and 64.

By modifying the structure of the heat dissipation member, heat of the light emitting diode can be easily released to the outside. As a result, the operating characteristics of the light emitting diode can be improved to extend the life of the light emitting diode. Therefore, the durability of the display device is improved.

Although the present invention has been described above, it will be readily understood by those skilled in the art that various modifications and variations are possible without departing from the spirit and scope of the claims set out below.

Claims (11)

Display panel; And One or more light source units adapted to provide light to the display panel Including, The light source unit A light emitting diode emitting light; And A printed circuit board having a pattern applied to transmit a driving signal to the light emitting diode Including; The light emitting diode includes a heat radiating member, and the heat radiating member is three-dimensionally coupled to the printed circuit board. The method of claim 1, The heat dissipation member, Heat dissipation body; And Protrusions protruding from the heat dissipation main body toward the printed circuit board And a projection part inserted into and coupled to an opening formed in the printed circuit board. The method of claim 2, The printed circuit board includes a heat dissipation layer formed on a surface of the opening. The method of claim 3, And a solder member electrically connecting the heat dissipation member and the printed circuit board, wherein the protrusion is coupled to the printed circuit board by the solder member. The method of claim 3, The heat dissipation layer extends to upper and lower surfaces of the printed circuit board. The method of claim 3, The heat dissipation layer is electrically insulated from the pattern. The method of claim 3, The heat dissipation layer is made of a conductive material. The method of claim 7, wherein The conductive material includes copper. The method of claim 1, The light emitting diode includes a first lead member and a second lead member to which a driving voltage is applied, and the heat dissipation member is integrally formed with any one of the first lead member and the second lead member. The method of claim 1, The light emitting diode further includes a light emitting diode chip, wherein the heat dissipation member is in contact with the light emitting diode chip, the light emitting diode chip emits heat through the heat dissipation member. In claim 1, The display panel is a liquid crystal display panel.

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