KR20080028259A - Ring type illuminator and method of thereof - Google Patents

Abstract

A ring type illuminator and a manufacturing method thereof are provided to stably maintain electrical connection between a lead of an LED(Light Emitting Diode) and a printed wiring board by firmly soldering the lead of the LED on both sides of the printed wiring board. A ring type illuminator includes a plurality of LEDs(8) and a printed wiring board(12). The printed wiring board is plate type or ring type. A ring type support plate(10) is interposed between light emitting units(14) of the LEDs and has a plurality of through holes(24) and an inclined surface(20) inclined downward to the inside of a diameter direction. Leads(16) of the LEDs are soldered by passing through a plurality of through holes(32) of the printed wiring board. The light emitting units of the LEDs are vertically supported on the inclined surface of the support plate.

Description

RING TYPE ILLUMINATOR AND METHOD OF THEREOF

1 is a perspective view showing a ring-shaped lighting device according to a first embodiment of the present invention.

2 is an exploded perspective view showing the ring-shaped lighting device of FIG.

3 is a schematic cross-sectional view of the ring-shaped lighting device of FIG.

FIG. 4 is an enlarged cross-sectional view showing a configuration of the through hole of the base plate of FIG. 3 and its surroundings. FIG.

It is a schematic principal part perspective view which shows the ring-shaped illumination device which concerns on 2nd Embodiment of this invention.

(Explanation of symbols for the main parts of the drawing)

2, 2A: ring shape lighting device

4: ring shape light source

6: housing

8: LED

10, 10A: large

12: printed wiring board

14: light emitting unit

16: lead

20: slope

22: ring-shaped recess

24, 24A: through hole

26: taper

30: positioning protrusion

32: through hole

36: positioning recess

50: heat dissipation member

[Patent Document 1] Patent No. 2975893

TECHNICAL FIELD This invention relates to the ring-shaped illuminating apparatus used for illuminating an inspection object in image processing inspection, etc., and its manufacturing method, for example.

Conventionally, when inspecting the quality of industrial products, such as a printed wiring board and a semiconductor, printing defects, such as a poor soldering and a foreign material, or the manufacturing misses, such as the manufacturing date printed on a beverage can, on a manufacturing line, a CCD Image processing inspection using imaging by a camera etc. is performed. In this image processing inspection, a ring-shaped illumination device for illuminating the inspection object arranged in the illumination region is used.

The above-described ring-shaped lighting device includes a ring-shaped light source for irradiating light in a ring shape, and the ring-shaped light source includes a plurality of LEDs and a bendable printed wiring board to which the plurality of LEDs are electrically connected. (For example, refer patent document 1). This ring-shaped lighting apparatus is manufactured as follows, for example. The printed wiring board is configured in a ring shape having a notch, and solders the respective leads of the plurality of LEDs to one side of the printed wiring board while the printed wiring board is held in a planar shape. Thereafter, one side of the printed wiring board is inward, and the printed wiring board is bent into a truncated cone shape, and both ends thereof are bonded to each other, whereby each light emitting part of the plurality of LEDs is cut off of the printed wiring board. It is arrange | positioned at the cone concave surface side.

However, the above-mentioned conventional ring-shaped lighting device has the following problems. Since the mounting density of the several LED with respect to a printed wiring board is comparatively high, it is not easy to bend a printed wiring board in a truncated cone shape, and, therefore, there exists a problem that a ring-shaped lighting apparatus cannot be manufactured easily. Further, as described above, bending a printed wiring board into a truncated cone shape causes stress on the printed wiring board, which in turn causes stress on the lead of the LED soldered to the printed wiring board, thereby soldering the lead of the LED. There is a problem that a crack occurs in the portion, and there is a possibility that a poor electrical contact between the lead of the LED and the printed wiring board occurs.

An object of the present invention is to provide a ring-shaped lighting device which can prevent electrical contact failure between a lead of a LED and a printed wiring board and can be easily manufactured, and a method of manufacturing the same.

The ring-shaped illumination device according to claim 1 of the present invention includes a plurality of LEDs and a printed wiring board to which the plurality of LEDs are electrically connected, wherein each of the plurality of LEDs includes a light emitting part covered with resin. And a lead extending from the light emitting portion, wherein a plurality of through holes are formed in the printed wiring board corresponding to each of the leads of the plurality of LEDs, and the leads of each of the plurality of LEDs are printed. In the ring-shaped lighting device inserted into the plurality of through holes of the wiring board and soldered,

The printed wiring board has a flat plate shape and a ring shape, and a ring-shaped base plate having insulation is interposed between the printed wiring board and each of the light emitting portions of the plurality of LEDs, and the base plate is formed from one side thereof. A plurality of through holes extending to the other side are formed, and one side thereof is provided with an inclined surface inclined downward inward in the radial direction,

Each of the leads of the plurality of LEDs passes through the plurality of through holes of the base plate and is inserted into and soldered to the plurality of through holes of the printed wiring board, and each of the light emitting portions of the plurality of LEDs is soldered. On the inclined surface of the base plate in a substantially vertical direction.

Moreover, in the ring shaped illuminating device of Claim 2 of this invention, the other surface of the said board | substrate is ring-shaped for accommodating the solder sucked in the one surface through the said plurality of through-holes of the said printed wiring board. A recess is formed.

Moreover, in the ring-shaped illuminating device of Claim 3 of this invention, the taper part which spreads outward is formed in each opening edge part of the said some through-hole in the said inclined surface side of the said base plate, It is characterized by the above-mentioned. It is done.

Moreover, in the ring-shaped illuminating device of Claim 4 of this invention, the said board | substrate and the said printed wiring board are each provided with the positioning means for mutually overlapping positioning with each other, It is characterized by the above-mentioned.

Moreover, in the ring shaped illuminating device of Claim 5 of this invention, the said positioning means is said coupling | joining with the positioning protrusion or recessed part formed in the said base plate, and the said positioning protrusion or recessed part mutually. It is comprised by the recessed part or protrusion part for positioning formed in the printed wiring board, It is characterized by the above-mentioned.

In addition, in the ring-shaped lighting apparatus according to claim 6 of the present invention, a housing for holding the base plate and the printed wiring board is further provided, and flexibility is provided between the other surface of the printed wiring board and the housing. The heat dissipation member which is provided is interposed, and the front-end | tip part of each said lead of the said some LED is thermoelectrically contacted with the said heat radiating member, It is characterized by the above-mentioned.

Moreover, in the ring-shaped illumination apparatus of Claim 7 of this invention, a plurality of LEDs, the ring-shaped base plate which has insulation to support these LEDs, and the printed wiring to which the said LEDs are electrically connected are made. With a substrate,

Each of the plurality of LEDs has a light emitting portion covered with a resin and a lead extending from the light emitting portion, and the printed wiring board is configured in a flat plate shape and a ring shape, and the printed wiring board includes a plurality of LEDs. A plurality of through holes are formed corresponding to each of the leads, and the base plate is formed with a plurality of through holes extending from one side to the other side, and the one side is provided with an inclined surface inclined downward toward the inside in the radial direction. As a manufacturing method of a ring-shaped lighting device,

Bending each of the leads of the plurality of LEDs, cutting the leads of each of the plurality of LEDs to a predetermined length, and the plurality of through holes of the base plate and the plurality of printed wiring boards. Matching the through-holes of the substrate; and making the other surface of the base plate and the one side of the printed wiring board face each other so as to overlap each other; supporting each of the light emitting portions of the plurality of LEDs on the inclined surface of the base plate; And inserting each of the leads of the plurality of LEDs into the plurality of through holes of the base plate and the plurality of through holes of the printed wiring board; and the insertions passed through the through holes and the through holes. And a step of soldering a lead to the through hole.

Implement the invention  Best form for

EMBODIMENT OF THE INVENTION Hereinafter, with reference to an accompanying drawing, various embodiment of the ring-shaped lighting apparatus which concerns on this invention, and its manufacturing method is demonstrated. 1 is a perspective view showing a ring lighting device according to a first embodiment of the present invention, FIG. 2 is an exploded perspective view showing the ring lighting device of FIG. 1, and FIG. 3 is a ring lighting device of FIG. 1. 4 is an enlarged cross sectional view showing a configuration of the through hole of the base plate of FIG. 3 and its surroundings.

1 to 4, the ring-shaped illumination device 2 shown in the drawing includes a ring-shaped light source 4 for irradiating light in a ring shape, and a housing 6 for holding the ring-shaped light source 4. Doing. Hereinafter, each of these components is demonstrated in detail.

The ring-shaped light source 4 includes a plurality of LEDs 8, a ring-shaped base plate 10 supporting the plurality of LEDs 8, and a printed wiring board 12 to which the plurality of LEDs 8 are electrically connected. ).

The LED 8 has a light emitting portion 14 and a pair of leads 16 extending from the light emitting portion 14. The light emitting portion 14 is formed in a shell shape by forming a chip (not shown) which is a light emitting body by a transparent resin or the like, and each of the other pair of leads 16 extends from the lower end of the light emitting portion 14 to the outside. have. In addition, at the lower end of the light emitting portion 14 (that is, the portion where the lead 16 is led out of the light emitting portion 14), the resin protrusion 18 in which the transparent resin forming the light emitting portion 14 slightly protrudes in an acid shape. ) Is present (see FIG. 4). This resin protrusion 18 is formed when the light emitting portion 14 is molded. In addition, in FIG. 2, only one LED 8 is shown.

The base plate 10 is formed of a material having high heat resistance and insulation, for example, polycarbonate, and is configured in a ring shape. On one side of the base plate 10, an inclined surface 20 inclined downward inward in the radial direction at an angle θ1 (for example, about 72 degrees) (see FIG. 3) with respect to the axis C of the ring-shaped lighting device 2. It is formed, and the ring-shaped recessed part 22 is formed in the outer surface. In addition, the base plate 10 is formed with a plurality of through holes 24 into which the leads 16 of the plurality of LEDs 8 are inserted, extending in the axis C direction from one side to the other side. The through holes 24 are formed concentrically in plural rows (four rows in this embodiment). At the opening end of the through hole 24 on the inclined surface 20 side of the base plate 10, a tapered portion 26 is formed to extend outwardly (see Fig. 4), and the size of the tapered portion 26 is It is gradually increasing toward the radial direction outward from the radial inside of the base plate 10, The accommodating part which the resin protrusion 18 of the light emitting part 14 of LED8 is accommodated in this taper part 26 inside. The space 28 is formed. Moreover, the positioning protrusion 30 (refer FIG. 2 and FIG. 4) as a positioning means is formed in the outer peripheral part on the other surface of the base plate 10. As shown in FIG.

The printed wiring board 12 is comprised in flat form and ring shape, and the outer diameter and inner diameter are comprised substantially the same as the outer diameter and inner diameter of the base plate 10, respectively. The printed wiring board 12 includes a plurality of through holes 32 corresponding to the leads 16 of the plurality of LEDs 8 (that is, corresponding to the plurality of through holes 24 of the base plate 10). Is formed. Conductive land portions (not shown) are formed at both ends of each of the plurality of through holes 32, and the conductive land portions are electrically connected to wiring patterns (not shown) formed on the printed wiring board 12. One end of the power cable 34 extending from the power supply device (not shown) is electrically connected to the wiring pattern on the other surface side of the printed wiring board 12 by soldering. Moreover, in the outer peripheral part on the single side | surface of the printed wiring board 12, the positioning recessed part 36 as a positioning means corresponding to the positioning protrusion part 30 of the base plate 10 (refer FIG. 2 and FIG. 4). Is formed, the positioning protrusions 30 and the positioning recesses 36 are engaged with each other, and the base plate 10 and the printed wiring board 12 face each other. Then, the plurality of through holes 24 of the base plate 10 and the plurality of through holes 32 of the printed wiring board 12 coincide with each other.

The housing 6 is comprised by the cylindrical housing main-body part 38 and the ring-shaped cover part 40 attached to one opening part of the housing main-body part 38. As shown in FIG. The inner diameter of the housing main body portion 38 is substantially the same as or slightly larger than the outer diameter of the base plate 10 and the printed wiring board 12. On the inner circumferential surface of the housing main body 38, a ring-shaped locking protrusion 42 projecting inward in the radial direction is formed, and at one end thereof, a power cable 34 extending from the printed wiring board 12 is provided. A rectangular first notched portion 44 for insertion is formed, and a plurality of screw insertion holes 46 are arranged at predetermined intervals in the circumferential direction.

The outer diameter of the cover portion 40 is configured to be substantially the same as or slightly smaller than the inner diameter of the housing main body portion 38. In the cover portion 40, a plurality of screw holes 48 are formed at predetermined intervals in the circumferential direction, and on one side thereof, a ring-shaped accommodation recess 52 for accommodating the heat dissipation member 50 described later. ) Is formed. In the outer peripheral portion of the cover portion 40, a plurality of screw holes 54 are formed corresponding to the plurality of screw insertion holes 46 of the housing body portion 38, and the first portion of the housing body portion 38 is formed. The second notch part 56 is formed corresponding to the notch part 44 (refer FIG. 2).

The heat dissipation member 50 accommodated in the receiving recess 52 of the cover portion 40 is formed in a ring shape, and is a deformable flexible material having electrical insulation and thermal conductivity, for example, silicon, fluorosilicone, SEP, or the like. Is formed.

Next, the manufacturing method of the ring-shaped illuminating device 2 is demonstrated. First, an area θ2 (for example, about 18 degrees) with respect to the light emitting portion 14 using a tool or the like in a portion near the resin protrusion 18 of the pair of leads 16 of the LED 8, for example, using a tool or the like. (Refer FIG. 3), and also the pair of leads 16 of the LED 8 are cut | disconnected to predetermined length using a tool etc., for example. For example, when the thickness D1 in the outermost through-hole 24 part of the base plate 10 is about 6 mm, and the thickness D2 of the printed wiring board 12 is about 1.5 mm, this through-hole 24 LED which is cut into a pair of leads 16 of the LED 8 to be inserted into the length of about 8.5 to 9.0 mm and inserted into the second through hole 24 from the outside of the base plate 10 The pair of leads 16 of 8) is cut into lengths shorter than this by a predetermined length. Similarly, a pair of LEDs 8 inserted through the through-hole 24 in the second row from the outside of the base plate 10, the through-hole 24 in the third row from the outside, and the innermost through-hole 24 pass through. The lead 16 is cut | disconnected so that length may become short in this order. By cutting in this way, as will be described later, when the lead 16 of the LED 8 passes through the through hole 24 of the base plate 10 and is inserted into the through hole 32 of the printed wiring board 12, The length of the tip of the lead 16 protruding from the other surface of the printed wiring board 12 can be secured by about 1.0 to 1.5 mm.

Thereafter, the plurality of through-holes 24 and the printed wiring of the base 10 are engaged by engaging the positioning projection 30 for the base 10 and the positioning recess 36 for the printed wiring board 12 with each other. The plurality of through holes 32 of the substrate 12 are matched, and the other surface of the base plate 10 and the one side surface of the printed wiring board 12 are opposed to each other, so that they are overlapped with each other. Fixed), etc.). Then, each of the pair of leads 16 of the LED 8 bent as described above passes through the pair of through-holes 24 corresponding to the base plate 10, respectively, of the printed wiring board 12. It inserts into the corresponding pair of through holes 32. At the time of insertion, the front end of the lead 16 is inserted into the through hole 24 of the base 10 while moving along the surface of the taper portion 26 in the radially outer side of the base 10. The lead 16 of 8 can be easily inserted into the through hole 24 of the base plate 10. In this way, when the lid 16 of the LED 8 is inserted, the resin protrusion 18 of the light emitting portion 14 of the LED 8 is accommodated in the accommodation space 28 inside the tapered portion 26, whereby The lower end surface of the light emitting portion 14 abuts on the inclined surface 20 of the base plate 10, and the light emitting portion 14 can be stably supported on the inclined surface 20 in the through-hole yoke 24. .

As described above, the lead 16 of the LED 8 is inserted into the through hole 32 of the printed wiring board 12 through the through hole 24 of the base plate 10, and the leading end of the lead 16 is inserted. Is soldered to the conductive land portion (through hole 32) on the other surface side of the printed wiring board 12. When soldering is performed in this manner, the solder 58 passes through the through hole 32 from the other surface of the printed wiring board 12 and is sucked to one side thereof, and the sucked solder 58 is formed on the base 10. It is accommodated in the ring-shaped recessed part 22 (refer FIG. 4), and also the lead 16 of the LED 8 can be reliably soldered to the conductive land part also in the single side | surface side of the printed wiring board 12 by this.

In addition, although this soldering is performed by flow soldering, for example, between the light-emitting part 14 of the LED 8 and the printed wiring board 12, the board | substrate formed from material with high heat resistance, such as polycarbonate ( 10), the heat of the molten solder in the solder bath is transmitted to the light emitting portion 14 of the LED 8 when the other surface of the printed wiring board 12 is brought into contact with the upper surface of the solder bath (not shown). It becomes difficult to become, thereby preventing the light emitting portion 14 of the LED 8 from being damaged by the heat of the solder.

When soldering is performed in this manner, the base plate 10 and the printed wiring board 12 are formed of the light emitting portion 14 of the LED 8 and the leads 16 soldered to the conductive land portions of the printed wiring board 12. Since it fits in between the front-end | tip parts, the said temporary fixing tape can be removed. In addition, one end of the power cable 34 extending from the power supply device is soldered to the wiring pattern on the other surface side of the printed wiring board 12.

The ring-shaped light source 4 assembled as described above is held in the housing 6 as follows. First, the ring-shaped light source 4 is inserted from one opening of the housing main body portion 38 into the inside thereof, and the outer peripheral portion on one side of the base plate 10 is caught by the locking protrusion 42 of the housing main body portion 38. do. And the heat dissipation member 50 is accommodated in the accommodation recessed part 52 of the cover part 40, and this cover part 40 is inserted in one opening part of the housing main body part 38. As shown in FIG. When inserted in this way, the heat dissipation member 50 is interposed between the other surface of the printed wiring board 12 and the one side of the cover portion 40, and the tip portion of the lead 16 protruding from the other surface of the printed wiring board 12 is dissipated. It is covered by the member 50, and the lead 16 and the heat dissipation member 50 come into thermoelectric contact. The power cable 34 extending from the printed wiring board 12 passes through the second notch portion 56 of the cover portion 40 and the first notch portion 44 of the housing body portion 38 to the outside. After that, the plurality of fixing screws 60 are screwed into the plurality of screw holes 54 of the cover portion 40 after passing through the plurality of screw insertion through holes 46 of the housing body portion 38. . As a result, the housing main body 38 and the cover 40 are fixed integrally, so that the ring-shaped light source 4 is interposed between the locking projection 42 of the housing main body 38 and one side of the cover 40. It is sandwiched. As described above, the manufacture of the ring-shaped lighting device 2 is completed.

In the ring-shaped lighting device 2 configured as described above, each light emitting portion 14 of the plurality of LEDs 8 is arranged in a ring shape on the inclined surface 20 of the base plate 10, and the axis C With respect to the angle θ2, the radially inner side of the ring-shaped light source 4 (ie, the direction substantially perpendicular to the inclined surface 20 of the base plate 10) is directed.

This ring-shaped illuminating device 2 is used for the following image processing inspection, for example. For example, by attaching a plurality of mounting screws (not shown) to the plurality of screw holes 48 of the cover portion 40, the inclined surface 20 of the ring-shaped light source 4 is lowered so that the ring-shaped illumination The apparatus 2 is mounted to an inspection apparatus (not shown) or the like. An illuminating area (not shown) is located below the ring-shaped illuminating device 2, and an object to be inspected (not shown) is disposed at the center of the illuminating area. In addition, a CCD camera (not shown) is provided above the ring-shaped illuminating device 2, and the CCD camera passes through the opening 62 of the ring-shaped illuminating device 2 so that the inspection object can be viewed. Consists of.

When a predetermined electric power from the electric power supply device is supplied to the ring-shaped illuminating device 2 via the electric power cable 34, this electric power is transferred to the wiring pattern of the printed wiring board 12, the conductive land portion, and the solder 58. Is supplied to the lid 16 of the LED 8 via the light emitting portion, and each of the light emitting portions 14 of the plurality of LEDs 8 emits light. As a result, the surface of the inspection object arranged in the illumination region is illuminated, and thus the image processing inspection of the inspection object is performed.

In addition, as described above, the tip portion of the lead 16 of the LED 8 is covered and contacted by the heat dissipation member 50, so that when the light emitting portion 14 of the LED 8 emits light, the light emitting portion 14 Heat generated from the lead 16 passes through the heat dissipation member 50 to the cover portion 40 and the housing body portion 38 to dissipate heat, thereby efficiently dissipating heat generated from the light emitting portion 14. Can be.

In the ring-shaped lighting device 2 of the present embodiment, each lead 16 of the plurality of LEDs 8 passes through the plurality of through holes 24 of the base plate 10 to the printed wiring board 12. Since the light emitting portions 14 of the plurality of LEDs 8 are supported by the inclined surface 20 of the base plate 10 by soldering, the plurality of LEDs 8 do not bend the printed wiring board 12 as in the prior art. Each of the light emitting portions 14) can be arranged as required in a ring shape, so that the ring-shaped lighting device 2 can be easily manufactured. In addition, stress does not act on the printed wiring board 12, and therefore, cracks do not occur in the soldered portions of the leads 16 of the LED 8, so that the leads 16 and the printed wiring board 12 of the LED 8 are not exposed. It is possible to prevent the electrical contact failure of). In addition, by appropriately changing the inclination angle θ1 of the inclined surface 20 of the base plate 10, the irradiation direction of light from the plurality of LEDs 8 can be easily changed.

Next, with reference to FIG. 5, 2nd Embodiment of a ring-shaped illumination apparatus is demonstrated. It is a schematic principal part perspective view which shows the ring-shaped illumination device which concerns on 2nd Embodiment of this invention. In FIG. 5, the same code | symbol is attached | subjected to the component same as the component of embodiment shown in FIGS. 1-4, and the description is abbreviate | omitted.

In the ring-shaped illuminating device 2A according to this embodiment, each of the plurality of through holes 24A formed in the base plate 10A is formed in an elongated hole shape, and one through hole 24A includes the LED 8. A pair of leads 16 are each inserted. The length of the through hole 24A is approximately equal to or slightly larger than the separation distance (pitch) of the pair of leads 16 of the LED 8.

In the ring-shaped illuminating device 2A of the other embodiment, the lead 16 of the LED 8 is inserted into one through hole 24A of the base plate 10A, so that the insertion and passing work of the lead 16 is performed. It can be implemented easily.

As mentioned above, although various embodiment of the ring-shaped lighting apparatus which concerns on this invention, and its manufacturing method was described, this invention is not limited to this embodiment, A various deformation | transformation and correction are not deviated from the scope of this invention. It is possible.

For example, in each said embodiment, although the positioning protrusion part 30 was formed in the other surface of the base plate 10, and it was comprised so that the positioning recessed part 36 may be formed in the single side | surface of the printed wiring board 12, On the other hand, you may comprise so that a positioning recess may be formed in the other surface of the base plate 10, and the positioning protrusion may be formed in the single side | surface of the printed wiring board 12. As shown in FIG. Alternatively, instead of forming the positioning protrusions 30 and the positioning recesses 36, the positioning means is constituted by markings formed on the other side of the base plate 10 and on one side of the printed wiring board 12, respectively. The markings may coincide with each other, and the base 10 and the printed wiring board 12 may be overlapped and positioned.

For example, in each said embodiment, although the lead 16 of the LED 8 was soldered to the printed wiring board 12 by the flow solder, you may solder, for example using a soldering iron etc. .

According to the ring-shaped illumination device of the present invention, each lead of the plurality of LEDs passes through the plurality of through holes of the base plate and is inserted into and soldered through the plurality of through holes of the printed wiring board, whereby each of the plurality of LEDs emits light. Since the additional base plate is supported in a substantially vertical direction on the inclined surface of the base plate, each light emitting portion of the plurality of LEDs can be arranged as required in a ring shape without bending the printed wiring board as in the prior art, thereby easily producing a ring-shaped lighting device. The plurality of LEDs can be precisely inclined at a predetermined angle by the inclined surface, and can be arranged. Further, stress does not act on the printed wiring board, and therefore, cracks do not occur in the soldered portions of the leads of the LED, thereby making it possible to prevent the electrical contact failure between the leads of the LED and the printed wiring board.

Moreover, according to the ring-shaped lighting apparatus of this invention, since the ring-shaped recessed part is formed in the other surface of a base board, when each lead of several LED is inserted through and soldered through the some through-hole of a printed wiring board, the printed wiring is carried out. Solder sucked through one side of the substrate through a plurality of through holes is accommodated in the ring-shaped recess. Therefore, the leads of the LED can be reliably soldered to the printed wiring board on both sides of the printed wiring board, so that the electrical connection between the LED leads and the printed wiring board can be maintained satisfactorily.

Moreover, according to the ring-shaped lighting apparatus of this invention, since the taper part which spreads outward is formed in each opening edge part of the some through hole in the inclined surface side of a base board, LED lead is inserted into the through hole of a base board. In this case, the resin protrusion formed on the lower end of the light emitting portion when the LED light emitting portion is molded by resin is accommodated in the accommodation space formed inside the tapered portion. As a result, the lower end surface of the light emitting portion of the LED abuts the inclined surface of the base plate, and it becomes possible to stably support the light emitting portion of the LED on the inclined surface in the through hole portion of the base plate.

In addition, according to the ring-shaped illuminating device of the present invention, since the positioning means for positioning the superstructure and the printed wiring board so as to overlap each other is formed, the plurality of through holes of the large board and the plurality of through of the printed wiring board are formed. It becomes possible to easily perform positioning when the large plate and the printed wiring board overlap each other so that the holes coincide with each other. Furthermore, since the positioning means consists of the positioning protrusions or recesses formed in the base plate, and the positioning recesses or protrusions formed in the printed wiring board joined with the positioning protrusions or recesses, the base plate and the print Positioning when the wiring boards overlap with each other can be performed more easily and reliably.

In addition, according to the ring-shaped illuminating device of the present invention, since the heat dissipation member having flexibility is interposed between the other surface of the printed wiring board and the housing, the front ends of the respective leads of the plurality of LEDs are covered with the heat dissipation member so as to be in thermal contact. Thus, heat from the lead passes through the heat radiating member to the housing to radiate heat. Therefore, it becomes possible to efficiently dissipate heat generated in each light emitting portion of the plurality of LEDs. In addition, the lead is pressed by the heat radiating member so that no external force acts on the lead, thereby preventing cracks in the soldered portion of the lead.

In addition, according to the method for manufacturing a ring-shaped lighting apparatus of the present invention, each lead of a plurality of LEDs is bent and cut to a predetermined length, and a plurality of through holes and a plurality of through holes are matched to form a large plate and a printed wiring board. While overlapping each other, each light emitting portion of the plurality of LEDs is supported on the inclined surface of the base plate, and each lead of the plurality of LEDs is inserted through the plurality of through holes of the base plate and inserted through the plurality of through holes of the printed wiring board. Since it solders, each light emitting part of a some LED can be arrange | positioned as needed by ring shape, without bending a printed wiring board like conventionally, and it becomes possible to manufacture a ring-shaped lighting apparatus easily, and also a some LED Can be arranged to be inclined at a predetermined angle precisely by the inclined surface. Further, stress does not act on the printed wiring board, and therefore, cracks do not occur in the soldered portions of the leads of the LED, thereby making it possible to prevent the electrical contact failure between the leads of the LED and the printed wiring board.

Claims (7)

And a plurality of LEDs and a printed wiring board to which the plurality of LEDs are electrically connected. Each of the plurality of LEDs has a light emitting portion covered with a resin and a lead extending from the light emitting portion. In the ring shape, a plurality of through holes are formed corresponding to each of the leads of the plurality of LEDs, and each of the leads of the plurality of LEDs is inserted into and soldered through the plurality of through holes of the printed wiring board. In the lighting device, The printed wiring board has a flat plate shape and a ring shape, and a ring-shaped base plate having insulation is interposed between the printed wiring board and each of the light emitting portions of the plurality of LEDs. A plurality of through holes extending from the one side to the other side are formed, and the one side is formed with an inclined surface inclined downward toward the inside in the radial direction, Each of the leads of the plurality of LEDs passes through the plurality of through holes of the base plate and is inserted into and soldered to the plurality of through holes of the printed wiring board, and each of the light emitting units of the plurality of LEDs includes: A ring-shaped illumination device, characterized in that supported on the inclined surface of the base in a substantially vertical direction. The method of claim 1, A ring-shaped recess is formed on the other surface of the base plate to receive solder sucked through the plurality of through holes of the printed wiring board and sucked up on one side thereof. The method according to claim 1 or 2, A ring-shaped lighting device, characterized in that a tapered portion extending outward is formed at each of the opening ends of the plurality of through holes on the inclined surface side of the base plate. The method according to claim 1 or 2, A ring-shaped illuminating device, characterized in that said base plate and said printed wiring board are each provided with positioning means for positioning them overlapping each other. The method of claim 4, wherein The said positioning means is comprised from the positioning protrusion or recessed part formed in the said base plate, and the positioning recessed part or protrusion formed in the said printed wiring board mutually joined with the said positioning protrusion or recessed part. Ring-shaped illuminating device. The method according to claim 1 or 2, A housing for holding the base plate and the printed wiring board is further provided, and a heat dissipation member having flexibility is interposed between the other surface of the printed wiring board and the housing, and each of the leads of the plurality of LEDs is provided. A front end portion is in thermal contact with the heat dissipation member in a ring shape illuminating device. And a plurality of LEDs, a ring-shaped base plate having insulation supporting the plurality of LEDs, and a printed wiring board to which the plurality of LEDs are electrically connected. Each of the plurality of LEDs has a light-emitting portion covered with resin and a lead extending from the light-emitting portion, wherein the printed wiring board has a flat plate shape and a ring shape, and the printed wiring board includes the plurality of LEDs. A plurality of through holes are formed in correspondence with each of the leads, and the base plate is formed with a plurality of through holes extending from one side to the other side, and the one side has a slope inclined downward toward the inside in the radial direction. As a manufacturing method of the formed ring-shaped lighting apparatus, Bending each of the leads of the plurality of LEDs, cutting the leads of each of the plurality of LEDs to a predetermined length, and the plurality of through holes of the base plate and the plurality of printed wiring boards. Matching the through-holes of the substrate; and making the other surface of the base plate and the one side of the printed wiring board face each other so as to overlap each other; supporting each of the light emitting portions of the plurality of LEDs on the inclined surface of the base plate; And inserting the leads of each of the plurality of LEDs into the plurality of through holes of the base plate and the plurality of through holes of the printed wiring board, and the insertion holes passed through the through holes and the through holes. And a step of soldering a lead to said through hole.

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