KR20080027535A - Back light assembly and display device having the same - Google Patents

Abstract

A backlight assembly and a display device having the same are provided to remove the necessity for a special LED(Light Emitting Diode) package by directly mounting LEDs on a connection substrate, thereby reducing package process costs and reducing the manufacturing cost of the display device. A backlight assembly comprises a connection substrate, light emitting chips, and an optical sheet. The connection substrate includes a plane unit(100) and a slope unit having a slope on the plane unit. The plane unit is formed over the front of the connection substrate of a plate shape. The plural slop units are formed along a length direction of the connection substrate. On the slope units, the plural light emitting chips are arranged. The light emitting chips include RGB(Red, Green and Blue) light emitting chips(411,413). The optical sheet is disposed on the upside of the light emitting chips to improve luminance characteristics of light emitted from the light emitting chips.

Description

BACK LIGHT ASSEMBLY AND DISPLAY DEVICE HAVING THE SAME}

1 is an exploded perspective view illustrating a backlight assembly according to a first embodiment of the present invention.

FIG. 2 is an enlarged plan view of a portion A shown in FIG. 1.

3 is a cross-sectional view taken along line II ′ of FIG. 2.

4 is a cross-sectional view illustrating another example of the connection substrate of FIG. 3.

FIG. 5 is a plan view illustrating another example of the inclined portion illustrated in FIG. 1.

FIG. 6 is a cross-sectional view taken along line II-II ′ of FIG. 5.

FIG. 7 is a plan view illustrating another example of the inclined portion illustrated in FIG. 1.

8 is an exploded perspective view illustrating a backlight assembly according to a second embodiment of the present invention.

9 is an exploded perspective view illustrating a display device according to an exemplary embodiment of the present invention.

<Description of the symbols for the main parts of the drawings>

100: flat portion 200: inclined portion

210: recessed inclined portion 211: bottom surface

212a: first inclined plane 212b: second inclined plane

212c: third inclined surface 250: protruding inclined portion

252: first protruding inclined portion 254: second protruding inclined portion

256: third projecting inclined portion 270: symmetrical inclined portion

300: connection substrate 400: light emitting chip

420: lens unit 600: storage container

610: bottom connection plate 700: backlight assembly

800: display panel 1000: display device

The present invention relates to a backlight assembly and a display device having the same, and more particularly, to a backlight assembly and a display device having the same for improving optical characteristics in a chip on board structure.

In general, the liquid crystal display device requires a separate light source for supplying light to the liquid crystal display panel because the liquid crystal display panel for displaying an image is a non-light emitting device that does not emit light by itself.

Recently, in order to improve color reproducibility, development of a liquid crystal display device using red, green, and blue light emitting diodes as a light source is in progress.

Since the package price of light emitting diodes is expensive, a chip on board (COB) process is used in which a light emitting diode chip is directly mounted on a printed circuit board. Accordingly, it is possible to reduce the manufacturing cost by removing the separate packaging process.

Specifically, in the COB process, red, green, and blue LED chips are mounted on a substrate by using solder, and the LED chips are connected by a wire bonding process. Thereafter, a polymer capping material such as silicon is coated on the light emitting diode chips. Monochromatic light generated from the red, green and blue light emitting diode chips are mixed in the polymer capping material and emitted as white light.

However, light emitting diode chips generate straight monochromatic light within a limited angle range. Accordingly, in order to emit uniform white light, it is necessary to improve the degree to which monochromatic light is mixed.

Accordingly, the technical problem of the present invention is to solve such a conventional problem, and an object of the present invention is to provide a backlight assembly capable of improving the mixing of monochromatic lights in a chip on board structure.

Another object of the present invention is to provide a display device having the above-described backlight assembly.

In order to realize the above object of the present invention, the backlight assembly according to the first embodiment includes a connection substrate and a light emitting chip. The connection substrate has a flat portion and an inclined portion that forms an inclination angle with the flat portion. The light emitting chip is disposed on an inclined surface of the inclined portion to generate light.

In this case, the inclined portion may have a plurality of inclined surfaces recessed from the flat portion, and at least two of the inclined surfaces on which the light emitting chip is disposed are formed to face each other.

In order to realize the above object of the present invention, the backlight assembly according to the second embodiment includes a storage container and a light emitting chip. The storage container includes a bottom connecting plate having a flat part and an inclined part that forms an inclination angle with the flat part, and a sidewall extending from an edge of the bottom connecting plate. The light emitting chip is disposed on an inclined surface of the inclined portion to generate light.

In accordance with another aspect of the present invention, a display device includes a display panel for displaying an image and a backlight assembly for supplying light to the display panel. The backlight assembly may include a connection substrate having a flat portion, an inclined portion that forms an inclination angle with the flat portion, and a light emitting chip disposed on an inclined surface of the inclined portion to generate light.

According to the backlight assembly and the display device having the same, since the light emitting chip is disposed on an inclined surface in the backlight assembly having a chip on board structure, the mixing of the white light emitted from the light emitting chip can be improved.

Hereinafter, with reference to the accompanying drawings, it will be described in detail the present invention.

1 is an exploded perspective view showing a backlight assembly according to a first embodiment of the present invention. FIG. 2 is an enlarged plan view of a portion A shown in FIG. 1. 3 is a cross-sectional view taken along line II ′ of FIG. 2.

1, 2, and 3, the backlight assembly 700 includes a connection substrate 300, light emitting chips 400, and an optical sheet 500.

The light emitting chips 400 are grouped and arranged in a line on the connection substrate 300. The connection board 300 is electrically connected to an external power supply device to supply power to the light emitting chips 400, and includes a wiring (not shown) for supplying power. For example, the connection substrate 300 is preferably made of a printed circuit board or a metal coated substrate coated with a metal having high thermal conductivity.

The connection substrate 300 includes a flat portion 100 and an inclined portion 200 that forms an inclined angle with the flat portion 100. The flat part 100 is formed over the entire surface of the plate-shaped connecting substrate 300. The inclined portion 200 forms a predetermined inclination angle with the flat portion 100 and is formed in plural along the longitudinal direction of the connection substrate 300.

In this case, the connection part 300 is formed with the flat part 100 and the inclined part 200 alternately, and the area between the inclined parts 200 adjacent to each other corresponds to the flat part 100. For example, the plurality of inclined portions 200 may be disposed in a zigzag form with the adjacent inclined portions 200.

Meanwhile, in order to have the structure in which the connection substrate 300 has the flat portion 100 and the inclined portion 200 formed continuously, the connection substrate 300 uses an imprint process or an injection process using a transfer mold. Can be prepared.

A plurality of light emitting chips 400 are disposed on the inclined portions 200, and details thereof will be described later.

The light emitting chips 400 emit light and are arranged in a line on the connection substrate 300. The light emitting chips 400 include a red light emitting chip 411, a green light emitting chip 412, and a blue light emitting chip 413. For example, the red light emitting chip 411 includes a red light emitting diode that generates red light, the green light emitting chip 412 includes a green light emitting diode that generates green light, and the blue light emitting chip 413 generates blue light. A blue light emitting diode is included.

One red light emitting chip 411, one green light emitting chip 412, and one blue light emitting chip 413 define one light emitting group, and a plurality of the light emitting groups are formed on an inclined portion of the connection substrate 300. 200 spaced apart. Alternatively, the light emitting groups may include a plurality of white light emitting chips. The light emitting groups may include a plurality of red light emitting chips 411, green light emitting chips 412, and blue light emitting chips 413.

The light emitting groups may further include a lens unit 420 covering the red, green, and blue light emitting chips 411, 412, and 413. The lens unit 420 is formed convexly in a dome shape and diffusely mixes the light emitted from the red, green, and blue light emitting chips 411, 412, and 413. The lens unit 420 is made of, for example, silicon or epoxy resin.

Alternatively, the lens unit 420 may cover each of the light emitting chips 400 separately. For example, the lens unit 420 may include a red lens covering the red light emitting chip 411, a green lens covering the green light emitting chip 412, and a blue lens covering the blue light emitting chip 413. .

The optical sheet 500 is disposed above the light emitting chips 400. The optical sheet 500 improves luminance characteristics of light emitted from the light emitting chips 400. For example, the optical sheet 500 may include a diffusion sheet for diffusing light or a prism sheet for condensing light.

The light emitting chips 400 are directly mounted on the connection board 300 through a soldering process. In the present invention, the light emitting chips 400 are disposed on the inclined surfaces of the inclined portion 200 formed on the connection substrate 300.

On the other hand, the inclined portion 200 in the present embodiment is a recessed inclined portion 210 recessed below the flat portion 100, or as shown in Figures 5 and 6 protruding inclined portion protruding upwards of the flat portion 100. 250. First, the recessed inclination portion 210 will be described, and then the protruding inclination portion 250 will be described.

2 and 3, the recessed inclined portion 210 is recessed recessed from the surface of the flat portion 100 and includes a plurality of inclined surfaces. For example, the recessed inclined portion 210 includes first, second and third inclined surfaces 212a, 212b and 212c. The first, second, and third inclined surfaces 212a, 212b, and 212c are inclined downward from the flat portion 100, respectively, to form a predetermined angle of inclination angle θ1 with the flat portion 100. At this time, the inclination angle θ1 is about 10 degrees to 50 degrees, and preferably about 45 degrees. In one example, the recessed inclination portion 210 has an inverted triangular pyramid shape in which pyramids are removed, and the first, second and third inclined surfaces 212a, 212b, and 212c respectively correspond to side surfaces of the inverted triangular pyramid.

At this time, at least two of the plurality of inclined surfaces are preferably formed to face each other. For example, the recessed inclined portion 210 includes first, second and third inclined surfaces 212a, 212b and 212c, and the first, second and third inclined surfaces 212a, 212b and 212c are recessed inclined. The lower center portion O1 of the portion 210 is formed to be inclined from the flat portion 100 so as to face each other.

In addition, the recessed inclination part 210 may further include a bottom surface 211 connected to the first, second and third inclined surfaces 212a, 212b, and 212c. The bottom surface 211 may have a triangular shape parallel to the flat portion 100 and connected to the first, second and third inclined surfaces 212a, 212b and 212c.

In the present invention, the light emitting chips 400 are disposed on the plurality of inclined surfaces forming the recessed inclined portion 210. For example, the light emitting chips 400 are disposed on the first, second, and third inclined surfaces 212a, 212b, and 212c facing each other of the recessed inclination part 210. For example, a red light emitting chip 411 is disposed on the first slope 212a, a green light emitting chip 412 is disposed on the second slope 212b, and a blue light emitting chip 413 is disposed on the third slope 212c. ) May be arranged. The red, green, and blue light emitting chips 411, 412, and 413 are disposed in a triangle shape, and at least two of them are disposed to face each other.

In this case, each of the red, green, and blue light emitting chips 411, 412, and 413 may be disposed in an equilateral triangle shape so as to face the lower center O1 of the recessed inclination part 210. The red, green, and blue light emitting chips 411, 412, and 413 emit straight light in an upward direction. Accordingly, the red light emitted from the red light emitting chip 411, the green light emitted from the green light emitting chip 412, and the blue light emitted from the blue light emitting chip 413 are formed at the lower center O1 of the recessed inclination part 210. Mixed, the backlight assembly 700 can emit more uniform white light as a whole.

As such, since the light emitting chips 400 disposed on the inclined surfaces of the recessed inclination part 210 face each other, the mixing ratio of the monochromatic lights emitted from the light emitting chips 400 may be further improved.

Referring to FIG. 3, when cutting a portion of the connection substrate 300, a cross section of the recessed inclined portion 210 extends to an inclined surface, a bottom surface, and an inclined surface. For example, the cross section of the recessed inclined portion 210 has a shape extending in the order of the third inclined surface 212c, the bottom surface 211 and the second inclined surface 212b. In contrast, when the recessed inclined portion 210 does not include the bottom surface 211, the third inclined surface 212c and the second inclined surface 212b may be directly connected to each other.

For example, the thickness t1 of the flat portion 100 of the connection substrate 300 is the same as the thickness t2 of the recessed inclination portion 210. That is, the connection substrate 300 may have a predetermined thickness, and the recessed inclination portion 210 may be formed by tilting predetermined regions corresponding to the recessed inclination portion 210. Accordingly, the upper and lower portions of the connecting substrate 300 have a concave-convex shape.

In addition, the lens unit 420 may be formed on the recessed inclination part 210. Specifically, the lens unit 420 covers the bottom surface 211 and the first, second and third inclined surfaces 212a, 212b and 212c of the recessed inclination portion 210 including the light emitting chips 400. As such, the lens unit 420 covers the light emitting chips 400 to mix light emitted from the light emitting chips 400 in the lens unit 420.

On the other hand, the lens unit 420 is formed to a predetermined thickness from the bottom surface 211 of the recessed inclination portion (210). For example, the straight line distance L from the upper end of the third inclined surface 212c to the upper end of the corresponding second inclined surface 212b is about 4.5 mm. The inclined inclination angle θ1 between the flat portion 100 and the third inclined surface 212c and between the flat portion 100 and the second inclined surface 212b is the same, and is preferably about 45 degrees. In this case, the height H of the lens unit 420, that is, the length from the bottom surface 211 to the upper portion of the lens unit 420 is preferably about 0.5 mm. In contrast, the thickness of the lens unit 420 may vary according to the inclination angle θ1 and the area of the bottom surface 211.

4 is a cross-sectional view illustrating another example of the connection substrate of FIG. 3.

Referring to FIG. 4, the thicknesses of the flat part 100 and the recessed inclination part 210 may be different from each other in the connection board 300. For example, the thickness t3 of the flat portion 100 of the connection substrate 300 may be thicker than the thickness t4 of the recessed inclination portion 210. That is, the upper surface of the connection substrate 300 is formed in an uneven shape, and the lower surface is formed in a plane.

FIG. 5 is a plan view illustrating another example of the inclined portion illustrated in FIG. 1. FIG. 6 is a cross-sectional view taken along line II-II ′ of FIG. 5.

1 and 5, the protruding inclination part 250 forms a predetermined inclination angle with the flat part 100 and is formed in plural along the longitudinal direction of the connection board 300. At this time, any of the protruding inclined portions 250 are disposed in a zigzag form with the adjacent protruding inclined portions 250.

Meanwhile, FIG. 5 illustrates three protruding inclined portions 250, that is, first, second and third protruding inclined portions 252, 254, and 256. In this case, the first, second and third protruding inclined portions 252, 254 and 256 are preferably adjacent to each other. Specifically, the first and second protruding slopes 252 and 254 are disposed adjacent to the first column. In addition, the third protruding inclined portion 256 is formed in a second column adjacent to the first row, and is disposed correspondingly between the first protruding inclined portion 252 and the second protruding inclined portion 254.

The first protruding inclined portion 252 includes a first red inclined surface 252a on which the red light emitting chip 411 is disposed, a first green inclined surface 252b on which the green light emitting chip 412 is disposed, and a blue light emitting chip 413. The first blue inclined surface 252c is disposed. The second protruding inclined portion 254 may include a second red inclined surface 254a on which the red light emitting chip 411 is disposed, a second green inclined surface 254b on which the green light emitting chip 412 is disposed, and a blue light emitting chip 413. A second blue inclined surface 254c disposed. The third protruding slope 256 includes a third red inclined plane 256a on which the red light emitting chip 411 is disposed, a third green inclined plane 256b on which the green light emitting chip 412 is disposed, and a blue light emitting chip 413. A third blue inclined surface 256c disposed.

At this time, the first green inclined surface 252b of the first protruding inclined portion 252, the second blue inclined surface 254c of the second protruding inclined portion 254, and the third red of the third protruding inclined portion 256. The inclined surfaces 256a are formed to face each other. In addition, the red, green, and blue light emitting chips 411, 412, and 413 are disposed in an equilateral triangle shape so as to face the center O 2 of the flat part 100 surrounded by the first, second, and third protruding inclined parts 252, 254, and 256. desirable.

Alternatively, the light emitting chips 400 disposed on the inclined surfaces of the protruding slope 250 may include at least two of the red, green, and blue light emitting chips 411, 412, and 413. In addition, the light emitting chips 400 disposed on the inclined surfaces of the protruding slope 250 may further include a white light emitting chip.

As such, as the red, green, and blue light emitting chips 411, 412, and 413 disposed on different inclined surfaces of the different protruding inclined portions 250 face each other, the monochromatic light emitted from the respective light emitting chips 400 may be It can be mixed well. Accordingly, the backlight assembly 700 may further improve the mixing degree of the white light emitted from the light emitting chips 400.

Meanwhile, referring to FIGS. 5 and 6, the protruding inclined portion 250 of the present exemplary embodiment is a recessed inclined portion 210 except that the protruding inclined portion 250 protrudes from the flat portion 100 when compared with the recessed inclined portion 210 described above. Has a shape corresponding to Since the plurality of protruding inclined portions 250 including the first, second and third protruding inclined portions 252, 254, and 256 have the same shape, the first protruding inclined portion 252 will be described below as an example.

In detail, the first protruding inclined portion 252 protrudes convexly from the surface of the flat portion 100 and includes a plurality of inclined surfaces. For example, the first protruding inclined portion 252 may include a first red inclined surface 252a on which the red light emitting chip 411 is disposed, a first green inclined surface 252b on which the green light emitting chip 412 is disposed, and a blue light emitting chip. 413 includes a first blue inclined surface 252c disposed. Each of the three inclined surfaces is inclined upward from the flat part 100 to form a predetermined angle of inclination angle θ2 with the flat part 100. At this time, the inclination angle θ2 is about 10 degrees to 50 degrees, and preferably about 45 degrees. For example, the first protruding inclined portion 252 has a triangular pyramid shape in which pyramids are removed.

In addition, the first protruding inclined portion 252 is connected to the first red, first green and first blue inclined surfaces 252a, 252b, and 252c, and further includes a first protruding surface 252d having a triangular shape as an example. can do.

Meanwhile, the connection board 300 including the protruding inclination parts 250 may be formed to have a predetermined thickness. On the contrary, the connection substrate 300 may be formed by varying the thickness of the flat portion 100 and the thickness of the protruding inclination portion 250.

FIG. 7 is a plan view illustrating another example of the inclined portion illustrated in FIG. 1.

Referring to FIGS. 1 and 7, the connection board 300 includes a flat portion 100 and an inclined portion 200 that forms an inclined angle with the flat portion 100, wherein the inclined portion 200 has the recessed inclination described above. The portion 210 and the protruding inclined portion 250 are different from the symmetric inclined portion 270.

Specifically, the symmetrical inclined portion 270 includes first, second, third and fourth inclined surfaces 271, 272, 273, 274. The four inclined surfaces are respectively inclined from the flat part 100 to form a predetermined inclination angle with the flat part 100.

The symmetrical inclined portion 270 of the present embodiment may protrude in an upward direction based on the flat portion 100, or alternatively, may be formed to be recessed in a downward direction. For example, the symmetrical inclined portion 270 is formed in an inverted quadrangular pyramid shape in which pyramids are removed, and the first, second, third and fourth inclined surfaces 271, 272, 273 and 274 correspond to the side surfaces of the inverted square pyramid.

Light emitting chips 400 are disposed on the first, second, third and fourth inclined surfaces 271, 272, 273 and 274. For example, a red light emitting chip 411 on the first inclined surface 271, a green light emitting chip 412 on the second inclined surface 272, and a blue light emitting chip 413 and a fourth inclined surface on the third inclined surface 273 ( The white light emitting chip 414 is disposed on the 274.

At this time, it is preferable that the first inclined surface 271 and the third inclined surface 273 face each other, and the second inclined surface 272 and the fourth inclined surface 274 face each other. Monochromatic light emitted from the light emitting chips 400 disposed on the inclined surfaces facing each other is mixed at the center O3 of the symmetric light emitting part 270 and emitted as white light.

In addition, the symmetric inclined portion 270 may further include a symmetrical bottom surface 275 connected to the first, second, third and fourth inclined surfaces 271, 272, 273 and 274. In one example, the symmetric bottom surface 275 is parallel to the flat portion 100, and is formed in a rectangular shape.

8 is an exploded perspective view illustrating a backlight assembly according to a second embodiment of the present invention.

Referring to FIG. 8, the backlight assembly 700 includes a storage container 600, light emitting chips 400, and an optical sheet 500.

The storage container 600 accommodates the light emitting chips 400 and the optical sheet 500, and includes a bottom connection plate 610 and a sidewall 620. The outer surface of the bottom connecting plate 610 has a rectangular frame shape, and the side wall 620 extends from an edge of the bottom connecting plate 610 to provide a storage space for accommodating the light emitting chips 400 and the optical sheet 500. Form. The storage container 600 is made of, for example, a metal having high strength and low deformation.

In the present embodiment, a plurality of light emitting chips 400 are arranged in a line on the surface of the bottom connection plate 610. The bottom connection plate 610 is electrically connected to an external power supply device to supply power to the light emitting chips 400, and includes a wire (not shown) for supplying power.

In detail, the bottom connection plate 610 includes a flat portion 611 and a plurality of inclined portions 612 having an inclination angle with the flat portion 611. The inclined portions 612 are formed along the length direction of the bottom connecting plate 610. As an example, any of the inclined portions 612 may be disposed in a zigzag form with the neighboring inclined portions 612.

In the present embodiment, the bottom connection plate 610 is the same as the connection substrate 300 of the first embodiment, and the shape of the inclined portions 612 and the structure diagram in which the light emitting chips 400 are disposed on the inclined portions 612. Since the same as the case of the inclined portion 200 of the first embodiment, a detailed description thereof will be omitted.

In addition, since the light emitting chips 400 and the optical sheet 500 of the present embodiment have the same configuration as the light emitting chips 400 and the optical sheet 500 described in the first embodiment, detailed description thereof will be omitted. do.

9 is an exploded perspective view illustrating a display device according to an exemplary embodiment of the present invention.

Referring to FIG. 9, the display apparatus 1000 includes a backlight assembly 700 for supplying light and a display panel 800 for displaying an image.

In the present embodiment, the backlight assembly 700 is the backlight assembly 700 including the connection board 300, which is the same as the first embodiment. In contrast, the backlight assembly 700 may be the backlight assembly 700 including the storage container 600, as in the second embodiment.

The display panel 800 is disposed on the backlight assembly 700 and displays an image using light supplied from the backlight assembly 700. The display panel 800 drives the first substrate 810, the second substrate 820 corresponding to the first substrate, and the liquid crystal layer 830 and the first substrate 810 disposed between the two substrates 810, 820. The driving circuit unit 840 is included.

The first substrate 810 is a transparent glass substrate in which a thin film transistor (hereinafter, referred to as TFT) as a switching element is formed in a matrix form. A data line is connected to a source terminal of the TFTs, and a gate line is connected to a gate terminal. In addition, a pixel electrode made of a transparent conductive material is connected to the drain terminal.

The second substrate 820 is spaced apart from the first substrate 810 at regular intervals to face each other, and includes a color filter for realizing color and a common electrode facing the pixel electrode of the first substrate 810.

When power is applied to the gate terminal and the source terminal of the TFT and the TFT is turned on, an electric field is formed between the pixel electrode and the common electrode. The liquid crystal arrangement of the liquid crystal layer 830 disposed between the first substrate 810 and the second substrate 820 is changed by the electric field, and the transmittance of light is changed according to the arrangement change of the liquid crystal to display an image of a desired gray scale. Done.

The driving circuit unit 840 includes a data printed circuit board 848 for supplying a data driving signal to the display panel 800, a gate printed circuit board 844 for supplying a gate driving signal to the display panel 800, and a data printed circuit board. The data driving circuit film 846 connecting the display panel 800 to the display panel 800 and the gate driving circuit film 842 connecting the gate printed circuit board 844 to the display panel 800 are included.

As described above, the LED is directly mounted on the connection board, so that a separate LED package process is unnecessary. Accordingly, it is possible to reduce the packaging process cost and reduce the overall manufacturing cost of the display device.

Meanwhile, the connection substrate includes an inclined portion having a protruding or recessed shape, and the light emitting diodes are mounted on the inclined surface instead of the flat surface. In this way, as the light emitting diodes emitting straight light in the upper direction rather than the side are mounted on the inclined surfaces of the connection substrate, the light emitting diodes face each other, and the white mixing efficiency of the light emitted from the light emitting diodes is reduced. It can improve more.

Although described above with reference to the embodiments, those skilled in the art can be variously modified and changed within the scope of the invention without departing from the spirit and scope of the invention described in the claims below. I can understand.

Claims (16)

A connection substrate having a flat portion and an inclined portion forming an inclination angle with the flat portion; And And a light emitting chip disposed on an inclined surface of the inclined portion to generate light. The backlight assembly of claim 1, wherein the inclined portion is recessed from the flat portion. The backlight assembly of claim 2, wherein the inclined portion has a plurality of inclined surfaces, and at least two of the inclined surfaces on which the light emitting chip is disposed face each other. The backlight assembly of claim 3, wherein the light emitting chip comprises at least two of a red light emitting chip, a green light emitting chip, and a blue light emitting chip. The light emitting device of claim 4, wherein the inclined portion comprises first, second and third inclined surfaces, wherein the red light emitting chip is the first inclined surface, the green light emitting chip is the second inclined surface, and the blue light emitting chip is the first inclined surface. The backlight assembly, characterized in that disposed on three inclined surfaces. The backlight assembly of claim 5, wherein the red, green, and blue light emitting chips are arranged in a triangle shape, and at least two of them are disposed to face each other. The backlight assembly of claim 5, wherein the red, green, and blue light emitting chips are disposed in an equilateral triangle shape to face the center of the triangle. The backlight assembly of claim 5, wherein the inclined portion further comprises a bottom surface connected to the first, second and third inclined surfaces. The backlight assembly of claim 3, wherein the light emitting chip comprises a white light emitting chip. The backlight assembly of claim 1, wherein the inclined portion protrudes convexly from the flat portion. The light emitting device of claim 10, wherein the inclined portion is formed in plural, and the first inclined surface on which the light emitting chip of the first inclined portion, which is one of the inclined portions, is disposed is different from the second inclined portion adjacent to the first inclined portion. The backlight assembly, characterized in that formed to face each other with the second inclined surface on which the chip is disposed. The backlight assembly of claim 1, further comprising a lens unit covering the light emitting chip to mix light. The backlight assembly of claim 1, wherein the inclination angle is 10 degrees to 50 degrees. A storage container including a bottom connecting plate having a flat part and an inclined part forming an inclination angle with the flat part, and a side wall extending from an edge of the bottom connecting plate; And And a light emitting chip disposed on an inclined surface of the inclined portion to generate light. A display panel displaying an image; And A backlight assembly for supplying light to the display panel; The backlight assembly A connection substrate having a flat portion and an inclined portion forming an inclination angle with the flat portion; And And a light emitting chip disposed on an inclined surface of the inclined portion to generate light. A display panel displaying an image; And A backlight assembly for supplying light to the display panel; The backlight assembly A storage container including a bottom plate having a flat portion and an inclined portion forming an inclination angle with the flat portion, and a side wall extending from an edge of the bottom plate; And And a light emitting chip disposed on an inclined surface of the inclined portion to generate light.

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