KR101469473B1 - Back light unit and liquid crystal display device using the same - Google Patents

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a backlight unit that can be slimmed and a liquid crystal display using the same.

A backlight unit according to an embodiment of the present invention includes a case formed of a metal; A plurality of light guide plates divided into a plurality of pieces and stored in the case and arranged in parallel; A plurality of light emitting diodes (OLEDs) disposed in the case and including a printed circuit board having a horizontal portion and a vertical portion integrated between the plurality of light guide plates, A reflective member disposed between a back surface of the plurality of light guide plates and an upper surface layer of the case; And a diffusion member disposed on the plurality of light guide plates and the case, wherein the horizontal portion physically contacts the reflective member and the case so that the light guide plate overlaps a plurality of boundary portions, And the vertical portion is disposed between the plurality of light guide plates through the reflective member.

According to the present invention having such a configuration, light emitting diodes are provided between the plurality of light guide plates, light is irradiated to the side surface of the light guide plate, and the light is converted into a surface light source, thereby reducing the optical distance between the light emitting diode and the diffusion member, have.

Light emitting diodes, light guide plates, slimmed, split, printed circuit boards

Description

BACK LIGHT UNIT AND LIQUID CRYSTAL DISPLAY DEVICE USING THE SAME [0002]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a backlight unit and a liquid crystal display using the same, and more particularly, to a backlight unit and a liquid crystal display using the same.

BACKGROUND ART [0002] Liquid crystal displays (LCDs) are liquid crystal displays (LCDs) having a liquid crystal panel composed of a plurality of liquid crystal cells arranged in a matrix and a plurality of control switches for switching video signals to be supplied to the liquid crystal cells, The amount of light transmitted through the unit (Back Light Unit) is adjusted to display a desired image on the screen.

Backlight units are in a trend of downsizing, thinning, and weight reduction. According to this trend, a backlight unit using a light emitting diode, which is advantageous in terms of power consumption, weight, luminance, etc., has been proposed instead of the fluorescent lamp used in the backlight unit.

1 is a view schematically showing a backlight unit using a conventional light emitting diode.

Referring to FIG. 1, a conventional backlight unit includes a case 10; A light emitting diode array (20) mounted on an inner bottom surface of the case; And a diffusion member 30 disposed on the front surface of the case 10 so as to face the light emitting diode array 20.

The case 20 includes side walls inclined at a predetermined inclination from a bottom surface and a bottom surface on which the light emitting diode array 20 is installed; And a seat portion bent from the side wall so as to be parallel to the bottom surface and on which the diffusion member 30 is seated.

The light emitting diode arrays 20 are arranged at regular intervals on the bottom surface of the case 10 and emit light by driving current supplied from the outside.

The diffusion member 30 diffuses the light emitted from the light emitting diode array 20 into the entire region and emits the light to the outside.

This conventional backlight unit diffuses the light from the light emitting diode array 20 using the diffusion member 30 to emit uniform light to the outside. To this end, the optical distance D between the diffusion member 30 and the light emitting diode array 20 should be maintained at a predetermined interval or more.

However, when the optical distance D is reduced for slimming down the backlight unit, as shown in FIG. 2, unevenness appears in the light emitting diode array 20. Therefore, the conventional backlight unit is limited in its slimness because the overall thickness is increased due to the optical distance D between the diffusion member 30 and the light emitting diode array 20.

In order to solve the above problems, the present invention provides a backlight unit that can be slimmed and a liquid crystal display using the backlight unit.

Another object of the present invention is to provide a backlight unit for increasing heat dissipation efficiency of a light emitting diode array and a liquid crystal display using the same.

Another object of the present invention is to provide a backlight unit capable of block driving and a liquid crystal display using the same.

Another object of the present invention is to provide a backlight unit for increasing the rigidity of a backlight unit and a liquid crystal display using the backlight unit.

According to an aspect of the present invention, there is provided a backlight unit including: a case; A plurality of light guide plates divided into a plurality of light guide plates arranged in parallel with the case; A plurality of light emitting diode units arranged between the plurality of light guide plates and irradiating light to side surfaces of the light guide plates; A reflective member disposed on a back surface of the plurality of light guide plates; And a diffusion member disposed on a front surface of the case so as to face the plurality of light guide plates.

A liquid crystal display device according to an embodiment of the present invention includes a liquid crystal panel for displaying an image by adjusting a transmittance of light; A backlight unit for emitting light to the liquid crystal panel; And at least one light collecting member disposed between the liquid crystal panel and the backlight unit, wherein the backlight unit comprises: a case; A plurality of light guide plates divided into a plurality of light guide plates arranged in parallel with the case; A plurality of light emitting diode units arranged between the plurality of light guide plates and irradiating light to side surfaces of the light guide plates; A reflective member disposed on a back surface of the plurality of light guide plates; And a diffusion member disposed on a front surface of the case so as to face the plurality of light guide plates.

Each of the plurality of light guide plates includes first and second grooves formed on both lower side surfaces, and the sidewalls of the first and second grooves have a lens shape.

And the light emitting diode portion is disposed in a space provided by at least one of the first and second grooves of the light guide plate.

And the plurality of light guide plates are arranged in parallel so as to be divided into a plurality of portions along at least one of a horizontal direction and a vertical direction in the case.

The backlight unit and the liquid crystal display device using the backlight unit according to the present invention may include a light emitting diode unit disposed between a plurality of light guide plates so that light is irradiated on the side surface of the light guide plate and converted into a surface light source, thereby reducing the optical distance between the light emitting diode unit and the diffusion member The backlight unit can be made slim.

In addition, the present invention can efficiently dissipate heat generated in the light emitting diode portion by directly contacting the light emitting diode portion with the case.

Further, according to the present invention, by forming a lower protruding portion for housing the light emitting diode portion in the case, the rigidity of the case is increased, and deformation such as warping of the backlight unit can be prevented.

In addition, the present invention provides a light emitting diode portion in an upper protruding portion vertically protruding from a bottom surface of a case, thereby efficiently dissipating heat generated in the light emitting diode portion and increasing the rigidity of the case, Can be prevented.

Furthermore, the present invention can separately control the brightness of each block by separately driving each block by dividing the light guide plate into a plurality of blocks along at least one of the horizontal direction and the vertical direction.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings and embodiments.

3 is a cross-sectional view schematically showing a backlight unit according to the first embodiment of the present invention.

Referring to FIG. 3, the backlight unit 100 according to the first embodiment of the present invention includes a case 110; A plurality of light guide plates (200) disposed inside the case (110); A plurality of light emitting diodes 300 formed between the plurality of light guide plates 200 to illuminate each light guide plate 200 with light; A reflective member 120 disposed on a back surface of the plurality of light guide plates 200; And a diffusion member 130 disposed on the front surface of the case 110 so as to face the plurality of light guide plates 200.

The case 110 has a "U" shape including a bottom wall and a side wall vertically bent from the bottom wall. At this time, the case 110 is formed of a metal material for emitting heat generated from the plurality of light emitting diode units 300.

As shown in Fig. 4, the plurality of light guide plates 200 have a " T "shape to include first and second grooves 202 and 204 formed on both lower side surfaces. Each of the plurality of light guide plates 200 is generally made of PMMA (Polymethylmethacrylate), which is a transparent acrylic resin, and a liquid PMMA resin is manufactured by an injection molding method. At this time, various patterns for emitting uniform light may be formed on the upper and lower surfaces of the light guide plate 200.

Each of the plurality of light guide plates 200 is disposed in parallel with the bottom surface of the case 110 so that the side surfaces of the light guide plates 200 are in surface contact with each other, thereby illuminating the light emitting diodes 300 through the first and second grooves 202, To the surface light source, and guides the light to the diffusion member 130.

5, the side surfaces of the first and second grooves 202 and 204 of the light guide plate 200 facing the light emitting diode units 300 are irradiated from the respective light emitting diode units 300 Lt; RTI ID = 0.0 > diffuse < / RTI >

The reflective member 120 is disposed on the back surface of the light guide plate 200 to reflect light from the light guide plate 200 toward the diffusion member 130, thereby preventing light loss and improving light efficiency. For this, the reflective member 120 may be formed of a plate or a sheet made of polyethylene terephthalate (PET) or polycarbonate (PC), and silver (Ag) or aluminum (Ag) .

The diffusion member 130 improves light characteristics such as brightness and uniformity by diffusing light from the light guide plate 200 to the entire area, and emits the light to the outside.

2, the light emitting diode unit 300 includes a printed circuit board 310 in the form of an "⊥" having a horizontal portion 312 and a vertical portion 314, as shown in FIG. 6; A first light emitting diode array (330) having a plurality of light emitting diode packages (320) disposed on one side of a vertical portion (314) of a printed circuit board (310); And a second light emitting diode array 340 having a plurality of light emitting diode packages 320 disposed on the other side of the vertical portion 314 of the printed circuit board 310.

The printed circuit board 310 is a metal printed circuit board for dissipating heat generated in the first and second light emitting diode arrays 330 and 340. Here, the metal printed circuit board may be a base substrate which is a metal material of aluminum or copper alloy; An insulating layer formed on the base substrate; A wiring layer formed on the insulating layer; And a wiring protection layer covering the wiring layer.

The horizontal portion 312 of the printed circuit board 310 is installed on the inner bottom surface of the case 110 so as to overlap the boundary portions of the plurality of light guide plates 200 arranged in parallel. The height H and the width W of the horizontal portion 312 are set so as to efficiently dissipate heat generated from the first and second light emitting diode arrays 330 and 340.

The vertical portion 314 of the printed circuit board 310 is vertically integrated with the central portion of the horizontal portion 312. The vertical portion 314 of the printed circuit board 310 is disposed between the plurality of light guide plates 200 so as to face the first groove 202 and the second groove 204 of the light guide plate 200.

The printed circuit board 310 disposed between the left and right walls of the case 110 and the light guide plate 200 among the plurality of light guide plates 200 arranged in parallel to the case 110 is formed in an L shape . That is, an L-shaped printed circuit board 310 in which the first light emitting diode array 330 is disposed is disposed in the first groove 202 of the light guide plate 200 adjacent to the left side wall of the case 110. An L-shaped printed circuit board 310 in which the second light emitting diode array 340 is disposed is disposed in the second groove 204 of the light guide plate 200 adjacent to the right side wall of the case 110. [

The light emitting diode packages 320 of the first light emitting diode array 330 are installed at regular intervals on one side of the vertical portion 314 of the printed circuit board 310. The light emitting diode packages 320 of the second light emitting diode array 340 are installed at regular intervals on the other side of the vertical portion 314 of the printed circuit board 310.

Each of the light emitting diode packages 320 of the first and second light emitting diode arrays 330 and 340 may have a side view or a top view.

Specifically, each of the light-emitting diode packages 320 in a side view form includes a structure 322 having side openings 321, as shown in Fig. 7; A light emitting diode chip 324 mounted on the side opening 321; And an encapsulating material 326 for encapsulating the side openings 321.

Further, each of the light emitting diode packages 320 in the side view form may further comprise a lens 328 formed in the composition 322 to correspond to the side opening 321 as shown in FIG. 8 .

The structure 322 includes lead frames (not shown) electrically connected to the light emitting diode chip 324; And a side opening 321 for emitting the light generated from the light emitting diode chip 324 to the outside side.

The side opening 321 has a constant depth and an inclined surface, and the inclined surface may be coated with a reflective material. At this time, the angle and depth of the inclined surface are set so as to optimize the viewing angle of light emission. The front surface of the side opening portion 321 may have a square shape.

The light emitting diode chip 324 may be mounted by a flip chip or a wire bonding method. In the case of flip-chip mounting, the solder bump is fixed to the lead frame and electrically connected. In the case of the wire bonding method, it is attached to the lead frame by, for example, adhesion and electrically connected by a wire. The light emitting diode chip 324 may be any one of RGGB type light emitting diode, RGGB type light emitting diode, and blue light emitting diode of red (R), two green (G) and blue (B) Chip) type.

The sealing material 326 is filled in the side opening 321 on which the light emitting diode chip 324 is mounted to seal the side opening 321. At this time, the upper surface of the sealing material 326 may have a lens shape.

When the light emitting diode chip 324 is a blue light emitting diode, the sealing material 326 may be a combination of an epoxy and a phosphor. In this case, the blue light generated from the blue light emitting diode chip 324 excites the phosphors to emit white light.

The lens 328 is formed to overlap on the side opening 321 to increase the emission angle of the light emitted from the side opening 321, thereby improving the emission directivity of the light.

Each light emitting diode package 320 in top view form includes a structure 332 having a front opening 331, as shown in FIG. 9; A light emitting diode chip 334 mounted on the front opening 331; And an encapsulating material 336 for encapsulating the front opening 331.

Furthermore, each LED package 320 of the top view type may further include a lens 338 formed on the structure 332 to correspond to the front opening 331, as shown in FIG.

The structure 332 includes lead frames (not shown) electrically connected to the light emitting diode chip 334; And a front opening 331 for emitting the light generated from the light emitting diode chip 334 to the external front surface.

The light emitting diode chip 334 may be mounted by a flip chip or wire bonding method. In the case of flip-chip mounting, the solder bump is fixed to the lead frame and electrically connected. In the case of the wire bonding method, it is attached to the lead frame by, for example, adhesion and electrically connected by a wire. The light emitting diode chip 334 may be formed of any one of a red (R), two green (G) and blue (B) RGGB type light emitting diode, a white light emitting diode and a blue light emitting diode, Lt; / RTI >

The front opening 331 has a predetermined depth and an inclined surface, and a reflective material may be coated on the inclined surface. At this time, the angle and depth of the inclined surface are set so as to optimize the viewing angle of light emission. The front surface of the front opening 331 may have various shapes depending on the directional characteristics in the vertical direction and the lateral direction in order to optimize the viewing angle of the light. For example, the front surface of the front opening 331 may have a circular shape (Fig. 11A), a square shape (Fig. 11B), a rounded corner (Fig. 11C) 11d, a rectangle with rounded corners (FIG. 11E), and an oval (FIG. 11F). At this time, the front surface of the front opening 331 has an asymmetric structure that can increase the directivity in the up-and-down direction and the right-and-left direction, that is, a shape having any one of a rectangle (FIG. 11E) and an ellipse .

The lens 338 is formed to overlap on the front opening 331 to increase the radiation angle of the light emitted from the front opening 331, thereby improving the light emission directivity.

In the case of installing the plurality of light emitting diode packages 320 having the side view type and the top view type in the vertical portion 314 of the printed circuit board 310 in the case of each of the top view type light emitting diode packages 320 The rear surface of the structure 332 is installed on the vertical portion 314 of the printed circuit board 310 and the side view light emitting diode packages 320 The side surface of the structure 322 is installed in the vertical portion 314 of the printed circuit board 310 so that the side opening 321 faces the side surface of the light guide plate 200. [

Each of the plurality of light emitting diode packages 320 emits light by a driving current supplied from an external light emitting diode driving unit (not shown) through the printed circuit board 310 and irradiates light to the side of each of the two adjacent light guiding plates 200 do. 3, each light emitting diode package 320 of the first light emitting diode array 330 of the light emitting diode unit 300 is connected to the right light pipe 200 (see FIG. 3) through the first groove 202, And each light emitting diode package 320 of the second light emitting diode array 340 of the light emitting diode unit 300 irradiates light to the light guide plate 200 adjacent to the left side through the second groove 204 do.

In the backlight unit 100 according to the first embodiment of the present invention, the light emitting diode unit 300 is provided between the side surfaces of the light guide plate 200, To the planar light source through the light guide plate 200. The planar light source 200 is a planar light source. Accordingly, the backlight unit 100 according to the first embodiment of the present invention can be made slimmer by reducing the optical distance between the light emitting diode unit 300 and the diffusion member 130 by using the light guide plate 200.

Meanwhile, in the backlight unit 100 according to the first embodiment of the present invention, the light emitting diode packages 320 of the light emitting diode unit 300 may be arranged in various forms.

Specifically, in the arrangement structure of the light emitting diode package 320 according to the first embodiment, as shown in FIG. 12, the light emitting diode unit 300 is divided into a plurality of longitudinally divided light guide plates 200 And is disposed in the outer frame portion. For example, the light guide plate 200 may be vertically divided into four. The light emitting diode packages 320 of the first and second light emitting diode arrays 330 and 340 are arranged to be symmetrical with respect to the vertical portion 314 of the printed circuit board 300. Further, each of the first and second light emitting diode arrays 330 and 340 may be arranged to correspond to each of the divided blocks, and may be individually driven on a block-by-block basis.

In the arrangement structure of the light emitting diode package 320 according to the first embodiment, the light guide plate 200 may be further divided in the lateral direction as shown in Fig. For example, the light guide plate 200 may be vertically divided into four and horizontally divided into two. Accordingly, by dividing the light guide plate 200 in the horizontal and horizontal directions, the light-emitting diode units 300 corresponding to the respective divided blocks can be individually controlled to enable block driving.

In the arrangement structure of the light emitting diode package 320 according to the second embodiment, as shown in FIG. 14, the light emitting diode unit 300 is disposed between the plurality of light guide plates 200 divided in the longitudinal direction, And is disposed in the outer portion. For example, the light guide plate 200 may be vertically divided into four. The light emitting diode packages 320 of the first and second light emitting diode arrays 330 and 340 are arranged in a zigzag shape with respect to the vertical portion 314 of the printed circuit board 300. That is, each light emitting diode package 320 of the second light emitting diode array 340 is disposed between each light emitting diode package 320 of the first light emitting diode array 330. Accordingly, the number of the light emitting diode packages 320 formed in any one of the first and second light emitting diode arrays 330 and 340 can be reduced by at least one. Further, each of the first and second light emitting diode arrays 330 and 340 may be arranged to correspond to each of the divided blocks, and may be individually driven on a block-by-block basis.

In the arrangement structure of the light emitting diode package 320 according to the second embodiment, the light guide plate 200 may be further divided in the lateral direction as shown in FIG. For example, the light guide plate 200 may be vertically divided into four and horizontally divided into two. Thus, by dividing the light guide plate 200 in the horizontal and horizontal directions, the light emitting diode units 300, which are divided and arranged so as to correspond to the respective divided blocks, can be individually controlled to enable block driving.

In the arrangement structure of the light emitting diode package 320 according to the third embodiment, as shown in FIG. 16, the light emitting diode unit 300 is disposed between the plurality of light guide plates 200 divided in the transverse direction, And is disposed in the outer portion. For example, the light guide plate 200 can be horizontally divided into four pieces. The light emitting diode packages 320 of the first and second light emitting diode arrays 330 and 340 are arranged to be symmetrical with respect to the vertical portion 314 of the printed circuit board 300. An L-shaped printed circuit board 310 in which the first light emitting diode array 330 is disposed is disposed in the first groove 202 of the light guide plate 200 adjacent to the upper side wall of the case 110. [ An L-shaped printed circuit board 310 on which a second light emitting diode array 340 is disposed is disposed in a second groove 204 of the light guide plate 200 adjacent to the lower side wall of the case 110. Further, each of the first and second light emitting diode arrays 330 and 340 may be arranged to correspond to each of the divided blocks, and may be individually driven on a block-by-block basis.

In the arrangement structure of the light emitting diode package 320 according to the third embodiment, the light guide plate 200 can be further divided in the longitudinal direction as shown in Fig. For example, the light guide plate 200 may be horizontally divided into four pieces and vertically divided into four pieces. Thus, by dividing the light guide plate 200 in the horizontal and horizontal directions, the light emitting diode units 300, which are divided and arranged so as to correspond to the respective divided blocks, can be individually controlled to enable block driving.

In the arrangement structure of the light emitting diode package 320 according to the fourth embodiment, as shown in FIG. 18, the light emitting diode unit 300 is disposed between the plurality of light guide plates 200 divided in the lateral direction, And is disposed in the outer portion. For example, the light guide plate 200 can be horizontally divided into four pieces. The light emitting diode packages 320 of the first and second light emitting diode arrays 330 and 340 are arranged in a zigzag shape with respect to the vertical portion 314 of the printed circuit board 300. That is, each light emitting diode package 320 of the second light emitting diode array 340 is disposed between each light emitting diode package 320 of the first light emitting diode array 330. Accordingly, the number of the light emitting diode packages 320 formed in any one of the first and second light emitting diode arrays 330 and 340 can be reduced by at least one. Further, each of the first and second light emitting diode arrays 330 and 340 may be arranged to correspond to each of the divided blocks, and may be individually driven on a block-by-block basis.

In the arrangement structure of the light emitting diode package 320 according to the fourth embodiment, the light guide plate 200 can be further divided in the longitudinal direction as shown in Fig. For example, the light guide plate 200 may be vertically divided into four pieces and vertically divided into four pieces. Thus, by dividing the light guide plate 200 in the horizontal and horizontal directions, the light emitting diode units 300, which are divided and arranged so as to correspond to the respective divided blocks, can be individually controlled to enable block driving.

In the backlight unit 100 according to the first embodiment of the present invention, the size (or area) of the light guide plate 200 disposed in the outer frame portion of the plurality of light guide plates 200, The light emitting diode unit 300 disposed between the side wall of the case 110 and the light guide plate 200 adjacent to the side wall may be omitted. 20, on the lower surface of each of the light guide plates 200 disposed at the outermost portions A and B out of the plurality of light guide plates 200 arranged in parallel and arranged in parallel, Grooves 202 and 204 are not formed.

21 is a cross-sectional view schematically showing a backlight unit 500 according to the second embodiment of the present invention.

21, the backlight unit 500 according to the second embodiment of the present invention has the same configuration as that of the first embodiment of the present invention except for the case 510 and the light emitting diode unit 600 .

The case 510 has a "U" shape including a bottom wall and a side wall vertically bent from the bottom wall. At this time, the case 510 is formed of a metal material for emitting heat generated from the plurality of light emitting diode parts 600.

The case 510 also includes a plurality of lower protrusions 514 projecting outwardly from the bottom surface to have a receiving groove 512 for receiving the light emitting diode unit 600. At this time, the plurality of lower protrusions 514 are formed at positions corresponding to each other between the light guide plates 200 disposed so as to be parallel to each other.

The light emitting diode unit 600 includes a printed circuit board 610 inserted into each of the receiving grooves 512 of the case 510; A first light emitting diode array (330) having a plurality of light emitting diode packages disposed on one side of the printed circuit board (610); And a second light emitting diode array 340 having a plurality of light emitting diode packages arranged on the other side of the printed circuit board 610.

The printed circuit board 610 is a metal printed circuit board for dissipating heat generated in the first and second light emitting diode arrays 330 and 340 as in the first embodiment of the present invention. The printed circuit board 610 is disposed in the receiving groove 512 of the case 510 and disposed between the plurality of light guide plates 200. That is, the printed circuit board 610 is disposed in a space provided by the first grooves 202 and the second grooves 204 of the two adjacent light guide plates 200, respectively.

The first light emitting diode array 330 irradiates the light from the plurality of light emitting diode packages emitted by the driving current supplied from the outside to the light guide plate 200 through the side wall of the second groove 204.

The second light emitting diode array 340 irradiates the light from the plurality of light emitting diode packages that are emitted by the driving current supplied from the outside to the light guide plate 200 through the side walls of the first groove 202.

In the backlight unit 500 according to the second embodiment of the present invention, the lower protrusion 514 having the receiving groove 512 is formed in the case 510, and a plurality of light emitting diode packages 320 Shaped printed circuit board 610 is disposed on the lower protruding portion 514 to provide the same effects as those of the first embodiment of the present invention and improve the assemblability. The backlight unit 500 according to the second embodiment of the present invention can increase the rigidity of the case 510 due to the lower protrusion 514 formed in the case 510 and prevent deformation such as warpage .

22 is a cross-sectional view schematically showing a backlight unit 700 according to the third embodiment of the present invention.

22, the backlight unit 500 according to the third embodiment of the present invention has the same configuration as that of the first embodiment of the present invention except for the case 710 and the light emitting diode unit 800 .

The case 710 has a "U" shape including a bottom wall and a side wall vertically bent from the bottom wall. At this time, the case 710 is formed of a metal material for emitting heat generated from the plurality of light emitting diode units 800.

Further, the case 710 includes a plurality of upper protrusions 712 protruding from the bottom surface at a constant height. At this time, each of the plurality of upper protrusions 712 is formed at a position overlapping the boundary between the light guide plate 200 and the light guide plate 200 arranged to be parallel to each other and supports the light guide plate 200. Here, the upper protrusion 712 may protrude through the reflective member 120.

The light emitting diode unit 800 includes first and second insulating interconnection layers 335 and 345 formed on the upper protrusion 712 of the case 710; A first light emitting diode array (330) having a plurality of light emitting diode packages arranged in a first insulating interconnection layer (335); And a second light emitting diode array 340 having a plurality of light emitting diode packages arranged in the second insulating interconnection layer 345.

Each of the first and second insulating interconnection layers 335 and 345 includes a plurality of interconnection layers 920 and 940 formed between a plurality of insulating layers 910, 930, and 950 as shown in FIG. 23 .

Each of the plurality of insulating layers 910, 930, and 950 may be a silicon material having thermal conductivity.

The plurality of wiring layers 920 and 940 are formed of a metal material between the plurality of insulating layers 910, 930, and 950 to supply driving currents supplied from the outside to the light emitting diode packages, respectively. The plurality of wiring layers 920 and 940 may be electrically connected to each other via a via hole passing through at least one of the plurality of insulating layers 910, 930, and 950.

Each of the first and second insulating interconnection layers 335 and 345 is provided on the upper protruding portion 712 of the case 710 by the lower adhesive layer 905. [

The first light emitting diode array 330 is mounted on the first insulating interconnection layer 335 by an upper adhesive layer 955. The first light emitting diode array 330 includes a plurality of light emitting diode packages that emit light by a driving current supplied from the outside through the wiring layers 920 and 940 of the first insulating interconnection layer 335, 204 to the light guide plate 200 through the side wall.

The second light emitting diode array 340 is installed in the second insulation layer 345 by the upper adhesive layer 955. The second light emitting diode array 340 is formed by connecting light from a plurality of light emitting diode packages that are emitted by a driving current supplied from the outside through the wiring layers 920 and 940 of the second insulating interconnection layer 345 to the first groove 202 to the light guide plate 200 through the side wall.

In the backlight unit 500 according to the third embodiment of the present invention, the light emitting diode arrays 330 and 340 are provided on the upper protrusion 712 protruding from the bottom surface of the case 510, The same effects as those of the first embodiment can be obtained and the heat generated when the light emitting diode arrays 330 and 340 are driven can be dissipated more efficiently. The backlight unit 700 according to the third embodiment of the present invention can increase the rigidity of the case 510 due to the upper protrusion 712 formed in the case 710, .

24 is a cross-sectional view schematically showing a liquid crystal display device according to an embodiment of the present invention.

Referring to FIG. 24, a liquid crystal display device according to an embodiment of the present invention includes a backlight unit 100; First and second light converging members (102, 104) arranged on the back light unit (100); And a liquid crystal panel 106 disposed on the second light collecting member 104.

The backlight unit 100 has the same configuration as that of the backlight unit 100 according to the first embodiment of the present invention shown in Figs. 3 to 20, so that the detailed description will be replaced with the above description.

The first light-collecting member 102 includes a base film (not shown); And a first condensing pattern (not shown) formed on the upper surface of the base film. At this time, the first condensing pattern includes a first concave-convex pattern for increasing the condensation or the front luminance of light emitted from the diffusion member 130 of the backlight unit 100. For example, the request pattern may be a triangular prism, a pyramid-shaped prism, a quadrangular pyramid, a triangular prism, a curved lens; And an elliptic lenticular lens formed regularly or irregularly.

The second light collecting member 104 includes a base film (not shown); And a second light condensing pattern (not shown) formed on the upper surface of the base film. At this time, the second light converging pattern includes a first concave-convex pattern for re-focusing the light emitted from the first light collecting member 102 or for increasing the front brightness. Here, the second concavo-convex pattern may be formed in a direction crossing the direction of the first concavo-convex pattern depending on its shape.

The liquid crystal panel 106 includes spacers for maintaining a constant interval between the two substrates; And a liquid crystal layer formed in a space provided by the spacers. The liquid crystal layer is driven in accordance with an applied electric field to adjust the transmittance of the light emitted from the backlight unit 100 through the first and second condenser members 102 and 104. An upper polarizer (not shown) is attached to the front surface of the liquid crystal panel 106, and a lower polarizer (not shown) is attached to the rear surface.

The liquid crystal display device according to the embodiment of the present invention can measure the transmittance of light emitted from the backlight unit 100 through the first and second condenser members 102 and 104 according to an image signal applied to the liquid crystal panel 106 So that a desired image is displayed on the liquid crystal panel 106.

Since the liquid crystal display device according to the embodiment of the present invention includes the backlight unit 100 according to the first embodiment of the present invention, it is suitable for slimming due to the reduction in the overall thickness of the backlight unit 100 .

25, a liquid crystal display device according to an embodiment of the present invention may include, in place of the backlight unit 100 according to the first embodiment of the present invention, a backlight unit 100 according to the second embodiment of the present invention, Unit 500 as shown in FIG. Here, the backlight unit 500 according to the second embodiment of the present invention is superseded by the above description.

26, the backlight unit 100 according to the first embodiment of the present invention may be replaced with a backlight unit 100 according to the third embodiment of the present invention, Unit 700 shown in FIG. Here, the backlight unit 700 according to the second embodiment of the present invention is superseded by the above description.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention. Will be clear to those who have knowledge of.

1 is a view schematically showing a backlight unit using a conventional light emitting diode;

2 is a view showing a stain caused by luminance unevenness generated in a conventional backlight unit;

3 is a cross-sectional view schematically showing a backlight unit according to the first embodiment of the present invention;

4 is a perspective view showing the light guide plate shown in Fig. 3;

5 is a perspective view showing another embodiment of the light guide plate shown in Fig. 3;

FIG. 6 is a perspective view schematically showing the light emitting diode portion shown in FIG. 3; FIG.

7 is a sectional view showing a side view type light emitting diode package shown in Fig. 6; Fig.

8 is a cross-sectional view showing another form of the side view type light emitting diode package shown in FIG. 6;

Fig. 9 is a sectional view showing the top view type light emitting diode package shown in Fig. 6; Fig.

10 is a cross-sectional view showing another form of the top view type light emitting diode package shown in FIG. 6;

11A to 11F are plan views showing various embodiments of the front opening shown in FIG. 9;

12 is a plan view showing an arrangement structure of a light emitting diode array according to the first embodiment of the present invention;

13 is a plan view showing another embodiment of the arrangement structure of the light emitting diode array according to the first embodiment of the present invention;

FIG. 14 is a plan view showing a layout structure of a light emitting diode array according to a second embodiment of the present invention; FIG.

15 is a plan view showing another embodiment of the arrangement structure of a light emitting diode array according to the second embodiment of the present invention;

16 is a plan view showing a layout structure of a light emitting diode array according to a third embodiment of the present invention;

17 is a plan view showing another embodiment of the arrangement structure of the light emitting diode array according to the third embodiment of the present invention;

18 is a plan view showing an arrangement structure of a light emitting diode array according to a fourth embodiment of the present invention;

19 is a plan view showing another embodiment of the arrangement structure of the light emitting diode array according to the fourth embodiment of the present invention;

20 is a cross-sectional view schematically showing another embodiment of the backlight unit according to the first embodiment of the present invention;

21 is a cross-sectional view schematically showing a backlight unit according to a second embodiment of the present invention;

22 is a cross-sectional view schematically showing a backlight unit according to a third embodiment of the present invention;

23 is a cross-sectional view schematically showing the first and second insulating interconnection layers shown in Fig. 22;

24 is a cross-sectional view schematically showing a liquid crystal display device according to the first embodiment of the present invention;

25 is a cross-sectional view schematically showing a liquid crystal display device according to a second embodiment of the present invention; And

26 is a cross-sectional view schematically showing a liquid crystal display device according to a third embodiment of the present invention.

Description of the Related Art [0002]

100, 500, 700: backlight unit 102, 104:

106: liquid crystal panel 110, 510, 710: case

120: reflective member 130: diffusion member

200: light guide plate 202, 204: groove

300: light emitting diode part 310, 600: printed circuit board

320: light emitting diode package 330: first light emitting diode array

340: second light emitting diode array 512: storage groove

514: lower protrusion 712: upper protrusion

Claims (25)

A case made of metal; A plurality of light guide plates divided into a plurality of pieces and stored in the case and arranged in parallel; A plurality of light emitting diodes (OLEDs) disposed in the case and including a printed circuit board having a horizontal portion and a vertical portion integrated between the plurality of light guide plates, A reflective member disposed between a back surface of the plurality of light guide plates and an upper surface layer of the case; And And a diffusion member disposed on the plurality of light guide plates and the case, Wherein the horizontal portion is physically contacted with the reflective member and the case so as to overlap the plurality of divided portions of the light guide plate, and is fixed between the reflective member and the case layer, and the vertical portion penetrates the reflective member, And the backlight unit. The method according to claim 1, Wherein each of the plurality of light guide plates includes first and second grooves formed on both lower side surfaces thereof. 3. The method of claim 2, And the side walls of the first and second grooves have a lens shape. 3. The method of claim 2, Wherein the light emitting diode portion is disposed in a space provided by at least one of the first and second grooves of the light guide plate. 5. The method of claim 4, Wherein the plurality of light guide plates are arranged in parallel so as to be divided into a plurality of portions along at least one of a horizontal direction and a vertical direction in the case. 6. The method of claim 5, Wherein the light emitting diode part comprises: a first light emitting diode array for emitting light generated from a plurality of light emitting diode packages disposed on one side of the vertical part to a side surface of the light pipe; And And a second light emitting diode array for emitting light generated from a plurality of light emitting diode packages disposed on the other side of the vertical portion to a side surface of the light guide plate. The method according to claim 6, Wherein each of the plurality of light emitting diode packages comprises: A structure provided on a vertical portion of the printed circuit board and having a side opening opposed to a side surface of the light guide plate; A light emitting diode chip mounted on the side opening; And And an encapsulant for encapsulating the side openings. 8. The method of claim 7, Wherein each of the plurality of light emitting diode packages further comprises a lens formed on the side opening. The method according to claim 6, Wherein each of the plurality of light emitting diode packages comprises: A structure installed on a vertical portion of the printed circuit board and having a front opening facing the side surface of the light guide plate; A light emitting diode chip mounted on the front opening; And And an encapsulant for encapsulating the front opening. 10. The method of claim 9, Wherein the front opening has one of a circular shape, a square shape, a rectilinear shape where rounded corners are rounded, a rectangle having rounded corners, and an elliptical shape. 11. The method of claim 10, Wherein each of the plurality of light emitting diode packages further comprises a lens formed on the front opening. The method according to claim 6, Wherein each of the light emitting diode packages of the first light emitting diode array and each of the light emitting diode packages of the second light emitting diode array are symmetrically arranged with respect to the vertical portion. The method according to claim 6, Wherein each of the light emitting diode packages of the first light emitting diode array and each of the light emitting diode packages of the second light emitting diode array is arranged in a zigzag shape along the vertical portion. delete delete delete delete delete delete A case including a plurality of lower protrusions having a receiving groove; A reflecting member formed inside the case and exposing the receiving groove; A plurality of light guide plates formed on the reflective member and arranged in parallel and divided in a plurality of positions at positions corresponding to the lower protrusions; A plurality of light emitting diodes (LEDs) including a flat printed circuit board housed vertically in the accommodating grooves, the plurality of light emitting diodes being arranged between the plurality of light guide plates to emit light to side surfaces of the light guide plates; And And a diffusion member disposed on the plurality of light guide plates and the case. 21. The method of claim 20, The light emitting diode unit comprises: A straight printed circuit board housed in the storage groove; A first light emitting diode array for emitting light generated from a plurality of light emitting diode packages arranged on one side of the printed circuit board to a side surface of the light pipe; And And a second light emitting diode array for emitting light generated from a plurality of light emitting diode packages disposed on the other side of the printed circuit board to a side surface of the light guide plate. A case including a bottom surface and an upper protrusion protruding from the bottom surface; A reflective member formed on a bottom surface of the case and penetrated by the upper protrusion; A plurality of light guide plates formed on the reflective member and arranged in parallel and divided in a plurality of positions at positions corresponding to the upper protrusions; A plurality of light emitting diodes (OLEDs) provided on the upper protrusions to irradiate light to the side surfaces of the light guide plates between the plurality of light guide plates; And And a diffusion member disposed on the plurality of light guide plates and the case, The light emitting diode portion includes a first insulating interconnection layer formed on a side surface of the upper protrusion portion; A second insulating interconnection layer formed on the other side of the upper protrusion; A first light emitting diode array for emitting light generated from a plurality of light emitting diode packages provided on the first insulating interconnection layer to a side surface of the light pipe; And And a second light emitting diode array for emitting light generated from a plurality of light emitting diode packages provided on the second insulating interconnection layer to a side surface of the light guide plate. delete 23. The method of claim 22, Each of the first and second insulating interconnection layers; A plurality of insulating layers; And And a wiring layer formed between the plurality of insulating layers. A liquid crystal panel for displaying an image by adjusting a transmittance of light; A backlight unit according to any one of claims 1 to 13, 20 to 22, and 24, which irradiates light to the liquid crystal panel; And And at least one light-condensing member disposed between the liquid crystal panel and the backlight unit.

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