KR20080005612U - Wide light emitting channel - Google Patents

Abstract

The present invention relates to a method of manufacturing a three-dimensional light emitting device that emits light in a small three-dimensional form, such as letters and even more evenly from the back.

In general, it has been using a light emitting material such as neon or cold cathode as a method for emitting three-dimensional characters, such as advertising or signage, but it is easy to break, there is a lot of risk and power consumption used at high pressure.

In order to solve this problem, conventionally, light emitting devices using light emitting diodes (LEDs) are used. The method of attaching the LED module to the inside of the three-dimensional frame has been used a lot, but in the small three-dimensional letters, the LED module is not easy to mount due to the large size, and the curved part inside the three-dimensional frame is more difficult to mount the module. There is a problem in that the generated heat does not emit to the outside of the three-dimensional frame, and the light emitting device limited to the front light emitting form of the light comes only from the front.

In order to solve this problem, the present invention is to adhere to the PCB (2) that is electrically conductive even when cutting freely to the inside of the three-dimensional light emitting device mold using the double-sided adhesive heat radiation tape (8) of the chip-shaped LED (6) The heat is radiated to the outside of the three-dimensional light emitting device mold, and the brightness of the chip LED 6 can be maintained for a longer time. The inside of the three-dimensional light emitting device mold can be easily controlled while controlling the distance of the PCB 2 freely. There is a time savings that can be attached to the top, resulting in maximum productivity.

Furthermore, it is possible to form the structure of the three-dimensional light emitting device by inserting the transparent catenary 9 into the three-dimensional light emitting device frame (1) outline line 21 to emit light at the front and top, bottom, left and right at the same time, and furthermore, at the same time to emit the rear light at the same time. Construct a three-dimensional light emitting device. By using such a three-dimensional light emitting device, it is easy to emit small three-dimensional patterns or letters that could not be emitted too small, and heat radiation of the LED to the outside to maintain the brightness of the LED for a long time to reduce the maintenance cost, three-dimensional By uniformly emitting light, it is easy to identify at any location and has the effect of providing a noticeable beautiful advertisement.

LED, channel

Description

Stereoscopic light emitting device

The present invention relates to a light emitting device that emits small three-dimensional characters, etc., wherein a compact printed circuit board (PCB) designed to be cut while freely adjusting the length is double-sided on the inner bottom surface of the light emitting device frame such as small three-dimensional characters. It is a light emitting device that mounts PCB using adhesive heat dissipation tape and inserts a transparent candlestick into the outline of the light emitting device, fills the synthetic resin inside the mold, cures it, and applies power to emit light. The present invention relates to a method of manufacturing a three-dimensional light emitting device that emits light evenly from the rear side while emitting light at the same time.

In general, it has been using a light emitting material such as neon or cold cathode as a method for emitting three-dimensional characters, such as advertising or signage, but it is easy to break, there is a lot of risk and power consumption used at high pressure.

In order to solve this problem, conventionally, light emitting devices using light emitting diodes (LEDs) are used. Conventionally, "Structure for dispersing light of a light emitting diode" of Application No. 20-1997-0036806, "Emitting structure of light using a synthetic resin and a light emitting diode" of Application No. 20-1999-0024725, Application No. 10-2000 -0049978, "Indoor / outdoor advertising apparatus and manufacturing method thereof," Application No. 10-2003-0011243, "Method of manufacturing advertising display apparatus and advertising apparatus", Application No. 10-2003-0076904 "Light emitting diode using a light emitting diode Display device and method for manufacturing the same ".

These conventional technologies have a problem that the life of the LED is shortened due to the heat emitted from the LED to the outside and limited to the front light emitting form.

These conventional technologies have a problem that the life of the LED is shortened by not emitting heat generated from the LED to the outside, and localized problems of emitting a three-dimensional pattern or letters only from the front surface.

The present invention was developed to solve the above problems, using a PCB designed to be easy to mount inside the compact three-dimensional light emitting device frame and to be easy to use, and simultaneously emits small three-dimensional patterns or letters on the front and top, bottom, left, and right sides. Furthermore, the object of the present invention is to manufacture a three-dimensional light emitting device capable of emitting light evenly to the rear surface.

As described above, in the present invention, the PCB 2, which is electrically conductive even when it is freely cut, is attached to the inside of the three-dimensional light emitting device mold using the double-sided adhesive heat-radiating tape 8 to heat the chip-shaped LED 6. Heat dissipation to the outside of the three-dimensional light emitting device mold, and the brightness of the chip-shaped LED 6 can be maintained for a longer time. There is a time saving that can be attached to the inner surface, maximizing productivity.

Furthermore, it is possible to form the structure of the three-dimensional light emitting device by inserting the transparent puddle 9 into the three-dimensional light emitting device frame (1) outline 21. Configure a light emitting device. By using such a three-dimensional light emitting device, it is easy to emit small three-dimensional patterns or letters that could not be emitted too small, and heat radiation of the LED to the outside to maintain the brightness of the LED for a long time to reduce the maintenance cost, three-dimensional By uniformly emitting light, it is easy to identify at any location and has the effect of providing a noticeable beautiful advertisement.

The three-dimensional light emitting device of the present invention for achieving this purpose is a three-dimensional light emitting device frame having a bottom surface and an outer frame, open in the upper or lower direction and can be cut freely and attached to the PCB and the PCB to which electricity is conducted. Double-sided adhesive heat dissipation tape that transfers the heat of the PCB to the outside of the light emitting device by attaching chip type LED, PCB bottom and inside of the light emitting device, and transparent stirrup and printed circuit board that can be inserted and fixed to the outline of the three-dimensional light emitting device. Power line for inputting power from outside the three-dimensional light emitting device frame by connecting to and transparent bushing for filling and curing up to the height of the three-dimensional light emitting device outline frame to insert the bushing to protect the power line and the transparent plunger to be completely waterproof. Synthetic resin mixed with color pigments to fill and cure to the height of transparent It characterized by comprising a coating layer for blocking the line.

Hereinafter, the present invention will be described with reference to the accompanying drawings.

1A is a perspective view showing an example of an upper surface of a printed circuit board mounted inside a three-dimensional light emitting device template;

1B is a perspective view illustrating an example of a lower surface of a printed circuit board mounted inside a three-dimensional light emitting device template.

In the PCB (2) used in the present invention is a chip-shaped LED (6) is arranged at regular intervals, and a cutting hole (4) for cutting at regular intervals between the chip-shaped LED (6) and the chip-shaped LED (6) and It consists of a plurality of via holes 3 connected to the conductive conductor pad 5 and the chip-shaped LED 6 and the conductive conductor pad 5 so as to be conductive even when cut freely.

The chip-shaped LED 6 is connected to a conductor pad 5 connected by wiring in the PCB 2. The connecting conductor pads 6 are configured at the top and the bottom, and the upper conductor pads are connected to the lower conductor pads through the via holes 3, one of the pair of conductor pads is the + pole terminal 18, and the other is the -pole. Terminal 19 is achieved.

The spacing of the chip-shaped LED 6 is determined by the shape and size of the three-dimensional light emitting device and by the light directing angle of the chip-shaped LED 6. Chip LEDs also include chip LEDs with multiple chips. Fully color can be achieved by using chip LEDs (6) containing RGB (Red, Blue, Green) tricolor chips.

The PCB 2 conducts heat from the chip-shaped LED 6 lead frame 20 to the connection pads 5 on the lower surface through the via holes 3 which are conducted to the wiring in the PCB 2. To do this, it is desirable to use a metal PCB with good thermal conductivity and to supply a stable current that reduces the heat generation of the LED by using a constant current IC and a chip resistor.

A double-sided adhesive heat dissipation tape 8 is used to attach the PCB 2 to the bottom surface of the three-dimensional light emitting device template 1. The double-sided adhesive heat-radiating tape (8) is used to attach the PCB (2) to the bottom surface of the three-dimensional light emitting device mold (1) so that the heat from the chip-shaped LED (6) lead frame (20) is conducted to the heat-radiating tape (8). The heat is conducted to the inner bottom of the light emitting device mold, and the heat is radiated to the outside of the mold.

Since the three-dimensional light emitting device mold 1 is mainly made of a metal mold such as stainless steel, galvan, hsinchu, and aluminum, it can emit heat well to the outside of the mold to maintain the luminance of the chip-shaped LED 6 for a longer time.

FIG. 2 is a cross-sectional view of the PCB 2 attached to the bottom surface of the three-dimensional light emitting device mold 1 by using a double-sided adhesive heat-radiating tape 8. When attaching the PCB 2 inside the three-dimensional light emitting device mold 1, the cutting holes 4 between the connecting conductor pads 5 may be freely cut to maintain proper spacing.

In addition, the white gloss paint may be easily used by those skilled in the art in order to reflect the direction of light emitted from the chip-shaped LED inside the three-dimensional light emitting device frame 1.

The PCB 2 to which the chip-shaped LED 6 is attached is cut and attached to the inner surface of the three-dimensional light emitting device mold 1, and the same polarity connection conductor pads 5 are connected to each other so as to be connected to each other. + Pole is + pole,-pole is-It is good to use copper wire which is easy to bend and has high fixation.

Connect each connecting conductor pad 5 so that the PCB 2 attached to the inner surface of the three-dimensional light emitting device mold 1 is connected, and lead wires for inputting power are connected to the positive and negative poles and then drawn out to the outside of the mold. .

In this case, it is preferable to insert the bushing 16 after perforating the bottom surface of the three-dimensional light emitting device mold 1 to protect the lead wire. The material of the bushing 16 is preferably a material of the non-conductor.

3 is a double-sided adhesive heat dissipation tape (8) inside the three-dimensional light emitting device mold (1) to attach the PCB (2) and withdraw the lead wire 15 for power input and then filled with transparent synthetic resin (10) After curing by hardening it is a cross-sectional view of the coating layer (12) for filling and curing the synthetic resin (11) mixed with color pigments thereon to block ultraviolet rays thereon.

The light of the chip-shaped LED 6 passes through the transparent synthetic resin layer 10 as it is, and the light is dispersed in the synthetic resin layer 11 in which color pigments are mixed so that the whole surface of the chip is uniformly emitted. In order to prevent the transparent synthetic resin 10 from leaking out when the lead wire 15 passing through the hole of the bushing 16 is removed, it is preferable to seal the hole of the bushing 16 using a hot melt adhesive so that the transparent synthetic resin does not leak out. .

As shown in Fig. 1, Fig. 2 and Fig. 3, the chip-shaped LED is attached to the inside of the three-dimensional light emitting device mold by using a double-sided adhesive heat-radiating tape (8), which is electrically conductive even when cutting freely. By dissipating the heat of (6) to the outside of the three-dimensional light emitting device mold (1), it is possible to obtain the effect of keeping the luminance of the LED light emitting for a longer time. Furthermore, it is possible to freely adjust and adjust the PCB spacing so that the PCB can be easily attached to the inner surface of the three-dimensional light emitting device frame, thereby maximizing productivity.

Furthermore, a three-dimensional light emitting device that emits light at the same time to the rear while simultaneously emitting the front and top, bottom, left, and right sides will be described.

4 is a cross-sectional view of the transparent candlestick 9 inserted in the outline 21 of the three-dimensional light emitting device mold 1.

As illustrated in FIG. 2, the PCB 2 is attached to the inner bottom of the mold by using a double-sided adhesive heat dissipation tape 8 inside the three-dimensional light emitting device mold 1, and then the transparent candlestick 9 is attached to the three-dimensional light emitting device mold 1. Insert into the outline (21).

The transparent cauldron 9 is fitted to fit the thickness of the outline 21 of the three-dimensional light emitting device mold 1 and a transparent transparent cauldron 9 is used to easily fit the curved portion. As the material of the transparent muffler 9, it is preferable to use a soft synthetic resin having elasticity such as epoxy or urethane.

5 is inserted into the transparent jell 9 in the contour 21 of the three-dimensional light emitting device mold (1) and then filled with a transparent synthetic resin (10) and cured by filling the synthetic resin (11) mixed with color pigments thereon. After that, it is a cross-section coated to block ultraviolet rays.

Three-dimensional light emitting device template (1) From the height of the outline (21) down to 1-3mm filled with a transparent synthetic resin (10) and cured and completely waterproof, the transparent synthetic resin (10) is a three-dimensional light emitting device template (1) outline (21) ) So that it does not leak out and fill the synthetic resin (11) mixed with the color pigment thereon from 1 to 3mm below the height of the transparent sol (9). Color pigments may be used in a variety of pigments, such as pigments in powder form, metallic powder form, shiny hologram.

When the coating layer 12 to block ultraviolet rays on the synthetic resin layer 11 mixed with the color pigment as shown in FIG. 5 can prevent the yellowing phenomenon that the surface color of the synthetic resin changes to yellow due to chemical reaction between air and the synthetic resin. The coating agent used for the coding layer 12 to block the ultraviolet rays are uv blockers, various uv coating acrylics, sheets and the like. The thickness of the coating layer may vary depending on the type of coating agent.

The light of the chip-shaped LED 6 inside the three-dimensional light emitting device mold 1 passes through the transparent synthetic resin layer 10 and the light is dispersed in the synthetic resin layer 11 mixed with color pigments so that the entire surface is uniformly emitted and the three-dimensional type Light emitting device 1 The light is evenly distributed to the side of the transparent muffler 9 sandwiched in the frame outline 21, so that even a three-dimensional surface can be emitted, that is, a three-dimensional light emitting device that emits three surfaces.

6 is a cross-sectional view of an example of a back-emitting type of a three-dimensional light emitting device.

The open portion of the three-dimensional light emitting device template 1 emits light around the wall toward the wall 13 or the like. At this time, when the three-dimensional light emitting device mold 1 is made to light by inserting the transparent cauldron 9, the wall surface 13 and the three-dimensional light emitting device mold 1 are uniformly attached even without attaching a certain distance with a bolt 17. The light is dispersed and emits back light.

7 is a cross-sectional view of a structure that simultaneously forms a top emission type and a bottom emission type of a three-dimensional light emitting device.

In order to emit light at the front and side at the same time, and to emit light at the same time, the structure of the three-dimensional light emitting device frame forms the structure of the dual three-dimensional light emitting device frame 14 having the H type structure. When three-dimensional patterns or letters are emitted simultaneously to the front and the side and the back, the overall appearance is lively and three-dimensional, making it easy to identify at any position.

Figure 1a is a perspective view showing an example of the upper surface of the printed circuit board mounted in the three-dimensional light emitting device mold of the present invention

Figure 1b is a perspective view showing an example of the lower surface of the printed circuit board mounted inside the three-dimensional light emitting device mold of the present invention

2 is a cross-sectional view of an example in which the PCB is attached to the bottom surface of the three-dimensional light emitting device of the present invention using a heat radiation tape.

FIG. 3 is a cross-sectional view of a transparent synthetic resin filled into the mold of the three-dimensional light emitting device of the present invention and filled with a synthetic resin mixed therewith to cure the synthetic resin and then coated to block ultraviolet rays thereon.

FIG. 4 is a cross-sectional view of an example of sandwiching a transparent cauldron on a three-dimensional light emitting device outline of the present invention.

[Figure 5] is inserted into the transparent jjimjwa the outline of the three-dimensional light emitting device frame of the present invention and then filled with a transparent synthetic resin and cured by filling a synthetic resin mixed with color pigment thereon and then coated to make UV light thereon Cross-section

6 is a cross-sectional view of an example of a back-emitting type of the three-dimensional light emitting device of the present invention.

7 is a cross-sectional view of a structure that simultaneously forms a front light emitting type and a bottom light emitting type of a three-dimensional light emitting device of the present invention

Claims (7)

Three-dimensional light emitting device mold having a bottom surface and an outer mold and having an open direction upward or downward Printed circuit board consisting of cutting holes that can be cut freely, via holes that conduct electricity and conduct heat, and connecting pads Three-dimensional light emitting device comprising a double-sided adhesive heat dissipation tape that can conduct heat by attaching a printed circuit board inside the three-dimensional light emitting device mold The method of claim 1, Three-dimensional light emitting device Three-dimensional light emitting device to fill and cure transparent synthetic resin inside the mold, and then fill and cure with synthetic resin mixed with color pigment The method of claim 1, Stereoscopic light emitting device with transparent guideline The method of claim 1 Three-dimensional light-emitting device Three-dimensional light-emitting device cured by inserting and inserting a transparent cauldron on the outline of the frame, filled with a transparent synthetic resin inside the three-dimensional light emitting device mold and filled with a synthetic resin mixed with color pigments thereon Step 1 to produce a three-dimensional frame with a bottom surface and a three-dimensional surface open upward or downward 2 steps to attach PCB to inner surface of three-dimensional light emitting device by using double-sided adhesive heat-radiating tape on printed circuit board consisting of cutting hole which can be cut freely, via hole which is electrically conductive, heat conduction and connecting conductor pad 3 steps to connect electric wire with connecting pad in PCB to apply power 4 stages of transparent catapults on the outline of the solid-state light emitting device 5 steps to fill and cure transparent synthetic resin 6 steps to harden by filling with synthetic resin mixed with color pigment Method of manufacturing a stereoscopic light emitting device Step 1 to produce a three-dimensional frame with a bottom and a three-dimensional surface open in the up and down directions 2 steps of attaching PCB to the inner surface of three-dimensional light emitting device frame by using double-sided adhesive heat-radiating tape on the printed circuit board consisting of cutting hole which can be cut freely, via hole which is electrically conductive and heat conduction and connecting conductor pad Three steps to connect the wires with the connecting conductor pads in the PCB to apply power from outside the three-dimensional light emitting device mold Four steps of inserting transparent cauldron on the outline of three-dimensional light emitting device type 5 steps to fill and cure transparent synthetic resin 6 steps to harden by filling with synthetic resin mixed with color pigment Method of manufacturing a three-dimensional light emitting device consisting of The three-dimensional light emitting device according to any one of claims 1 to 4, wherein the solid state light emitting device has a UV blocking coating layer that can block ultraviolet rays after filling and curing with a synthetic resin mixed with color pigments.

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