KR20080001651U - A dust powder collector installed at the vacuum line of the semiconductor and LCD panel manufacturing device - Google Patents

Abstract

The present invention relates to a foreign matter dust collector installed in the vacuum pipe line of the semiconductor and LCD panel manufacturing apparatus, and more particularly, to a vacuum chamber to discharge the waste gas and foreign substances generated in the vacuum chamber 10 is processed semiconductor and LCD panel Inlet 31a of a predetermined size is formed on one side to be installed in the vacuum pipe line 12 connected to the (10), the outlet 31b is formed on the opposite side where the inlet 31a is formed, the inlet and outlet Body 31 made of a predetermined size to form a constant space sealed between; A plurality of partition walls 34 are installed at predetermined intervals so as to maintain an acute angle with respect to the bottom surface 33 of the body 31 toward the inlet 31a side from the inside of the body 31 to divide the inside of the body 31. ); From the bottom surface 33 of the body 31 to each partition 34 so that the foreign matter and the waste gas introduced from the inlet side provided on one side of the body 31 passes through each partition 34, the path is changed and moved. Formed and dust-collected by having a structure having a plurality of through-holes 35 having different heights at positions above a certain height, so that the waste gas and foreign substances passing through the partitions are discharged through the through-holes after impacting the partitions. This is made of a foreign material dust collector.

Vacuum piping line, foreign body dust collector, bulkhead, through hole

Description

A dust powder collector installed at the vacuum line of the semiconductor and LCD panel manufacturing device

1 is a schematic installation diagram of a vacuum pipe line of a conventional semiconductor and LCD panel manufacturing apparatus,

Figure 2 is an internal cross-sectional view of a conventional vacuum pipe line used for a certain period of time,

Figure 3 is a state dust collector installed in the vacuum pipe line of the semiconductor and LCD panel manufacturing apparatus according to a first embodiment of the present invention,

4 is a perspective view of the internal structure of the foreign material dust collector according to the first embodiment of the present invention,

5 is a cross-sectional view taken along the line A-A of FIG.

6 is a perspective view of the internal structure of the foreign material dust collector according to the second embodiment of the present invention,

7 is a cross-sectional view taken along the line B-B of FIG.

8 is a cross-sectional view of the state of use of the foreign matter precipitator according to the second embodiment of the present invention.

* Brief description of symbols for the main parts of the drawings

10: vacuum chamber 12: vacuum piping line

14 vacuum pump 16 outlet

20: purification device 30: foreign body dust collector

32: bulkhead 34: through hole

35 through hole 36 connector

38: connecting member 40: cooling water pipe

50: Defect

The present invention relates to a foreign material precipitator installed in the vacuum pipe line of the semiconductor and LCD panel manufacturing apparatus, more specifically, a plurality of partitions inclined to one side in the interior having a constant volume is installed at a predetermined interval, each partition is different from each other The through-holes of different sizes are installed to cross each other so that foreign matters from one side collide with the bulkheads and are discharged through the through-holes so as to minimize the accumulation of foreign matters in the vacuum pipe line so as to collide with each partition and fall and collect. It relates to a foreign material dust collector installed in the vacuum pipe line of the semiconductor and LCD panel manufacturing apparatus.

In general, a semiconductor chip or LCD (Liquid Crystal Display) panel is processed in a predetermined vacuum chamber. Defects or waste gases generated during processing of the semiconductor chip or LCD panel are externally discharged by a vacuum discharge means installed at one side of the vacuum chamber. It is configured to be discharged.

That is, the vacuum discharge means is installed in the vacuum pipe line 12 is a predetermined length extending from the vacuum chamber 10 to the discharge port, and the end of the vacuum pipe line 12 is installed in the waste gas from the vacuum chamber 10 And a scrubber 20 connected to a vacuum pump 14 for generating a constant vacuum pressure to discharge foreign matters, and a scrubber 20 connected in the middle of the vacuum pipe line 12 to purify the toxic components of the waste gas before discharge of the waste gas. It is composed of a configuration provided with, etc., its schematic configuration is shown in FIG.

Hazardous gases such as silane (SiH ₄ ), arsine (AsH ₃ ), phosphine (PH ₃ ), etc. generated during the processing of semiconductors, etc. in the vacuum chamber 10 through the vacuum discharge means having such a configuration is a constant diameter It is discharged to the outside via the vacuum pipe line 12 of the, the waste gas contains a predetermined moisture and the fine particles generated during the chip processing together to generate a solid (powder).

The generated solid particles are charged by the charging phenomenon (peeling charge, flow charge, friction charge, mixed charge, etc.) with the inside of the vacuum pipe line 12 while being discharged to the outlet along the vacuum pipe line 12. As a result of the powder having a physical property sticking to the inner surface of the vacuum pipe line, the phenomenon occurs. Thus, the powder stuck to the inside of the vacuum pipe line is stuck in the vacuum pipe line.

As a result, when the vacuum pipe line 12 is removed and examined after producing the product for a certain period of time, as shown in FIG. 2, the inside of the vacuum pipe line 12 is adhered by stacking the foreign material 50 to narrow the moving passage. As a result, the pumping capacity of the vacuum pump is lowered and the waste gas flow passage is narrowed, thereby reducing the waste gas discharge performance in the vacuum chamber, thereby increasing the defect rate in the processing of a fine semiconductor.

Therefore, in the related art, in order to remove powder accumulated in the vacuum pipe, the vacuum pipe line should be periodically replaced (once / month) or the vacuum pipe line should be cleaned.

As a result, the production process of the product must be paused for the replacement or cleaning of the vacuum pipe line. Therefore, the effective utilization rate of the line is reduced, and the productivity of the product decreases, leading to enormous economic loss and the maintenance of the vacuum pipe line. There was a problem that costs enormous costs.

Thus, in order to prevent the powder formed by the waste gas and foreign substances generated in the vacuum chamber processing semiconductor and LCD panels from accumulating inside the vacuum piping line, the desorption apparatus of the vacuum piping line which can be installed in the vacuum piping line should be devised. There is a need to do so.

The present invention is to effectively prevent the deposition of foreign matter inside the vacuum pipe line of the conventional semiconductor and LCD panel manufacturing apparatus described above, and to maintain and manage the vacuum pipe line by extending the cleaning cycle for removing foreign matter in the vacuum pipe line It is an object of the present invention to provide a foreign material precipitator installed in a vacuum pipe line of a semiconductor and LCD panel manufacturing apparatus that can reduce costs and minimize the place where the operation rate of semiconductor processing and manufacturing equipment is reduced.

In order to achieve the above object, the foreign matter collector installed in the vacuum piping line of the semiconductor and LCD panel manufacturing apparatus according to the present invention is connected to the vacuum chamber to discharge the waste gas and foreign substances generated in the vacuum chamber in which the semiconductor and LCD panel are processed. A body having a predetermined size so that an inlet of a predetermined size is formed at one side so as to be installed in the vacuum pipe line, an outlet is formed at the opposite side where the inlet is formed, and a closed constant space is formed between the inlet and the outlet; A plurality of partition walls each installed at a predetermined interval while maintaining a constant inclination to maintain an acute angle with the body bottom toward the inlet side from the inside of the body to divide the inside of the body; Each partition wall has a plurality of through-holes having different installation heights above a predetermined height from the bottom surface of the body so that foreign matter and waste gas introduced from the inlet side provided on one side of the body pass through each partition wall and move in a changed course. Each is provided.

In particular, the through-holes formed in each of the partition wall has a structure that gradually decreases in diameter from the inlet side to the outlet side, so that the effective foreign matter accumulation.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

3 is a state diagram in which the foreign matter precipitator 30 according to the first embodiment of the present invention is installed in the vacuum pipe line 12 of the semiconductor and LCD panel manufacturing apparatus, and the foreign matter precipitator 30 according to the present invention is a vacuum chamber 10. It is preferable to be installed at the front end of the vacuum pipe line (12) connected to the).

That is, the foreign material dust collector 30 of the present invention to filter out the waste gas and foreign matter (Defect) discharged from the vacuum chamber 10 as much as possible before passing through the vacuum pipe line 12, the foreign matter inside the vacuum pipe line 12 The inlet 31a and the outlet 31b which are connected to the vacuum pipe line 12 are provided at both sides of the body 31 having a sealed inner volume of a predetermined size to prevent the accumulation to the maximum, In the interior of the body 31, a plurality of partitions 34 are installed at regular intervals, and the interior of the body 31 sealed by each partition 34 is divided into several, each partition 34 of a certain size Through holes 35 are formed, respectively, so that the waste gas and foreign substances introduced from the inlet 31a are discharged to the outlet 31b on the opposite side of the inlet via the through hole 35 of each partition 34. .

Hereinafter, with reference to the accompanying drawings, each embodiment according to the present invention will be described in more detail.

My Example 1

4 and 5 illustrate an internal perspective perspective view and a longitudinal cross-sectional view, respectively, to facilitate understanding of the structure of the foreign material precipitator according to the first embodiment of the present invention.

As shown in FIG. 4, the foreign material precipitator 30 according to the first embodiment of the present invention includes a sealed body 31 having a predetermined size, and an inlet 31a formed at both left and right sides of the body 31. It consists of a predetermined length of the connection pipe 36 is coupled to the outlet (31b).

That is, the body 31 is to be made in a variety of shapes, the drawing consists of a rectangular parallelepiped shape, the connection pipe 36 to the inlet 31a and outlet 31b formed on the front and rear of the body 31 Connection member 38 is provided to facilitate the connection, and the connection pipe 38 is preferably made of a bellows pipe that can be stretched to its length.

In addition, a plurality of partition walls 34 are installed at a predetermined interval inside the body 31, and through holes 35 having a predetermined size are formed in the partition walls 34, and an inlet 31a through which waste gas and foreign substances are introduced. The size of the through hole 35 formed in each of the partition walls 34 is increased so as to move toward the discharge port 31b from the) side.

As can be seen in the cross-sectional view of FIG. 5, the through holes 35 formed in each partition wall 34 have a predetermined height above the bottom surface 33 of the body 31, preferably a diameter of the through holes formed in each partition wall. The waste gas and the foreign substances that have passed through the somewhat larger heights are different from each other so that the waste gas and foreign substances introduced into the body 31 do not pass through the body 31 at one time and have passed through the through-holes of the partition located at the front. When the horizontal movement is to hit the next bulkhead to provide a structure that can be discharged to the outside of the body 31 only after hitting each partition several times while passing through each of several partitions, each partition 34 is a body (31) It is installed to have a constant inclination angle with respect to the inner bottom surface of the).

That is, the inclined partition wall is formed such that the installation angle of the bottom surface 38 of the body 31 and the partition walls 34 is maintained at an acute angle (θ <90 degrees) toward the inlet port 32 in which the waste gas and foreign substances are introduced. The waste gas and foreign matter hitting (34) are swirled under the bulkhead to provide a structure for collecting foreign matter at the bottom of the bulkhead.

2nd Example

Meanwhile, FIGS. 6 and 7 illustrate a second embodiment of the present invention. The second embodiment of the present invention has a high temperature by supplying cooling water to a body using the foreign material dust collector of the first embodiment as described above. It is configured to provide a structure in which foreign matters easily adhere to the partition walls, and the dust collecting effect of the foreign matters can be further improved.

As shown in the figure, the cooling water conduit 40 is installed so that the cooling water can be supplied from the outside to the inside of the body 31, the cooling water conduit 40 is formed through each partition 34 installed at a predetermined interval through It is installed to be coupled to each partition in a zigzag avoiding the ball 35, it is preferable that one cooling water conduit 40 is continuously installed from one front partition to the last partition, the cooling water conduit passing through the last partition. 40 is drawn to the outside of the body 31 is sent to the coolant storage tank provided separately.

The foreign material precipitator 30a according to the second embodiment of the present invention as described above has a partition wall that is cooled by the passage of cooling water when the waste gas and foreign substances that have escaped from the vacuum chamber in a high temperature state are introduced into the body and hit each of the partition walls 34. 34) It easily aggregates and promotes powder formation, and the solid powder with large particles falls under the inclined partition wall, and foreign matter passes through each partition wall and accumulates in the form of solidified powder, exits the dust collector and passes through the vacuum pipe line. When the foreign matter is almost filtered to provide a structure that can minimize the accumulation of foreign matter in the vacuum pipe line, the cooling water conduit 40 is buried in the front or rear of each partition 34 or inside the partition. Is installed as a structure.

On the other hand, it will be described below with reference to the state of use of the second embodiment shown in Figure 8 with respect to the action and effect of the foreign material dust collector according to an embodiment of the present invention made of the above-described configuration.

As shown in the figure, the hot waste gas and foreign matters escaping from the vacuum chamber 10 are introduced into one inlet 31a of the body 31 and then collide with each other in the form of powder of a predetermined size while hitting each partition wall 34. The waste gas and the foreign matter, which are stuck to the collided partition wall or fall below the partition wall 34, and have passed through the through hole 35 of the partition wall 34, move to the space where the partition wall is installed, and then hit the partition wall again. In addition, the waste gas and foreign substances, etc., which hit the partitions, are agglomerated into a powder of a predetermined size and are stuck to the partitions or dropped below the partitions to collect dust repeatedly while passing through the partitions.

That is, the waste gas and foreign matters introduced into the body 31 are moved to one horizontal wall because of the property of moving horizontally, and then the surface of the next partition wall because of the through holes formed at different heights in each partition wall. The waste gas and foreign substances collided with the partition wall are installed in the cooling water conduit 40 through which the coolant flows, and the heat is lost while colliding with the surface of the partition wall where the cool water is maintained. They stick to the bulkhead or fall below the sloped bulkhead and collect under the bulkhead.

In particular, since the partitions provided inside the body of the foreign material dust collector according to the present invention are installed to be inclined at a predetermined slope with respect to the moving direction of the waste gas, the waste gases and foreign substances hitting the partition wall are vortexed under the partition wall so that the powders agglomerated by the partition wall It naturally gathers under the bulkhead.

In this way, the waste gas and foreign matters are aggregated and firstly filtered while passing through several partitions 34 provided with through-holes 35 at different positions, so that many foreign substances are removed from the waste gas passing through the vacuum pipe line. As described above, not only can the work time for removing and cleaning the vacuum pipe line be drastically reduced, but also the temporary work interruption of the semiconductor parts during the cleaning work of the vacuum line line can be prevented from occurring.

That is, in the case of agglomeration of foreign materials using the foreign material dust collector according to the present invention, after removing the dust collector only from the vacuum pipe line after a certain period of use, it is necessary to replace it with a new foreign material dust collector. Productivity reduction can be minimized by stopping the machining of semiconductor components.

In addition, it is possible to reduce the performance degradation and periodic cleaning of the purifier installed in the vacuum pipe line to reduce the maintenance and management costs of the vacuum pipe line.

As described above, the foreign material precipitator installed in the vacuum pipe line of the semiconductor and LCD panel manufacturing apparatus according to the present invention not only has a simple structure, it is easy to install and separate, and when replacing only the foreign material precipitator vacuum pipe Since it can be removed from the line and replaced, the cleaning time can be drastically reduced than when the entire vacuum piping line is removed and cleaned, so that the productivity of parts can be improved as much as possible. A useful effect is to reduce the cost of maintaining and maintaining the pipeline.

Claims (5)

A certain size inlet is formed on one side so that the semiconductor and LCD panel can be installed in a vacuum pipe line connected to the vacuum chamber to discharge waste gas and foreign substances generated in the vacuum chamber processed, and an outlet is formed on the opposite side where the inlet is formed. A body having a predetermined size so as to form a constant space sealed between the inlet and the outlet; A plurality of partition walls each installed at predetermined intervals to maintain an acute angle with respect to the bottom of the body toward the inlet side from the inside of the body to divide the inside of the body; Each partition wall has a plurality of through holes each having a different height at a predetermined height or more from a bottom surface of the body so that foreign matter and waste gas introduced from the inlet side of the body pass through each partition wall and move in a changed path. A foreign material precipitator installed in the vacuum pipe line of the semiconductor and LCD panel manufacturing apparatus, characterized in that formed in the formed structure. The method of claim 1, Manufacturing the semiconductor and LCD panel, characterized in that the inlet and outlet side of the body is made of a structure of the bellows-type connection tube of a predetermined length provided with a connection member at one end to facilitate the installation and separation of the body in the vacuum pipe line Foreign body dust collector installed in the vacuum piping line of the device. The method according to claim 1 or 2, The through-holes formed in each of the partition wall is installed in the vacuum pipe line of the semiconductor and LCD manufacturing apparatus, characterized in that the diameter of the structure gradually decreases from the inlet side to the outlet side. The method of claim 3, The body is installed in the vacuum pipe line of the semiconductor and LCD manufacturing apparatus, characterized in that the cooling water conduit is installed so that the discharged after the cooling water supplied from the outside circulates inside. The method of claim 4, wherein The cooling water conduit is a foreign material precipitator is installed in the vacuum pipe line of the semiconductor and LCD manufacturing apparatus, characterized in that made of a structure installed so as to pass through the surface of each partition installed inside the body.

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